TestConX 2022 – Monday

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Monday May 2, 2022

7:00 a

Continental Breakfast

Start the day right and enjoy the continental breakfast while networking with other attendees.

8:30 a

Welcome
Red Mountain Ballroom
Opening Remarks

Welcoming remarks from the General Chair, Ira Feldman

9:00 a

Keynote
Red Mountain Ballroom
Keynote
“Fulcrum of Innovation: From Chemistry to Metallurgy”
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Ross Berntson

Ross Berntson

President and COO
Indium Corporation

Humans began their metallurgical journey in 10,000 BC with the copper age and shortly thereafter learned how to produce the first solder interconnects (my focus) after which, despite enormous gains elsewhere in the material world, humans were distracted and innovation paused. Solder stayed solder and joints would be largely recognizable to our Egyptian and Sumerian ancestors.
 
Oh, you may say that the conversion to Pb-free solder was a notable detour, but the lack of imagination created a consensus around SnAgCu alloys that were largely based on mimicking the performance of their SnPb predecessors. Perhaps our researchers were enthralled by the polymer age and that novel adhesives, underfills, and encapsulants could solve all our assembly problems. This approach is now failing. Metallurgists today are liberated to explore the periodic table and the unique properties of metals to create solutions for the demanding electronics assembly industry. The solutions included enhanced reliability, reduced carbon footprints, increased thermal performance, and rapid assembly and prototyping. Egyptian and Sumerian artisans would be amazed and inspired, as I hope you will be. Together, we can design our companies to keep the innovations flowing and enable materials science to change the world yet again.

 

Keynote sponsored by Smiths Interconnect Smiths Interconnect Logo

10:00 a

Break & Networking

Enjoy the break and networking time.

10:30 a

Session 1
Red Mountain Ballroom
5G and millimeter-wave (mm-wave)
“High Volume Manufacturing of 5G RF Transceivers”
David Vondran
Teradyne
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“Analytical Approach to ADC/DAC PCB Design for 5G Baseband Device Testing”
Best Data
Noel Del Rio
NXP Semiconductors
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“A Handler-based Solution for 60 GHz AiP DUT Testing (and an Early Look at Test Results)”
Brian Wadell
Teradyne
Jonathan Williams
Teradyne
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12:30 p

Lunch

Lunch is served. Enjoy the break and networking time.

1:30 p

Session 2
Red Mountain Ballroom
Contact Technology
“Bridging the Gap, Part 2”
Paul Schubring
HighRel
Dan Hwang
HiCon Global
Noel Del Rio
NXP Semiconductors
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“Next-Generation Grounding Solution for Small Leadless Packages - Blade Compliant Ground (BCG)”
Max Carideo
Johnstech
Valts Treiberg
Johnstech
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“The Next Generation of True Kelvin Spring Probes”
Lambert "Bert" Brost
Technoprobe
Ming-Ting Wu
Microfabrica
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4:00 p

Session 3
Red Mountain Ballroom
Operations 1
“An intelligent automation tool for ATE engineers”
Prabakaran "Prabakaran K" Krishnasmy
Caliber Interconnect Solutions Pvt Ltd
Mark Berry
Caliber Interconnect Solutions Pvt Ltd
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“Smart Manufacturing - Edge Computing Inference Opportunities and Challenges in ATE”
Eli Roth
Teradyne Inc
Pady Kannampalli
Teradyne Inc
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“Nx-Lab - The Next Generation Test Floor Management System”
Most Educational
Seong Guan "SG" Ooi
Intel
Daryl Wei Zhung
Intel
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6:00 p

TestConX EXPO & Reception

The TestConX EXPO is a very popular part of the TestConX program with many great exhibits for connecting electronic test professionals to solutions. There is always something new to see or someone new to meet. Not to mention excellent food, drinks, and time for attendees to network with exhibitors!

9:00 p

Adjourn

Program subject to change without notice.