Talking Points – Interconnectology: Inspiring a Paradigm Shift


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Talking Points
Interconnectology: Inspiring a Paradigm Shift

Here is BiTS Workshop’s answer to the panel discussion. Co-produced with 3D InCites and Impress Labs, this special segment was presented in a Letterman/Leno inspired ‘talk show’ format hosted by the Queen of 3D, Françoise von Trapp and features guest appearances by interconnectology experts.

There is a grass-roots initiative to introduce terminology to semiconductor manufacturing that better defines processes used to build the next-generation of IC devices. Rather than ‘advanced packaging’, the emphasis should be placed on the ‘advanced interconnect’ step. Where packaging used to be about protection, electrical connection and thermal management, it is now more about pitch translation, and the terminology should reflect that. Additionally, a specialized skillset has been defined to support these processes that overlap wafer-level and packaging skills. This knowledge base includes materials science, mechanical and electrical engineering. As such, Interconnectologists specializing in Interconnectology will carve a new space in the industry.

For more information on Interconnectology, read the 3D InCites blog post, Introducing Interconnectology: A Call to Arms.

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Françoise von Trapp blogs about emerging 3D integration technologies on the online community she established, 3D InCites. Previously Sr. Technology Editor at Chip Scale Review and Managing Editor of Advanced Packaging Magazine, she now hangs her hat at Impress Labs, where she serves as subject matter expert for the agency’s clients in the semiconductor space.

Scott Jewler has 20 years of semiconductor assembly and test experience. Prior to joining ANSI, Scott held senior executive roles at several leading OSATS including Powertech Technology, Inc., STATS ChipPAC and Amkor.

At Invensas, Sitaram Arkalgood is Director of 3D Technologies.

Chris Scanlan joined Deca Technologies, Inc. in November 2009. A 17-year veteran of the semiconductor industry, his focus is interconnect technology development and product line management. Prior to Deca, he held various VP positions at Amkor Technology in the areas of R&D, product management, and applications engineering.

At Feldman Engineering Corp., Ira Feldman manages and develops unique high technology solutions and business strategies for clients. Prior to establishing his consulting firm, he held executive and management positions at Microfabrica, NanoNexus, Agilent Technologies, and Hewlett Packard.

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