{"id":54,"date":"2013-03-04T15:48:59","date_gmt":"2013-03-04T23:48:59","guid":{"rendered":"http:\/\/www.bitsworkshop.org\/wordpress\/?p=54"},"modified":"2023-05-15T09:59:51","modified_gmt":"2023-05-15T16:59:51","slug":"session-2-test-tooling-made-easy","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2013\/session-2-test-tooling-made-easy\/","title":{"rendered":"Session 2 – Test Tooling Made Easy"},"content":{"rendered":"\n

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Session 2 – Test Tooling Made Easy<\/h1>\n\nWhether you\u2019re testing conventional packages like QFNs and BGAs, or emerging 2.5D and 3D packages, you\u2019re only as successful as your test floor equipment. This session\u2019s presenters span the spectrum of tooling issues beginning with a method for 3D package handling through the integration of complex technologies. Next, you\u2019ll learn how to prevent semiconductor test system coolant leakage by implementing a hazardous warning system. Operator error in manual test handlers comes under scrutiny thanks to a failure analysis investigation in QFN packages. Lastly, we take a look at cost saving through homogenous spring pin tip implementation in a high volume manufacturing (HVM) environment.
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\"3D Package Handling: A Simple Case of Integrating Complex Technologies\"<\/strong>
\nZain Abadin
\nAdvantest America, Inc<\/p>\n

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\"Innovation Way to Prevent Semiconductor Test Tester Coolant Leakage with Hazardous Warning System\"<\/strong>
\nYee Wei Tiang
\nIntel ATM Penang, Malaysia<\/p>\n

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\"Die-Cracking Failure Analysis of QFN Packages in Manual Test Handler\"<\/strong>
\nM.P. Divakar, PhD
\nStack Design Automation
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\"Cost Saving Through Homogenous Spring Loaded Pin Tip Implementation in High Volume Manufacturing (HVM) Environment\"<\/strong>
\nChin Siang (David) Chew, Nithya Nandhan Subramaniam
\nIntel Technology\t<\/p>\n

Chin Chien Tee
\nInterconnect Devices, Inc.<\/p>\n

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\"PDF-Icon<\/a> Presentation Download<\/a>
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Whether you\u2019re testing conventional packages like QFNs and BGAs, or emerging 2.5D and 3D packages, you\u2019re only as successful as your test floor equipment. This session\u2019s presenters span the spectrum of tooling issues beginning with a method for 3D package handling through the integration of complex technologies. Next, you\u2019ll learn how to prevent semiconductor test system coolant leakage by implementing … <\/p>\n

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