English version follows
2024년 10월 28~29일에 개최되는 첫번째 TestConX® Korea 행사에 여러분을 초대합니다.
이틀일정으로 진행되는 TestConX Korea는 최신기술 및 업계동향에 대한 인사이트를 제공하는 세션파트와 국내 외 유력 테스트 업체들의 솔루션을 직접 확인할 수 있는 TestConX EXPO행사로 구성되어 있습니다.
테스트 공정 전문가들과 클라이언트가 한 자리에 만나는TestConX Korea는
서로의 인사이트를 공유하고 비즈니스 기회를 모색할 수 있는 최적의 장소로
참석하는 분들 모두에게 좋은 기회가 될 것입니다.
아울러 TestConX Korea에서는
Ultra-high volume operation 및 Millimeter-wave 기술을 포함한
5G Testing과 관련해 인사이트를 나눠 주실 연사를 찾고 있습니다.
추가적으로 테스트와 Burn-in에 대한 발표 제안도 큰 의미가 있을 것 같습니다.
Presentation시간은 30분으로 (발표25분, Q&A 5분)
TestConX에서 제공하는 PPT양식을 사용하여 영어 또는 한국어로 발표할 수 있고,
발표를 위한 제안서는 250~300단어로 작성해 하단 주소로 보내주시면 됩니다.
☐ 세부 일정
제안서 제출 : 7월 12일 (금)
결과 통보 : 8월 2일 (금)
자료 제출 : 9월 30일 (금)
☐ 양식 / 제출처
[javascript protected email address]
다음 주제 목록을 참조해 주세요
Call for Presentations and Posters for
TestConX Korea 2025
Suwon, South Korea – November 18, 2025
Join us for the 3rd annual TestConX® Korea workshop to be held as a live in-person event on November 18, 2025. We will have a full day of technical presentations and the TestConX EXPO where you will find the latest in test products and solutions. Don’t miss the preeminent Korean event focused on connecting electronic test professionals to solutions.
The TestConX Korea Technical Program Committee is seeking presentations that highlight the testing challenges and solutions driven by the Artificial Intelligence (AI) “Everywhere Explosion” with the ever-increasing demand for High Bandwidth Memory and application specific processors (ASPs). Other proposals on a broad range of test and burn-in topics, as illustrated below, are also highly valued.
Each presentation at TestConX Korea is provided a thirty-minute presentation slot (approximately 25 minutes for the presentation with 5 minutes for questions and answers). Authors may choose to present in English or Korean. And authors only need to prepare a PowerPoint presentation. (There is no paper to write.)
Please submit a 250-to-500-word abstract for presentations of your original, previously unpublished, technical presentation by July 1, 2025.
Submit via:
or
- Email [javascript protected email address] korea-abstracts@testconx.org including title of presentation, complete contact information (name, affiliation/company name, job title, email address, phone number, and mailing address) for each author, and name of presenter.
Abstracts will be reviewed and authors will be notified around July 18, 2025.
Presentation submissions are due September 26, 2025.
Language: Presentation in English or Korean. PowerPoint slides in English using the TestConX provided template with the option to also create Korean slides.
발표 주제에 대해서 제한은 없습니다. 아래 Test 관련된 분야를 참고하시면 됩니다.
Topics that address the challenges of these and other test applications include, but are not limited to:
Artificial Intelligence (AI) related test applications of highest interest include:
- High Bandwidth Memory testing - including singulated die and known good stack testing
- Efficient Application Specific Processor (ASP) testing – including high pin-count high-power devices
Other high-interest test applications include:
- System Level Test – especially for LPDDR memory and Chiplet packaging
- Smartphone & 5G/6G including antenna in package (AiP) and mm-wave
- Electric vehicles - power, sensing, and battery test
Electrical & Mechanical Challenges in package testing
- High frequency and high data rate techniques and technologies including 5G and mm-wave
- Wafer Level Packages (WLP) and Panel Level Processing (PLP)
- High current, high power, and/or high temperature device testing
- Handler & change kit designs and considerations
- Fine Pitch Kelvin Contacting
- Thermal management and modelling
- Contact technology
- Bare Die, system on a chip (SOC), system-in-package (SiP), and 2/2.5/3D package testing
- Wafer level chip scale (WLCSP) test for Known Good Die (KGD) or final test
Test Process & Operational Challenges
- Over the Air (OtA) and Antenna in Package (AiP) testing
- System Level Test (SLT)
- Test & Burn-in floor operations
- Socket repair, cleaning, and re-plating methods
- Massively parallel and non-singulated test (Wafer Level and Panel Level)
- Test strategies for reducing qualification and production time
- Socket & PCB verification, checkout, & qualification
- Strip Testing and Test-in-Tray
- High reliability testing for mission critical and medical applications
- Microelectromechanical system (MEMS) and non-electrical (optical, fluidic, magnetic, acoustic, etc.) stimuli testing
- Bring-up, characterization, and validation
- Cloud and big-data analytics
- Design for testability including ATE test, SLT, and reliability test
- Failure analysis
Module & Product Test Challenges
- Fixturing and test contact
- Test automation
- Automated material handling
- Wireless testing at scale / high volume
- Thermal control
Printed Circuit Board (PCB) Design & Manufacturing Challenges
- For high temperature Burn-in board applications
- High data rate test applications
- Space Transformers and Ultra-fine pitch
- Board to Board Interconnects