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Burn-in & Test
Socket WorkshopTM |
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BiTS
is the world's premier workshop dedicated to
providing a forum for the latest information
about burn-in and test socketing, and related
fields.
At BiTS you'll find a comprehensive technical
program, exhibits of the latest products and
services, and many opportunities to meet,
network and explore ideas with other test and
burn-in socketing professionals.
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ARCHIVE PAGES |
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COPYRIGHT NOTICE |
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The papers in this publication
comprise the proceedings of the 2007 BiTS Workshop. They reflect the authors’
opinions and are reproduced as presented , without change. Their inclusion in
this publication does not constitute an endorsement by the BiTS Workshop, the
sponsors, BiTS Workshop LLC, or the authors.
There is NO copyright protection claimed by this publication or the authors.
However, each presentation is the work of the authors and their respective
companies: as such, it is strongly suggested that any use reflect proper
acknowledgement to the appropriate source. Any questions regarding the use of
any materials presented should be directed to the author/s or their companies.
All photographs on this page are copyrighted by BiTS Workshop LLC. The BiTS logo
and ‘Burn-in & Test Socket Workshop’ are trademarks of BiTS Workshop LLC.
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Technical Program
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More than 25
presentations addressing important topics in socketing and related
areas were delivered by authors from the user and supplier communities.
Two Tutorials were offered
where you can learn from experts to build your leading edge skills.
A respected Invited Speaker
shared his views on the socket industry from a unique perspective.
In the keynote address, a renowned
industry leader spoke on a key topic sure to stimulate thoughts and
ideas.
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BiTS EXPO
2007
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58 exhibitors, from socketing
and related industries, exhibited their products and
services during breaks in the technical program. Click HERE for more info.
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Participants
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BiTS 2007 brought together 360 full-conference attendees and 58 exhibitors from
around the world, representing end users and suppliers of sockets, boards,
burn-in systems, handlers, packages and other related equipment, materials and
services.
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BiTS 2007 in the Press
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BiTS 2007 Organizing Committee
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Rafiq Hussain (AMD),
Fred Taber (BiTS
Workshop), Mike Noel (Freescale), Marc Knox (IBM), Steve Hamren (Micron Technology), Owen Prillaman (Yamaichi Electronics),
Valts Treibergs (Everett Charles Technologies), Mark
Murdza (Antares Advanced Test Technologies), Not pictured: Paul Boyce (Advantage Specialist),
John Ambrosini (Enplas -Tesco), John Moore (Texas Instruments)
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BiTS
2007 TUTORIALS |
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Tutorial 1 |
ATE
Printed Circuit Board Design; Performance vs. Design for Manufacturability
vs. Time to Test |
2007tutorial1arobio.pdf
(3 MB)
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Steve Arobio
Chief Operating Officer
Dynamic Test Solutions |
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| Current
printed circuit board design requirements have challenged the
manufacturing processes to new limits. In the ATE industry in
particular, test performance, signal speeds, multi-site device
testing and shortened time to test demands have pushed the PCB
Industry to more layers, tighter pitch, higher aspect ratios,
exotic materials and customized processes. At times, the
consequences have been poor yields, extensive test floor
trouble-shooting, longer lead times and higher costs. This
tutorial will address several of the performance drivers, along
with the possible trade-offs associated with each of them, to give
the Test Engineer a choice. |
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Tutorial 2 |
An
Overview of Critical Issues in IC Packaging |
2007tutorial2cohn.pdf
(20.3 MB)
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Charles Cohn
Senior Analyst
TechSearch International |
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| Semiconductor
packaging has become increasingly critical as the package becomes
the limiting factor in integrated circuit (IC) performance. This
tutorial provides insight into the important aspects of these
critical packaging issues. Topics include an overview of the IC
packages used in volume production, trends in IC packages such as
body size, pin count, and package pitch. Materials and test issues
will also be addressed. |
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| Invited
Speaker |
From
the Frying Pan Into the Fire; Working on Both Sides of the Tooling Supply
Chain |
2007invited.pdf
(714 KB)
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Steven B. Strauss
VP of Engineering
Antares Advanced Test Technologies |
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For many years I was the consumer of test technology and test
tooling at Intel Corporation. In the last year I have jumped from the 'frying
pan into the fire'. Now I am the VP of Engineering at Antares Advanced Test
Technologies. My responsibilities in this new role include supplying the test
tooling needs for many customers.
This experience in the role of supplier has been a learning experience.
Having spent time in both roles I can compare and contrast the challenges of
both supplier and customer. My intent in this presentation is to highlight the
issues and challenges that occur when suppliers have to respond to the demands
of customers.
At the root of these issues are always the assumptions that are made by the
customers with respect to the capabilities of suppliers and vice versa.
Differences are abound in technology, measurement, supplier management,
effectiveness of customer specifications, mid-stream design and requirements
changes and risks that can be assumed as well as political considerations for
all parts of the supply chain.
Mr. Strauss is the Vice President of
Engineering at Antares Advanced Test Technologies. Prior to joining
Antares, he held the position of Intel's Test Tooling Operation Manager,
where he was responsible for enabling and providing test tooling
collaterals to design, development and high volume factories. Mr.
Strauss delivered the Keynote Address at the 2002 BiTS Workshop. |
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BiTS
2007 TECHNICAL PROGRAM - SESSIONS
Covering the Latest Information on Important
Topics in Socketing and Related Areas |
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CHALLENGES
DAY |
| Opening
Remarks |
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2007welcome.pdf
(457 KB)
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| Welcoming remarks from the General
Chair |
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BiTS 2007 Keynote
Address
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The
Impact of New Applications and Increasing Device Complexity on the Future of
Testing |
2007keynote.pdf
(3.79 MB)
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Mr. Appleton is Chairman of the Board, Chief
Executive Officer and President of Micron Technology, Inc. He joined Micron
in 1983 and has held a series of increasingly responsible positions,
including Production Manager, Director of Manufacturing and Vice President
of Manufacturing. In 1994, Mr. Appleton was appointed to his current
position of Chairman, Chief Executive Officer and President.
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Steven R. Appleton
Chairman, CEO and President, Micron Technology
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| The emergence of consumer
applications, coupled with advances in highly integrated packages,
has significantly changed both the economic equation and the
technical challenges for testing new complex devices.
The wide variety of applications requiring
various levels of quality and reliability, combined with their
vastly different product life cycles, also poses a need to rethink
the industry's historical perspective of "one size fits
all".
We will explore these topics in light of current
market trends and their impact on test costs and strategies moving
forward.
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Session 1 |
Designing for Socket Electrical Integrity |
2007s1.pdf
(3.23 MB)
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limitations of test hardware can be found in almost any family of
products. Whether it's high speed, low power memory DUT's, ultra fast
wireless DUT's, or high power processors, the need to create mechanically
and electrically predictable interfaces demand more from today's socket
designer. This session will delve into the electrical attributes that are
commonly monitored, and how they can affect the quality of test. |
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"Determining Inductance In Contactors" |
Ryan Satrom
Everett Charles Technologies |
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| "Evaluation
of a New Low Inductance Socket Technology - For High Speed Memory
Device Testing" |
Joachim Moerbt
Advantest (Europe) GmbH |
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| "Socket
Life Cycle RF Testing" |
Gert Hohenwarter
GateWave Northern, Inc. |
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Session 2 |
Socket
Analysis and Characterization Methods |
2007s2.pdf
(1.25 MB)
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Test and Burn-in Socket world is continually changing. Challenges are on
the rise in areas of alignment (fine pitch), modeling (speed, performance,
and thermal), and measurement (Cres). To meet all of the different
requirements, suppliers need to develop means to analyze and characterize
their customer's needs. This session will focus on techniques and data
that have been developed and used to determine the maximum performance
from a socket. |
| "Revolutionizing
High-Speed Socket Test" |
Michael de Bie
Exotest |
Boris Coto
AMD |
Rafiq Hussain
AMD |
| "Understanding
Impact of Burn-In Sockets on Fragile Semiconductor Packages Using
Finite Element Analysis" |
Prasanth Ambady
Sensata
Technologies |
Keith Crowe
Sensata Technologies |
Hide Furukawa
Sensata Technologies |
"Contact Resistance is Sexy Again"
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Tim Swettlen
Intel Corporation |
Morten Jensen
Intel Corporation |
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Session 3 |
Pushing the Power/Thermal Envelope |
2007s3.pdf
(1.63 MB)
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| If
you are planning on pushing the power/thermal envelope in your BiTS
applications, this session is for you. The trio of authors in this session
will provide key insight into a number of distinct, yet interrelated,
disciplines essential for success with higher power applications,
including general design considerations and modeling/optimizing for high
current, as well as the introduction of a novel thermal interface
measurement technique. |
| "Comparison of
Methods for Measuring Residual Stresses in Connector Alloy Strip
for BiTS Applications" |
John Harkness, FASM
Brush Wellman Incorporated |
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| "Socket and Heat
Sink Considerations in High Power Burn-in" |
John McElreath
Micro Control Company |
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| "Determining Thermal Resistance Characteristics
Without a Power Sensor" |
Trent Johnson
AMD |
Jerry Tustaniwskyj
Delta Design |
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INTERCONNECT
DAY
Tuesday, March 13, 2007 |
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Session 4 |
Trends in Contact Technologies |
2007s4.pdf
(214 KB)
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| Electrical
Contacts: tighter pitches, greater electrical integrity, more cycles and
lower cost make for a demanding set of requirements. Yet with fresh looks
at, and innovative approaches to, current technologies, plus the
introduction of novel new ones, this session's authors will leave you with
many options to choose from in selecting the contact that suits your
technical and business needs. |
| "Next Generation
Contact Technology For Fine Pitch Semiconductor Test" |
Valts Treibergs
Everett Charles Technologies |
Jason Mroczkowski
Everett Charles Technologies |
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| " 'Off-set' Pin Contact Innovation - An Effective Contact Solution to
Pb-Free Devices for MT8704iHF (Multitest) Test Handler" |
Ariel Sabellon
Cypress - Philippines |
Eugene F. Batilo
Cypress - Philippines |
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| "Braided
Electrical Contact Element (BeCe)" |
Che-Yu Li
Che-Yu Li and Company, LLC |
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| "Elastomeric
Interconnects - Reliable Enough for Production?" |
Frank Bumb
Phoenix Test Arrays |
Jack Pereschuk
Phoenix Test Arrays
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Nick Langston, Sr.
Antares Advanced Test Tech.
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Session 5 |
PCB Advancements and Opportunities |
2007s5.pdf
(1.95 MB)
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| With
reduced pitch and higher frequencies creating challenges for the socketing
and contacting community, the Printed Circuit Board (PCB) portion of the
system can not be forgotten. In this session we will explore some
technologies, techniques and methods to improve PCB performance and
quality. |
| “Socket Signal Integrity
- Impact from IC & Board” |
James Zhou
Antares Advanced Test Tech. |
Jiachun
(Frank) Zhou
Antares Advanced Test Tech. |
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| “Minimizing Socket
& Board Inductance Using a Novel Decoupling Interposer” |
Nicholas Langston,
Sr.
Antares Advanced Test Tech. |
James Zhou
Antares Advanced Test Tech. |
Hongjun Yao
Antares Advanced Test Tech. |
“Benchmarking
Printed Circuit Board Fabrication Suppliers Using IPC's PCQR2
Database”
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Bill Mack
Texas Instruments Inc. |
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| Hot Topics Session |
Advancements in Contacting Leading Edge Packages |
2007ht.pdf
(6.91 MB)
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| Whether
it's WLP, WLCSP, POP or other leading edge device packaging, the pursuit
of fresh and innovative contacting / socketing technologies is underway.
In this session, with a focus on addressing the contacting challenges
presented by leading edge packaging, you'll hear about three novel
approaches to deal with wafer level and 3D packages. |
| "Novel
Low Cost Test and Burn-in Wafer Level Packaging" |
Belgacem Haba, Ph.D.
Tessera, Inc. |
David
Ovrutsky
Tessera, Inc. |
Guilian Gao,
Ph.D.
Tessera, Inc. |
Vage
Oganesian
Tessera, Inc. |
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| "A
New Probe Card Approach for Wafer Level Chip Scale Package
Testing" |
Norman J. Armendariz,
Ph.D.
Texas Instruments, Inc |
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| "POP
Rocks: Approaches to Socketing Package-on-Package Devices" |
Jon Diller
Interconnect Devices, Inc. |
Kiley Beard
Interconnect Devices, Inc. |
Jamie Andes
Interconnect Devices, Inc. |
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DESIGN
DAY
Wednesday, March 14, 2007 |
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Session 6 |
Socket Design and Use Challenges |
2007s6.pdf
(1.55 MB)
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| The
design of effective & reliable socketing solutions requires
understanding both specific design elements and the interface of the
socket and the package. In this session our authors will share
assessments, methodologies, analyses and solutions that improve socket
design and performance. You'll come away with some new ideas to consider
for your operations. |
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Session 7 |
Exploring Handler, Socket & Device Interfacing |
2007s7.pdf
(5.41 MB)
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| With
today's challenging package geometries it is no easy task getting the
devices through the handler and properly placed in the contactor to make
solid electrical contact. This session will review some issues and
solutions of the important, but often ignored, area of device handling and
contacting. |
| "The Importance
of the Mechanical Interface in Final Test Efficiency" |
Mark Stenholm
Antares Advanced Test Technologies |
| "Effects of
Handler Insertion Variations on Contactor Performance for Pb-Free
Devices" |
Jeff Sherry
Johnstech International Corp. |
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| "Contacting
Solution for Optical Sensor IC - HD DVD Application" |
Gerhard Gschwendtberger
Multitest elektronische Systeme GmbH |
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| Awards
/ Closing Remarks
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2007closing.pdf
(323 KB)
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| After three days
loaded with information and networking, it's now time wrap-up. Here are a few
closing remarks and some recognition to the people and papers that have
distinguished themselves in one way or another at BiTS 2007.
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Page last modified
03/28/11
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BiTS WorkshopTM is a production of
BiTS Workshop LLC |
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