
{"id":1661,"date":"2016-03-07T18:00:06","date_gmt":"2016-03-08T02:00:06","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?p=1661"},"modified":"2023-05-15T09:59:26","modified_gmt":"2023-05-15T16:59:26","slug":"posters-2","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2016\/posters-2\/","title":{"rendered":"Posters"},"content":{"rendered":"<p><strong>\"WiGig Test\"<\/strong><br \/>\nBert Brost \u2013 Xcerra<\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016poster1Brost_8727.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016poster1Brost_8727.pdf\" target=\"_blank\" \/>Poster Download<\/a><\/p>\n<p><strong>\"Re-balling BGA with Gold Plated Copper Spheres, the Need and the SMT Challenges\"<\/strong><br \/>\nEmad Al-Momani, Srikanth Mothukuri, Jack Mumbo  - Intel Corporation<\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016poster2Al-Momani_6792.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016poster2Al-Momani_6792.pdf\" target=\"_blank\" \/>Poster Download<\/a><\/p>\n<p><strong>\"Thermal Test Methodology for Validating Automotive Semiconductor Packages\"<\/strong><br \/>\nYing Feng Pang, Amy Xia - Intel Corporation<\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016poster3Pang_6303.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016poster3Pang_6303.pdf\" target=\"_blank\" \/>Poster Download<\/a><br \/>\n<strong>\"Insitu 256 Node Resistive Leakage Tester\"<\/strong><br \/>\nGordon Cowan, Rich Zavala - HighRel, Inc.<\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016poster4Cowan_3270.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016poster4Cowan_3270.pdf\" target=\"_blank\" \/>Poster Download<\/a><br \/>\n<br \/>&nbsp;<\/br><br \/>\nReturn to the 2016 BiTS Workshop Archive <a title=\"Return to 2016 Index\" href=\"\/premium\/bits-workshop-2016-event-archive\">index page<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>&#8220;WiGig Test&#8221; Bert Brost \u2013 Xcerra &nbsp;Poster Download &#8220;Re-balling BGA with Gold Plated Copper Spheres, the Need and the SMT Challenges&#8221; Emad Al-Momani, Srikanth Mothukuri, Jack Mumbo &#8211; Intel Corporation &nbsp;Poster Download &#8220;Thermal Test Methodology for Validating Automotive Semiconductor Packages&#8221; Ying Feng Pang, Amy Xia &#8211; Intel Corporation &nbsp;Poster Download &#8220;Insitu 256 Node Resistive Leakage Tester&#8221; Gordon Cowan, Rich Zavala &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/2016\/posters-2\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[11],"tags":[],"class_list":["post-1661","post","type-post","status-publish","format-standard","hentry","category-bits2016","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/1661","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=1661"}],"version-history":[{"count":6,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/1661\/revisions"}],"predecessor-version":[{"id":2675,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/1661\/revisions\/2675"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=1661"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/categories?post=1661"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/tags?post=1661"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}