Virtual Event May 11-13, 2020
TestConX is a global community of test professionals. In order to allow everyone who is registered to participate in the live sessions, we will be repeating each set of presentations twice (A & B). This will give everyone two opportunities to see the three sessions of presentations regardless of where they are located. Since these will be interactive presentations, they may differ depending upon the questions asked.
Below are the session times in each timezone. The interactive presentations will also be recorded and available in the Premium Archive shortly after the event.
Registered Virtual Event attendees will automatically receive emails from Zoom (by May 8) with unique personalized access links for the live interactive presentations. Six total emails (one per session) will be sent with each link good for only the specified session. You may use the appropriate links in each email to add the desired sessions to your calendar. Feel free to attend as many as you would like and ignore the rest. No need to register further.
Interactive Session 1 A&B
Welcoming remarks from the General Chair, Ira Feldman
Demands for entertainment connectivity, edge computing, energy efficiency, speed, convenience, safety, and much more are driving changes in electronic architecture, especially advanced packaging. This presentation will examine the advances in materials technologies, with an emphasis on the interconnect systems and thermal management necessary to support these new packages. Performance, processing challenges, and total cost will be discussed for each material. The presenter will also share some of the roadmap gaps that need to be addressed with new materials as well as possible solutions.
Keynote sponsored by SmithsInterconnect
Interactive Session 2 A&B
Interactive Session 3 A&B
Program subject to change without notice.