Burn-in & Test
is the world's premier workshop dedicated to
providing a forum for the latest information
about burn-in and test socketing, and related
At BiTS you'll find a comprehensive technical
program, exhibits of the latest products and
services, and many opportunities to meet,
network and explore ideas with other test and
burn-in socketing professionals.
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The papers in this publication
comprise the proceedings of the 2002 BiTS Workshop. They reflect the authors’
opinions and are reproduced as presented , without change. Their inclusion in
this publication does not constitute an endorsement by the BiTS Workshop, the
sponsors, BiTS Workshop LLC, or the authors.
There is NO copyright protection claimed by this publication or the authors.
However, each presentation is the work of the authors and their respective
companies: as such, it is strongly suggested that any use reflect proper
acknowledgement to the appropriate source. Any questions regarding the use of
any materials presented should be directed to the author/s or their companies.
All photographs on this page are copyrighted by BiTS Workshop LLC. The BiTS logo
and ‘Burn-in & Test Socket Workshop’ are trademarks of BiTS Workshop LLC.
The third annual Burn-in and Test Socket (BiTS)
workshop was sponsored by the Test Technology Technical Council of the IEEE
Computer Society. BiTS is the only IEEE sponsored workshop dedicated to
providing a forum for the latest information about the socket industry.
23 presentations and two guest
speaker presentations, covering a range of important socketing topics,
were delivered by suppliers and users. The presentations were organized
into 8 sessions: two sessions on Monday, 4 on Tuesday and 2 on
Wednesday. At registration, attendees received the Proceedings, which
contained all of the presentations..
BiTS 2002 Expo (Supplier Displays)
BiTS again this year hosted Supplier Displays. 32
suppliers displayed their products during breaks in the technical program.
Click HERE for a list of
BiTS 2002 Attendees
BiTS 2002 brought over 198 participants from around
the world representing end users and suppliers of sockets, boards, burn-in
systems, handlers, packages and other related equipment, materials and services.
BiTS 2002 Organizing Committee
John O'Sullivan (Johnstech), Paul Boyce (Motorola-ret.),
Rafiq Hussain (AMD), Fred Taber (IBM), Maddie Harwood (IEEE), Bill Mann (SW
Test Workshop), Clay Carpenter (Intel), John Ambrosini (Enplas-Tesco), Valts
Treibergs (ECT), Owen Prillaman (Yamaichi). Not pictured: Wray Johnson
(Texas Instruments), Dale Gleason (Agilent)
BiTS 2002 Press
- ChipScale Review May - June 2002
Best Paper at BiTS
- THE FINAL TEST REPORT - Vol. 13.
No. 04 May 2002
From: Bill Mann (IEEE)
The third annual Burn-In and Test Sockets workshop was held in Mesa,
AZ on March 3 to 6, 2002. This Test Technology Technical Council sponsored workshop
brought together 190 test professionals for the two and a half day program.
General Chair, Fred Taber, IBM Microelectronics, and his committee
arranged 23 presentations in eight sessions: Socket Design Investigations, Managing High
Frequency, Thermal Management Methods, Burn-In Methodology, Modeling and Characterization,
Burn-In Systems, Burn-In Board Design, and New Products.
Alan K. Allan, Invited Speaker from Intel, presented appropriate
portions of The International Technology Roadmap for Semiconductors.
Steven Strauss, also from Intel, gave a very provocative Keynote
Address, Tooling: The Other Capital Equipment.
Fred Taber, IBM, BiTS General Chairman's Opening and
Sunday, March 3, 2002
International Technology Roadmap For Semiconductors (ITRS) - Guidance for Global
Technology and Manufacturing R&D Resources in the New Millenium "
Alan K. Allan, Staff Engineer
Monday, March 4, 2002
8:30AM Socket Design
This opening session deals with investigations into
several issues facing the socket engineer. You'll hear about recent work on contact
material and reducing socket cost through design simplification.
- "Effect Of High Temperature Heating
On Music Wire Spring Performance"
Jiachun (Frank) Zhou, January Kister, Alberto M. Campos
Kulicke & Soffa Interconnect, Inc.
- "Low Cost Burn-in Socket
Design For Area Array Package (BGA)"
Yamaichi Electronics, USA Inc.
- "Force and Resistance Probing Automation
Valts Treibergs, Jason Mroczkowski
Everett Charles Technologies
10:30AM Managing High
Socketing higher frequency devices, often in high
volume, presents a host of challenging electrical and mechanical requirements to the
socket/contactor engineer. This session's presenters share innovative work on designing,
modeling and characterizing sockets/contactors for devices operating into the GHz
- "Optimizing Load Board Design
And Modeling For High Frequency Contactors"
Johnstech International Corporation
- "The New YieldPro Array Series
- "Electrical And Mechanical
Performance Characterization Of High Frequency Test Sockets"
Lisa Steckley, Dr. Hanyi Ding
Tuesday, March 5, 2002
Controlling the temperature of today's higher power
devices during test and burn-in operations has led to thermal management features becoming
an integral feature in sockets. Learn about some procedures, methods & techniques to
control device temperature.
- "Thermal Modeling Of Burn-in
Advanced Micro Devices
- "Burn-in System And Driver Board Technology Advances"
Mike Niederhofer, Bruce Simikowski
Incal Technology, Inc.
Trends in device complexity & circuit count,
accelerating test & burn-in costs and advanced packaging are driving innovative
approaches to the back-end-of-line processes. This session's presenters provide insight
into alternative burn-in methodologies to deal with these trends.
- "Alternatives For Burning In
Aehr Test Systems
- "Strip Burn-in For Fine Pitch Semiconductor Devices"
Hon Lee Kon, Hongfei Yan
- "High Performance Burn-in In Low Cost Environment"
Tamas Kerekes - ELES Semiconductor Equipment
Giampiero Trupia - STMicroelectronics
Analysis, and Characterization
The session on the topics of Modeling, Analysis and Characterization
has always been a hit at BiTS, and this year should be no exception. This four paper
session discusses RF electrical measurements & modeling, contact force measurements
and the relationship of contact resistance to insertions.
- "Electrical Modeling And
Contactor Performance In A RF System"
Jim Adley, Eric Leung, Jeff Sherry
Johnstech International Corporation
- "Leaded 2mm Contactors:
Measuring And Modeling To 10 GHz"
Tom Strouth, Orlando Bell, Gary Otonari, Eric Bogatin - GigaTest
Jeff Sherry - Johnstech International Corporation
- "Force Measurement On Sockets
Richard Block, Rafiq Hussain
Advanced Micro Devices
Today's burn-in systems are required to handle
devices with higher power and a range of sizes (often small), provide active thermal
management, integrate with the socket's thermal management features and be cost effective.
Several burn-in system approaches to address these needs will be discussed.
- "A Large Capacity And High
Performance Burn-in And Test System For High Power Dissipating Components"
Dr. Jerry Tustaniwskyj, Dr. James Babcock, Jim V. Rhodes
- "Burn-in Oven With Chilled
Water Heat Exchanger"
Chyi Feng Leow
- "The Challenges In Fine Pitch
Hwan Ming Wang, Anthony Wong Yeh Ching
"Tooling: The other
Steven B. Strauss
Wednesday, March 6, 2002
8:00AM Burn-in Board
Another popular topic at BiTS. This year's session
spaned a spectrum of burn-in board design topics, including contact pad plating
considerations, optimizing and simulating decoupling and a discussion of the options for
- "Burn-in Board Over-current
Protection What Are The Options?"
KW Low, Zamel Jaafar
- "Protecting Conductor Pads On
Burn-in Boards From Oxidation And Corrosion"
Alfred Sugarman, Al Loranger
Loranger International Corporation
- "Power Decoupling Optimizer
A Systematic Frequency Domain Approach To BiB Noise Decoupling Simulation"
10:30AM New Products
Learn about some new socket products. The three
papers in this session discuss a variety of challenges socket engineers face and offer
unique solutions. We'' all watch closely to see if a candidate emerges for the 3rd annual
"Almost Brilliant Disguise" award.
- "Kelvin Contacting Solutions
For Leadless Device Types"
Multitest Elektronische Systeme GmbH
- "Interconnecting At 40 GHz and
Paricon Technologies Corporation
- "Electro-chemical Cleaning
Nu Signal LLC
Original Sponsoring Organization
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