{"id":850,"date":"2014-03-11T14:42:20","date_gmt":"2014-03-11T21:42:20","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?p=850"},"modified":"2023-05-15T09:59:39","modified_gmt":"2023-05-15T16:59:39","slug":"session-6-interconnectology-its-what-we-do","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2014\/session-6-interconnectology-its-what-we-do\/","title":{"rendered":"Session 6 – Interconnectology: It’s What We Do"},"content":{"rendered":"\n

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Session 6 – Interconnectology: It’s What We Do<\/h1>\n\nLast Year's BiTS workshop introduced the benefits from the Interconnectology approach of collaboration across the supply chain from device design to test. This session focuses on interconnect designs and advancements. As contactor design has had to evolve to address shrinking pads and decreasing pitches, there's lower contact force. The first presentation details the development of long-life stamped spring probes in response to challenging technology roadmaps, all at a cost that includes maintenance and replacement costs. Next up is a paper on validations sockets (used for post-silicon validation and are quite different from test sockets). This paper brings awareness to these sockets and their challenges to encourage industry collaboration for solving future post-silicon validation interconnect challenges. The session concludes with an exploration of crosstalk sources and discusses solutions and emerging technologies, including costs, to reduce crosstalk. See? It's all about Interconnectology.
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\n\"Long Life \/ Stamped Spring Probe Development\"<\/strong>
\nSamuel Pak, A.J. Park
\nIWIN Co. Ltd.<\/p>\n

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\"PDF-Icon<\/a> Presentation Download<\/a>
\n\"Validation Interconnect Socket - Application and Future Challenges\"<\/strong>
\nAshok Kabadi
\nIntel Corporation<\/p>\n

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\"PDF-Icon<\/a> Presentation Download<\/a>
\n\"Crosstalk Mitigation in ATE Socket-Device Interface Boards\"<\/strong>
\nThomas P. Warwick
\nR&D Altanova, Inc.<\/p>\n

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\"PDF-Icon<\/a> Presentation Download<\/a>
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 <\/br>
\nReturn to the 2014 BiTS Workshop Archive index page<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Last Year’s BiTS workshop introduced the benefits from the Interconnectology approach of collaboration across the supply chain from device design to test. This session focuses on interconnect designs and advancements. As contactor design has had to evolve to address shrinking pads and decreasing pitches, there’s lower contact force. The first presentation details the development of long-life stamped spring probes in … <\/p>\n

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