
{"id":1533,"date":"2016-03-09T10:00:42","date_gmt":"2016-03-09T18:00:42","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?p=1533"},"modified":"2023-05-15T09:59:26","modified_gmt":"2023-05-15T16:59:26","slug":"bits-2016-session-8","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2016\/bits-2016-session-8\/","title":{"rendered":"BiTS 2016 Session 8"},"content":{"rendered":"<div class=\"presentation\" id=\"s8p1\">\"Modeling Socket Thermal Performance Inside a Burn-In Chamber\"\n<\/div>\n<p>Jason Cullen<br \/>\nPlastronics<br \/>\nRob Caldwell<br \/>\nDelta V Instruments<\/p>\n<p><a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016s8p1Cullen_5576.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016s8p1Cullen_5576.pdf\" target=\"_blank\" \/>Presentation Download<\/a>  <\/p>\n<div class=\"presentation\" id=\"s8p2\">\"Established the first WLCSP Testing at Tri-temp for RF and Non-RF Products\"<\/div>\n<p>Edwin Valderama<br \/>\nJin Sheng Tan<br \/>\nIntel Technologies<\/p>\n<p><a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016s8p2Valderama_6714.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016s8p2Valderama_6714.pdf\" target=\"_blank\" \/>Presentation Download<\/a>  <\/p>\n<div class=\"presentation\" id=\"s8p3\">\"A Silicon Photonics Wafer Probing Test Cell\"<\/p>\n<\/div>\n<p>Roberto Aranzulla, Daniele Sala, Roberto Barbon - ST Microelectronics<br \/>\nGiuseppe Astone, Maurizio Rigamonti, Massimo Galli - ST Microelectronics<br \/>\nJean Luc Jeanneau, Dario Adorni, Paul Mooney - Tokyo Electron<br \/>\nHubert Werkmann, Fabio Pizza - Advantest Europe GmbH<br \/>\nJose Moreira, Zhan Zhang - Advantest<\/p>\n<p><a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><\/p>\n<div style=\"clear: both;\"><\/div>\n<p><a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016s8p3Moreira_3107.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2016\/BiTS2016s8p3Moreira_3107.pdf\" target=\"_blank\" \/>Presentation Download<\/a>  <\/p>\n<p>&nbsp;<\/br><br \/>\nReturn to the 2016 BiTS Workshop Archive <a title=\"Return to 2016 Index\" href=\"\/premium\/bits-workshop-2016-event-archive\">index page<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>&#8220;Modeling Socket Thermal Performance Inside a Burn-In Chamber&#8221; Jason Cullen Plastronics Rob Caldwell Delta V Instruments &nbsp;Presentation Download &#8220;Established the first WLCSP Testing at Tri-temp for RF and Non-RF Products&#8221; Edwin Valderama Jin Sheng Tan Intel Technologies &nbsp;Presentation Download &#8220;A Silicon Photonics Wafer Probing Test Cell&#8221; Roberto Aranzulla, Daniele Sala, Roberto Barbon &#8211; ST Microelectronics Giuseppe Astone, Maurizio Rigamonti, Massimo &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/2016\/bits-2016-session-8\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[11],"tags":[],"class_list":["post-1533","post","type-post","status-publish","format-standard","hentry","category-bits2016","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/1533","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=1533"}],"version-history":[{"count":8,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/1533\/revisions"}],"predecessor-version":[{"id":2673,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/posts\/1533\/revisions\/2673"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=1533"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/categories?post=1533"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/tags?post=1533"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}