TestConX 2020 Interactive Sessions

Image

Virtual Event May 11-13, 2020

 
 

TestConX is a global community of test professionals. In order to allow everyone who is registered to participate in the live sessions, we will be repeating each set of presentations twice (A & B). This will give everyone two opportunities to see the three sessions of presentations regardless of where they are located. Since these will be interactive presentations, they may differ depending upon the questions asked.

Below are the session times in each timezone. The interactive presentations will also be recorded and available in the Premium Archive shortly after the event.

Image

Registered Virtual Event attendees will automatically receive emails from Zoom (by May 8) with unique personalized access links for the live interactive presentations. Six total emails (one per session) will be sent with each link good for only the specified session. You may use the appropriate links in each email to add the desired sessions to your calendar.  Feel free to attend as many as you would like and ignore the rest. No need to register further.

Interactive Session 1 A&B

Welcome
Opening Remarks

Welcoming remarks from the General Chair, Ira Feldman

“Welcome”
Video Player Goes Here
PDF-Icon 150x139 Presentation Download
Keynote Preview
Keynote Preview
“Materials Science Innovation in Advanced Packaging (1A)”
pdf-coming-soon
Subscribe to access PREMIUM content today.
“Materials Science Innovation in Advanced Packaging (1B recording)”
Image
Ross Berntson
President and COO
Indium Corporation

Demands for entertainment connectivity, edge computing, energy efficiency, speed, convenience, safety, and much more are driving changes in electronic architecture, especially advanced packaging. This presentation will examine the advances in materials technologies, with an emphasis on the interconnect systems and thermal management necessary to support these new packages. Performance, processing challenges, and total cost will be discussed for each material. The presenter will also share some of the roadmap gaps that need to be addressed with new materials as well as possible solutions.


Keynote sponsored by SmithsInterconnect SmithsInterconnect

Market Report
Market Report
Updates on the test & test consumables market
“Market Overview (1A recording)”
Ira Feldman
Feldman Engineering
PDF-Icon 150x139 Presentation Download
“Market Overview (1B recording)”
“What Does the Rapid Growth in Systems Level Test Mean for You? (1A recording)”
John West
VLSI Research
PDF-Icon 150x139 Presentation Download
“What Does the Rapid Growth in Systems Level Test Mean for You? (1B recording)”
Best Poster
Best Poster
“RF Multiple Cavity Structure of PCBs Using Coaxial Metal Walls (1A recording)”
Best Poster
Takasuke Hashimoto
JC Electronics Corporation
Masamichi Shigemura
JC Electronics Corporation
Masakazu Aoto
JC Electronics Corporation
pdf-coming-soon
Subscribe to access PREMIUM content today.
“RF Multiple Cavity Structure of PCBs Using Coaxial Metal Walls(1B recording)”

Interactive Session 2 A&B

Best of TestConX 2020
5G and OTA Testing
“Socket Design and Handler Integration Challenges in Over the Air Testing for 5G Applications (2A recording)”
Best Presentation
Jose Moreira
Advantest
Natsuki Shiota
Advantest
Hiroyuki Mineo
Advantest
Aritomo Kikuchi
Advantest
Hiromitsu Takasu
Advantest
PDF-Icon 150x139 Presentation Download
“Socket Design and Handler Integration Challenges in Over the Air Testing for 5G Applications (2B recording)”
“Over the Air Test Solution for New 5G / mm-Wave Band Wireless ICs (2A recording)”
Attendee Choice
Yukang "Dylan" Feng
Cohu
PDF-Icon 150x139 Presentation Download
“Over the Air Test Solution for New 5G / mm-Wave Band Wireless ICs (2B recording)”
“RF Test Strategies and Solutions for 5G Millimeter Wave Devices (2A recording)”
Most Inspirational
Jeorge Hurtarte
Teradyne
PDF-Icon 150x139 Presentation Download
“RF Test Strategies and Solutions for 5G Millimeter Wave Devices (2B recording)”

Interactive Session 3 A&B

Best of TestConX 2020
Power Integrity, mmWave, and Validation
“Power Integrity in Load Boards from the GND Up (3A recording)”
Most Educational
Don Thompson
R&D Altanova
PDF-Icon 150x139 Presentation Download
“Power Integrity in Load Boards from the GND Up (3B recording)”
“Thermal Challenges in Enabling Validation & Test of 3D Package on Package (3A recording)”
Attendee Choice
Ying-feng Pang
Intel
Arunima Panigrahy
Intel
Jack Mumbo
Intel
Michael Apodaca
Intel
Victor Polyanko
Intel
PDF-Icon 150x139 Presentation Download
“Thermal Challenges in Enabling Validation & Test of 3D Package on Package(3B recording)”
“Pin Savers: Enabling ATE testing 81GHz mmWave RFCOM SoC Device (3A recording)”
Attendee Choice
Guor-Chaur Jung
Texas Instruments
James "Mr. T" Tong
Texas Instruments
PDF-Icon 150x139 Presentation Download
“Pin Savers: Enabling ATE testing 81GHz mmWave RFCOM SoC Device(3B recording)”

Program subject to change without notice.