Fred Taber, IBM, BiTS General Chairman's Opening
here if you have troubles with the PDF files!
Sunday, March 2, 2003
The Cost Of Test & Burn-in - What Are The Options?"
Moderator: Fred Taber,
Ken Heiman, Micro Control Company
Marc Knox, IBM Microelectronics
M.S. Maung, Advanced Micro Devices
Helge Puhlmann, Yamaichi Electronics Deutschland
Steve Strauss, Intel
Bob Zacharis, Pycon
(see the panel members in the PDF file above)
Monday, March 3, 2003
Session 1: "Test and Burn-in Operations"
We kicked things off in this opening session with
presentations covering several techniques and methodologies to improve Test and Burn-in
operations. We heard about ways to raise yield, increase productivity, lower cost and
"Full Wafer Contact
Burn-In and Test - The Ultimate in Parallelism"
"Strategic Use of
ELES Semiconductor Equipment
Electrical Interface Design for the Fixture Between Tester and DUT to Achieve Reduced Cost
and Leadtime in ATE Toolings"
Koh Tuan Meng & Lim Kok Lay
(Presented by Steve Hamren)
Session 2: "Burn-in Tools And Test Equipment"
This session's presenters shared their work on tools,
equipment and methods, for Burn-in systems, burn-in boards and sockets, that automate,
simplify, test, measure and monitor.
"DUT Host: DUT-level
Burn-in System Diagnostic Tool"
Trent W. Johnson
Advanced Micro Devices
"Total Automation of
Burn-in Process Flow"
Test and Burn-In Sockets using a Desk Top Test System"
Jeff Cymerys, Rafiq Hussain - Advanced Micro Devices
Ken Hallmen - Checksum
Tuesday, March 4, 2003
Session 3: "Socket And Board Development"
Key development process steps include evaluating
alternatives, simulating operation and performance testing. This session's presentations
cover selecting and evaluating a BiB circuit design alternative, and simulating and
testing socket performance.
Effect: Challenges for Fine Pitch Burn-in Board Design"
Hon Lee Kon, Anthony Yeh Chiing Wong, K W Low
Socket Testing and Evaluation"
"Thermal Testing of
James Forster & Savithri Subramanyam
Session 4: "Modeling &
This session has always been one of the most popular
at BiTS and this year should be no exception. With discussions relevant to today's higher
power and higher pin count devices, our presenters will discuss measuring current carrying
capacity, socket force models and contact resistance.
Methods for Measuring Current Carrying Capacity of Sockets"
Roger Weiss, PhD
Paricon Technologies Corp.
Model for Sockets Using Response Surface Methodology"
Ironwood Electronics Inc.
"Effect of Pin Tip
Structure on Contact Resistance"
Jiachun (Frank) Zhou, Alberto M. Campos, Jim Roundy
Kulicke & Soffa Interconnect, Inc.
Glenn A. Cunningham - Intel
Session 5: "Thermal Management Techniques"
Controlling the temperature of today's higher power devices during
test and burn-in operations has led to thermal management provisions becoming an integral
feature in sockets. Learn about methods and techniques to control device temperature and
ways to characterize and implement them.
- "Thermal Interface Materials: An
Implementation Process (From Cradle to Grave)"
Marc Knox, Michelle Qiao, Tuknekah Noble & Yvan Cossette
- "Characterization of a Thermal Control
Unit Using Various Thermal Enhancers"
Jihad Y. Hammoud - Kulicke & Soffa
Anand V. Reddy - Intel
- "Least-Volume Optimization of Finned
Heat Sinks for Burn-In Air Cooling Solutions"
Zhaojuan He, Patrick E. Phelan
Arizona State University
- "Thermo-electric Coolers - Are They For
Session 6: "Socketing Lead-Free Packages"
The move to lead-free solder compositions is
accelerating. What is the effect of lead-free solder materials on the performance of
sockets and contacts? Will lead-free alloys drive development of new socket and contact
technologies? Hear the results of three studies that discuss these questions.
"Lead Free Area
Array Module Test and Burn-in"
Ethan Gallagher, Zenon Podpora
"The Effects of No
Lead Solder Balls on Burn-In Socket Design Decisions"
Mike Noel, Don VanOverloop, Daniel Wilcox, K.Y. Yap - Motorola
Tom Lyzinski, Keith Callahan -Wells-CTI
BiTS Keynote Speaker
Keynote Topic: "IC Market Recovery Outlook"
Keynote Speaker: Bill McClean, President, IC Insights
Wednesday, March 5, 2003
Session 7: "Contact Technology"
It's the first time at BiTS for a full session
focused on socket contacts. Topics covered in the presentations include plating to reduce
solder adhesion, optimizing performance of fine pitch contacts and the effect of contactor
geometry on high frequency performance.
Palladium-Cobalt on Test Probe Plungers: An Improved Method for Reducing Solder
Therese Souza, Larre Nelson
Rika Denshi America
For 0.5 mm Pitch and Below"
Prasanth Ambady, James Forster, Jason Cullen
Performance of Various Test Contactor Geometries - 0.8mm Pitch"
"Properties of Socket Materials"
There are many factors, and their specifications, to
consider when selecting materials for test and burn-in socket bodies. In another new
session at BiTS, you'll hear an array of information to assist and guide your materials
"Materials for Test
Richard W. Campbell, PhD
Determination of Contactor Dielectrics at RF Frequencies"
Everett Charles Technologies
"High Flow Glass
filled Polyetherimide Resins for Burn-In Test Sockets"
Ken Rudolph, Robert R. Galluci, Chisato Suganuma
General Electric Plastics
Awards Presentation and Wrap-up
Fred Taber's closing remarks for BiTS 2003.
After three days loaded with information and
networking, it was now time to pack our bags and take what we've learned back to our jobs.
But first, there were a few closing remarks after some recognition to the people and papers
that have distinguished themselves in one way or another at BiTS 2003.
Original Sponsoring Organization