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BiTS 2017 Session 7

"Applying FEA Simulation for Test Interface Unit"

Jason Koh
Test Tooling Solutions Group

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"BI RHINO Handling Solution"

Yaniv Raz
Intel

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"Optical Device Testing at Wafer Level and Package Devices"

Carl Kasinski
Aehr

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"Fan-in WLCSP Test Requirements"

Mike Frazier
Xcerra

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