TestConX 2022 – Tuesday

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Tuesday May 3, 2022

7:00 a

Continental Breakfast

Start the day right and enjoy the continental breakfast while networking with other attendees.

8:00 a

Session 4
Red Mountain Ballroom
Market Report & Advanced Technologies
“The Current status of the Burn-in and Test Socket Market”
Lin Fu
Yole Développement
John West
Yole Développement
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“Semiconductor and Test Market Outlook: Is increased macro uncertainty driving the end of high growth?”
Risto Puhakka
VLSI Research
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“Challenges for elastomer interposer application for system level test of PoP package”
BoHyun "BH" Kim
TSE
Sol Lee
TSE
Min Cheol "Min" Kim
TSE
Yeongbeen "Jimmy" Hwang
TSE
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“Thermal Challenges & Cooling Methods for High Power Electronics”
Suhail Azim
Test Tooling Solutions Group
Cheng Hsin "Kenny" Lee
Test Tooling Solutions Group
Phaik Yean "PY" Goay
Test Tooling Solutions Group
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10:00 a

Poster
Red Mountain Foyer
Poster Break and Networking
“Elastomer Interposer Structure for BGA Testing”
Tony Smith
Phoenix Test Arrays
Frank Bumb
Phoenix Test Arrays
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“28GBaud High-Speed PHY Measurements at Wafer Probe”
Best Poster
Choung Huynh
Multilane Inc.
Douglas Malech
Multilane Inc.
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“Thermal Resistance Measurement through Socket Interconnect”
Ila Palaniappa
Ironwood Electronics
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“High Frequency and High Current Stamped Spring Probe”
Hyungjun "AJ" Park
IWIN
Sang Yang "Samuel" Pak
IWIN
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11:00 a

Session 5
Red Mountain Ballroom
Operations 2
“KISS 2.0 (Keep It Simple & Save in Burn-In Operation)”
Most Inspirational
Joe Tan
MSV Systems & Services Pte Ltd
Chun Hong Low
MSV Systems & Services Pte Ltd
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“Throughput and Capacity improvement by Known Good Sockets Process in production”
Jesse Ko
Modus Test
Jack Lewis
Modus Test
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“Simplifying and Standardizing Semiconductor Test”
Robert "Rob" Stoner
Cohu
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12:30 p

Lunch

Lunch is served. Enjoy the break and networking time.

1:30 p

Session 6
Red Mountain Ballroom
High Speed
“55 GHz Octal-site Wafer Test Probecard for 5G mmWave devices”
Jason Mroczkowski
Cohu
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“Introduction of unique Coaxial socket with the use of Flexible Printed Circuit (FPC)”
Hokuto "Paul" Kanesashi
Enplas
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“56Gbps High-Speed Test at Wafer Sort”
Douglas Malech
Multilane
Chuong Hyunh
Multilane
Jeffery "Jeff" Arasmith
Technoprobe
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3:00 p

TestConX EXPO

Continue to explore the great exhibits at the TestConX EXPO. There is always something new to see or someone new to meet. Refreshments and drinks are served but don't spoil your appetite before the TestConX Social...

6:00 p

TestConX Social Event

Continue the networking with your colleagues and industry friends at the TestConX Social Event.

There will be lots of fun and great food in store!

9:00 p

Adjourn

Program subject to change without notice.