TestConX 2021 Virtual Event

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May 3-7, 2021 Free Virtual Event


Welcome to TestConX 2021!

We are excited to bring the knowledge and expertise of TestConX directly to you via live interactive virtual presentations. And registration is free courtesy of our sponsors.

Be sure to reserve May 3-7, 2021 from 7 - 10 am Pacific time for each day's session. 

We are looking forward to having you join us in May!

Ila Pal & James Tong, Technical Program Co-chairs
Ira Feldman, General Chair
on behalf of the entire TestConX organization

 

Monday May 3, 2021
7-10 am PDT/UTC-7

Session 1
5G/mmWave

5G/mmWave devices present significant challenges across semiconductor test industry, from instrumentation, material, test interconnects to HVM handling equipment. This session will start with an overview of 5G/mmWave testing, followed by a discussion on test platform and calibration techniques. We will take a deep dive on a socket and handler integration for OTA testing, then a comprehensive check on PCB design optimization for up to 70 GHz, and finish the session with a close examination of a novel structure of switching PCBs and contactors for mmWave testing.

“From 5G mmWave to 6G THz: What's Next in RF Test Challenges”
Jeorge Hurtarte
Teradyne
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“Open Platform Production Test for 5G/mmWave Semiconductor Devices”
Jon Semancik
Marvin Test Solutions
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“Socket Design and Handler Integration for High-Volume Over the Air Testing of 5G Applications”
Aritomo Kikuchi
Advantest
Natsuki Shiota
Advantest
Yasuyuki Kato
Advantest
Hiroyuki Mineo
Advantest
Jose Moreira
Advantest
Hiromitsu Takasu
Advantest
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“Optimized PCBs in a 5G World”
Don Thompson
R&D Altanova
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“Package Testing of mmWave 5G Applications”
Aaren Lonks
Cohu
Don Thompson
RDA
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Tuesday May 4, 2021
7-10 am PDT/UTC-7

Session 2
Big Data for Semiconductors & Market Reports

Big data and machine learning is seemingly everywhere, with the technology becoming pervasive. In this session we look at new forms of data collection enabling big data and its use to solve problems in the semiconductor industry, specifically machine learning algorithms are being utilized to investigate the causal mechanisms of customer returns in a test flow of semiconductor manufacturing environment (resulting in Big Data). We also take time to come up to speed the other ‘big’ dataset as we do every year, the marketplace report and outlook!

“Marketplace Report”
Ira Feldman
Feldman Engineering
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“Semiconductor Market in 2021 and Beyond: Sustainable Growth, or Bubble?”
John West
VSLI Research
Abstract (English)

"The relentless demand for semiconductors over the past year is showing no signs of easing. Supply chains are working at full stretch, and at the current rate of growth, the industry will reach a value of over one trillion US dollars by 2030. Concerns are growing that the market has been too good for too long, and a correction is due soon.

This presentation explores the dynamics driving the industry, the warning signs of a market correction to look out for, and what this means for suppliers of test and burn-in sockets"

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“Big Data & Machine Learning For Customer Returns”
Rahima Mohammed
Intel
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“Production Wafer Probe of 77-81 GHz Automotive Radar Applications”
Jason Mroczkowski
Cohu
Martinrty "Marty" Cavegn
Cohu
Jory Twitchell
NXP
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Poster Session
Poster Session

“The Channel Branching Technology with Fan-Out Buffers for Implementing a High Parallelism Probe Card”
Yun-Hyok Choi
SungKyunKwan University
Jun-Pyo Lee
SungKyunKwan University
Gyu-Yeol Kim
Samsung Electronics Company
Byung-Sung Kim
Semiconductor Building
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“Reusable ATE Interface - Making the Most out of Uni-Board(mDIB)”
Senthilkumar Dhamodharan
Caliber Interconnect Solutions Pvt Ltd
Mohanasundaram "Mohan" Selvaraj
Caliber Interconnect Solutions Pvt Ltd
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“Optimal Localization of DC/AC Relay Chips in a High Parallelism Probe Card for ENhancement of SIgnal Integrity”
Junhee Han
SungKyunKwan University
Kwangho Kim
SungKyunKwan University
Gyu-Yeol Kim
Samsung Electronics Company
Wansoo Nah
Sungkyunkwan University
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“Achieving 54+ Ghz Using Optimized Socket Architecture with Traditional probe technology for low cost-of-test”
Peter Cockburn
Cohu
Jason Mroczkowski
Cohu
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Wednesday May 5, 2021
7-10 am PDT/UTC-7

Session 3
Contact Technology
Contacts

Contact technology plays a critical role in making stable electro-mechanical contact from the semiconductor processor to the PCB, with critical challenges rising from denser pitch on the lands/solder-balls, higher pin and I/O count, larger package size, RoHS lead-free, shortening of time-to-market, cost control. In this session, we will start with proposing a structure to prevent crosstalk of elastomer sockets to improve transmission losses and reduce costs. Second presentation will be on understanding resistance fluctuations in contacts under high current loading. Third presentation will show how important lower ground inductances are to devices performance operating at high frequencies that affect device test yields. Final presentation will be on the importance of using high frame rate microscope cameras in a test environment for motion studies.

“Coaxial Elastomer Socket for Crosstalk Shielding”
Yunchan "YC" Nam
TSE
BoHyun "BH" Kim
TSE
Seungho Woo
TSE
Matt Hansen
TSE
Dave "Dave " Oh
TSE
Wonhui "WH" Choi
TSE
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“Resistance Flucuations in Contacts Under High Current Loading”
Gert Hohenwarter
GateWave Northern Inc.
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“Evolution of High-Performance Spring Probes”
Lambert "Bert" Brost
Technoprobe
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“Ground Inductance Modeling of Test Contactor”
Jeff Sherry
Johnstech International
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Thursday May 6, 2021
7-10 am PDT/UTC-7

Session 4
Meeting High Performance Need
Validation

This session will discuss solutions including an alternative low cost approach that lets the user source analog signals using pre-existing high-speed digital instruments, challenges on testing Bluetooth earphone device in ATE, modeling and measurement of high bandwidth devices with minimized error, and a roadmap and expectations for 30-70 GHz signals in a load board or probe card. You will also learn about a new high performance PCB interposer design used for evaluating different PAM4 SERDES performance without the need to redesign the validation platform. Finally, a new socket design for desktop CPUs will be discussed for enabling higher CPU frequencies.

“'Dancing Over Digital-Analog Dichotomy' - Engendering Analog Signals from Digital Channels”
Senthilkumar Dhamodharan
Caliber Interconnect Solutions Pt Ltd
Mohanasundaram "Mohan" Selvaraj
Caliber Interconnect Solutions Pvt Ltd
Harshita Gollamudi
Caliber Interconnect Solutions Pvt Ltd
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“Demonstrating V93000 WSMX_HR Analog Performance Requirement in TWS Application”
Hersy Liu
Advantest
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“Design and Analysis of a High-Performance PCB Interposer for 100G PAM4 Validation”
Xiao-Ming Gao
Intel
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“Modeling Measurement of High Bandwidth Device”
Nozar Naing
Texas Instruments
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“A New Desktop Socketing Approach to Boost Operating Frequencies”
Emad Al-Momani
Intel
Kevin Doran
Intel
Cory Mason
Intel
Hayley Klug
Intel
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Friday May 7, 2021
7-10 am PDT/UTC-7

Session 5
Take the big picture
System Level Test

Creating a reliable and performant test-cell is a challenging task, independent of if it is for system-level test, final test or wafer probe configuration. Many different aspects need to be considered to become successful. In this session, we will put the spotlight on four specific areas from all three test areas. We will start with a look at System-Level test, before taking on the challenge of large fan-out for wafer probe heads. Next we will understand why electro-static discharge management is critical to the test industry, and we will finish with an in-depth look into the technology of elastomer contactors.

“Next Generation Elastomer for SLT/ATE Evaluation”
Sanghyun "S.H." Joo
ISC
JunHyuk Yang
ISC
Donggyun Woo
ISC
Mike Dell
ISC
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“System Level Test Needs, Requirements, and Equipment”
Richard "Rich" Karr
Texas Instruments
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“Design Strategy for Achieving a Transparent Probe Head”
Svetlana Sejas
Nidec SV TCL
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“ESD Protective Contactors for Optimal Test Performance”
David Skodje
Johnstech International
Emerson Reyes
Analog Devices
Ruel Cruz
Analog Devices
Raymond Sietereales
Analog Devices
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Poster Session
Poster Session

“Unleashing the Magic of Parallelism in ATE”
Senthilkumar Dhamodharan
Caliber Interconnect Solutions Pvt Ltd
Mohanasundaram "Mohan" Selvaraj
Caliber Interconnect Solutions Pvt Ltd
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“AI Chip Structure Test Challenge and AI Application Test Coverage Enhancement on ATE”
Corning Zhu
Enflame-tech
Winston Zhang
Enflame-tech
Jason Cao
Enflame-tech
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Sponsorship Directory

Please thank our sponsors who have made this event possible!


Additional sponsorships are available please contact TestConx office


Premier Sponsor



TSE Logo

Cohu, Inc. (NASDAQ: Cohu) has grown to become a global leader in test and handling equipment, thermal subsystems, interface solutions, vision inspection and MEMS test solutions, and a leader in printed circuit board test. We deliver leading-edge solutions to enable a smarter, safer, and more connected future. Cohu offers the broadest portfolio of equipment and services for back-end semiconductor manufacturing, including a one-stop-shop for test and handling equipment, thermal subsystems, test contacting, vision inspection, and MEMS test solutions.

Our enhanced product portfolio gives our customers the best possible combination of technologies to match their business and technical needs. Cohu’s product portfolio is focused on increasing yield, reducing cost of test and accelerating time-to-market.

Cohu has 50+ years of semiconductor test expertise providing optimal test contactor and probe pin solutions for every type of application and challenge, using innovative and sophisticated R&D methods.

Our solutions provide:

  • Best-in-class temperature range and accuracy
  • Innovative solutions with intelligent contactors to ensure test performance at every insertion
  • Reliable low-force contacting products
  • Wide range of high voltage and high current contactors
  • High-pin count, precision interface products
  • High performance interface solutions, including OTA mmWave applications and WLCSP probe heads
  • Integrated temperature controlled, intelligent contactors

Emeritus Sponsor



JohnstechLogo

JOHNSTECH INTERNATIONAL is a global R&D leader in the field of microcircuit testing, providing reliable, cost-effective testing solutions for automotive, commercial, and industrial applications. Founded in 1991 by David Johnson, Johnstech works together with the world’s most respected OSATs, foundries, and EDA companies to develop the most precise and dependable test contactors and test sockets on the marketplace today. For more info, visit www.johnstech.com.


Honored Sponsors



ISC Logo

Come visit us and see what we are all about as ISC.



IWIN Logo

IWIN test probe for high signal integrity at extremely high speed test.

We’ve achieved remarkable results in increasing the performance of probe by stamping technology.

We have not only realized making probe shorter, but also achieved innovative structural development that can show powerful characteristics with existing probe lengths.

Based on our technology, we promise to provide the best solution for your test environment.


TSE Logo

As a Technology and Science Enabler in the field of Semiconductor Test and Display Test, TSE has developed the innovative technologies needed by its customers and has engaged in continuous research and productivity improvement activities. Founded in 1994,it has engaged as a leader in interface systems for Semiconductor Test


Distinguished Sponsors



Backer Hotwatt Logo

Backer Hotwatt recently acquired Sun Electric Heater company, merging over a century’s worth of innovative and nimble solutions ingenuity with technical, design, and quality expertise. We design, test, and manufacture world-class component-level heating solutions to help solve tough application challenges. Our revolutionary mini cartridge heater, SunRod, is used for many OEM applications, including semiconductor test sockets, medical devices, and test and measurement equipment. This patented high-temperature heater offers longer life, uniform temperatures, and easy installation in the smallest devices, enabling engineers to meet the design challenges of highly miniaturized application requirements and to customize their heating element with value-added features..


ICE Logo

INNOVATIVE CIRCUITS ENGINEERING, INC. has been providing Reliability Testing, ESD Testing and Failure analysis to organizations around the globe for 30 years. We now offer a full suite of RF Testing solutions. We strive to maximize customer satisfaction with its close attention to customer requirements, devotion to quality and timely delivery. While providing innovative solutions to technical challenges is our goal.

JMT

JMT Inc. is a global leading test solution provider and has been providing unique rubber/PCR® test socket for fine pitch and high speed semiconductors to the global customers since 1988.

Becoming a family member of TFE Inc. in 2019, we have grown into a Total Test Solution Provider by adding Change Kit and Load Board/Burn-In Board in addition to PCR® Test Socket to our product portfolio. With our wide range of high performance testing products and solutions, we are ready for the new challenges of many advanced devices including RF, 5G, Mobile, Automotive & AI.

Download product information and contact us at jmt_01@jmt21.co.jp to learn more!

NIdec Sv TCL

Nidec SV TCL is a global provider of high-quality semiconductor testing solutions. Our extensive product line includes the innovative MEMS Probes and MEMS-based probe cards along with a variety of Vertical and Cantilever Probe Card technologies. Our proprietary MEMSFlex™ Probes are fully customizable, capable of both wafer/final test, and can be utilized for many advanced devices including RF, 5G, Mobile, Auto & IoT. We also have analytical and simulation capabilities along with full turnkey services for probe cards and final test.

Our unmatched worldwide infrastructure provides coverage for major semiconductor regions around the world with full design & manufacturing capabilities for our probe technologies in USA, China, Japan, Korea, Taiwan & Singapore.

Contact us at sales@nidecsvtcl.com to learn more!


R&D Altanova Logo

R&D Altanova is the leading provider of full turn-key test interface solutions to many of the world's largest integrated device manufacturers, fabless semiconductor companies and semiconductor foundries. Headquartered in New Jersey, R&D Altanova has offices and support teams around the world, including California, Pennsylvania, Costa Rica, Shanghai, and Taiwan.

We specialize in advanced turn-key test interface solutions for both wafer sort and final test applications. Our solutions include advanced in-house design and simulation (SI/PI), advanced fabrication capabilities (probe cards, interface PCB's, and MLO substrates) as well as full component and mechanical assembly.


UIGreen Logo

UI Green is a worldwide supplier of micro-precision components, spring probes, test sockets and connectors. By controlling the design and production of our spring pins, we are able to offer a broad array of spring probes for tester interfaces, test sockets, and wafer testing. We produce a broad array of test sockets including high performance coaxial sockets for reliable testing up to 56Gbps digital; QFN sockets for analog, RF, and automotive applications; and probe heads for WLCSP. You can find our sockets testing GPU, CPU, and WLCSP products.


Exhibitor Sponsors



ELES Logo

ELES is a worldwide TfR (Test for Reliability) company offering Solutions for all IC families.

The challenging quality and reliability requirements needed by automotive and mission critical applications, have led ELES to develop RETE (Reliability Embedded Test Engineering), an innovative approach encompassing HW, SW and methodology to help reaching zero-defects in products manufacturing.

Combining Stress and Test in the same platform, RETE collects a large quantity of data related to the weaknesses of devices. ELES’ “learn from failure” process makes it possible to reduce Burn-In quickly and safely since the more robust process allows to produce the devices without defects.

Contact us at SalesSEMI@eles.com


MJC Logo

MICRONICS JAPAN CO., LTD. (MJC) is a leading company in testing and measurement equipment for semiconductors who offer a lineup of leading-edge products that meet market needs.

Our J-contact that is uniquely designed “J” shaped structure reduces the pattern damage of load board surfaces. Our products are:

  • Suitable for high frequency test applications.
  • Scrubbing action resists contamination, reduces the need for cleaning, and provides long term durability & performance.
  • Support Kelvin test requirement.
  • Single needle replacement for easy repair.
  • Meet the high performance requirements for QFP, QFN testing applications.

Contact us at sales@mjcasia.com to learn more.



Phoenix Test Arrays

Phoenix Test Arrays is a leading supplier of high performance contact solutions for a wide range of IC test applications from manual lab characterization to high volume ATE production. Our proprietary Silmat® elastomeric technology delivers industry leading signal integrity and current carrying capacity to meet the demanding requirements of RF/mmWave, precision analog and high-speed digital devices. Innovative features and durable components enable reliable and consistent results in challenging test environments.

For over 20 years, our experienced team has delivered custom socket designs and integrated test solutions with fast lead times, responsive service and global support. Contact us today at info@phxtest.com to learn more and benefit from our innovative products, precision engineering and expertise you can trust.


Smiths Interconnect Logo

Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices as well as high performance spring probe technology and cable assemblies. Our extensive product portfolio accommodates devices with finest micro pitches as well as those with very high bandwidth requirements. Off-the -shelf and custom products are proven to deliver the best solution for the customer’s specific needs.