{"id":839,"date":"2014-03-10T14:01:09","date_gmt":"2014-03-10T21:01:09","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?p=839"},"modified":"2023-05-15T09:59:51","modified_gmt":"2023-05-15T16:59:51","slug":"distinguished-speaker-brandon-prior","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2014\/distinguished-speaker-brandon-prior\/","title":{"rendered":"Distinguished Speaker – Brandon Prior"},"content":{"rendered":"\n

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Distinguished Speaker – Brandon Prior<\/h1>\n\nMr. Prior shared an overview of the global packaging market, with a focus on emerging and fast growth package solutions. In his presentation he reviewed where package miniaturization and modularization has taken us so far, and where it will lead in the next 5 years. Teardowns of high density boards and packages were used to illustrate key points.
\n
\n\"Packaging And Interconnect Trends: QFN, WLCSP, Fine Pitch And Modular\/3D Solutions\"<\/strong>
\nBrandon Prior
\nSenior Consultant
\nPrismark Partners<\/p>\n

Mr. Prior is a Senior Consultant at Prismark Partners. He joined Prismark in 1996 and is the author of their Semiconductor and Packaging Report. In his role at Prismark, he provides market and competitive analyses within semiconductor packaging and interconnects.<\/p>\n

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Mr. Prior shared an overview of the global packaging market, with a focus on emerging and fast growth package solutions. In his presentation he reviewed where package miniaturization and modularization has taken us so far, and where it will lead in the next 5 years. Teardowns of high density boards and packages were used to illustrate key points.<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[],"class_list":["post-839","post","type-post","status-publish","format-standard","hentry","category-bits2014","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/839","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=839"}],"version-history":[{"count":6,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/839\/revisions"}],"predecessor-version":[{"id":2635,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/839\/revisions\/2635"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=839"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/categories?post=839"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/tags?post=839"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}