Session 5 – Sockets With Integrity

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Session 5 – Sockets With Integrity

High frequency signal and power integrity with sockets are essential to successful package testing. The opening presenter shares first-hand experience pairing the design of a high-speed load board with sockets of the desired bandwidth to avoid significantly reduced system performance. The second paper assesses power and ground performance through an examination of signal and power routings and the corresponding ground return paths for a PCB/socket combination. The final presenter looks at how ever shrinking devices with more functionality and higher density I/Os bring sensitive signal lines closer together, contributing to signal integrity issues.

"High Bandwidth Sockets For SERDES Applications On ATE Load Boards"
Don Thompson
R&D Altanova

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"Signal and Power Integrity Impact of Ground Slugs in Sockets"
Gert Hohenwarter
GateWave Northern, Inc.

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"Building Blocks and Predictors for Good Contactor Signal Integrity"
Jeff Sherry
Johnstech International

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