Passive optical alignment with micron-level precision is a critical enabler for photonic coupling in high-volume back-end testing. This work presents an OEM photonic connector that achieves low-loss, repeatable edge-coupling without the need for active alignment. The passive interface provides a stable seating position suitable for both OEM integration and compatibility with test systems, enabling reliable photonic testing in high-volume manufacturing environments.

Spring pin interconnects are the workhorse of the automated test equipment (ATE) industry. Not only are they critical components in DUT sockets for package testing and vertical probe cards for wafer testing, they are also the default interconnect for most of the ATE instrumentation to the DUT test fixture printed circuit board. Although spring pin interconnects have been used successfully for decades there is still an aura of “black magic” associated with them with several associated myths. This is due to the fact that spring pin manufacturers try to protect their intellectual property as much as possible and also the large variety of spring pin interconnects used across multiple industries. In this presentation we will concentrate on the spring pin to PCB via interconnect used in the ATE DUT test fixture interface. These are Nickel/Gold plated interconnects. We will discuss first the basic concepts and key design and performance metrics of such interconnect including the importance of the mating force, material hardness, radial accuracy and avoiding resonant behavior at high frequencies. We will also discuss the PCB spring via mating side and the different mating geometries that can happen on such an interconnect (Spring pin in via hole or spring pin in via pad). In this discussion we will compare theoretical computations of the expected contact resistance with measured data. We will conclude with some comments on the challenges of reliability testing of spring pin interconnects.

SACQ solder alloys—comprising Tin-Silver-Copper with minor additions of Bismuth and Nickel—are increasingly adopted as RoHS-compliant alternatives to traditional SnPb and SAC305 solders. While SACQ delivers improved drop shock resistance and thermal fatigue performance, its distinct metallurgical characteristics introduce new challenges for electrical contact during high-volume production testing.
Compared to SAC305, SACQ exhibits a harder, more brittle surface at cold temperatures and a softer, more adhesive surface at elevated temperatures. These temperature-dependent mechanical shifts, compounded by SACQ’s accelerated oxidation behavior, significantly impact contact resistance stability, increase the risk of probe contamination, and accelerate probe wear. These effects are particularly critical in socketed and contact-based test environments where repeatability and mechanical compliance are essential.
This presentation examines SACQ solder behavior across three key thermal regimes—Room Temperature (RT), Hot Temperature (HT), and Cold Temperature (CT)—and outlines mitigation strategies to maintain reliable electrical contact. Topics include the selection of optimized contact materials, tailored probe geometries, and controlled force profiles. To ground these insights in practical application, the audience will be introduced to the Cohu Diamondx tester and Matrix handler setup used to evaluate SACQ devices under varying thermal and mechanical conditions.

The paper outlines best practices and test strategies for validating coaxial socket performance in semiconductor testing. It emphasizes: 1. Domain-specific CRES testing for signal, power, and ground pins to improve accuracy. 2. Methods to detect shorts between pins and the shielding block and verify ground pin contact quality. 3. The IOShort and VSS ground percentage measurement approach for spotting insulation issues and monitoring shield health. 4. The need for routine validation during maintenance to address degradation from wear, oxidation, or contamination. Overall, the study provides a systematic framework to maintain signal integrity, shielding effectiveness, and long-term reliability of coaxial sockets.

We developed the "TZ3300 Series," resin-based materials with superior micromachinability. The TZ3300 standard grade offers reliable machinability and stability in demanding environments. TZ3300-L1 (Dk≒2.7) ensures stable performance over 100 GHz. Advancements include TZ3300-HL (Dk≒2.5) and TZ3300-S (low CTE/≒5 ppm), with evaluations ongoing for mass production.

Metals have long been used as thermal interface materials (TIMs), offering substantially higher thermal conductivity and other significant advantages such as long-term reliability over organic, polymer and filler-based alternatives. Compressible metal TIMs are specifically engineered for use between a heat source and a heat sink, heat spreader, or heat-pipe for the effective dissipation of heat. These metal foils are patterned to enhance mechanical compliance and thermal performance with designs tailored for different applications. The thermal performance of a compressible metal TIM is dependent on several parameters, most notably the metal/alloy, thickness, and pattern type in regard to the TIM itself. Additional external factors include pressure, time, mechanism of compression, and substrate planarity and topography. This presentation will discuss the effects of time, pressure, thickness, and patterning on effective thermal resistance and bondline thickness (BLT) using the ASTM D5470 test method while also characterizing the relationships between each variable.

Revised Abstract Recent research and industry roadmaps highlight that the choice and performance of Thermal Interface Materials (TIM) are pivotal in defining the transition from traditional indirect liquid cooling to advanced thermal management strategies in High Performance Computing (HPC) systems. In the context of rapidly escalating power densities and stringent reliability demands, the practical application of TIM selection becomes central to achieving reliable, scalable, and efficient heat dissipation in next-generation HPC architectures. The TIM roadmap aligned to product offering for 2025 outlines ambitious targets for lowering thermal resistance, setting a benchmark of 0.25 C-cm²/W for critical platforms and establishing clear milestones to reduce thermal resistance below 0.10 C-cm²/W. Comprehensive simulation and testing protocols have been established, with standard test conditions defined at 40 psi and 105°C to ensure consistency and repeatability of results. Additionally, precise control over die height variation is targeted between 60–80 μm, while the warpage is limited to a maximum of 150 μm to support mechanical and thermal integrity. Achieving these technical objectives requires a multi-faceted approach that integrates material specification, supplier engagement, and process innovation. Key strategies include phasing out the use of aluminum foil, transitioning to adhesive attachment methods, and adopting advanced coatings designed to prevent staining and degradation over time. These efforts are underpinned by close collaboration between industry partners and material suppliers, fostering an ecosystem that accelerates the development of high-performance TIM solutions. Ultimately, these advancements are expected to enable the next wave of HPC system designs, supporting greater computational capabilities while maintaining robust thermal management and operational reliability. This presentation will discuss the challenges, methodologies, and collaborative pathways that are shaping the future of TIM integration in HPC environments, providing insights into roadmap-driven innovation and practical deployment considerations for the research and engineering communities.