May 3-7, 2021 Free Virtual Event
Welcome to TestConX 2021!
We are excited to bring the knowledge and expertise of TestConX directly to you via live interactive virtual presentations. And registration is free courtesy of our sponsors.
Be sure to reserve May 3-7, 2021 from 7 - 10 am Pacific time for each day's session.
We are looking forward to having you join us in May!
Ila Pal & James Tong, Technical Program Co-chairs
Ira Feldman, General Chair
on behalf of the entire TestConX organization
5G/mmWave devices present significant challenges across semiconductor test industry, from instrumentation, material, test interconnects to HVM handling equipment. This session will start with an overview of 5G/mmWave testing, followed by a discussion on test platform and calibration techniques. We will take a deep dive on a socket and handler integration for OTA testing, then a comprehensive check on PCB design optimization for up to 70 GHz, and finish the session with a close examination of a novel structure of switching PCBs and contactors for mmWave testing.
Big data and machine learning is seemingly everywhere, with the technology becoming pervasive. In this session we look at new forms of data collection enabling big data and its use to solve problems in the semiconductor industry, specifically machine learning algorithms are being utilized to investigate the causal mechanisms of customer returns in a test flow of semiconductor manufacturing environment (resulting in Big Data). We also take time to come up to speed the other ‘big’ dataset as we do every year, the marketplace report and outlook!
Contact technology plays a critical role in making stable electro-mechanical contact from the semiconductor processor to the PCB, with critical challenges rising from denser pitch on the lands/solder-balls, higher pin and I/O count, larger package size, RoHS lead-free, shortening of time-to-market, cost control. In this session, we will start with proposing a structure to prevent crosstalk of elastomer sockets to improve transmission losses and reduce costs. Second presentation will be on understanding resistance fluctuations in contacts under high current loading. Third presentation will show how important lower ground inductances are to devices performance operating at high frequencies that affect device test yields. Final presentation will be on the importance of using high frame rate microscope cameras in a test environment for motion studies.
This session will discuss solutions including an alternative low cost approach that lets the user source analog signals using pre-existing high-speed digital instruments, challenges on testing Bluetooth earphone device in ATE, modeling and measurement of high bandwidth devices with minimized error, and a roadmap and expectations for 30-70 GHz signals in a load board or probe card. You will also learn about a new high performance PCB interposer design used for evaluating different PAM4 SERDES performance without the need to redesign the validation platform. Finally, a new socket design for desktop CPUs will be discussed for enabling higher CPU frequencies.
Creating a reliable and performant test-cell is a challenging task, independent of if it is for system-level test, final test or wafer probe configuration. Many different aspects need to be considered to become successful. In this session, we will put the spotlight on four specific areas from all three test areas. We will start with a look at System-Level test, before taking on the challenge of large fan-out for wafer probe heads. Next we will understand why electro-static discharge management is critical to the test industry, and we will finish with an in-depth look into the technology of elastomer contactors.