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TestConX China 2018

Session 1 - Market Report

  • Keynote - Advanced Packaging Innovation Challenges - Super-thin Optical SiP & CIS
  • Keynote - Large Panel Fan-Out (LPFO) Technology Overview and Development
  • Market Place Report - Strong Global Demand for Semiconductors Brings Unlimited Opportunities in China

Session 2 - 5G and mm-wave Test Challenges

  • RF Module Test Challenges
  • Over the Air Test for Antenna in Package IC
  • Feasibility Evaluation of a Spring Pin Wafer Probing Approach for a 5G WLCSP Application

Session 3 - High Frequency and High Current

  • Interpretation and Application of Test Contactor Specification
  • One Type Wiping Contact Introduction
  • Contact Probe CCC Study and Application

Session 4 - Advanced Contact & Socket Technology

  • The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side
  • Test yield control by on-line laser cleaning
  • Additive Manufacturing Capability Study for Semiconductor Test Components

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  • Home
  • Next Events
    • TestConX China 2025
    • TestConX Korea 2025
    • TestConX 2026
  • Committee
    • TestConX Korea Committee
    • TestConX China Committee
    • TestConX USA Committee
  • Archive Index
  • Access – Subscribe
  • Profile