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TestConX 2019 – Overview

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Overview
Sunday
Monday
Tuesday
Wednesday

Overview


Sunday March 3, 2019

  • Optional Tutorial
    • Beyond Sort, Burn-In, and Class Testing: Post Silicon Validation Hardware Strategy
  • Welcome Reception & Dinner
  • Invited Speaker
    • Jan Vardaman,TechSearch International, Inc.


Monday March 4, 2019

  • Keynote
    • Michael Campbell, Qualcomm
  • Technical Sessions
    • High Frequency, 5G, and millimeter-wave
    • Validation 1
    • Advanced Packaging
    • Validation 2
    • System Level Test
    • Validation 3
  • Poster Session
  • TestConX EXPO & Reception


Tuesday March 5, 2019

  • Distinguished Speaker
    • Tawfik Arabi, Intel
  • Technical Sessions
    • Printed Circuit Board 1
    • Market Session
    • Printed Circuit Board 2
    • Contact Technology
    • Printed Circuit Board 3
  • TestConX EXPO
  • TestConX Social Event


Wednesday March 6, 2019

  • Technical Sessions
    • Thermal
    • Operations
  • Awards

Program subject to change without notice.

Overview
Sunday
Monday
Tuesday
Wednesday

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