{"id":1155,"date":"2015-03-16T16:00:56","date_gmt":"2015-03-16T23:00:56","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?p=1155"},"modified":"2023-05-15T09:59:39","modified_gmt":"2023-05-15T16:59:39","slug":"session-2-spanning-the-socket-rainbow","status":"publish","type":"post","link":"https:\/\/www.testconx.org\/premium\/2015\/session-2-spanning-the-socket-rainbow\/","title":{"rendered":"Session 2 – Spanning the Socket Rainbow"},"content":{"rendered":"

Test socket solutions and the requirements of the device under test (DUT) vary according to the device end application. This session spans the socket spectrum from automotive applications, which require devices to withstand extreme temperature and high current, to mobile applications, which have high cost sensitivity. Markus Wagner, Cohu, explores contacting solutions for high power bare die testing. Valts Treibergs, Xcerra, compares different methods for determining current carrying capacity in test socket interconnects. Andreas Nagy, Xcerra, gives an overview of test temperature requirements of automotive and consumer applications and discusses consequences for test strategies. Praveen kumar Ramamoorthy, Infineon, focuses on socket design and development specifically for the extreme temperature and high current testing challenges of automotive devices. <\/p>\n

\"Contacting Solutions for High Power Bare Die Testing (IGBT MOS-FET and Diodes)\"<\/strong>
\nMarkus Wagner
\nCohu SEG<\/p>\n

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\"PDF-Icon<\/a> Presentation Download<\/a> <\/p>\n

\"Comparison of Different Methods in Determining Current Carrying Capacity of Semiconductor Test Contacts\"<\/strong>
\nValts Treibergs
\nXcerra Corporation<\/p>\n

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<\/div>\n

\"PDF-Icon<\/a> Presentation Download<\/a> <\/p>\n

\"Are New Temperature Test Strategies Needed? Meeting Performance and Cost Requirements of Today\u2019s Applications\"<\/strong>
\nAndreas Nagy
\nXcerra Corporation<\/p>\n

\"\"<\/a><\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Presentation Download<\/a> <\/p>\n

\"Extreme Temperature and High Current Testing Challenges of Automotive Devices\"<\/strong>
\nPraveen kumar Ramamoorthy, Murad Hudda
\nInfineon Technologies<\/p>\n

Dan Maccoux
\nJF Microtechnology SDN BHD<\/p>\n

Muhamad Izzat bin Roslee
\nJF Microtechnology Berhad<\/p>\n

\"\"<\/a><\/p>\n

<\/div>\n

\"PDF-Icon<\/a> Presentation Download<\/a> <\/p>\n

 <\/br>
\nReturn to the 2015 BiTS Workshop Archive index page<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Test socket solutions and the requirements of the device under test (DUT) vary according to the device end application. This session spans the socket spectrum from automotive applications, which require devices to withstand extreme temperature and high current, to mobile applications, which have high cost sensitivity. Markus Wagner, Cohu, explores contacting solutions for high power bare die testing. Valts Treibergs, … <\/p>\n

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