Test cell integration is best not left to the “luck o’ the Irish.” Testing today’s packaged semiconductor devices requires careful integration of automated test equipment (ATE) and handlers to reduce the cost of test. In this first of two sessions, presenters examine ways to streamline processes as well as alternative approaches that reduce the need for costly ATE and handlers. Alexander Wieler, esmo, starts with a semi-automated device interface board (DIB) loader, which allows for the quick exchange of DIBs without undocking the tester from the handler. Raimondo Sessego, Freescale, introduces a novel approach to testing MEMS G Cell devices. Stanley explains how this mechanical-flip burn-in system for tire pressure monitoring system (TPMS) sensors eliminates the need for a high cost ATE and flip handler combination. Mike Frazier, Xcerra, reviews the challenges of testing and handling singulated WLCSP devices using a strip or carrier format.
"Semi Automated DIB/PIB Loader"
Alexander Wieler
esmo AG
"Mechanical Flip Burn In (FBI) for Tire Pressure Monitoring System"
Raimondo Sessego, James Stanley, Joe Milazzo
Freescale Semiconductor
"Final Test Solution of WLCSP devices"
Mike Frazier
Xcerra Corporation
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