Test socket solutions and the requirements of the device under test (DUT) vary according to the device end application. This session spans the socket spectrum from automotive applications, which require devices to withstand extreme temperature and high current, to mobile applications, which have high cost sensitivity. Markus Wagner, Cohu, explores contacting solutions for high power bare die testing. Valts Treibergs, Xcerra, compares different methods for determining current carrying capacity in test socket interconnects. Andreas Nagy, Xcerra, gives an overview of test temperature requirements of automotive and consumer applications and discusses consequences for test strategies. Praveen kumar Ramamoorthy, Infineon, focuses on socket design and development specifically for the extreme temperature and high current testing challenges of automotive devices.
"Contacting Solutions for High Power Bare Die Testing (IGBT MOS-FET and Diodes)"
Markus Wagner
Cohu SEG
"Comparison of Different Methods in Determining Current Carrying Capacity of Semiconductor Test Contacts"
Valts Treibergs
Xcerra Corporation
"Are New Temperature Test Strategies Needed? Meeting Performance and Cost Requirements of Today’s Applications"
Andreas Nagy
Xcerra Corporation
"Extreme Temperature and High Current Testing Challenges of Automotive Devices"
Praveen kumar Ramamoorthy, Murad Hudda
Infineon Technologies
Dan Maccoux
JF Microtechnology SDN BHD
Muhamad Izzat bin Roslee
JF Microtechnology Berhad
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