{"id":831,"date":"2014-03-11T11:43:42","date_gmt":"2014-03-11T18:43:42","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?p=831"},"modified":"2023-05-15T09:59:39","modified_gmt":"2023-05-15T16:59:39","slug":"session-4-the-market-is-open","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2014\/session-4-the-market-is-open\/","title":{"rendered":"Session 4 – The Market is Open"},"content":{"rendered":"\n

Welcome!<\/span><\/h1>\n

To access the archive contents (presentation slides, videos, multimedia, etc.) sign in using your LinkedIn account by clicking the LinkedIn button to the right. Full Conference Attendees and Subscribers<\/a> have access to all content now. FREE guests, once signed in, have access to the presentations after June 1, 2014.<\/h2>\n

------ This message is only displayed when you are not signed in. ------<\/span><\/p>\n

Session 4 – The Market is Open<\/h1>\n\nThe BiTS Workshop just wouldn't be the BiTS Workshop without at least one presentation on the test and burn-in marketplace. In this year's three presentations, first we'll hear about the technical and market forces that are shaping the future of test and burn-in, particularly the challenges of industry cycles with the never ending quest for reduced costs. Next up will be our own Fred Taber, with his fourth annual Socket Report on the size of the market, whether its shrinking or growing, and companies that are leading the charge. This session's final paper hones in on a market technology trend with one innovative high-density package-on-package (PoP) solution requiring test hardware to accommodate fine pitch wire-tip interconnects. Socket and test hardware development and verification studies are underway to take this technology to high volume manufacturing.
\n
\n\"The Technical and Market Forces Shaping the Future of Test and Burn-In Sockets\"<\/strong>
\nJohn West
\nVLSI Research, Inc.<\/p>\n

\"\"<\/a><\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Presentation Download<\/a>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/p>\n

\"Socket Marketplace Report\"<\/strong>
\nFred Taber
\nTaber Consulting<\/p>\n

\"\"<\/a><\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Presentation Download<\/a>\t<\/p>\n

\"Manufacturing Readiness of Bond Via Array (BVA\u2122) Technology for Fine-Pitch Package-on-Package (PoP)\"<\/strong>
\nRajesh Katkar, Rey Co, Wael Zohni
\nInvensas<\/p>\n

\"\"<\/a><\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Presentation Download<\/a>\t<\/p>\n

 <\/br>
\nReturn to the 2014 BiTS Workshop Archive index page<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

The BiTS Workshop just wouldn’t be the BiTS Workshop without at least one presentation on the test and burn-in marketplace. In this year’s three presentations, first we’ll hear about the technical and market forces that are shaping the future of test and burn-in, particularly the challenges of industry cycles with the never ending quest for reduced costs. Next up will … <\/p>\n

Read More<\/a><\/div>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[8],"tags":[],"class_list":["post-831","post","type-post","status-publish","format-standard","hentry","category-bits2014","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/831","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=831"}],"version-history":[{"count":7,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/831\/revisions"}],"predecessor-version":[{"id":2727,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/831\/revisions\/2727"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=831"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/categories?post=831"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/tags?post=831"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}