{"id":2089,"date":"2017-03-06T15:30:02","date_gmt":"2017-03-06T23:30:02","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?p=2089"},"modified":"2023-05-15T09:59:07","modified_gmt":"2023-05-15T16:59:07","slug":"posters-2017","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2017\/posters-2017\/","title":{"rendered":"Posters 2017"},"content":{"rendered":"

\"Enabling Temperature Margining Solutions for Validating Automotive Electronics in Lab Automation Environment\"<\/strong>
\nYing Feng Pang
\nHagai Wertheim
\nRahima Mohammed
\nAmy Xia
\nIntel Corporation<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a> <\/p>\n

\"Tool-less Thermal Tool Thermal Interface Material Holder and Package Pusher\"<\/strong>
\nNicky Strumtza
\nIntel Corporation<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a><\/p>\n

\"New Gimbaling Mechanism for Automated Test Systems\"<\/strong>
\nNicky Srumtza
\nIntel Corporation<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"Development of fan-out layer assembled 100um pitch BGA socket with 3D MEMS Technologies\"<\/strong>
\nSungho Kim
\nEunkyung Lee
\nSanghee Park
\nJongmyeon Lee
\nMicrofriend Inc.<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a><\/p>\n

\"Extremely short spring probe and socket body\"<\/strong>
\nAJ Park
\nIWIN Co.,LTd.<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"Design method to endure the stress by high spring pin counts on the wafer test\"<\/strong>
\nShin-Ho Kang
\nGyu-Yeol Kim
\nSang-kyu Yoo
\nSamsung Electronics Company<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"Heat\/Cold Resistant Dicing Tape for Frame Handling Final Test\"<\/strong>
\nEiji Hayashishita
\nAkimitsu Morimoto
\nHideki Fukumoto
\nMitsui Chemicals Tohcello, Inc.<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"Air Cooled Thermal Tool for System Level High Volume Manufacturing Testing\"<\/strong>
\nRahima Mohammed
\nRidvan Sahan
\nYing-feng Pang
\nAmy Xia
\nHagai Wertheim
\nIntel Corporation<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a><\/p>\n

\"Elastomer Qualification Case Study for Extended Duration Contact Cycles\"<\/strong>
\nMike Dell
\nISC
\nEmad Al-Momani
\nIntel<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"Universal adjustable docking for automated test equipment systems\"<\/strong>
\nJess Coleta
\nWilly Ganoy
\nON Semiconductor Philippines<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"Design, Fabrication, and Characterization of Dense and Large-stand-Off Compressible MicroInterconnects (CMIs) for Advanced Testing and Socket System Application\"<\/strong>
\nPaul Jo
\nMuneeb Zia
\nJoe Gonzalez
\nMuhannad Bakir
\nGeorgia Institute of Technology<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a><\/p>\n

\"Low Cost \/ Low Profile Spring Probe\"<\/strong>
\nSamuel Pak
\nIWIN Co., Ltd.<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"Embedded Thin Film NiP Resistors Relax Signal Integrity Constraints on Printed Circuit Boards Designed for High Speed\"<\/strong>
\nManuel Herrera
\nOhmega Technologies, Inc.<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"WL Test Probe Continuous Improvement\"<\/strong>
\nJim Brandes
\nXcerra<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"Introduction of Thermal Interface Material (TIM) in Thermal Management Solution\"<\/strong>
\nHH Ng
\nTTS<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a><\/p>\n

\"Metallic Thermal Interface Material Selection for Burn-In\"<\/strong>
\nDavid Saums
\nDS&A, LLC
\nTim Jensen
\nRon Hunadi
\nCarol Gowans
\nBob Jarrett
\nIndium Corporation<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a><\/p>\n

\"Statistical Method for setting up Safe Screen Voltage for Products\"<\/strong>
\nKrishna Mohan Chavali
\nGlobalfoundries US Inc<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n\"Reliability Evaluation of Wing Riser Solder Joint used in Post Silicon Validation Environment\"<\/strong>
\nAmy Xia
\nYing-feng Pang
\nJack Mumbo
\nEmad Al-Momani
\nIntel<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a><\/p>\n

\"A Case Study Evaluating the Performance of Carbon Nanotube Based Thermal Interface Materials in a Burn in and Test Application\"<\/strong>
\nCraig E. Green
\nLeonardo Prinzi
\nBaratunde Cola
\nCarbice Nanotechnologies, Inc
\nBenoit Foisy
\nYvan Cossette
\nIBM Bromont<\/p>\n

Carbice Nanotechnologies, Inc<\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Poster Download<\/a>
\n
 <\/br>
\nReturn to the 2017 BiTS Workshop Archive index page<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

“Enabling Temperature Margining Solutions for Validating Automotive Electronics in Lab Automation Environment” Ying Feng Pang Hagai Wertheim Rahima Mohammed Amy Xia Intel Corporation  Poster Download “Tool-less Thermal Tool Thermal Interface Material Holder and Package Pusher” Nicky Strumtza Intel Corporation  Poster Download “New Gimbaling Mechanism for Automated Test Systems” Nicky Srumtza Intel Corporation  Poster Download “Development of fan-out layer assembled 100um … <\/p>\n

Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[14],"tags":[],"class_list":["post-2089","post","type-post","status-publish","format-standard","hentry","category-bits2017","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/2089","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=2089"}],"version-history":[{"count":14,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/2089\/revisions"}],"predecessor-version":[{"id":2795,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/2089\/revisions\/2795"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=2089"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/categories?post=2089"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/tags?post=2089"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}