Welcome!
To access the archive contents (presentation slides, videos, multimedia, etc.) sign in using your LinkedIn account by clicking the LinkedIn button to the right. Full Conference Attendees and Subscribers have access to all content now. FREE guests, once signed in, have access to the presentations after June 1, 2013.
------ This message is only displayed when you are not signed in. ------
Session 7 – Product and Material Mélange
This final session focuses on new products and materials in the test and burn-in market. The first presentation looks at high-temperature burn-in readiness, discussing a burn-in socket solution designed to address cost, design and performance challenges of high temperature burn-in. Next on the agenda is a description of new technologies developed to produce high reliability stamped parts and elastomer contacts for a finer pitch and high performance applications. The final presentation covers a new and innovative ESD control molding compound for encapsulation, developed to reduce the ESD issues in the test process."High Temperature Burn-in (Up to 200 Deg. C): Are We Ready Yet?"
Noriyuki Matsuoka, Kazumi Uratsuji
Yamaichi Electronics Co., Ltd.
Jec Sangalang
Yamaichi Electronics USA
Ryota Takeuchi
NGK Insulators, Ltd.
"Development of High Performance Spring Probe Pin and Elastomer Contact by Stamping"
Samuel Pak
IWIN Co. Ltd.
A.J. Park
IWIN Co. Ltd.
"ESD Safe Materials for Test Socket and Encapsulation"
Tatsuya Kawasaki
Krefine Co., Ltd.
Return to the 2013 BiTS Workshop Archive index page