TestConX 2023 – Tuesday

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Tuesday March 7, 2023

7:00 a

Continental Breakfast

Start the day right and enjoy the continental breakfast while networking with other attendees.

8:00 a

Market
Red Mountain Ballroom
Market
“Status of the Burn-in and Test Socket Market”
Lin Fu
Yole Intelligence
John West
Yole Intelligence
“Future of Test Connectivity Systems”
Panchami Phadke
TechInsights
Session 5
Red Mountain Ballroom
Operations 1
“The Heterogeneous Road is Paved with Data”
Keith Schaub
Advantest
“Comparison of State-of-The-Art Models for Socket Pin Defect Detection”
Vijayakumar Thangamariappan
Advantest
Nidhi Agrawal
Advantest
Jason Kim
Advantest
Constantinos Xanthopoulos
Advantest
Ira Leventhal
Advantest
Ken Butler
Advantest
Joe Xiao
Essai

10:00 a

Poster
Red Mountain Foyer
Poster Break and Networking
“The deskewing technology for channel branching with fan-out buffers to implement a high parallelism probe card”
Yun-hyok Choi
Sungkyunkwan University
Byung-sung Kim
Sungkyunkwan University
Gyu-Yeol Kim
Samsung Electronics
“A Statistical Approach To Grouping Pins During Testing To Achieve Optimized Test Limits”
Deepak Musuwathi Ekanath
NXP Semiconductors
Matthew Crain
NXP Semiconductors
“Yield Enhancement through Novel Procedure of Redundancy Analysis for Massive DRAM Wafer Test”
Eun-Sun Jeon
Samsung
Gyu-Yeol Kim
Samsung
“3D MEMS coaxial structure for 0.6mm pitch high speed connector up to 60GHz”
Tae Kyun "Steve" Kim
Microfriend
Yong Ho "YH" Cho
Microfriend
Jong Gwan Yook
Yonsei University
Joo Yong "JY" Kim
Microfriend
Sang Taek Oh
TLB Co., Ltd.
“Review of Polymer Materials Utilized in Test Socket Applications with a Comparison of Key Material Properties”
Michael "Mike" Tustin
Ensinger
Louis Lau
Ensinger
Nami Lohbeck
Ensinger
Anton Schranner
Ensinger
“On-Die Measurement and Simulations Based Co-Validation of DDR5 and Beyond”
Xiao-Ming Gao
Intel

11:00 a

Session 6
Red Mountain Ballroom
Operations 2
“Flexible Burn-in Sampling Plans”
Horst Lewitschnig
Infineon Technologies Austria AG
“Design for Stress”
Joao Goncalves
Infineon
“New ATE Testing Techniques Using PCl-Express with Link Scale-PCIe to Solve Scan, Structural Protocol and Third-Party Integration Challenges”
Brendan Tully
Amazon
Michael Kozma
Advantest

12:30 p

Lunch

Lunch is served. Enjoy the break and networking time.

1:30 p

Session 7
Red Mountain Ballroom
Validation & Simulation
“Using Encrypted HFSS models in HFSS to Determine System Performance”
Jeff Sherry
Johnstech International
“Correlation and Verification of a Simulation Model to a Measured Result”
James Hattis
Johnstech International
“Closed loop simulation and measurement of a test socket on a load board”
Noel Del Rio
NXP Semiconductor
Nadia Steckler
Cohu
“Analysis of Test Socket Performance and Overall Equipment Effectiveness”
Lambert "Bert" Brost
Technoprobe

3:30 p

TestConX EXPO

Continue to explore the great exhibits at the TestConX EXPO. There is always something new to see or someone new to meet. Refreshments and drinks are served but don't spoil your appetite before the TestConX Social...

6:30 p

TestConX Social Event

Continue the networking with your colleagues and industry friends at the TestConX Social Event.

There will be lots of fun and great food in store!

9:00 p

Adjourn

Program subject to change without notice.