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Tuesday March 7, 2023

7:00 a

Continental Breakfast

Start the day right and enjoy the continental breakfast while networking with other attendees.

8:00 a

Market

Red Mountain Ballroom

Market

“Evolution of Semiconductor Technologies with New Applications Are Bringing A Bigger Stage for Test Suppliers”

Lin Fu

Yole Intelligence

John West

Yole Intelligence

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“Future of Test Connectivity Systems”

Panchami Phadke

TechInsights

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Session 5

Red Mountain Ballroom

Operations 1

“The Heterogeneous Road is Paved with Data”

Kenneth "Ken" Butler

Advantest

Keith Schaub

Advantest

Sonny Banwari

Advantest

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“Comparison of State-of-The-Art Models for Socket Pin Defect Detection”

Vijayakumar Thangamariappan

Advantest

Nidhi Agrawal

Advantest

Jason Kim

Advantest

Constantinos Xanthopoulos

Advantest

Ira Leventhal

Advantest

Ken Butler

Advantest

Joe Xiao

Essai

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10:00 a

Poster

Red Mountain Ballroom

Poster

“The deskewing technology for channel branching with fan-out buffers to implement a high parallelism probe card”

Yun-hyok Choi

Sungkyunkwan University

Byung-sung Kim

Sungkyunkwan University

Gyu-Yeol Kim

Samsung Electronics

Cheol-Heui Park

Samsung Electronics

Jaewoong Choi

Samsung Electronics

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“A Statistical Approach To Grouping Pins During Testing To Achieve Optimized Test Limits”

Deepak "Deepak M E" Musuwathi Ekanath

NXP Semiconductors

Matthew Crain

NXP Semiconductors

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“3D MEMS coaxial structure for 0.6 mm pitch high speed connector up to 60 GHz”

Tae Kyun "Steve" Kim

Microfriend

Yong Ho "YH" Cho

Microfriend

Jong Gwan Yook

Yonsei University

Joo Yong "JY" Kim

Microfriend

Sang Taek Oh

TLB Co., Ltd.

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“Review of Polymer Materials Utilized in Test Socket Applications with a Comparison of Key Material Properties”

Michael "Mike" Tustin

Ensinger

Louis Lau

Ensinger

Nami Lohbeck

Ensinger

Anton Schranner

Ensinger

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“High frequency High pin count test socket”

Hyungjun "AJ" Park

IWIN

Sang Yang "Samuel" Pak

IWIN

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“High current carrying spring probe 30 Amps/pin”

Hyungjun "AJ" Park

IWIN

Sang Yang "Samuel" Pak

IWIN

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11:00 a

Session 6

Red Mountain Ballroom

Operations 2

“Flexible Burn-in Sampling Plans”

Horst Lewitschnig

Infineon Technologies Austria AG

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“Design for Stress”

Joao Goncalves

Infineon

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“Portable Stimulus Test Development and Execution on ATE Systems”

Dave Armstrong

Advantest

Marcus Schulze Westenhorst

Advantest

Markus Buecker

Advantest

Klaus Dieter Hilliges

Advantest

Mate Burazin

Advantest

Mate Burazin

Advantest

Mate Burazin

Advantest

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12:30 p

Lunch

Lunch is served. Enjoy the break and networking time.

1:30 p

Session 7

Red Mountain Ballroom

Validation & Simulation

“Optimizing and Correlating a Spring Probe Contactor Electrical Performance Using RF Modeling”

James Hattis

Johnstech International

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“Full RF Characterization of Contactor Design on Load Board”

Aaren Lonks

Cohu

Nadia Steckler

Cohu

Jason Mroczkowski

Cohu

Noel Del Rio

NXP Semiconductor

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“Analysis of Test Socket Performance and Overall Equipment Effectiveness”

Lambert "Bert" Brost

Technoprobe

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“Using Encrypted HFSS models in HFSS to Determine System Performance”

Jeff Sherry

Johnstech International

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3:30 p

TestConX EXPO

Continue to explore the great exhibits at the TestConX EXPO. There is always something new to see or someone new to meet. Refreshments and drinks are served but don't spoil your appetite before the TestConX Social...

6:30 p

TestConX Social Event

Continue the networking with your colleagues and industry friends at the TestConX Social Event.

There will be lots of fun and great food in store!

9:00 p

Adjourn

Program subject to change without notice.