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TestConX 2025 – Overview

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Overview
Sunday
Monday
Tuesday
Wednesday

EXPO

Overview


Sunday
March 2

  • Optional Tutorial
    • Categorization, Testing, and Selection of Thermal Interface Materials for Semiconductor Test
    • Connecting Your DUT to Your Tester
  • Welcome Reception & Dinner
    • Market Snapshot and Panel


Monday
March 3

  • Keynote
    • AI for Test
  • Technical Sessions
    • Contact Technology
    • Test/System challenges
    • Signal Integrity
  • TestConX EXPO & Reception


Tuesday
March 4

  • Distinguished Speaker
  • Technical Sessions
    • Market Session
    • Poster Session
    • Socket Technology
    • Thermal
  • TestConX EXPO
  • TestConX Social Event


Wednesday
March 5

  • Technical Sessions
    • Materials
    • PCB Technology
  • Awards

Program subject to change without notice.

Overview
Sunday
Monday
Tuesday
Wednesday

EXPO
TestConX Mesa 2025 Sponsors
Premier

HighRel HiCon Logo
Honored Sponsor
IWIN Logo

Leeno Logo

ISC Logo


Distinguished Sponsor
Advantest

Smiths Interconnect Logo

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  • Home
  • Next Events
    • TestConX China 2025
    • TestConX Korea 2025
    • TestConX 2026
  • Committee
    • TestConX Korea Committee
    • TestConX China Committee
    • TestConX USA Committee
  • Archive Index
  • Access – Subscribe
  • Profile