
{"id":39,"date":"2013-03-06T11:55:22","date_gmt":"2013-03-06T19:55:22","guid":{"rendered":"http:\/\/www.bitsworkshop.org\/wordpress\/?p=39"},"modified":"2023-05-15T09:59:51","modified_gmt":"2023-05-15T16:59:51","slug":"session-7-product-and-material-melange","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2013\/session-7-product-and-material-melange\/","title":{"rendered":"Session 7 &#8211; Product and Material M\u00e9lange"},"content":{"rendered":"\n<h1><span style=\"color: #339966;\">Welcome!<\/span><\/h1>\n<h2>To access the archive contents (presentation slides, videos, multimedia, etc.) sign in using your LinkedIn account by clicking the LinkedIn button to the right. Full Conference Attendees and <a title=\"Access \u2013 Subscribe\" href=\"\/premium\/welcome\/\" title=\"Details about subscriptions\">Subscribers<\/a> have access to all content now. FREE guests, once signed in, have access to the presentations after June 1, 2013.<\/h2>\n<p><span style=\"color: #339966;\">------ This message is only displayed when you are not signed in. ------<\/span><\/p>\n<h1 class=\"entry-title\" style=\"font-weight:normal;\">Session 7 &#8211; Product and Material M\u00e9lange<\/h1>\n\nThis final session focuses on new products and materials in the test and burn-in market. The first presentation looks at high-temperature burn-in readiness, discussing a burn-in socket solution designed to address cost, design and performance challenges of high temperature burn-in. Next on the agenda is a description of new technologies developed to produce high reliability stamped parts and elastomer contacts for a finer pitch and high performance applications. The final presentation covers a new and innovative ESD control molding compound for encapsulation, developed to reduce the ESD issues in the test process.<br \/>\n<!--more--><\/p>\n<p><strong>\"High Temperature Burn-in (Up to 200 Deg. C): Are We Ready Yet?\"<\/strong><br \/>\nNoriyuki Matsuoka, Kazumi Uratsuji<br \/>\nYamaichi Electronics Co., Ltd.<\/p>\n<p>Jec Sangalang<br \/>\nYamaichi Electronics USA<\/p>\n<p>Ryota Takeuchi<br \/>\nNGK Insulators, Ltd.<br \/>\n<img decoding=\"async\" src=\"\/premium\/wp-content\/uploads\/bestdata.png\" alt=\"\" \/><\/p>\n<p><a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2013\/BiTS2013s7p1Matsuoka_3621.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2013\/BiTS2013s7p1Matsuoka_3621.pdf\" target=\"_blank\" \/>Presentation Download<\/a>\t\t\t\t\t\t\t\t\t\t<\/p>\n<p><strong>\"Development of High Performance Spring Probe Pin and Elastomer Contact by Stamping\"<\/strong><br \/>\nSamuel Pak<br \/>\nIWIN Co. Ltd.<\/p>\n<p>A.J. Park<br \/>\nIWIN Co. Ltd.<\/p>\n<p><a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2013\/BiTS2013s7p2Pak_7449.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2013\/BiTS2013s7p2Pak_7449.pdf\" target=\"_blank\" \/>Presentation Download<\/a>\t\t\t\t\t\t<\/p>\n<p><strong>\"ESD Safe Materials for Test Socket and Encapsulation\"<\/strong><br \/>\nTatsuya Kawasaki<br \/>\nKrefine Co., Ltd.<\/p>\n<p><a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2013\/BiTS2013s7p3Kawasaki_1291.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2013\/BiTS2013s7p3Kawasaki_1291.pdf\" target=\"_blank\" \/>Presentation Download<\/a>\t<\/p>\n<p>&nbsp;<\/br><br \/>\nReturn to the 2013 BiTS Workshop Archive <a title=\"Return to 2013 Index\" href=\"\/premium\/bits-workshop-2013-event-archive\">index page<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>This final session focuses on new products and materials in the test and burn-in market. The first presentation looks at high-temperature burn-in readiness, discussing a burn-in socket solution designed to address cost, design and performance challenges of high temperature burn-in. Next on the agenda is a description of new technologies developed to produce high reliability stamped parts and elastomer contacts &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/2013\/session-7-product-and-material-melange\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[3],"tags":[],"class_list":["post-39","post","type-post","status-publish","format-standard","hentry","category-bits2013","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/39","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=39"}],"version-history":[{"count":24,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/39\/revisions"}],"predecessor-version":[{"id":2626,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/39\/revisions\/2626"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=39"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/categories?post=39"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/tags?post=39"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}