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Tuesday March 7, 2023
7:00 a
Continental Breakfast
Start the day right and enjoy the continental breakfast while networking with other attendees.
8:00 a
Market
“Status of the Burn-in and Test Socket Market”
“Future of Test Connectivity Systems”
Operations 1
“The Heterogeneous Road is Paved with Data”
“Comparison of State-of-The-Art Models for Socket Pin Defect Detection”
10:00 a
Poster Break and Networking
“The deskewing technology for channel branching with fan-out buffers to implement a high parallelism probe card”
“A Statistical Approach To Grouping Pins During Testing To Achieve Optimized Test Limits”
“Yield Enhancement through Novel Procedure of Redundancy Analysis for Massive DRAM Wafer Test”
“3D MEMS coaxial structure for 0.6mm pitch high speed connector up to 60GHz”
“Review of Polymer Materials Utilized in Test Socket Applications with a Comparison of Key Material Properties”
“On-Die Measurement and Simulations Based Co-Validation of DDR5 and Beyond”
11:00 a
Operations 2
“Flexible Burn-in Sampling Plans”
“Design for Stress”
“New ATE Testing Techniques Using PCl-Express with Link Scale-PCIe to Solve Scan, Structural Protocol and Third-Party Integration Challenges”
12:30 p
Lunch
Lunch is served. Enjoy the break and networking time.
1:30 p
Validation & Simulation
“Using Encrypted HFSS models in HFSS to Determine System Performance”
“Correlation and Verification of a Simulation Model to a Measured Result”
“Closed loop simulation and measurement of a test socket on a load board”
“Analysis of Test Socket Performance and Overall Equipment Effectiveness”
3:30 p
TestConX EXPO
Continue to explore the great exhibits at the TestConX EXPO. There is always something new to see or someone new to meet. Refreshments and drinks are served but don't spoil your appetite before the TestConX Social...
6:30 p
TestConX Social Event
Continue the networking with your colleagues and industry friends at the TestConX Social Event.
There will be lots of fun and great food in store!
9:00 p
Adjourn
Program subject to change without notice.