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Session 1 - September 13, 2016
- Opening Remarks
- Keynote - Evolutions in Packaging Technologies for IoT – Assembly and Testing
- Implementation Challenges of an ATE Test Cell for At-Speed Production Test of 32 Gbps Applications
- Addressing Challenges in High Temperature Burn-In
- Derating Transient Voltage Suppressor Diodes for Burn-In Applications
- An Ignorable Testing Technology for High Speed/Frequency Device Testing