TestConX 2023 – Wednesday

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Wednesday March 8, 2023

7:00 a

Continental Breakfast

Start the day right and enjoy the continental breakfast while networking with other attendees.

8:00 a

Session 8
Red Mountain Ballroom
Materials
“Metal insulator transition materials for next generation semiconductor test socket”
Hansang Kwon
Pukyong National University
“Critical Properties for Selecting Plastic Materials”
Scott Williams
Port Plastics
“Novel graphene enhanced thermal interface materials for thesting and thermal burn-in applicationsrmal te”
Kristoffer Martinsen
Smart High Tech AB
Lars Almhem
Smart High Tech AB
Hongfeng Zhang
Smart High Tech AB
Johan Liu
Smart High Tech AB
“Challenges faced for TIM Selection for Production Testing & Packaging”
Kim Wee "Ivan" Tan
Inspiraz Technology

10:00 a

Break & Networking

Enjoy the break and networking time.

10:30 a

Session 9
Red Mountain Ballroom
Thermal
“Compensation of device power dissipation during test”
Markus Harzenetter
esmo USA
“IC Chip Testing in Liquid Cooled Socket”
Jiachun "Frank" Zhou
Smiths Interconnect
Annie Mu
Smiths Interconnect
Cleveland Chen
Smiths Intercconect
“Thermal and Mechanical Challenges for Test Handlers”
Jerry Tustaniwskyj
Cohu
Ernest Blanco
Cohu

12:00 p

Closing
Red Mountain Ballroom
Awards & Closing Remarks

It's been three and a half days packed with learning, exploring, and sharing. Before we pack our bags and take what we've learned back to our jobs, there are a few closing remarks. We will take a moment to reflect and recognize the people, presentations, and posters that have distinguished themselves at TestConX 2023.

12:30 p

Workshop Adjourns

Program subject to change without notice.