Call for Presentations

Call for Presentations and Posters for
TestConX 2021
May 2-5, 2021 - Mesa, Arizona

TestConX is seeking presentation and poster proposals on a broad range of test and burn-in topics.

PRESENTATIONS at TestConX are each provided a thirty minute presentation slot (approximately 25 for the presentation with 5 minutes for questions and answers). Authors only need to prepare a PowerPoint presentation. (There is no paper to write.)

POSTERS are the three oversized 24" W x 36" H pages which are displayed during an interactive session with the attendees

Presentations and Poster final submissions are due in mid-January.

Please submit a 250 to 500 word abstract for presentations or posters of your original, previously unpublished, technical presentation by December 18, 2020

Fill out this form Online here
Email to [javascript protected email address] using this TestConX Program Abstract Template.

Abstracts will be reviewed and authors will be notified around Jan 15, 2021


Topics of interest include, but are not limited to:

Advanced Packaging & Test Challenges

  • "Mega" or "Hyper" devices and packages with extreme test challenges
    • Very high-pin-count (>8,000 pins)
    • High-performance socket technologies for high-end servers
    • Big Digital, Big Analog & Mixed Signal pushing tester resource and configuration limits
  • Wafer level chip scale packaging (WLCSP) test
    • Fan Out Wafer Level Packaging (FOWLP)
    • Panel Level Processing (PLP)

System Level Test (SLT)

  • Methods & strategies for System Level Test
  • Module or System Level Test (SLT) to enhance or replace Final Test
  • Cell aware test
  • Tradeoffs between System and Structural test methods
  • Innovations in test methods for large digital ('Big D'), large analog ('Big A'), and mixed signal systems on chip (SOCs)

 mm-Wave and 5G testing

  • Device specific test requirements and strategies for devices with non-digital functions
  • Over-the-air (OTA) testing

Big Data

  • Validation and Test data analytics
  • Adaptive test methodology

Microelectromechanical Systems (MEMS) Sensor Test

  • Microelectromechanical system (MEMS) and non-electrical (optical, fluidic, magnetic, acoustic, etc.) stimuli testing

 Production Automation

  • Test automation including advances in test cell integration, handler change kits, and extreme parallelism
  • Post "final" electrical test activities that impact or insure quality
  • High multi-site testing

Validation and Characterization

  • Strategies, techniques, fixtures, and equipment for validation, characterization, and system bring-up
  • Testing of high-power computing devices and related thermal challenges

Printed Circuit Board Design, Fabrication, and Assembly

  • Design, fabrication, assembly, and verification challenges of high complexity printed circuit boards (PCB) and flex-circuits (FC) for test and burn-in applications
  • Advanced materials and manufacturing technologies for printed circuit boards (PCB), sockets, and anything related to functional test, system-level test, or burn-in
  • Over the air (OTA) and other testing for 5G and mm wave
    • Circuit structure, signal loss, impedance control and materials
  • High-power devices – layout techniques and thermal management
  • Power delivery – layout techniques and power delivery techniques
  • High-speed board design
  • Advances in design tool automation
  • Embedded passives and active components
  • Board to Board Interconnects
  • Coefficient of thermal expansion (CTE), force, and planarity issues
  • Space Transformers and high density interconnect through blind and buried vias
  • Materials and construction for Temperature/Humidity/Bias (THB), highly accelerated stress test (HAST), high temperature operating life (HTOL), or other special applications
  • Long term reliability of PCB and FC structures and materials used for test applications especially under extreme mechanical and/or thermal load/shock


As an Author you’ll contribute to a stimulating and comprehensive technical program by sharing your latest work and advancements with colleagues from around the globe. Whether you’ve previously made a podium or poster presentation at TestConX, or are considering becoming an author for the first time, we encourage and welcome you to submit an abstract for your proposed presentation or poster.

TestConX is the world’s premier event for test engineering and operations dedicated to providing a forum for the latest information on a broad range of topics related to electronic test. Focused on "connecting electronic test professional to solutions", the technical program provides practical content that is immediately useful. TestConX is the place where industry colleagues from around the world come to learn from presentations made by people like you!

For additional questions and other inquiries please contact: [javascript protected email address]