TestConX 2022 – Monday

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Monday May 2, 2022

7:00 a

Continental Breakfast

Start the day right and enjoy the continental breakfast while networking with other attendees.

8:30 a

Welcome
Red Mountain Ballroom
Opening Remarks

Welcoming remarks from the General Chair, Ira Feldman

9:00 a

Keynote
Red Mountain Ballroom
Keynote
“TBA”
 
 
 

Keynote sponsored by Smiths Interconnect Smiths Interconnect Logo

10:00 a

Break & Networking

Enjoy the break and networking time.

10:30 a

Session 1
Red Mountain Ballroom
5G and millimeter-wave (mm-wave)
“Multi site OTA testing for mmWAVE AiP device”
Yasunori Yamaguchi
DENKEN CO.,LTD.
“Test challenges and solution trends for Big Data wireless, optical, and digital ICs.”
Jeorge Hurtarte
Teradyne
“Analytical Approach to ADC/DAC PCB Design for 5G Baseband Device Testing”
Noel Del Rio
NXP Semiconductors

12:30 p

Lunch

Lunch is served. Enjoy the break and networking time.

1:30 p

Session 2
Red Mountain Ballroom
Contact Technology
“Introduction of unique Coaxial socket with the use of Flexible Printed Circuit (FPC)”
Hokuto "Paul" Kanesashi
Enplas
“56Gbps High-Speed Test at Wafer Sort”
Douglas Malech
Multilane
Chuong Hyunh
Multilane
Jeffery "Jeff" Arasmith
Technoprobe
“55GHz Octal-site Wafer Test Probecard for 5G mmWave devices”
Jason Mroczkowski
Cohu

4:00 p

Session 3
Red Mountain Ballroom
Operations 1
“Bridging the Gap”
Paul Schubring
HiCon Global
Dan Hwang
HiCon Global
Noel Del Rio
NXP Semiconductors
“Blade Compliant Ground (BCG)”
Max Carideo
Johnstech
Valts Treibergs
Johnstech
“The Next-Generation of True Kelvin Spring Probes”
Lambert "Bert" Brost
Technoprobe
Ming-Ting Wu
Microfabrica

6:00 p

TestConX EXPO & Reception

The TestConX EXPO is a very popular part of the TestConX program with many great exhibits for connecting electronic test professionals to solutions. There is always something new to see or someone new to meet. Not to mention excellent food, drinks, and time for attendees to network with exhibitors!

9:00 p

Adjourn

Program subject to change without notice.