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Session 2 – Test Tooling Made Easy
Whether you’re testing conventional packages like QFNs and BGAs, or emerging 2.5D and 3D packages, you’re only as successful as your test floor equipment. This session’s presenters span the spectrum of tooling issues beginning with a method for 3D package handling through the integration of complex technologies. Next, you’ll learn how to prevent semiconductor test system coolant leakage by implementing a hazardous warning system. Operator error in manual test handlers comes under scrutiny thanks to a failure analysis investigation in QFN packages. Lastly, we take a look at cost saving through homogenous spring pin tip implementation in a high volume manufacturing (HVM) environment."3D Package Handling: A Simple Case of Integrating Complex Technologies"
Zain Abadin
Advantest America, Inc
"Innovation Way to Prevent Semiconductor Test Tester Coolant Leakage with Hazardous Warning System"
Yee Wei Tiang
Intel ATM Penang, Malaysia
"Die-Cracking Failure Analysis of QFN Packages in Manual Test Handler"
M.P. Divakar, PhD
Stack Design Automation
"Cost Saving Through Homogenous Spring Loaded Pin Tip Implementation in High Volume Manufacturing (HVM) Environment"
Chin Siang (David) Chew, Nithya Nandhan Subramaniam
Intel Technology
Chin Chien Tee
Interconnect Devices, Inc.
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