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Awards & Closing RemarksIt's been three days packed with learning, exploring and sharing, but now it's time to pack our bags and take what we've learned back to our jobs. But first, there are a few closing remarks and some recognition to the people and papers that have distinguished themselves in one way or another at BiTS 2013.
General Chairman, BiTS Workshop
“Auto Centering Manual Actuator
One Manual Lid for Different Package Sizes Testing”
Ying Hoe Mah, Shamal Mundiyath
JF Microtechnology Berhad
"High Temperature Burn-in (Up to 200 Deg. C): Are We Ready Yet?"
Noriyuki Matsuoka, Kazumi Uratsuji
Yamaichi Electronics Co., Ltd.
Yamaichi Electronics USA
NGK Insulators, Ltd.
"Bridging Between 3D and 3D TSV Stacking Technologies"
Belgacem Haba, Ph.D.
"Anatomy of a Socket"
Paul F. Ruo
Aries Electronics, Inc.
"Optimization of Package, Socket, and PC board for 25 to 40GHz RF Devices"
Carol McCuen, Phil Warwick
R & D Circuits
"Die-Cracking Failure Analysis of QFN Packages in Manual Test Handler"
M.P. Divakar, PhD
Stack Design Automation
Return to the 2013 BiTS Workshop Archive index page