"WiGig Test"
Bert Brost – Xcerra
"Re-balling BGA with Gold Plated Copper Spheres, the Need and the SMT Challenges"
Emad Al-Momani, Srikanth Mothukuri, Jack Mumbo - Intel Corporation
"Thermal Test Methodology for Validating Automotive Semiconductor Packages"
Ying Feng Pang, Amy Xia - Intel Corporation
Poster Download
"Insitu 256 Node Resistive Leakage Tester"
Gordon Cowan, Rich Zavala - HighRel, Inc.
Poster Download
Return to the 2016 BiTS Workshop Archive index page