{"id":822,"date":"2014-03-11T11:09:05","date_gmt":"2014-03-11T18:09:05","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?p=822"},"modified":"2023-05-15T09:59:51","modified_gmt":"2023-05-15T16:59:51","slug":"session-3-show-them-what-were-made-of","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2014\/session-3-show-them-what-were-made-of\/","title":{"rendered":"Session 3 – Show Them What We’re Made Of"},"content":{"rendered":"\n

Welcome!<\/span><\/h1>\n

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Session 3 – Show Them What We’re Made Of<\/h1>\n\nMicroelectronics continually tests the limits and ingenuity of test and burn-in strategies. So, more and more, the onus falls on materials solutions for sockets. This session kicks off with an examination of available socket materials to foster a better understanding of their relative merits for various applications, plus there's a sneak preview of coming material trends. The continuing trend of tighter pitches, higher temperatures and higher density contacts places heavy demands on test probes and equipment, particularly the materials used to manufacture them. As these materials continuously evolve, finite element modeling can help designers demonstrate the effects of material properties and performance as you'll learn in the second paper. The third presentation focuses on high temperature burn-in for automotive applications, emphasizing advancements in contact pin plating and surface finishing technologies to address the thermal challenges being faced. Wrapping up this session is a case study comparing three types of palladium alloys for spring pin contactors to determine what the best material is for test.
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\n\"The Stuff We\u2019re Made Of An Examination of the State of the Art in Socket Materials\"<\/strong>
\nJon Diller
\nSmiths Connectors | IDI
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\"Rising to the Challenge: Material Evolution to Enable Reliable Performance at Tighter Pitches and Higher Temperature\"<\/strong>
\nMike Gedeon
\nMaterion
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\"180 Deg. C BGA Burn-in, Is It Doable?\"<\/strong>
\nKenji Ichihara, Masaru Sato, Noriyuki Matsuoka
\nYamaichi Electronics Co., Ltd.<\/p>\n

Jec Sangalang
\nYamaichi Electronics USA<\/p>\n

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\"PDF-Icon<\/a> Presentation Download<\/a>\t\t\t\t\t<\/p>\n

\"Palladium Alloy Hardening and Wear Away Characteristics\"<\/strong>
\nTakuto Yoshida, Craig Hudson
\nTest Tooling Solutions Group<\/p>\n

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\"PDF-Icon<\/a> Presentation Download<\/a>\t\t\t\t\t\t<\/p>\n

 <\/br>
\nReturn to the 2014 BiTS Workshop Archive index page<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Microelectronics continually tests the limits and ingenuity of test and burn-in strategies. So, more and more, the onus falls on materials solutions for sockets. This session kicks off with an examination of available socket materials to foster a better understanding of their relative merits for various applications, plus there’s a sneak preview of coming material trends. The continuing trend of … <\/p>\n

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