{"id":9051,"date":"2026-08-19T18:14:16","date_gmt":"2026-08-20T01:14:16","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=9051"},"modified":"2026-08-19T18:14:16","modified_gmt":"2026-08-20T01:14:16","slug":"testconx-china-2026","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx-china-2026\/","title":{"rendered":"TestConX China 2026"},"content":{"rendered":"
\"Image\"<\/span>

Suzhou - October 29, 2026<\/span><\/strong><\/h1>\n<\/div><\/div><\/div>
\n

Suzhou International Expo Centre \u82cf\u5dde\u56fd\u9645\u535a\u89c8\u4e2d\u5fc3<\/a> <\/h4>\n

Hall G202 - No. 688, Suzhou Avenue East,
Suzhou Industrial Park, Suzhou, Jiangsu Province, China<\/p>\n<\/div>\n

 Workshop registration includes all technical sessions, the TestConX EXPO, buffet lunch,
morning & afternoon tea breaks, <\/span>and download of the Proceedings.<\/span><\/span><\/p><\/div><\/div><\/div><\/div><\/div>

TestConX<\/span><\/a>, over the course of its twenty-seven-year history, has established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope includes packaged semiconductor “final” test, burn-in, system level test, and beyond to encompass all practical aspects of electronics testing such as validation, advanced packaging testing, module test, and finished product test.<\/span><\/p>\n

Join us in-person for the 12th annual TextConX China<\/strong>! You will not want to <\/span>miss this opportunity to be part of TestConX as we connect a larger community of test professionals and to participate in this excellent event!<\/span><\/p>\n

 <\/p><\/div>

<\/div><\/div><\/div>

Thursday October 29, 2026<\/strong><\/h1>\n<\/div><\/div><\/div>
<\/div><\/div><\/div>

8:45<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Welcome<\/div><\/div>
Welcome<\/div>
<\/div>

<\/p><\/div>

\n
\n“Opening Remarks” \n<\/div>\n
\n
\n
\nIra Feldman\n <\/div>\n\t
\nFeldman Engineering\n\t <\/div>\n <\/div>\n<\/div>\n<\/div>\n<\/div>\n\t \n
<\/div><\/div><\/div>
<\/div>
\n
\n
Keynote<\/div><\/div>
To Be Announced<\/div>
<\/div>

<\/p><\/div><\/div>\n\t \n

<\/div>
<\/div><\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/div><\/div>
\n
\n
Session 1<\/div><\/div>
Market<\/div>
<\/div>

<\/p><\/div>

\n
\n“How high-performance packaging is reshaping the test and burn-in socket market.” \n<\/div>\n
\n
\n
\nJohn West\n <\/div>\n\t
\nYole Group\n\t <\/div>\n <\/div>\n<\/div>\n<\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

10:30<\/h1>\n<\/div><\/div><\/div><\/div>

Break & Networking<\/strong><\/h1>\nEnjoy time to meet with the presenters and network while refreshments are served.<\/span><\/span><\/div><\/div><\/div>
<\/div><\/div><\/div>

11:00<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Session 2<\/div><\/div>
Contacts\/Probes<\/div>
<\/div>

<\/p><\/div>

\n
\n“You're Not Alone: The pain and game of burning probes” \n
“\u4f60\u5e76\u4e0d\u5b64\u5355\uff1a\u63a2\u9488\u70e7\u6bc1\u7684\u75db\u70b9\u4e0e\u535a\u5f08” \n<\/div>\n
\n
\n
\nYuanjun \"YJ\" Shi\n <\/div>\n\t
\n\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

Abstract:<\/strong><\/p>\n\n

\nThis study aims to analyze and investigate the causes of probe burn during wafer testing of high-current, high-power devices. We employ an integrated approach combining:\n<\/p>\n\n

    \n
  1. Monte Carlo simulations of random resistor network distributions,<\/li>\n
  2. Multiphysics finite element simulations coupling joule heating with thermal diffusion to model temperature rise,<\/li>\n
  3. AI-driven fitting\/optimization using TensorFlow with CUDA acceleration, to predict the temperature rise according to different pin count group and individual probe current distribution.<\/li>\n
  4. Molecular dynamics (MD) simulations to characterize tensile strength properties under different temperature.<\/li>\n<\/ol>\n\n

    \nBy synthesizing insights from these methodologies, we explore the underlying mechanisms of probe burn formation. Our analysis specifically examines whether the identified thermo-electro-mechanical phenomena represent the primary cause or constitute one contributing factor among others\u2026\u2026\n<\/p><\/p>

    \nYJ Shi<\/strong> is a senior expert in semiconductor testing and precision metallic interconnect technologies, with more than two decades of experience in SoC testing, spring probes (Pogo Pins), and MEMS probe and probe card research and development.\n<\/p>\n\n

    \nHe began his career at AMD as a packaging process engineer and SoC test development engineer, and subsequently served as Probe Assembly Manager at Antares, Probe Card R&D Manager at Microprobe Technology, Probe Card R&D Manager for FormFactor China, R&D Director at Twinsolution, and General Manager of Nanofab Semiconductor Technology.\n<\/p>\n\n

    \nHis expertise centers on the development of highly reliable, high-frequency, and miniaturized metallic interconnect structures. His core capabilities include Pogo Pin and MEMS probe structural design, materials engineering, mems process budgeting, micro-assembly, reliability and electrical performance validation, and production ramp-up.\n<\/p>\n\n

    \nHe has comprehensive experience spanning technology roadmap planning, product definition, R&D organization building, mems process development, customer qualification, and production stabilize, with a particular strength in translating advanced probe technologies into robust, scalable, and manufacturable solutions.\n<\/p><\/p><\/details>\n

    \n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

    \u6458\u8981\uff1a<\/strong><\/p>\n\n

    \n\u672c\u7814\u7a76\u65e8\u5728\u5206\u6790\u548c\u63a2\u7a76\u9ad8\u7535\u6d41\u3001\u9ad8\u529f\u7387\u5668\u4ef6\u5728\u6676\u5706\u6d4b\u8bd5\u8fc7\u7a0b\u4e2d\u53d1\u751f\u63a2\u9488\u70e7\u6bc1\u7684\u539f\u56e0\u3002\u6211\u4eec\u91c7\u7528\u7efc\u5408\u6027\u7814\u7a76\u65b9\u6cd5\uff0c\u7ed3\u5408\u4ee5\u4e0b\u51e0\u79cd\u5206\u6790\u4e0e\u4eff\u771f\u624b\u6bb5\uff1a\n<\/p>\n\n

      \n
    • \u57fa\u4e8e\u968f\u673a\u7535\u963b\u7f51\u7edc\u5206\u5e03\u7684\u8499\u7279\u5361\u6d1b\uff08Monte Carlo\uff09\u6a21\u62df\uff1b<\/li>\n
    • \u591a\u7269\u7406\u573a\u6709\u9650\u5143\u4eff\u771f\uff0c\u5c06\u7126\u8033\u70ed\u4e0e\u70ed\u6269\u6563\u8fc7\u7a0b\u8fdb\u884c\u8026\u5408\uff0c\u4ee5\u6a21\u62df\u6e29\u5347\u53d8\u5316\uff1b<\/li>\n
    • \u57fa\u4e8e\u4eba\u5de5\u667a\u80fd\u7684\u62df\u5408\u4e0e\u4f18\u5316\u65b9\u6cd5\uff0c\u5229\u7528 TensorFlow \u548c CUDA \u52a0\u901f\uff0c\u6839\u636e\u4e0d\u540c\u63a2\u9488\u6570\u91cf\u5206\u7ec4\u53ca\u5355\u4e2a\u63a2\u9488\u7684\u7535\u6d41\u5206\u5e03\uff0c\u9884\u6d4b\u63a2\u9488\u6e29\u5347\uff1b<\/li>\n
    • \u5206\u5b50\u52a8\u529b\u5b66\uff08Molecular Dynamics\uff0cMD\uff09\u4eff\u771f\uff0c\u7528\u4e8e\u8868\u5f81\u4e0d\u540c\u6e29\u5ea6\u6761\u4ef6\u4e0b\u6750\u6599\u7684\u6297\u62c9\u5f3a\u5ea6\u7279\u6027\u3002<\/li>\n<\/ul>\n\n

      \n\u901a\u8fc7\u7efc\u5408\u5206\u6790\u4e0a\u8ff0\u65b9\u6cd5\u83b7\u5f97\u7684\u7ed3\u679c\u548c\u5206\u6790\uff0c\u672c\u7814\u7a76\u8fdb\u4e00\u6b65\u63a2\u8ba8\u63a2\u9488\u70e7\u6bc1\u5f62\u6210\u7684\u5185\u5728\u673a\u5236\u3002\u6211\u4eec\u91cd\u70b9\u5206\u6790\u6240\u8bc6\u522b\u51fa\u7684\u70ed-\u7535-\u529b\u8026\u5408\u73b0\u8c61\u5224\u65ad\u5176\u7a76\u7adf\u662f\u5bfc\u81f4\u63a2\u9488\u70e7\u6bc1\u7684\u4e3b\u8981\u539f\u56e0\uff0c\u8fd8\u662f\u4f17\u591a\u5f71\u54cd\u56e0\u7d20\u4e2d\u7684\u4e00\u4e2a\u2026\u2026\n<\/p><\/p>

      \u65bd\u5143\u519b<\/strong>\u662f\u96c6\u6210\u7535\u8def\u6d4b\u8bd5\u4e0e\u7cbe\u5bc6\u91d1\u5c5e\u4e92\u8054\u9886\u57df\u8d44\u6df1\u4e13\u5bb6\uff0c\u62e5\u6709\u4e8c\u5341\u4f59\u5e74 SoC \u6d4b\u8bd5\u3001\u5f39\u7c27\u63a2\u9488\uff08Pogo Pin\uff09\u53ca MEMS \u63a2\u9488\/\u63a2\u9488\u5361\u7814\u53d1\u4e0e\u4ea7\u4e1a\u5316\u7ecf\u9a8c\u3002<\/p>\n\n

      \n\u804c\u4e1a\u751f\u6daf\u59cb\u4e8e AMD\uff0c\u5386\u4efb\u5c01\u88c5\u5de5\u827a\u5de5\u7a0b\u5e08\u548c SoC \u6d4b\u8bd5\u5f00\u53d1\u5de5\u7a0b\u5e08\uff1b\u968f\u540e\u5148\u540e\u62c5\u4efb\u5b89\u6258\u9510\u63a2\u9488\u7ec4\u88c5\u7ecf\u7406\u3001\u7f8e\u535a\u79d1\u6280\u63a2\u9488\u5361\u7814\u53d1\u7ecf\u7406\u3001FormFactor \u4e2d\u56fd\u533a\u63a2\u9488\u5361\u7814\u53d1\u7ecf\u7406\u3001\u97ec\u76db\u7814\u53d1\u603b\u76d1\u53ca\u6676\u665f\u5fae\u7eb3\u534a\u5bfc\u4f53\u79d1\u6280\u516c\u53f8\u603b\u7ecf\u7406\u3002\n<\/p>\n\n

      \n\u5176\u957f\u671f\u4e13\u6ce8\u4e8e\u9ad8\u53ef\u9760\u3001\u9ad8\u9891\u53ca\u5fae\u578b\u5316\u91d1\u5c5e\u4e92\u8054\u7ed3\u6784\u7814\u53d1\uff0c\u6838\u5fc3\u4e13\u957f\u6db5\u76d6 Pogo Pin \u4e0e MEMS \u63a2\u9488\u7684\u7ed3\u6784\u8bbe\u8ba1\u3001\u6750\u6599\u4f53\u7cfb\u3001\u7cbe\u5bc6\u5236\u9020\u3001\u5fae\u7ec6\u7ec4\u88c5\u3001\u53ef\u9760\u6027\u4e0e\u7535\u6c14\u6027\u80fd\u9a8c\u8bc1\uff0c\u4ee5\u53ca\u91cf\u4ea7\u5bfc\u5165\u3002\n<\/p>\n\n

      \n\u65bd\u5143\u519b\u5177\u5907\u4ece\u6280\u672f\u8def\u7ebf\u89c4\u5212\u3001\u4ea7\u54c1\u5b9a\u4e49\u548c\u7814\u53d1\u7ec4\u7ec7\u5efa\u8bbe\uff0c\u5230\u5de5\u827a\u5f00\u53d1\u3001\u5ba2\u6237\u9a8c\u8bc1\u7684\u5b8c\u6574\u7ecf\u9a8c\uff0c\u5c24\u5176\u64c5\u957f\u5c06\u63a2\u9488\u53ca\u63a2\u9488\u5361\u6280\u672f\u8f6c\u5316\u4e3a\u7a33\u5b9a\u3001\u53ef\u91cf\u4ea7\u7684\u4ea7\u54c1\u89e3\u51b3\u65b9\u6848\u3002\n<\/p><\/p><\/details>\n<\/div>\n

      \n
      \n“GPAC130: A Cost-Effective Palladium Alloy Material for Chip Test Probes” \n
      “GPAC130: \u4e00\u79cd\u5e94\u7528\u4e8e\u82af\u7247\u6d4b\u8bd5\u63a2\u9488\u7684\u9ad8\u6027\u4ef7\u6bd4\u94af\u5408\u91d1\u6750\u6599” \n<\/div>\n
      \n
      \n
      \nDaying Cao\n <\/div>\n\t
      \nZhejiang Goldlink Tech Co., Ltd.\n\t <\/div>\n <\/div>\n
      \n
      \nJingde Wang\n <\/div>\n\t
      \nZhejiang Goldlink Tech Co.,Ltd\n\t <\/div>\n <\/div>\n
      \n
      \nLei \"Ray\" Cao\n <\/div>\n\t
      \nZheijiang Goldlink Tech Co., Ltd.\n\t <\/div>\n <\/div>\n<\/div>\n
      \n\tAbstract - Biography (English)<\/summary>\n

      \r\nAs semiconductor devices continue to evolve toward greater complexity, higher integration, and smaller geometries, palladium alloy materials are increasingly adopted in semiconductor test probes due to their favorable mechanical and electrical properties. However, conventional palladium alloys commonly used in the market typically exhibit a hardness of approximately 460 HV<\/strong> after heat treatment and an electrical resistivity of 13\u201314 \u03bc\u03a9\u00b7cm<\/strong>. These limitations result in relatively poor wear resistance, shorter service life, and higher electrical resistance, making them less suitable for advanced semiconductor testing applications that require high probe density, long testing cycles, and enhanced reliability. In addition, many high-performance palladium alloys rely on elevated proportions of precious metals to achieve superior properties, leading to significantly increased manufacturing costs. This challenge becomes particularly pronounced in complex semiconductor test modules containing a large number of high-density probes, where balancing performance and cost-effectiveness remains difficult.\r\n<\/p>\r\n\r\n

      \r\nTo address these industry challenges, the GOLDLINK R&D Center<\/strong> initiated a dedicated development program and successfully developed GPAC130<\/strong>, a novel high-performance palladium alloy specifically designed for semiconductor test probe applications. By maintaining the palladium content at 40 wt.%<\/strong> while optimizing the alloy composition and refining the manufacturing process, GPAC130 achieves a significant enhancement in overall electromechanical performance.\r\n<\/p>\r\n\r\n

      \r\nThe alloy exhibits a hardness of 510\u2013540 HV<\/strong> and an electrical resistivity of 10.5\u201311.5 \u03bc\u03a9\u00b7cm<\/strong>, while retaining excellent machinability suitable for the fabrication of precision spring probes. Compared with conventional high-performance palladium alloys, GPAC130 achieves significantly improved hardness and reduced electrical resistivity while maintaining the same palladium content.\r\n<\/p>\r\n\r\n

      \r\nThe alloy offers a favorable balance between performance and cost, making it a promising material for advanced semiconductor test probe applications. Its combination of high hardness<\/strong>, low resistivity<\/strong>, and good machinability<\/strong> can effectively support the increasing demands of modern semiconductor testing, including high reliability<\/em>, extended test duration<\/em>, and high-density probe configurations<\/em>.\r\n<\/p><\/p>

      \nDaying Cao<\/strong>\n<\/p>\n\n

      \nAs the Chief Data Scientist of the R&D Center at Zhejiang Goldlink Tech Co.,Ltd, he brings more than ten years of experience in artificial intelligence and big data. His research and engineering expertise focuses on data analytics, machine learning, and large language models (LLMs<\/strong>) application across finance, technology, and advanced manufacturing.\n<\/p>\n\n

      \nHe has led multiple AI-driven innovation projects within the company, applying interdisciplinary knowledge to enhance intelligent manufacturing and accelerate product development. He received his M.A. in Statistics<\/strong> from Columbia University and holds dual bachelor\u2019s degrees in Applied Mathematics<\/strong> and Computer Science<\/strong>.\n<\/p><\/p><\/details>\n

      \n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

      \n\u968f\u7740\u534a\u5bfc\u4f53\u82af\u7247\u4e0d\u65ad\u5411\u590d\u6742\u5316\u3001\u5c0f\u578b\u5316\u53d1\u5c55\uff0c\u94af\u5408\u91d1\u6750\u6599\u51ed\u501f\u5176\u4f18\u5f02\u7684\u673a\u68b0\u6027\u80fd\u548c\u7535\u6c14\u6027\u80fd\uff0c\u6b63\u8d8a\u6765\u8d8a\u5e7f\u6cdb\u5730\u5e94\u7528\u4e8e\u534a\u5bfc\u4f53\u6d4b\u8bd5\u63a2\u9488\u5236\u9020\u3002\u7136\u800c\uff0c\u76ee\u524d\u5e02\u573a\u4e0a\u5e38\u7528\u7684\u94af\u5408\u91d1\u6750\u6599\u786c\u5ea6\u901a\u5e38\u7ea6\u4e3a460 HV<\/strong>\uff0c\u7535\u963b\u7387\u4e3a13\u201314 \u03bc\u03a9\u00b7cm<\/strong>\uff0c\u5b58\u5728\u8010\u78e8\u6027\u76f8\u5bf9\u8f83\u5dee\u3001\u4f7f\u7528\u5bff\u547d\u8f83\u77ed\u4ee5\u53ca\u7535\u963b\u7387\u8f83\u9ad8\u7b49\u4e0d\u8db3\uff0c\u56e0\u6b64\u96be\u4ee5\u6ee1\u8db3\u5148\u8fdb\u534a\u5bfc\u4f53\u6d4b\u8bd5\u5bf9\u9ad8\u5bc6\u5ea6\u3001\u957f\u6d4b\u8bd5\u5468\u671f\u53ca\u9ad8\u53ef\u9760\u6027\u7684\u9700\u6c42\u3002\u6b64\u5916\uff0c\u4e3a\u83b7\u5f97\u66f4\u4f18\u5f02\u7684\u6027\u80fd\uff0c\u8bb8\u591a\u9ad8\u6027\u80fd\u94af\u5408\u91d1\u666e\u904d\u91c7\u7528\u8f83\u9ad8\u6bd4\u4f8b\u7684\u8d35\u91d1\u5c5e\u914d\u6bd4\uff0c\u5bfc\u81f4\u5236\u9020\u6210\u672c\u663e\u8457\u589e\u52a0\u3002\u7279\u522b\u662f\u5728\u5305\u542b\u9ad8\u5bc6\u5ea6\u63a2\u9488\u7684\u590d\u6742\u534a\u5bfc\u4f53\u6d4b\u8bd5\u6a21\u5757\u4e2d\uff0c\u5982\u4f55\u517c\u987e\u6750\u6599\u6027\u80fd\u4e0e\u6210\u672c\u6548\u76ca\u5df2\u6210\u4e3a\u884c\u4e1a\u9762\u4e34\u7684\u95ee\u9898\u3002\n<\/p>\n\n

      \n\u9488\u5bf9\u4e0a\u8ff0\u884c\u4e1a\u75db\u70b9\uff0cGOLDLINK\u7814\u53d1\u4e2d\u5fc3<\/strong>\u5f00\u5c55\u4e13\u9879\u6280\u672f\u7814\u53d1\uff0c\u6210\u529f\u5f00\u53d1\u51fa\u4e00\u6b3e\u4e13\u7528\u4e8e\u534a\u5bfc\u4f53\u6d4b\u8bd5\u63a2\u9488\u7684\u65b0\u578b\u9ad8\u6027\u80fd\u94af\u5408\u91d1\u6750\u6599GPAC130<\/strong>\u3002\u8be5\u6750\u6599\u5728\u4fdd\u6301\u94af\u542b\u91cf40 wt.%<\/strong>\u4e0d\u53d8\u7684\u57fa\u7840\u4e0a\uff0c\u901a\u8fc7\u4f18\u5316\u5408\u91d1\u6210\u5206\u8bbe\u8ba1\u548c\u6539\u8fdb\u751f\u4ea7\u5236\u9020\u5de5\u827a\uff0c\u5b9e\u73b0\u4e86\u673a\u68b0\u6027\u80fd\u4e0e\u7535\u6c14\u6027\u80fd\u7684\u63d0\u5347\u3002\n<\/p>\n\n

      \nGPAC130\u5177\u6709510\u2013540 HV<\/strong>\u7684\u786c\u5ea6\u548c10.5\u201311.5 \u03bc\u03a9\u00b7cm<\/strong>\u7684\u7535\u963b\u7387\uff0c\u540c\u65f6\u4fdd\u6301\u4e86\u4f18\u5f02\u7684\u5207\u524a\u52a0\u5de5\u6027\u80fd\uff0c\u53ef\u6ee1\u8db3\u7cbe\u5bc6\u5f39\u7c27\u63a2\u9488\u7684\u5236\u9020\u52a0\u5de5\u9700\u6c42\u3002\u4e0e\u4f20\u7edf\u9ad8\u6027\u80fd\u94af\u5408\u91d1\u76f8\u6bd4\uff0cGPAC130\u5728\u4fdd\u6301\u76f8\u540c\u94af\u542b\u91cf\u7684\u524d\u63d0\u4e0b\uff0c\u5b9e\u73b0\u4e86\u66f4\u9ad8\u7684\u786c\u5ea6\u548c\u66f4\u4f4e\u7684\u7535\u963b\u7387\uff0c\u5728\u6750\u6599\u6027\u80fd\u4e0e\u6210\u672c\u4e4b\u95f4\u53d6\u5f97\u4e86\u826f\u597d\u7684\u5e73\u8861\uff0c\u4e3a\u5148\u8fdb\u534a\u5bfc\u4f53\u6d4b\u8bd5\u63a2\u9488\u63d0\u4f9b\u4e86\u4e00\u79cd\u5177\u6709\u5e94\u7528\u524d\u666f\u7684\u65b0\u578b\u6750\u6599\u89e3\u51b3\u65b9\u6848\u3002\n<\/p><\/p>

      \n\u66f9\u5927\u701b<\/strong>\n<\/p>\n\n

      \n\u73b0\u4efb\u6d59\u6c5f\u91d1\u8fde\u63a5\u79d1\u6280\u80a1\u4efd\u6709\u9650\u516c\u53f8\u7814\u53d1\u4e2d\u5fc3\u9996\u5e2d\u6570\u636e\u79d1\u5b66\u5bb6\uff0c\u6df1\u8015\u4eba\u5de5\u667a\u80fd\u4e0e\u5927\u6570\u636e\u9886\u57df\u5341\u4f59\u5e74\uff0c\u805a\u7126\u6570\u636e\u5206\u6790\uff0c\u673a\u5668\u5b66\u4e60\u7b97\u6cd5\u3001\u5927\u6a21\u578b\u5e94\u7528\u843d\u5730\uff0c\u8986\u76d6\u91d1\u878d\u3001\u4e92\u8054\u7f51\u3001\u9ad8\u7aef\u5236\u9020\u7b49\u591a\u884c\u4e1a\uff1b\u7275\u5934\u63a8\u52a8\u516c\u53f8\u591a\u9879AI<\/strong>\u76f8\u5173\u6280\u672f\u9879\u76ee\u843d\u5730\uff0c\u4f9d\u6258\u4ea4\u53c9\u5b66\u79d1\u4f18\u52bf\uff0c\u4ee5\u6570\u636e\u667a\u80fd\u8d4b\u80fd\u516c\u53f8\u751f\u4ea7\u4e0e\u4ea7\u54c1\u7814\u53d1\u3002\n<\/p>\n\n

      \n\u54e5\u4f26\u6bd4\u4e9a\u5927\u5b66\u7edf\u8ba1\u5b66\u7855\u58eb\uff0c\u62e5\u6709\u5e94\u7528\u6570\u5b66\u3001\u8ba1\u7b97\u673a\u79d1\u5b66\u672c\u79d1\u5b66\u4f4d\u3002\n<\/p><\/p><\/details>\n<\/div>\n

      \n
      \n“High Power Burn-in Socket (Vulcan)” \n
      “\u9ad8\u529f\u7387\u8001\u5316\u6d4b\u8bd5\u63d2\u5ea7(Vulcan)” \n<\/div>\n
      \n
      \n
      \nJeffrey \"Jeff\" McCallion\n <\/div>\n\t
      \nSmiths Interconnect\n\t <\/div>\n <\/div>\n
      \n
      \nMiguel Delgadillo\n <\/div>\n\t
      \nSmiths Inconnect a Molex Company\n\t <\/div>\n <\/div>\n
      \n
      \nJoe Huang\n <\/div>\n\t
      \nsmiths interconnect\n\t <\/div>\n <\/div>\n<\/div>\n
      \n\tAbstract - Biography (English)<\/summary>\n

      \r\nWith the development of AI<\/strong> and automated driving technology, semiconductor chips are evolving toward higher power<\/strong>, larger package sizes<\/strong>, and higher pin counts<\/strong>. Traditional burn-in socket designs cannot handle the high temperatures and insertion forces required for these demanding applications. Typically, tooled injection-molded burn-in sockets and simple clamshell lids are used; however, conventional mold materials and standard lid actuation mechanisms cannot support the power and force needed to properly compress the spring probes or withstand the rigorous burn-in and stress-testing process.\r\n<\/p>\r\n\r\n

      \r\nIn this paper, we present a solution that addresses these thermal and large-device challenges by introducing our new purpose-built, high-power burn-in socket solution, Vulcan<\/strong>. The new Vulcan<\/strong> product line leverages our H-Pin probe technology<\/strong>, high-performance socket materials, and our patent-pending Shuttle Bar Lid Force Delivery System<\/strong> to overcome the force, thermal, and power barriers associated with next-generation semiconductor devices.\r\n<\/p>\r\n\r\n

      \r\nThis paper describes the new socket concept in detail and presents simulation results<\/strong>, validation testing<\/strong>, and real-world performance data<\/strong> demonstrating that the Vulcan platform provides superior electrical<\/em>, mechanical<\/em>, and thermal<\/em> performance to maximize device reliability and yield.\r\n<\/p><\/p>

      Joe Huang<\/strong><\/p>\r\n\r\n

      \r\nJoe Huang is a Mechanical Engineer at Smiths Interconnect, a Molex company.\r\nHe graduated from Yangzhou University in 2019 with a degree in Mechanical Design,\r\nManufacturing and Automation. He joined Smiths Interconnect, a Molex company, in\r\n2022 and currently works as a Mechanical Engineer and Thermal Design Engineer\r\nresponsible for semiconductor test product design.\r\n<\/p><\/p><\/details>\n

      \n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

      \r\n\u968f\u7740\u4eba\u5de5\u667a\u80fd\u548c\u81ea\u52a8\u9a7e\u9a76\u6280\u672f\u7684\u53d1\u5c55\uff0c\u82af\u7247\u6b63\u671d\u7740\u66f4\u9ad8\u529f\u7387\u3001\u66f4\u5927\u5c3a\u5bf8\u548c\u66f4\u9ad8\u5f15\u811a\u6570\u7684\u65b9\u5411\u6f14\u8fdb\uff0c\u4f20\u7edf\u7684\u8001\u5316\u6d4b\u8bd5\u63d2\u5ea7\u8bbe\u8ba1\u5df2\u65e0\u6cd5\u5e94\u5bf9\u8fd9\u4e9b\u6781\u7aef\u5de5\u51b5\u6240\u9700\u7684\u9ad8\u6e29\u548c\u9ad8\u4f5c\u7528\u529b\u3002\u901a\u5e38\uff0c\u6b64\u7c7b\u5e94\u7528\u4f1a\u4f7f\u7528\u6a21\u5177\u6ce8\u5851\u6210\u578b\u7684\u8001\u5316\u6d4b\u8bd5\u63d2\u5ea7\u548c\u7b80\u5355\u7684\u7ffb\u76d6\u5f0f\u6d4b\u8bd5\u538b\u76d6\u3002\u7136\u800c\uff0c\u4f20\u7edf\u7684\u6a21\u5177\u6750\u6599\u548c\u6807\u51c6\u7684\u6d4b\u8bd5\u76d6\u9a71\u52a8\u673a\u6784\u65e0\u6cd5\u652f\u6301\u6d4b\u8bd5\u6240\u9700\u7684\u9ad8\u529f\u7387\uff0c\u96be\u4ee5\u514b\u670d\u6d4b\u8bd5\u63d2\u5ea7\u7684\u538b\u7d27\u529b\u4ee5\u5c06\u5f39\u7c27\u63a2\u9488\u538b\u7f29\u5230\u7279\u5b9a\u884c\u7a0b\uff0c\u4e5f\u96be\u4ee5\u627f\u53d7\u4e25\u82db\u7684\u5e94\u529b\u6d4b\u8bd5\u9636\u6bb5\u3002\r\n<\/p>\r\n\r\n

      \r\n\u5728\u672c\u6587\u4e2d\uff0c\u6211\u4eec\u5c06\u901a\u8fc7\u4ecb\u7ecd\u6211\u4eec\u5168\u65b0\u63a8\u51fa\u7684\u3001\u4e13\u4e3a\u9ad8\u529f\u7387\u9879\u76ee\u800c\u8bbe\u8ba1\u7684\u8001\u5316\u6d4b\u8bd5\u63d2\u5ea7\u89e3\u51b3\u65b9\u6848\u201cVulcan\u201d\uff0c\u6765\u9610\u8ff0\u5982\u4f55\u5e94\u5bf9\u6563\u70ed\u548c\u5927\u5c3a\u5bf8\u82af\u7247\u5e26\u6765\u7684\u6311\u6218\u3002\u6211\u4eec\u5168\u65b0\u7684 Vulcan \u4ea7\u54c1\u7ebf\u5229\u7528\u4e86\u6211\u4eec\u4e13\u6709\u7684 H \u63a2\u9488\u6280\u672f\u548c\u9ad8\u6027\u80fd\u6d4b\u8bd5\u63d2\u5ea7\u6750\u6599\uff0c\u4ee5\u53ca\u6211\u4eec\u6b63\u5728\u7533\u8bf7\u7684\u65b0\u4e13\u5229\u201c\u6ed1\u68ad\u6746\u6d4b\u8bd5\u538b\u76d6\u529b\u4f20\u5bfc\u7cfb\u7edf\u201d\uff0c\u4ece\u800c\u514b\u670d\u4e86\u538b\u7d27\u529b\u3001\u6563\u70ed\u548c\u529f\u7387\u65b9\u9762\u7684\u969c\u788d\u3002\u672c\u6587\u5c06\u8be6\u7ec6\u63cf\u8ff0\u6211\u4eec\u7684\u65b0\u6982\u5ff5\uff0c\u5e76\u5c55\u793a\u4eff\u771f\u3001\u9a8c\u8bc1\u548c\u5b9e\u9645\u6570\u636e\uff0c\u4ee5\u8bc1\u660e\u8be5\u4ea7\u54c1\u80fd\u591f\u63d0\u4f9b\u5353\u8d8a\u7684\u7535\u6c14\u3001\u673a\u68b0\u548c\u70ed\u6027\u80fd\uff0c\u4ece\u800c\u5b9e\u73b0\u6700\u9ad8\u6d4b\u8bd5\u826f\u7387\u3002\r\n<\/p><\/p>

      \u9ec4\u6587\u6770<\/strong><\/p>\r\n\r\n

      \r\n\u9ec4\u6587\u6770
      \r\n\u673a\u68b0\u5de5\u7a0b\u5e08\uff0cSmiths Interconnect a Molex company\r\n<\/p>\r\n\r\n

      \r\n\u9ec4\u6587\u6770\uff0c2019\u5e74\u6bd5\u4e1a\u4e8e\u626c\u5dde\u5927\u5b66\uff0c\u6240\u5b66\u4e13\u4e1a\u662f\u673a\u68b0\u8bbe\u8ba1\u5236\u9020\u53ca\u81ea\u52a8\u5316\u3002\u81ea2022\u5e74\u8d77\uff0c\u9ec4\u6587\u6770\u5c31\u804c\u4e8e\u53f2\u5bc6\u65af\u82f1\u7279\u5eb7\u83ab\u4ed5\u516c\u53f8\uff0c\u76ee\u524d\u4efb\u804c\u673a\u68b0\u5de5\u7a0b\u5e08\u4e0e\u70ed\u8bbe\u8ba1\u5de5\u7a0b\u5e08\uff0c\u8d1f\u8d23\u534a\u5bfc\u4f53\u6d4b\u8bd5\u4ea7\u54c1\u8bbe\u8ba1\u3002\r\n<\/p><\/p><\/details>\n<\/div>\n<\/div>\n\t \n

      <\/div><\/div><\/div>

      12:30<\/h1>\n<\/div><\/div><\/div><\/div>

      Lunch and EXPO<\/h1>\nEnjoy the delicious hot buffet lunch and networking time. Then take the time to explore the TestConX EXPO. There will be many great exhibits to connect electronic test professionals to solutions. You will be certain to see something new or meet someone new. As attendees to TestConX know, there is always excellent food, drinks, and time for attendees to network with exhibitors! TestConX EXPO will open at 12:30 and will remain open throughout the afternoon until 18:00<\/span><\/span><\/div><\/div><\/div>
      <\/div><\/div><\/div>

      13:30<\/h1>\n<\/div><\/div><\/div><\/div>
      \n
      \n
      Session 3<\/div><\/div>
      Thermal<\/div>
      <\/div>

      <\/p><\/div>

      \n
      \n“Beyond Thermal Conductivity: What Really Matters for Compressible Metal TIMs” \n
      “\u8d85\u8d8a\u5bfc\u70ed\u7387\uff1a\u771f\u6b63\u5f71\u54cd\u538b\u7f29\u578b\u91d1\u5c5e\u70ed\u754c\u9762\u6750\u6599\u6027\u80fd\u7684\u5173\u952e\u56e0\u7d20” \n<\/div>\n
      \n
      \n
      \nSiang Hooi Foo\n <\/div>\n\t
      \nIndium Corporation\n\t <\/div>\n <\/div>\n
      \n
      \nMilo\u0161 \"Milos\" Lazi\u0107\n <\/div>\n\t
      \nIndium Corporation\n\t <\/div>\n <\/div>\n
      \n
      \nCarson Burt\n <\/div>\n\t
      \nIndium Corporation\n\t <\/div>\n <\/div>\n
      \n
      \nRyan Mayberry\n <\/div>\n\t
      \nIndium\n\t <\/div>\n <\/div>\n<\/div>\n
      \n\tAbstract (English)<\/summary>\n

      As AI, HPC, and power electronics continue to push thermal design limits, thermal interface materials (TIMs) are increasingly required to accommodate surface non-coplanarity while maintaining low thermal resistance under limited assembly pressure. Compressible metal TIMs offer a unique combination of high thermal conductivity and mechanical compliance, making them attractive for next-generation cooling applications.<\/p>\n\n

      This study investigates the effects of installation time, applied pressure, material thickness, and pattern geometry on the thermal performance of compressible indium-based metal TIMs. Thermal resistance measurements were conducted using ASTM D5470 methodology at elevated temperature under pressures ranging from 20\u201350 psi. Multiple TIM thicknesses and surface patterns were evaluated over a 72-hour test duration to characterize the evolution of bond line thickness and effective thermal resistance.<\/p>\n\n

      Results show that installation time and applied pressure have the most significant impact on thermal performance due to continued plastic deformation and reduction of interfacial resistance. While TIM thickness influences bulk thermal resistance, its overall effect is moderated by the high thermal conductivity of indium. Pattern geometry plays a critical role during initial installation by concentrating local pressure and improving surface conformity, particularly in applications with non-coplanar mating surfaces.<\/p>\n\n

      The findings provide practical design guidelines for selecting compressible metal TIM configurations and assembly conditions to optimize thermal performance and long-term reliability in AI accelerators, data center hardware, and power electronic systems.<\/p>\n<\/p><\/details>\n

      \n\t\u6458\u8981 (Chinese)<\/summary>\n

      \u968f\u7740\u4eba\u5de5\u667a\u80fd\uff08AI\uff09\u3001\u9ad8\u6027\u80fd\u8ba1\u7b97\uff08HPC\uff09\u53ca\u529f\u7387\u7535\u5b50\u6280\u672f\u6301\u7eed\u63a8\u52a8\uff0c\u7cfb\u7edf\u529f\u7387\u5bc6\u5ea6\u4e0d\u65ad\u63d0\u5347\uff0c\u6563\u70ed\u8bbe\u8ba1\u9762\u4e34\u8d8a\u6765\u8d8a\u4e25\u82db\u7684\u6311\u6218\u3002\u70ed\u754c\u9762\u6750\u6599\uff08Thermal Interface Materials, TIM\uff09\u9664\u4e86\u80fd\u9002\u5e94\u754c\u9762\u7684\u975e\u5171\u9762\uff08Non-Coplanarity\uff09\u7279\u6027\uff0c\u8fd8\u9700\u8981\u5728\u6709\u9650\u7684\u88c5\u914d\u538b\u529b\u4e0b\u7ef4\u6301\u4f4e\u70ed\u963b\uff0c\u4fdd\u8bc1\u7a33\u5b9a\u4e14\u9ad8\u6548\u7684\u5bfc\u70ed\u6027\u80fd\u3002\u53ef\u538b\u7f29\u91d1\u5c5e TIM \u517c\u5177\u9ad8\u5bfc\u70ed\u7387\u4e0e\u4f18\u5f02\u7684\u673a\u68b0\u9002\u914d\u6027\uff0c\u5df2\u6210\u4e3a\u4e0b\u4e00\u4ee3\u9ad8\u6548\u6563\u70ed\u89e3\u51b3\u65b9\u6848\u7684\u91cd\u8981\u53d1\u5c55\u65b9\u5411\u3002<\/p>\n\n

      \u672c\u7814\u7a76\u63a2\u8ba8\u4e86\u5b89\u88c5\u65f6\u95f4\u3001\u65bd\u52a0\u538b\u529b\u3001\u6750\u6599\u539a\u5ea6\u53ca\u56fe\u6848\u7ed3\u6784\uff08Pattern Geometry\uff09\u5bf9\u53ef\u538b\u7f29\u91d1\u5c5e\u94df\u57fa TIM \u5bfc\u70ed\u6027\u80fd\u7684\u5f71\u54cd\u3002\u70ed\u963b\u6d4b\u8bd5\u91c7\u7528 ASTM D5470 \u6807\u51c6\u65b9\u6cd5\uff0c\u5728\u9ad8\u6e29\u6761\u4ef6\u4e14\u5728 20\u201350 psi \u538b\u529b\u8303\u56f4\u5185\u8fdb\u884c\u8bc4\u4f30\u3002\u7814\u7a76\u6db5\u76d6\u591a\u79cd TIM \u539a\u5ea6\u53ca\u56fe\u6848\u8bbe\u8ba1\uff0c\u6301\u7eed\u6d4b\u8bd5 72 \u5c0f\u65f6\uff0c\u4ee5\u8868\u5f81\u7ed3\u5408\u5c42\u539a\u5ea6\uff08Bond Line Thickness, BLT\uff09\u548c\u6709\u6548\u70ed\u963b\u968f\u65f6\u95f4\u7684\u53d8\u5316\u89c4\u5f8b\u3002<\/p>\n\n

      \u7814\u7a76\u7ed3\u679c\u8868\u660e\uff0c\u5b89\u88c5\u65f6\u95f4\u4e0e\u65bd\u52a0\u538b\u529b\u5bf9\u70ed\u6027\u80fd\u5f71\u54cd\u6700\u4e3a\u663e\u8457\u3002\u8fd9\u4e3b\u8981\u5f52\u56e0\u4e8e\u6750\u6599\u6301\u7eed\u53d1\u751f\u5851\u6027\u53d8\u5f62\uff08Plastic Deformation\uff09\uff0c\u4f7f\u754c\u9762\u63a5\u89e6\u66f4\u52a0\u5145\u5206\uff0c\u4ece\u800c\u964d\u4f4e\u754c\u9762\u70ed\u963b\u3002\u867d\u7136 TIM \u6750\u6599\u539a\u5ea6\u4f1a\u5f71\u54cd\u5176\u81ea\u8eab\u70ed\u963b\uff0c\u4f46\u7531\u4e8e\u94df\u5177\u6709\u6781\u9ad8\u7684\u5bfc\u70ed\u7387\uff0c\u5176\u6574\u4f53\u5f71\u54cd\u76f8\u5bf9\u6709\u9650\u3002\u56fe\u6848\u8bbe\u8ba1\u5219\u5728\u521d\u59cb\u88c5\u914d\u9636\u6bb5\u53d1\u6325\u5173\u952e\u4f5c\u7528\uff0c\u53ef\u63d0\u9ad8\u5c40\u90e8\u63a5\u89e6\u538b\u529b\u5e76\u589e\u5f3a\u8868\u9762\u8d34\u5408\u80fd\u529b\uff0c\u7279\u522b\u9002\u7528\u4e8e\u975e\u5171\u9762\u7684\u5e94\u7528\u573a\u666f\u3002<\/p>\n\n

      \u672c\u7814\u7a76\u7ed3\u679c\u4e3a\u53ef\u538b\u7f29\u578b\u91d1\u5c5e TIM \u7684\u6750\u6599\u548c\u56fe\u6848\u9009\u578b\uff0c\u4ee5\u53ca\u88c5\u914d\u65b9\u5f0f\u9009\u62e9\u63d0\u4f9b\u4e86\u975e\u5e38\u5b9e\u7528\u7684\u8bbe\u8ba1\u6307\u5357\uff0c\u4ee5\u6b64\u6765\u63d0\u5347 AI \u52a0\u901f\u5668\u3001\u6570\u636e\u4e2d\u5fc3\u786c\u4ef6\u53ca\u529f\u7387\u7535\u5b50\u7cfb\u7edf\u4e2d\u7684\u6563\u70ed\u6027\u80fd\u4e0e\u957f\u671f\u53ef\u9760\u6027\u3002<\/p>\n<\/p><\/details>\n<\/div>\n

      \n
      \n“AI-assisted Protocol Analysis Solution” \n
      “\u57fa\u4e8e SMT8 \u534f\u8bae\u89e3\u6790\u4e0e\u672c\u5730 AI \u5206\u6790\u7684 ATE \u5bc4\u5b58\u5668\u914d\u7f6e\u81ea\u52a8\u9a8c\u8bc1\u4e0e\u4f18\u5316\u65b9\u6cd5” \n<\/div>\n
      \n
      \n
      \nXuan Rong\n <\/div>\n\t
      \nHuatek\n\t <\/div>\n <\/div>\n
      \n
      \nSteve Xie\n <\/div>\n\t
      \nAdvantest\n\t <\/div>\n <\/div>\n<\/div>\n
      \n\tAbstract (English)<\/summary>\n

      \nTopic: AI-assisted_Protocol_Analysis_Solution<\/strong>\n<\/p>\n\n

      \nWith the increasing design complexity of advanced integrated circuits, chip testing has become quite complex. More than 90%<\/strong> of test items require the specified protocol set to enter a predefined operating mode before measurement execution. This process is achieved by configuring registers through a chip protocol such as I2C<\/strong>, JTAG<\/strong>, or SPI<\/strong>. In complex test scenarios, a single ATE<\/strong> test program may include tons of register initialization and dynamic configuration operations. In addition, register configuration processes and subsequent measurement operations often interleave, and the accuracy of test results depends on the precise timing window after the target register state configuration is completed.\n<\/p>\n\n

      \nThere are several challenges listed below that will be experienced:\n<\/p>\n\n

        \n
      1. Verification of register configuration mostly depends on manual inspection during program development and debugging.<\/li>\n
      2. Engineers must pick out the specified cycle ranges which need to insert measurement actions from amounts of configuration cycles in register configuration sequences.<\/li>\n
      3. Modification and validation of register configurations typically depend on a lot of manual work like parsing and trial-and-error debugging.<\/li>\n<\/ol>\n\n

        \nTo resolve these problems, this paper released an AI-assisted SMT8 protocol-based pattern parsing and optimization method<\/strong>. Chapter 1 provides a detailed overview of the background and current state of ATE test, and Chapter 2 describes the core functions of the method. The method performs protocol-level decoding of DFT<\/strong> raw test vectors to automatically extract register address mappings, configuration data, and execution cycle information. Furthermore, a local AI-driven data analysis module is introduced to analyze and interpret the test plan contents and automatically compare parsed register configuration behavior with the test plan specifications.\n<\/p>\n\n

        \nThis framework focuses on the following key technical challenges:\n<\/p>\n\n

          \n
        1. Abstraction of waveform information in raw test vectors.<\/li>\n
        2. versatile protocol Compatibility.<\/li>\n
        3. Accurate localization of cycle ranges for register configuration segments.<\/li>\n
        4. Local AI model preset tuning and verification skill definition.<\/li>\n<\/ol>\n\n

          \nThe method consists of waveform reconstruction<\/strong>, protocol action serialization<\/strong>, protocol rule matching<\/strong>, test data processing<\/strong>, and AI analysis<\/strong>.\n<\/p>\n\n

          \nExperimental results demonstrate that the method significantly improves register configuration readability and debugging efficiency in ATE-based chip testing workflows. Compared with conventional manual analysis approaches:\n<\/p>\n\n

            \n
          1. The time spent on register configuration consistency verification is reduced from 18 hours per project<\/strong> to 2 hours per project<\/strong> (almost 88% save<\/strong>).<\/li>\n
          2. The time spent on register configuration modification during debugging is reduced from 10 hours per project<\/strong> to 4 hours per project<\/strong> (reduce 60%<\/strong> time cost).<\/li>\n
          3. The overall test program development and debugging cycle is reduced by approximately 30%<\/strong> on average.<\/li>\n
          4. The program error rate is reduced by 70%<\/strong>.<\/li>\n<\/ol>\n\n

            \nBy combining automatic protocol-level decoding of raw test vectors with local AI analysis modules, the method effectively solves the register configuration problem in complex ATE testing, achieving significant improvements in both efficiency and accuracy.\n<\/p><\/p><\/details>\n

            \n\t\u6458\u8981 (Chinese)<\/summary>\n

            \u4e3b\u9898\uff1a<\/strong>\u57fa\u4e8e SMT8 \u534f\u8bae\u89e3\u6790\u4e0e\u672c\u5730 AI \u5206\u6790\u7684 ATE \u5bc4\u5b58\u5668\u914d\u7f6e\u81ea\u52a8\u9a8c\u8bc1\u4e0e\u4f18\u5316\u65b9\u6cd5<\/p>\n\n

            \u968f\u7740\u5148\u8fdb\u96c6\u6210\u7535\u8def\u8bbe\u8ba1\u590d\u6742\u5ea6\u7684\u4e0d\u65ad\u63d0\u5347\uff0c\u82af\u7247\u6d4b\u8bd5\u4e5f\u53d8\u5f97\u65e5\u76ca\u590d\u6742\u3002\u8d85\u8fc790%\u7684\u6d4b\u8bd5\u9879\u76ee\u8981\u6c42\u5728\u6267\u884c\u6d4b\u91cf\u524d\uff0c\u901a\u8fc7\u6307\u5b9a\u7684\u534f\u8bae\u96c6\u4f7f\u7cfb\u7edf\u8fdb\u5165\u9884\u5b9a\u4e49\u7684\u5de5\u4f5c\u6a21\u5f0f\u3002\u8fd9\u4e00\u8fc7\u7a0b\u901a\u5e38\u901a\u8fc7 I2C\u3001JTAG \u6216 SPI \u7b49\u82af\u7247\u534f\u8bae\u5bf9\u5bc4\u5b58\u5668\u8fdb\u884c\u914d\u7f6e\u6765\u5b9e\u73b0\u3002\u5728\u590d\u6742\u7684\u6d4b\u8bd5\u573a\u666f\u4e2d\uff0c\u5355\u4e2a ATE \u6d4b\u8bd5\u7a0b\u5e8f\u53ef\u80fd\u5305\u542b\u5927\u91cf\u5bc4\u5b58\u5668\u521d\u59cb\u5316\u548c\u52a8\u6001\u914d\u7f6e\u64cd\u4f5c\u3002\u6b64\u5916\uff0c\u5bc4\u5b58\u5668\u914d\u7f6e\u8fc7\u7a0b\u4e0e\u540e\u7eed\u7684\u6d4b\u91cf\u64cd\u4f5c\u5f80\u5f80\u4ea4\u9519\u8fdb\u884c\uff0c\u6d4b\u8bd5\u7ed3\u679c\u7684\u51c6\u786e\u6027\u53d6\u51b3\u4e8e\u76ee\u6807\u5bc4\u5b58\u5668\u72b6\u6001\u914d\u7f6e\u5b8c\u6210\u540e\u7684\u7cbe\u786e\u65f6\u5e8f\u7a97\u53e3\u3002<\/p>\n\n

            \u8fd9\u4f1a\u51fa\u73b0\u5982\u4e0b\u8fd9\u4e9b\u6311\u6218\uff1a<\/p>\n\n

              \n
            1. \u5bc4\u5b58\u5668\u914d\u7f6e\u6b63\u786e\u6027\u9a8c\u8bc1\u4e3b\u8981\u4f9d\u8d56\u4e8e\u7a0b\u5e8f\u5f00\u53d1\u548c\u8c03\u8bd5\u671f\u95f4\u7684\u624b\u52a8\u68c0\u67e5\u3002<\/li>\n
            2. \u5de5\u7a0b\u5e08\u5fc5\u987b\u5728\u5927\u91cf\u5bc4\u5b58\u5668\u5e8f\u5217\u914d\u7f6e\u4e2d\uff0c\u7b5b\u9009\u51fa\u9700\u8981\u63d2\u5165\u6d4b\u91cf\u64cd\u4f5c\u7684\u6307\u5b9a\u65f6\u95f4\u8282\u70b9\u3002<\/li>\n
            3. \u5bc4\u5b58\u5668\u914d\u7f6e\u7684\u4fee\u6539\u548c\u9a8c\u8bc1\u901a\u5e38\u4f9d\u8d56\u4e8e\u5927\u91cf\u624b\u52a8\u5de5\u4f5c\u3002<\/li>\n<\/ol>\n\n

              \u4e3a\u89e3\u51b3\u8fd9\u4e9b\u95ee\u9898\uff0c\u63d0\u51fa\u4e86\u57fa\u4e8e SMT8 \u534f\u8bae\u89e3\u6790\u4e0e\u672c\u5730 AI \u5206\u6790\u7684 ATE \u5bc4\u5b58\u5668\u914d\u7f6e\u81ea\u52a8\u9a8c\u8bc1\u4e0e\u4f18\u5316\u65b9\u6cd5\u3002\u672c\u6587\u7ed3\u6784\u5982\u4e0b\uff1a\u7b2c1\u7ae0\u8be6\u7ec6\u6982\u8ff0\u4e86 ATE \u6d4b\u8bd5\u7684\u80cc\u666f\u53ca\u73b0\u72b6\uff0c\u7b2c2\u7ae0\u63cf\u8ff0\u4e86\u8be5\u65b9\u6cd5\u7684\u6838\u5fc3\u529f\u80fd\uff0c\u5305\u62ec\u5bf9 DFT \u539f\u59cb\u6d4b\u8bd5\u5411\u91cf\u8fdb\u884c\u534f\u8bae\u7ea7\u89e3\u7801\uff0c\u81ea\u52a8\u63d0\u53d6\u5bc4\u5b58\u5668\u5730\u5740\u6620\u5c04\u3001\u914d\u7f6e\u6570\u636e\u548c\u6267\u884c\u5468\u671f\u4fe1\u606f\u3002\u9664\u6b64\u4e4b\u5916\uff0c\u8fd8\u5f15\u5165\u4e86\u4e00\u4e2a\u57fa\u4e8e\u672c\u5730 AI \u7684\u6570\u636e\u5206\u6790\u6a21\u5757\uff0c\u7528\u4e8e\u5206\u6790 Test Plan \u5185\u5bb9\uff0c\u6700\u540e\u5c06\u539f\u59cb\u6d4b\u8bd5\u5411\u91cf\u89e3\u6790\u51fa\u7684\u5bc4\u5b58\u5668\u914d\u7f6e\u4e0e AI \u4ece Test Plan \u63d0\u53d6\u7684\u5bc4\u5b58\u5668\u914d\u7f6e\u89c4\u8303\u8fdb\u884c\u6bd4\u5bf9\uff0c\u5e76\u751f\u6210\u7ed3\u679c\u62a5\u544a\u3002<\/p>\n\n

              \u8be5\u6846\u67b6\u91cd\u70b9\u89e3\u51b3\u4e86\u4ee5\u4e0b\u5173\u952e\u6280\u672f\u6311\u6218\uff1a<\/p>\n\n

                \n
              1. \u539f\u59cb\u6d4b\u8bd5\u5411\u91cf\u4e2d\u6ce2\u5f62\u4fe1\u606f\u7684\u62bd\u8c61\u5316\u3002<\/li>\n
              2. \u901a\u7528\u7684\u534f\u8bae\u517c\u5bb9\u6027\u3002<\/li>\n
              3. \u5bc4\u5b58\u5668\u914d\u7f6e\u6bb5\u65f6\u949f\u5468\u671f\u7684\u7cbe\u786e\u5b9a\u4f4d\u3002<\/li>\n
              4. \u672c\u5730 AI \u6a21\u578b\u9884\u8bbe\u7684\u8c03\u4f18\u53ca\u9a8c\u8bc1\u3002<\/li>\n<\/ol>\n\n

                \u5b9e\u9a8c\u7ed3\u679c\u8868\u660e\uff0c\u8be5\u65b9\u6cd5\u663e\u8457\u63d0\u9ad8\u4e86\u57fa\u4e8e ATE \u7684\u82af\u7247\u6d4b\u8bd5\u5de5\u4f5c\u6d41\u4e2d\u5bc4\u5b58\u5668\u914d\u7f6e\u7684\u53ef\u8bfb\u6027\u548c\u8c03\u8bd5\u6548\u7387\u3002\u4e0e\u4f20\u7edf\u7684\u624b\u52a8\u5206\u6790\u65b9\u6cd5\u76f8\u6bd4\uff1a<\/p>\n\n

                  \n
                1. \u7528\u4e8e\u5bc4\u5b58\u5668\u914d\u7f6e\u4e00\u81f4\u6027\u9a8c\u8bc1\u7684\u65f6\u95f4\u4ece\u6bcf\u4e2a\u9879\u76ee 18 \u5c0f\u65f6\u51cf\u5c11\u5230\u6bcf\u4e2a\u9879\u76ee 2 \u5c0f\u65f6\uff08\u8282\u7701\u8fd1 88%\uff09\u3002<\/li>\n
                2. \u8c03\u8bd5\u8fc7\u7a0b\u4e2d\u7528\u4e8e\u4fee\u6539\u5bc4\u5b58\u5668\u914d\u7f6e\u7684\u65f6\u95f4\u4ece\u6bcf\u4e2a\u9879\u76ee 10 \u5c0f\u65f6\u51cf\u5c11\u5230 4 \u5c0f\u65f6\uff08\u65f6\u95f4\u6210\u672c\u964d\u4f4e 60%\uff09\u3002<\/li>\n
                3. \u6d4b\u8bd5\u7a0b\u5e8f\u7684\u6574\u4f53\u5f00\u53d1\u548c\u8c03\u8bd5\u5468\u671f\u5e73\u5747\u7f29\u77ed\u4e86\u7ea6 30%\u3002<\/li>\n
                4. \u7a0b\u5e8f\u9519\u8bef\u7387\u964d\u4f4e\u4e86 70%\u3002<\/li>\n<\/ol>\n\n

                  \u901a\u8fc7\u5c06\u539f\u59cb\u6d4b\u8bd5\u5411\u91cf\u7684\u534f\u8bae\u7ea7\u81ea\u52a8\u89e3\u7801\u4e0e\u672c\u5730 AI \u5206\u6790\u6a21\u5757\u76f8\u7ed3\u5408\uff0c\u8be5\u65b9\u6cd5\u6709\u6548\u89e3\u51b3\u4e86\u590d\u6742 ATE \u6d4b\u8bd5\u4e2d\u7684\u5bc4\u5b58\u5668\u914d\u7f6e\u95ee\u9898\uff0c\u5728\u6548\u7387\u548c\u51c6\u786e\u6027\u65b9\u9762\u5747\u5b9e\u73b0\u4e86\u663e\u8457\u63d0\u5347\u3002<\/p><\/p><\/details>\n<\/div>\n<\/div>\n\t \n

                  \n
                  \n
                  <\/div>
                  PCB<\/div>
                  <\/div>

                  <\/p><\/div>

                  \n
                  \n“A differential channel skew compensation and resonance elimination method for suppressing glass fiber effect in high-speed PCBs” \n
                  “\u4e00\u79cd\u6291\u5236\u9ad8\u901f PCB \u73bb\u7ea4\u6548\u5e94\u7684\u5dee\u5206\u901a\u9053 skew \u8865\u507f\u4e0e\u8c10\u632f\u6d88\u9664\u65b9\u6cd5” \n<\/div>\n
                  \n
                  \n
                  \nShuai \"Andy\" Wang\n <\/div>\n\t
                  \nPi Semiconductor\n\t <\/div>\n <\/div>\n<\/div>\n
                  \n\tAbstract - Biography (English)<\/summary>\n

                  \nFiber weave effect (FWE<\/strong>) on PCBs induces PN skew<\/strong> within differential pairs, which triggers severe insertion loss resonance in high-speed applications such as 112Gbps PAM4<\/strong> systems. This paper verifies that PN skew acts as the root cause and proposes an innovative compensation scheme.\n<\/p>\n\n

                  \nBy coating high-dielectric-constant (high-Dk) solder mask<\/strong> on the faster transmission line, the propagation delays of differential traces are well balanced. Experimental results demonstrate that the proposed method eliminates resonance and reduces PN skew<\/strong> from -36 ps<\/strong> to below 10 ps<\/strong>.\n<\/p>\n\n

                  \nThis technique provides a simple and low-cost solution for skew mitigation.\n<\/p><\/p>

                  \nWith 14 years of SIPI simulation experience<\/strong>, I have conducted SIPI simulations for mobile phone SoC chips, CPU chips, ADCs and DACs, as well as simulations of 800G and 1.6T optical modules<\/strong>. Currently, I am engaged in SIPI simulation of FT boards at Pi Semiconductor.\n<\/p><\/p><\/details>\n

                  \n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

                  \nPCB \u4e0a\u7684\u73bb\u7ea4\u6548\u5e94\uff08FWE<\/strong>\uff09\u4f1a\u5728\u5dee\u5206\u5bf9\u4e2d\u5f15\u8d77 PN \u65f6\u5ef6\u5dee\uff08PN Skew\uff09<\/strong>\uff0c\u4ece\u800c\u5728 112Gbps PAM4<\/strong> \u7b49\u9ad8\u901f\u573a\u666f\u4e0b\u5bfc\u81f4\u4e25\u91cd\u7684\u63d2\u635f\u8c10\u632f\u3002\u672c\u6587\u786e\u5b9a\u4e86 PN \u65f6\u5ef6\u5dee\u662f\u6839\u672c\u539f\u56e0\uff0c\u5e76\u63d0\u51fa\u4e86\u4e00\u79cd\u65b0\u9896\u7684\u8865\u507f\u65b9\u6cd5\u3002\n<\/p>\n\n

                  \n\u901a\u8fc7\u5728\u901f\u5ea6\u8f83\u5feb\u7684\u4f20\u8f93\u7ebf\u4e0a\u6d82\u8986\u9ad8\u4ecb\u7535\u5e38\u6570\u7684\u7eff\u6cb9\uff0c\u6211\u4eec\u6709\u6548\u5730\u5e73\u8861\u4e86\u4f20\u8f93\u65f6\u5ef6\u3002\u5b9e\u9a8c\u7ed3\u679c\u8868\u660e\uff0c\u8be5\u65b9\u6cd5\u80fd\u6d88\u9664\u8c10\u632f\uff0c\u5e76\u5c06 PN \u65f6\u5ef6\u5dee<\/strong> \u4ece -36 \u76ae\u79d2<\/strong> \u964d\u4f4e\u81f3 10 \u76ae\u79d2\u4ee5\u4e0b<\/strong>\u3002\n<\/p>\n\n

                  \n\u8fd9\u662f\u4e00\u79cd\u7b80\u5355\u3001\u4f4e\u6210\u672c\u964d\u4f4e\u5ef6\u65f6\u5dee\u7684\u89e3\u51b3\u65b9\u6848\u3002\n<\/p><\/p>

                  \n14\u5e74SIPI\u4eff\u771f\u7ecf\u9a8c<\/strong>\uff0c\u5148\u540e\u4ece\u4e8b\u624b\u673aSOC\u82af\u7247\u3001CPU\u82af\u7247\u3001ADC\u3001DAC\u82af\u7247\u7684SIPI\u4eff\u771f\u3001800G\/1.6T\u5149\u6a21\u5757\u4eff\u771f<\/strong>\u3002\u76ee\u524d\u5728\u5706\u5468\u7387\u534a\u5bfc\u4f53\u4ece\u4e8bFT\u677f\u7684SIPI\u4eff\u771f\u5de5\u4f5c\u3002\n<\/p><\/p><\/details>\n<\/div>\n

                  \n
                  \n“High efficiency test solution on v93000 for Display Driver Chip” \n
                  “\u9762\u5411\u9ad8\u5206\u8fa8\u7387\u663e\u793a\u9a71\u52a8\u82af\u7247\u7684 V93000 \u9ad8\u5e76\u884c\u9ad8\u6548\u7387\u6d4b\u8bd5\u65b9\u6848” \n<\/div>\n
                  \n
                  \n
                  \nChelsea Zhou\n <\/div>\n\t
                  \nAdvantest (China) Management Co., Ltd.\n\t <\/div>\n <\/div>\n
                  \n
                  \nSteve Xie\n <\/div>\n\t
                  \nAdvantest\n\t <\/div>\n <\/div>\n<\/div>\n
                  \n\tAbstract - Biography (English)<\/summary>\n

                  \nWith the growth of the demand for entertainment, high resolution and high refresh rate displayers become increasingly popular. These products are always featured with display resolution up to 4k<\/strong> and refresh rates up to 300Hz<\/strong>, which means they need a high bandwidth and high-speed process unit. Normally, Display Driver Chip is equipped with high performance analog modules, variety of display interface modules and complex digital processing modules. To test this chip, there are several special notices list below:\n<\/p>\n\n

                    \n
                  1. Cost sensitive both on hardware solution and software test time<\/li>\n
                  2. High performance demand on analog tests both at high Frequency (up to 75Mhz<\/strong>) and high resolution (up to 24 bits<\/strong>), it is a great challenge for tester and data processing<\/li>\n
                  3. To meet high parallelism and high-performance testing requirements, strict LB design to ensure high-quality SI and PI is essential.<\/li>\n
                  4. Complex circuit designed involve multi-site data Consistency problem<\/li>\n<\/ol>\n\n

                    \nIn this paper, we delivered a high efficiency test solution based on a real case. This test solution included hardware LB design and software test program develop algorithm. It includes 4 chapters for description:\n<\/p>\n\n

                      \n
                    1. \nGenerally, introduce the test DUT background (like spec target, IP module, test requirement). Then recommend an optimized 16 sites<\/strong> hardware solution with high parallelism. List the key point of how to control test time, TTR suggestions based on the real case.\n<\/li>\n\n
                    2. \nCompletely test process introduction of analog module. Including 75Mhz with 14 bits ADC test<\/strong> and 1KHz 24bits DAC test<\/strong>. To prove WSMX AWG performance can meet the spec of the target DUT, we collect real experiment data which include 10MHz to 100MHz<\/strong> dynamic performance of sine wave with WSMX HS unit. And a special calculation algorithm will be shown in this part, which can obviously improve test performance of dynamic parameters like SNR\/SNDR\/THD\/SFDR<\/strong> even test with non-coherence sample (SNR can improve over 30dB<\/strong> in some extremely condition).\n<\/li>\n\n
                    3. \nLB design special notice, detail descript signal routing rules while testing. A holey signal path placement suggestion based on real case will be added here (In some extremely condition, THD will have 20dB gap<\/strong>).\n<\/li>\n\n
                    4. \nDemonstrate the root causes of multi-site inconsistency problems across analog test items and provide effective optimization solutions. (yield can improve obviously)\n<\/li>\n<\/ol>\n\n

                      \nIn addition, the target device is already in mass production, analog test performance meets the goal. So, the reference test result will be also past at the end.\n<\/p><\/p>

                      \nChelsea Zhou<\/strong>\n<\/p>\n\n

                      \nDevelop Application Engineer of ADVANTEST<\/strong>. Obtained a bachelor\u2019s degree in electronic information systems in 2022. With more than 4 years<\/strong> of experience in developing ATE<\/strong> test programs. Engaged in digital, high-speed and mixed-signal chip testing, providing ATE chip test software and hardware solutions for leading semiconductor corporations in the Chinese mainland.\n<\/p><\/p><\/details>\n

                      \n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

                      \n\u968f\u7740\u5a31\u4e50\u5e94\u7528\u9700\u6c42\u7684\u6301\u7eed\u589e\u957f\uff0c\u9ad8\u5206\u8fa8\u7387\u3001\u9ad8\u5237\u65b0\u7387\u663e\u793a\u4ea7\u54c1\u65e5\u76ca\u666e\u53ca\u3002\u5f53\u524d\u663e\u793a\u5668\u4ea7\u54c1\u5206\u8fa8\u7387\u53ef\u8fbe 4K<\/strong>\uff0c\u5237\u65b0\u7387\u53ef\u8d85\u8fc7 300Hz<\/strong>\uff0c\u5bf9\u82af\u7247\u5e26\u5bbd\u548c\u9ad8\u901f\u6570\u636e\u5904\u7406\u80fd\u529b\u63d0\u51fa\u4e86\u66f4\u9ad8\u8981\u6c42\u3002\u663e\u793a\u9a71\u52a8\u82af\u7247\uff08Display Driver Chip<\/strong>\uff09\u901a\u5e38\u96c6\u6210\u9ad8\u6027\u80fd\u6a21\u62df\u6a21\u5757\u3001\u591a\u79cd\u663e\u793a\u63a5\u53e3\u6a21\u5757\u4ee5\u53ca\u590d\u6742\u6570\u5b57\u5904\u7406\u6a21\u5757\uff0c\u56e0\u6b64\u5176\u6d4b\u8bd5\u9762\u4e34\u8bf8\u591a\u6311\u6218\uff0c\u5305\u62ec\u786c\u4ef6\u6210\u672c\u4e0e\u6d4b\u8bd5\u65f6\u95f4\u63a7\u5236\u3001\u9ad8\u9891\u9ad8\u7cbe\u5ea6\u6a21\u62df\u6027\u80fd\u9a8c\u8bc1\u3001\u9ad8\u5e76\u884c\u6d4b\u8bd5\u4e0b\u7684\u4fe1\u53f7\u5b8c\u6574\u6027\uff08SI<\/strong>\uff09\u4e0e\u7535\u6e90\u5b8c\u6574\u6027\uff08PI<\/strong>\uff09\u8bbe\u8ba1\uff0c\u4ee5\u53ca\u591a\u7ad9\u70b9\u6d4b\u8bd5\u4e00\u81f4\u6027\u7b49\u95ee\u9898\u3002\n<\/p>\n\n

                      \n\u672c\u6587\u57fa\u4e8e\u5b9e\u9645\u91cf\u4ea7\u9879\u76ee\uff0c\u63d0\u51fa\u4e86\u4e00\u5957\u9488\u5bf9\u663e\u793a\u9a71\u52a8\u82af\u7247\u7684\u9ad8\u6548\u7387\u6d4b\u8bd5\u89e3\u51b3\u65b9\u6848\uff0c\u6db5\u76d6\u786c\u4ef6 Load Board<\/strong> \u8bbe\u8ba1\u4e0e\u8f6f\u4ef6\u6d4b\u8bd5\u7a0b\u5e8f\u5f00\u53d1\u4e24\u5927\u90e8\u5206\u3002\u9996\u5148\u4ecb\u7ecd\u88ab\u6d4b\u5668\u4ef6\uff08DUT<\/strong>\uff09\u7684\u4ea7\u54c1\u80cc\u666f\u3001\u6027\u80fd\u6307\u6807\u3001IP \u6a21\u5757\u7279\u6027\u53ca\u6d4b\u8bd5\u9700\u6c42\uff0c\u5e76\u7ed3\u5408\u5b9e\u9645\u6848\u4f8b\u63d0\u51fa\u4f18\u5316\u7684 16 Site<\/strong> \u9ad8\u5e76\u884c\u786c\u4ef6\u65b9\u6848\uff0c\u4ee5\u53ca\u964d\u4f4e\u6d4b\u8bd5\u65f6\u95f4\uff08Test Time Reduction, TTR<\/strong>\uff09\u7684\u5173\u952e\u7b56\u7565\u3002\n<\/p>\n\n

                      \n\u5176\u6b21\uff0c\u8be6\u7ec6\u4ecb\u7ecd\u6a21\u62df\u6a21\u5757\u6d4b\u8bd5\u6d41\u7a0b\uff0c\u5305\u62ec 75 MHz\u300114 \u4f4d ADC<\/strong> \u6d4b\u8bd5\u4ee5\u53ca 1 kHz\u300124 \u4f4d DAC<\/strong> \u6d4b\u8bd5\u3002\u901a\u8fc7\u5b9e\u9645\u5b9e\u9a8c\u6570\u636e\u9a8c\u8bc1 WSMX<\/strong> \u9ad8\u901f AWG<\/strong> \u5e73\u53f0\u5728 10 MHz \u81f3 100 MHz<\/strong> \u8303\u56f4\u5185\u7684\u52a8\u6001\u6027\u80fd\uff0c\u5e76\u63d0\u51fa\u4e00\u79cd\u6539\u8fdb\u7b97\u6cd5\uff0c\u5728\u975e\u76f8\u5e72\u91c7\u6837\u6761\u4ef6\u4e0b\u4ecd\u53ef\u663e\u8457\u63d0\u5347 SNR<\/strong>\u3001SNDR<\/strong>\u3001THD<\/strong> \u53ca SFDR<\/strong> \u7b49\u52a8\u6001\u53c2\u6570\u7684\u6d4b\u8bd5\u7cbe\u5ea6\uff0c\u6781\u7aef\u6761\u4ef6\u4e0b SNR<\/strong> \u63d0\u5347\u53ef\u8d85\u8fc7 30 dB<\/strong>\u3002\n<\/p>\n\n

                      \n\u6b64\u5916\uff0c\u8bba\u6587\u8fd8\u603b\u7ed3\u4e86\u6a21\u62df\u6d4b\u8bd5\u4e2d Load Board<\/strong> \u8bbe\u8ba1\u548c\u4fe1\u53f7\u5e03\u7ebf\u7684\u5173\u952e\u6ce8\u610f\u4e8b\u9879\uff0c\u5e76\u7ed3\u5408\u5b9e\u9645\u6848\u4f8b\u7ed9\u51fa\u4f18\u5316\u5efa\u8bae\u3002\u5728\u67d0\u4e9b\u6781\u7aef\u6761\u4ef6\u4e0b\uff0c\u5408\u7406\u7684\u4fe1\u53f7\u8def\u5f84\u8bbe\u8ba1\u53ef\u4f7f THD<\/strong> \u6027\u80fd\u6539\u5584\u8d85\u8fc7 20 dB<\/strong>\u3002\u540c\u65f6\uff0c\u9488\u5bf9\u591a Site<\/strong> \u6d4b\u8bd5\u4e2d\u7684\u6570\u636e\u4e00\u81f4\u6027\u95ee\u9898\uff0c\u6df1\u5165\u5206\u6790\u5176\u6839\u672c\u539f\u56e0\uff0c\u5e76\u63d0\u51fa\u6709\u6548\u4f18\u5316\u65b9\u6848\uff0c\u4ece\u800c\u663e\u8457\u63d0\u5347\u91cf\u4ea7\u6d4b\u8bd5\u826f\u7387\u3002\u6700\u7ec8\uff0c\u57fa\u4e8e\u5df2\u7ecf\u91cf\u4ea7\u7684\u76ee\u6807\u4ea7\u54c1\u9a8c\u8bc1\u4e86\u8be5\u65b9\u6848\u7684\u6709\u6548\u6027\uff0c\u6d4b\u8bd5\u7ed3\u679c\u8868\u660e\u6a21\u62df\u6027\u80fd\u6ee1\u8db3\u8bbe\u8ba1\u76ee\u6807\u8981\u6c42\u3002\n<\/p><\/p>

                      \n\u5468\u6dd1\u5a77<\/strong>\n<\/p>\n\n

                      \n\u73b0\u4efb Advantest<\/strong> \u5e94\u7528\u5f00\u53d1\u5de5\u7a0b\u5e08\uff08Application Engineer\uff09\uff0c\u4e8e2022\u5e74\u83b7\u5f97\u7535\u5b50\u4fe1\u606f\u7cfb\u7edf\u4e13\u4e1a\u5b66\u58eb\u5b66\u4f4d\u3002\u62e5\u67094\u5e74\u4ee5\u4e0a<\/strong>ATE<\/strong>\u6d4b\u8bd5\u7a0b\u5e8f\u5f00\u53d1\u7ecf\u9a8c\uff0c\u4e13\u6ce8\u4e8e\u6570\u5b57\u3001\u9ad8\u901f\u63a5\u53e3\u53ca\u6df7\u5408\u4fe1\u53f7\u82af\u7247\u6d4b\u8bd5\u3002\u4e3a\u4e2d\u56fd\u5927\u9646\u9886\u5148\u7684\u534a\u5bfc\u4f53\u4f01\u4e1a\u63d0\u4f9bATE<\/strong>\u6d4b\u8bd5\u8f6f\u4ef6\u548c\u786c\u4ef6\u89e3\u51b3\u65b9\u6848\uff0c\u5177\u5907\u4e30\u5bcc\u7684\u91cf\u4ea7\u6d4b\u8bd5\u5f00\u53d1\u4e0e\u6280\u672f\u652f\u6301\u7ecf\u9a8c\u3002\n<\/p><\/p><\/details>\n<\/div>\n<\/div>\n\t \n

                      <\/div><\/div><\/div>

                      15:30<\/h1>\n<\/div><\/div><\/div><\/div>

                      Poster  & EXPO<\/strong><\/h1>\nEnjoy time to walk the EXPO floor and network while refreshments are served. Take some time to see our posters as you enjoy refreshments.<\/span><\/span><\/div><\/div><\/div>\n
                      \n
                      Posters<\/div><\/div>
                      <\/div>
                      <\/div>

                      <\/p><\/div>

                      \n
                      \n“You're Not Alone: The pain and game of burning probes” \n
                      “\u4f60\u5e76\u4e0d\u5b64\u5355\uff1a\u63a2\u9488\u70e7\u6bc1\u7684\u75db\u70b9\u4e0e\u535a\u5f08” \n<\/div>\n
                      \n
                      \n
                      \nYuanjun \"YJ\" Shi\n <\/div>\n\t
                      \n\n\t <\/div>\n <\/div>\n<\/div>\n
                      \n\tAbstract - Biography (English)<\/summary>\n

                      Abstract:<\/strong><\/p>\n\n

                      \nThis study aims to analyze and investigate the causes of probe burn during wafer testing of high-current, high-power devices. We employ an integrated approach combining:\n<\/p>\n\n

                        \n
                      1. Monte Carlo simulations of random resistor network distributions,<\/li>\n
                      2. Multiphysics finite element simulations coupling joule heating with thermal diffusion to model temperature rise,<\/li>\n
                      3. AI-driven fitting\/optimization using TensorFlow with CUDA acceleration, to predict the temperature rise according to different pin count group and individual probe current distribution.<\/li>\n
                      4. Molecular dynamics (MD) simulations to characterize tensile strength properties under different temperature.<\/li>\n<\/ol>\n\n

                        \nBy synthesizing insights from these methodologies, we explore the underlying mechanisms of probe burn formation. Our analysis specifically examines whether the identified thermo-electro-mechanical phenomena represent the primary cause or constitute one contributing factor among others\u2026\u2026\n<\/p><\/p>

                        \nYJ Shi<\/strong> is a senior expert in semiconductor testing and precision metallic interconnect technologies, with more than two decades of experience in SoC testing, spring probes (Pogo Pins), and MEMS probe and probe card research and development.\n<\/p>\n\n

                        \nHe began his career at AMD as a packaging process engineer and SoC test development engineer, and subsequently served as Probe Assembly Manager at Antares, Probe Card R&D Manager at Microprobe Technology, Probe Card R&D Manager for FormFactor China, R&D Director at Twinsolution, and General Manager of Nanofab Semiconductor Technology.\n<\/p>\n\n

                        \nHis expertise centers on the development of highly reliable, high-frequency, and miniaturized metallic interconnect structures. His core capabilities include Pogo Pin and MEMS probe structural design, materials engineering, mems process budgeting, micro-assembly, reliability and electrical performance validation, and production ramp-up.\n<\/p>\n\n

                        \nHe has comprehensive experience spanning technology roadmap planning, product definition, R&D organization building, mems process development, customer qualification, and production stabilize, with a particular strength in translating advanced probe technologies into robust, scalable, and manufacturable solutions.\n<\/p><\/p><\/details>\n

                        \n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

                        \u6458\u8981\uff1a<\/strong><\/p>\n\n

                        \n\u672c\u7814\u7a76\u65e8\u5728\u5206\u6790\u548c\u63a2\u7a76\u9ad8\u7535\u6d41\u3001\u9ad8\u529f\u7387\u5668\u4ef6\u5728\u6676\u5706\u6d4b\u8bd5\u8fc7\u7a0b\u4e2d\u53d1\u751f\u63a2\u9488\u70e7\u6bc1\u7684\u539f\u56e0\u3002\u6211\u4eec\u91c7\u7528\u7efc\u5408\u6027\u7814\u7a76\u65b9\u6cd5\uff0c\u7ed3\u5408\u4ee5\u4e0b\u51e0\u79cd\u5206\u6790\u4e0e\u4eff\u771f\u624b\u6bb5\uff1a\n<\/p>\n\n

                          \n
                        • \u57fa\u4e8e\u968f\u673a\u7535\u963b\u7f51\u7edc\u5206\u5e03\u7684\u8499\u7279\u5361\u6d1b\uff08Monte Carlo\uff09\u6a21\u62df\uff1b<\/li>\n
                        • \u591a\u7269\u7406\u573a\u6709\u9650\u5143\u4eff\u771f\uff0c\u5c06\u7126\u8033\u70ed\u4e0e\u70ed\u6269\u6563\u8fc7\u7a0b\u8fdb\u884c\u8026\u5408\uff0c\u4ee5\u6a21\u62df\u6e29\u5347\u53d8\u5316\uff1b<\/li>\n
                        • \u57fa\u4e8e\u4eba\u5de5\u667a\u80fd\u7684\u62df\u5408\u4e0e\u4f18\u5316\u65b9\u6cd5\uff0c\u5229\u7528 TensorFlow \u548c CUDA \u52a0\u901f\uff0c\u6839\u636e\u4e0d\u540c\u63a2\u9488\u6570\u91cf\u5206\u7ec4\u53ca\u5355\u4e2a\u63a2\u9488\u7684\u7535\u6d41\u5206\u5e03\uff0c\u9884\u6d4b\u63a2\u9488\u6e29\u5347\uff1b<\/li>\n
                        • \u5206\u5b50\u52a8\u529b\u5b66\uff08Molecular Dynamics\uff0cMD\uff09\u4eff\u771f\uff0c\u7528\u4e8e\u8868\u5f81\u4e0d\u540c\u6e29\u5ea6\u6761\u4ef6\u4e0b\u6750\u6599\u7684\u6297\u62c9\u5f3a\u5ea6\u7279\u6027\u3002<\/li>\n<\/ul>\n\n

                          \n\u901a\u8fc7\u7efc\u5408\u5206\u6790\u4e0a\u8ff0\u65b9\u6cd5\u83b7\u5f97\u7684\u7ed3\u679c\u548c\u5206\u6790\uff0c\u672c\u7814\u7a76\u8fdb\u4e00\u6b65\u63a2\u8ba8\u63a2\u9488\u70e7\u6bc1\u5f62\u6210\u7684\u5185\u5728\u673a\u5236\u3002\u6211\u4eec\u91cd\u70b9\u5206\u6790\u6240\u8bc6\u522b\u51fa\u7684\u70ed-\u7535-\u529b\u8026\u5408\u73b0\u8c61\u5224\u65ad\u5176\u7a76\u7adf\u662f\u5bfc\u81f4\u63a2\u9488\u70e7\u6bc1\u7684\u4e3b\u8981\u539f\u56e0\uff0c\u8fd8\u662f\u4f17\u591a\u5f71\u54cd\u56e0\u7d20\u4e2d\u7684\u4e00\u4e2a\u2026\u2026\n<\/p><\/p>

                          \u65bd\u5143\u519b<\/strong>\u662f\u96c6\u6210\u7535\u8def\u6d4b\u8bd5\u4e0e\u7cbe\u5bc6\u91d1\u5c5e\u4e92\u8054\u9886\u57df\u8d44\u6df1\u4e13\u5bb6\uff0c\u62e5\u6709\u4e8c\u5341\u4f59\u5e74 SoC \u6d4b\u8bd5\u3001\u5f39\u7c27\u63a2\u9488\uff08Pogo Pin\uff09\u53ca MEMS \u63a2\u9488\/\u63a2\u9488\u5361\u7814\u53d1\u4e0e\u4ea7\u4e1a\u5316\u7ecf\u9a8c\u3002<\/p>\n\n

                          \n\u804c\u4e1a\u751f\u6daf\u59cb\u4e8e AMD\uff0c\u5386\u4efb\u5c01\u88c5\u5de5\u827a\u5de5\u7a0b\u5e08\u548c SoC \u6d4b\u8bd5\u5f00\u53d1\u5de5\u7a0b\u5e08\uff1b\u968f\u540e\u5148\u540e\u62c5\u4efb\u5b89\u6258\u9510\u63a2\u9488\u7ec4\u88c5\u7ecf\u7406\u3001\u7f8e\u535a\u79d1\u6280\u63a2\u9488\u5361\u7814\u53d1\u7ecf\u7406\u3001FormFactor \u4e2d\u56fd\u533a\u63a2\u9488\u5361\u7814\u53d1\u7ecf\u7406\u3001\u97ec\u76db\u7814\u53d1\u603b\u76d1\u53ca\u6676\u665f\u5fae\u7eb3\u534a\u5bfc\u4f53\u79d1\u6280\u516c\u53f8\u603b\u7ecf\u7406\u3002\n<\/p>\n\n

                          \n\u5176\u957f\u671f\u4e13\u6ce8\u4e8e\u9ad8\u53ef\u9760\u3001\u9ad8\u9891\u53ca\u5fae\u578b\u5316\u91d1\u5c5e\u4e92\u8054\u7ed3\u6784\u7814\u53d1\uff0c\u6838\u5fc3\u4e13\u957f\u6db5\u76d6 Pogo Pin \u4e0e MEMS \u63a2\u9488\u7684\u7ed3\u6784\u8bbe\u8ba1\u3001\u6750\u6599\u4f53\u7cfb\u3001\u7cbe\u5bc6\u5236\u9020\u3001\u5fae\u7ec6\u7ec4\u88c5\u3001\u53ef\u9760\u6027\u4e0e\u7535\u6c14\u6027\u80fd\u9a8c\u8bc1\uff0c\u4ee5\u53ca\u91cf\u4ea7\u5bfc\u5165\u3002\n<\/p>\n\n

                          \n\u65bd\u5143\u519b\u5177\u5907\u4ece\u6280\u672f\u8def\u7ebf\u89c4\u5212\u3001\u4ea7\u54c1\u5b9a\u4e49\u548c\u7814\u53d1\u7ec4\u7ec7\u5efa\u8bbe\uff0c\u5230\u5de5\u827a\u5f00\u53d1\u3001\u5ba2\u6237\u9a8c\u8bc1\u7684\u5b8c\u6574\u7ecf\u9a8c\uff0c\u5c24\u5176\u64c5\u957f\u5c06\u63a2\u9488\u53ca\u63a2\u9488\u5361\u6280\u672f\u8f6c\u5316\u4e3a\u7a33\u5b9a\u3001\u53ef\u91cf\u4ea7\u7684\u4ea7\u54c1\u89e3\u51b3\u65b9\u6848\u3002\n<\/p><\/p><\/details>\n<\/div>\n

                          \n
                          \n“GPAC130: A Cost-Effective Palladium Alloy Material for Chip Test Probes” \n
                          “GPAC130: \u4e00\u79cd\u5e94\u7528\u4e8e\u82af\u7247\u6d4b\u8bd5\u63a2\u9488\u7684\u9ad8\u6027\u4ef7\u6bd4\u94af\u5408\u91d1\u6750\u6599” \n<\/div>\n
                          \n
                          \n
                          \nDaying Cao\n <\/div>\n\t
                          \nZhejiang Goldlink Tech Co., Ltd.\n\t <\/div>\n <\/div>\n
                          \n
                          \nJingde Wang\n <\/div>\n\t
                          \nZhejiang Goldlink Tech Co.,Ltd\n\t <\/div>\n <\/div>\n
                          \n
                          \nLei \"Ray\" Cao\n <\/div>\n\t
                          \nZheijiang Goldlink Tech Co., Ltd.\n\t <\/div>\n <\/div>\n<\/div>\n
                          \n\tAbstract - Biography (English)<\/summary>\n

                          \r\nAs semiconductor devices continue to evolve toward greater complexity, higher integration, and smaller geometries, palladium alloy materials are increasingly adopted in semiconductor test probes due to their favorable mechanical and electrical properties. However, conventional palladium alloys commonly used in the market typically exhibit a hardness of approximately 460 HV<\/strong> after heat treatment and an electrical resistivity of 13\u201314 \u03bc\u03a9\u00b7cm<\/strong>. These limitations result in relatively poor wear resistance, shorter service life, and higher electrical resistance, making them less suitable for advanced semiconductor testing applications that require high probe density, long testing cycles, and enhanced reliability. In addition, many high-performance palladium alloys rely on elevated proportions of precious metals to achieve superior properties, leading to significantly increased manufacturing costs. This challenge becomes particularly pronounced in complex semiconductor test modules containing a large number of high-density probes, where balancing performance and cost-effectiveness remains difficult.\r\n<\/p>\r\n\r\n

                          \r\nTo address these industry challenges, the GOLDLINK R&D Center<\/strong> initiated a dedicated development program and successfully developed GPAC130<\/strong>, a novel high-performance palladium alloy specifically designed for semiconductor test probe applications. By maintaining the palladium content at 40 wt.%<\/strong> while optimizing the alloy composition and refining the manufacturing process, GPAC130 achieves a significant enhancement in overall electromechanical performance.\r\n<\/p>\r\n\r\n

                          \r\nThe alloy exhibits a hardness of 510\u2013540 HV<\/strong> and an electrical resistivity of 10.5\u201311.5 \u03bc\u03a9\u00b7cm<\/strong>, while retaining excellent machinability suitable for the fabrication of precision spring probes. Compared with conventional high-performance palladium alloys, GPAC130 achieves significantly improved hardness and reduced electrical resistivity while maintaining the same palladium content.\r\n<\/p>\r\n\r\n

                          \r\nThe alloy offers a favorable balance between performance and cost, making it a promising material for advanced semiconductor test probe applications. Its combination of high hardness<\/strong>, low resistivity<\/strong>, and good machinability<\/strong> can effectively support the increasing demands of modern semiconductor testing, including high reliability<\/em>, extended test duration<\/em>, and high-density probe configurations<\/em>.\r\n<\/p><\/p>

                          \nDaying Cao<\/strong>\n<\/p>\n\n

                          \nAs the Chief Data Scientist of the R&D Center at Zhejiang Goldlink Tech Co.,Ltd, he brings more than ten years of experience in artificial intelligence and big data. His research and engineering expertise focuses on data analytics, machine learning, and large language models (LLMs<\/strong>) application across finance, technology, and advanced manufacturing.\n<\/p>\n\n

                          \nHe has led multiple AI-driven innovation projects within the company, applying interdisciplinary knowledge to enhance intelligent manufacturing and accelerate product development. He received his M.A. in Statistics<\/strong> from Columbia University and holds dual bachelor\u2019s degrees in Applied Mathematics<\/strong> and Computer Science<\/strong>.\n<\/p><\/p><\/details>\n

                          \n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

                          \n\u968f\u7740\u534a\u5bfc\u4f53\u82af\u7247\u4e0d\u65ad\u5411\u590d\u6742\u5316\u3001\u5c0f\u578b\u5316\u53d1\u5c55\uff0c\u94af\u5408\u91d1\u6750\u6599\u51ed\u501f\u5176\u4f18\u5f02\u7684\u673a\u68b0\u6027\u80fd\u548c\u7535\u6c14\u6027\u80fd\uff0c\u6b63\u8d8a\u6765\u8d8a\u5e7f\u6cdb\u5730\u5e94\u7528\u4e8e\u534a\u5bfc\u4f53\u6d4b\u8bd5\u63a2\u9488\u5236\u9020\u3002\u7136\u800c\uff0c\u76ee\u524d\u5e02\u573a\u4e0a\u5e38\u7528\u7684\u94af\u5408\u91d1\u6750\u6599\u786c\u5ea6\u901a\u5e38\u7ea6\u4e3a460 HV<\/strong>\uff0c\u7535\u963b\u7387\u4e3a13\u201314 \u03bc\u03a9\u00b7cm<\/strong>\uff0c\u5b58\u5728\u8010\u78e8\u6027\u76f8\u5bf9\u8f83\u5dee\u3001\u4f7f\u7528\u5bff\u547d\u8f83\u77ed\u4ee5\u53ca\u7535\u963b\u7387\u8f83\u9ad8\u7b49\u4e0d\u8db3\uff0c\u56e0\u6b64\u96be\u4ee5\u6ee1\u8db3\u5148\u8fdb\u534a\u5bfc\u4f53\u6d4b\u8bd5\u5bf9\u9ad8\u5bc6\u5ea6\u3001\u957f\u6d4b\u8bd5\u5468\u671f\u53ca\u9ad8\u53ef\u9760\u6027\u7684\u9700\u6c42\u3002\u6b64\u5916\uff0c\u4e3a\u83b7\u5f97\u66f4\u4f18\u5f02\u7684\u6027\u80fd\uff0c\u8bb8\u591a\u9ad8\u6027\u80fd\u94af\u5408\u91d1\u666e\u904d\u91c7\u7528\u8f83\u9ad8\u6bd4\u4f8b\u7684\u8d35\u91d1\u5c5e\u914d\u6bd4\uff0c\u5bfc\u81f4\u5236\u9020\u6210\u672c\u663e\u8457\u589e\u52a0\u3002\u7279\u522b\u662f\u5728\u5305\u542b\u9ad8\u5bc6\u5ea6\u63a2\u9488\u7684\u590d\u6742\u534a\u5bfc\u4f53\u6d4b\u8bd5\u6a21\u5757\u4e2d\uff0c\u5982\u4f55\u517c\u987e\u6750\u6599\u6027\u80fd\u4e0e\u6210\u672c\u6548\u76ca\u5df2\u6210\u4e3a\u884c\u4e1a\u9762\u4e34\u7684\u95ee\u9898\u3002\n<\/p>\n\n

                          \n\u9488\u5bf9\u4e0a\u8ff0\u884c\u4e1a\u75db\u70b9\uff0cGOLDLINK\u7814\u53d1\u4e2d\u5fc3<\/strong>\u5f00\u5c55\u4e13\u9879\u6280\u672f\u7814\u53d1\uff0c\u6210\u529f\u5f00\u53d1\u51fa\u4e00\u6b3e\u4e13\u7528\u4e8e\u534a\u5bfc\u4f53\u6d4b\u8bd5\u63a2\u9488\u7684\u65b0\u578b\u9ad8\u6027\u80fd\u94af\u5408\u91d1\u6750\u6599GPAC130<\/strong>\u3002\u8be5\u6750\u6599\u5728\u4fdd\u6301\u94af\u542b\u91cf40 wt.%<\/strong>\u4e0d\u53d8\u7684\u57fa\u7840\u4e0a\uff0c\u901a\u8fc7\u4f18\u5316\u5408\u91d1\u6210\u5206\u8bbe\u8ba1\u548c\u6539\u8fdb\u751f\u4ea7\u5236\u9020\u5de5\u827a\uff0c\u5b9e\u73b0\u4e86\u673a\u68b0\u6027\u80fd\u4e0e\u7535\u6c14\u6027\u80fd\u7684\u63d0\u5347\u3002\n<\/p>\n\n

                          \nGPAC130\u5177\u6709510\u2013540 HV<\/strong>\u7684\u786c\u5ea6\u548c10.5\u201311.5 \u03bc\u03a9\u00b7cm<\/strong>\u7684\u7535\u963b\u7387\uff0c\u540c\u65f6\u4fdd\u6301\u4e86\u4f18\u5f02\u7684\u5207\u524a\u52a0\u5de5\u6027\u80fd\uff0c\u53ef\u6ee1\u8db3\u7cbe\u5bc6\u5f39\u7c27\u63a2\u9488\u7684\u5236\u9020\u52a0\u5de5\u9700\u6c42\u3002\u4e0e\u4f20\u7edf\u9ad8\u6027\u80fd\u94af\u5408\u91d1\u76f8\u6bd4\uff0cGPAC130\u5728\u4fdd\u6301\u76f8\u540c\u94af\u542b\u91cf\u7684\u524d\u63d0\u4e0b\uff0c\u5b9e\u73b0\u4e86\u66f4\u9ad8\u7684\u786c\u5ea6\u548c\u66f4\u4f4e\u7684\u7535\u963b\u7387\uff0c\u5728\u6750\u6599\u6027\u80fd\u4e0e\u6210\u672c\u4e4b\u95f4\u53d6\u5f97\u4e86\u826f\u597d\u7684\u5e73\u8861\uff0c\u4e3a\u5148\u8fdb\u534a\u5bfc\u4f53\u6d4b\u8bd5\u63a2\u9488\u63d0\u4f9b\u4e86\u4e00\u79cd\u5177\u6709\u5e94\u7528\u524d\u666f\u7684\u65b0\u578b\u6750\u6599\u89e3\u51b3\u65b9\u6848\u3002\n<\/p><\/p>

                          \n\u66f9\u5927\u701b<\/strong>\n<\/p>\n\n

                          \n\u73b0\u4efb\u6d59\u6c5f\u91d1\u8fde\u63a5\u79d1\u6280\u80a1\u4efd\u6709\u9650\u516c\u53f8\u7814\u53d1\u4e2d\u5fc3\u9996\u5e2d\u6570\u636e\u79d1\u5b66\u5bb6\uff0c\u6df1\u8015\u4eba\u5de5\u667a\u80fd\u4e0e\u5927\u6570\u636e\u9886\u57df\u5341\u4f59\u5e74\uff0c\u805a\u7126\u6570\u636e\u5206\u6790\uff0c\u673a\u5668\u5b66\u4e60\u7b97\u6cd5\u3001\u5927\u6a21\u578b\u5e94\u7528\u843d\u5730\uff0c\u8986\u76d6\u91d1\u878d\u3001\u4e92\u8054\u7f51\u3001\u9ad8\u7aef\u5236\u9020\u7b49\u591a\u884c\u4e1a\uff1b\u7275\u5934\u63a8\u52a8\u516c\u53f8\u591a\u9879AI<\/strong>\u76f8\u5173\u6280\u672f\u9879\u76ee\u843d\u5730\uff0c\u4f9d\u6258\u4ea4\u53c9\u5b66\u79d1\u4f18\u52bf\uff0c\u4ee5\u6570\u636e\u667a\u80fd\u8d4b\u80fd\u516c\u53f8\u751f\u4ea7\u4e0e\u4ea7\u54c1\u7814\u53d1\u3002\n<\/p>\n\n

                          \n\u54e5\u4f26\u6bd4\u4e9a\u5927\u5b66\u7edf\u8ba1\u5b66\u7855\u58eb\uff0c\u62e5\u6709\u5e94\u7528\u6570\u5b66\u3001\u8ba1\u7b97\u673a\u79d1\u5b66\u672c\u79d1\u5b66\u4f4d\u3002\n<\/p><\/p><\/details>\n<\/div>\n

                          \n
                          \n“High Power Burn-in Socket (Vulcan)” \n
                          “\u9ad8\u529f\u7387\u8001\u5316\u6d4b\u8bd5\u63d2\u5ea7(Vulcan)” \n<\/div>\n
                          \n
                          \n
                          \nJeffrey \"Jeff\" McCallion\n <\/div>\n\t
                          \nSmiths Interconnect\n\t <\/div>\n <\/div>\n
                          \n
                          \nMiguel Delgadillo\n <\/div>\n\t
                          \nSmiths Inconnect a Molex Company\n\t <\/div>\n <\/div>\n
                          \n
                          \nJoe Huang\n <\/div>\n\t
                          \nsmiths interconnect\n\t <\/div>\n <\/div>\n<\/div>\n
                          \n\tAbstract - Biography (English)<\/summary>\n

                          \r\nWith the development of AI<\/strong> and automated driving technology, semiconductor chips are evolving toward higher power<\/strong>, larger package sizes<\/strong>, and higher pin counts<\/strong>. Traditional burn-in socket designs cannot handle the high temperatures and insertion forces required for these demanding applications. Typically, tooled injection-molded burn-in sockets and simple clamshell lids are used; however, conventional mold materials and standard lid actuation mechanisms cannot support the power and force needed to properly compress the spring probes or withstand the rigorous burn-in and stress-testing process.\r\n<\/p>\r\n\r\n

                          \r\nIn this paper, we present a solution that addresses these thermal and large-device challenges by introducing our new purpose-built, high-power burn-in socket solution, Vulcan<\/strong>. The new Vulcan<\/strong> product line leverages our H-Pin probe technology<\/strong>, high-performance socket materials, and our patent-pending Shuttle Bar Lid Force Delivery System<\/strong> to overcome the force, thermal, and power barriers associated with next-generation semiconductor devices.\r\n<\/p>\r\n\r\n

                          \r\nThis paper describes the new socket concept in detail and presents simulation results<\/strong>, validation testing<\/strong>, and real-world performance data<\/strong> demonstrating that the Vulcan platform provides superior electrical<\/em>, mechanical<\/em>, and thermal<\/em> performance to maximize device reliability and yield.\r\n<\/p><\/p>

                          Joe Huang<\/strong><\/p>\r\n\r\n

                          \r\nJoe Huang is a Mechanical Engineer at Smiths Interconnect, a Molex company.\r\nHe graduated from Yangzhou University in 2019 with a degree in Mechanical Design,\r\nManufacturing and Automation. He joined Smiths Interconnect, a Molex company, in\r\n2022 and currently works as a Mechanical Engineer and Thermal Design Engineer\r\nresponsible for semiconductor test product design.\r\n<\/p><\/p><\/details>\n

                          \n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

                          \r\n\u968f\u7740\u4eba\u5de5\u667a\u80fd\u548c\u81ea\u52a8\u9a7e\u9a76\u6280\u672f\u7684\u53d1\u5c55\uff0c\u82af\u7247\u6b63\u671d\u7740\u66f4\u9ad8\u529f\u7387\u3001\u66f4\u5927\u5c3a\u5bf8\u548c\u66f4\u9ad8\u5f15\u811a\u6570\u7684\u65b9\u5411\u6f14\u8fdb\uff0c\u4f20\u7edf\u7684\u8001\u5316\u6d4b\u8bd5\u63d2\u5ea7\u8bbe\u8ba1\u5df2\u65e0\u6cd5\u5e94\u5bf9\u8fd9\u4e9b\u6781\u7aef\u5de5\u51b5\u6240\u9700\u7684\u9ad8\u6e29\u548c\u9ad8\u4f5c\u7528\u529b\u3002\u901a\u5e38\uff0c\u6b64\u7c7b\u5e94\u7528\u4f1a\u4f7f\u7528\u6a21\u5177\u6ce8\u5851\u6210\u578b\u7684\u8001\u5316\u6d4b\u8bd5\u63d2\u5ea7\u548c\u7b80\u5355\u7684\u7ffb\u76d6\u5f0f\u6d4b\u8bd5\u538b\u76d6\u3002\u7136\u800c\uff0c\u4f20\u7edf\u7684\u6a21\u5177\u6750\u6599\u548c\u6807\u51c6\u7684\u6d4b\u8bd5\u76d6\u9a71\u52a8\u673a\u6784\u65e0\u6cd5\u652f\u6301\u6d4b\u8bd5\u6240\u9700\u7684\u9ad8\u529f\u7387\uff0c\u96be\u4ee5\u514b\u670d\u6d4b\u8bd5\u63d2\u5ea7\u7684\u538b\u7d27\u529b\u4ee5\u5c06\u5f39\u7c27\u63a2\u9488\u538b\u7f29\u5230\u7279\u5b9a\u884c\u7a0b\uff0c\u4e5f\u96be\u4ee5\u627f\u53d7\u4e25\u82db\u7684\u5e94\u529b\u6d4b\u8bd5\u9636\u6bb5\u3002\r\n<\/p>\r\n\r\n

                          \r\n\u5728\u672c\u6587\u4e2d\uff0c\u6211\u4eec\u5c06\u901a\u8fc7\u4ecb\u7ecd\u6211\u4eec\u5168\u65b0\u63a8\u51fa\u7684\u3001\u4e13\u4e3a\u9ad8\u529f\u7387\u9879\u76ee\u800c\u8bbe\u8ba1\u7684\u8001\u5316\u6d4b\u8bd5\u63d2\u5ea7\u89e3\u51b3\u65b9\u6848\u201cVulcan\u201d\uff0c\u6765\u9610\u8ff0\u5982\u4f55\u5e94\u5bf9\u6563\u70ed\u548c\u5927\u5c3a\u5bf8\u82af\u7247\u5e26\u6765\u7684\u6311\u6218\u3002\u6211\u4eec\u5168\u65b0\u7684 Vulcan \u4ea7\u54c1\u7ebf\u5229\u7528\u4e86\u6211\u4eec\u4e13\u6709\u7684 H \u63a2\u9488\u6280\u672f\u548c\u9ad8\u6027\u80fd\u6d4b\u8bd5\u63d2\u5ea7\u6750\u6599\uff0c\u4ee5\u53ca\u6211\u4eec\u6b63\u5728\u7533\u8bf7\u7684\u65b0\u4e13\u5229\u201c\u6ed1\u68ad\u6746\u6d4b\u8bd5\u538b\u76d6\u529b\u4f20\u5bfc\u7cfb\u7edf\u201d\uff0c\u4ece\u800c\u514b\u670d\u4e86\u538b\u7d27\u529b\u3001\u6563\u70ed\u548c\u529f\u7387\u65b9\u9762\u7684\u969c\u788d\u3002\u672c\u6587\u5c06\u8be6\u7ec6\u63cf\u8ff0\u6211\u4eec\u7684\u65b0\u6982\u5ff5\uff0c\u5e76\u5c55\u793a\u4eff\u771f\u3001\u9a8c\u8bc1\u548c\u5b9e\u9645\u6570\u636e\uff0c\u4ee5\u8bc1\u660e\u8be5\u4ea7\u54c1\u80fd\u591f\u63d0\u4f9b\u5353\u8d8a\u7684\u7535\u6c14\u3001\u673a\u68b0\u548c\u70ed\u6027\u80fd\uff0c\u4ece\u800c\u5b9e\u73b0\u6700\u9ad8\u6d4b\u8bd5\u826f\u7387\u3002\r\n<\/p><\/p>

                          \u9ec4\u6587\u6770<\/strong><\/p>\r\n\r\n

                          \r\n\u9ec4\u6587\u6770
                          \r\n\u673a\u68b0\u5de5\u7a0b\u5e08\uff0cSmiths Interconnect a Molex company\r\n<\/p>\r\n\r\n

                          \r\n\u9ec4\u6587\u6770\uff0c2019\u5e74\u6bd5\u4e1a\u4e8e\u626c\u5dde\u5927\u5b66\uff0c\u6240\u5b66\u4e13\u4e1a\u662f\u673a\u68b0\u8bbe\u8ba1\u5236\u9020\u53ca\u81ea\u52a8\u5316\u3002\u81ea2022\u5e74\u8d77\uff0c\u9ec4\u6587\u6770\u5c31\u804c\u4e8e\u53f2\u5bc6\u65af\u82f1\u7279\u5eb7\u83ab\u4ed5\u516c\u53f8\uff0c\u76ee\u524d\u4efb\u804c\u673a\u68b0\u5de5\u7a0b\u5e08\u4e0e\u70ed\u8bbe\u8ba1\u5de5\u7a0b\u5e08\uff0c\u8d1f\u8d23\u534a\u5bfc\u4f53\u6d4b\u8bd5\u4ea7\u54c1\u8bbe\u8ba1\u3002\r\n<\/p><\/p><\/details>\n<\/div>\n<\/div>\n\t \n

                          <\/div><\/div><\/div>

                          16:30<\/h1>\n<\/div><\/div><\/div><\/div>
                          \n
                          \n
                          Session 5<\/div><\/div>
                          ATE 2<\/div>
                          <\/div>

                          <\/p><\/div>

                          \n
                          \n“Diagnosing SOA-Induced Aging Drift in Analog Pin Electronics: Implications for AI and HPC Test” \n
                          “\u8bca\u65ad\u6a21\u62df\u5f15\u811a\u7535\u5b50\u5668\u4ef6\u4e2d\u7531SOA\u5f15\u8d77\u7684\u8001\u5316\u6f02\u79fb\uff1a\u5bf9AI\u4e0eHPC\u6d4b\u8bd5\u7684\u542f\u793a” \n<\/div>\n
                          \n
                          \n
                          \nHailin Wang\n <\/div>\n\t
                          \nElevATE Semiconductor\n\t <\/div>\n <\/div>\n<\/div>\n
                          \n\tAbstract - Biography (English)<\/summary>\n

                          \nSilent Data Corruption (SDC)<\/strong> and post-deployment hardware faults have emerged as significant reliability concerns for hyperscale AI and HPC infrastructure, with recent industry reports from Google, Meta, and the Open Compute Project (OCP) highlighting defects that pass manufacturing test but only manifest under specific bias conditions or after extended operation. The published case studies are predominantly digital. In this study, we examine the same failure class in an analog Automated Test Equipment (ATE)<\/strong> pin electronics ASIC, devices that perform final test on AI and HPC silicon.\n<\/p>\n\n

                          \nA customer reported progressive VCOM threshold drift<\/strong> on a 256-channel application, affecting approximately 50%<\/strong> of channels and continuing past -900 mV<\/strong> with no observable stabilization. All affected devices had passed final test before production. Failing devices were inspected, and results from initial visual inspection, ATE re-test, and emission microscopy were inconclusive. Bench characterization across 50 devices<\/strong> spanning multiple lots and date codes confirmed that the drift was reproducible and exhibited strong dependence on register configuration and operating temperature but evaded standard production screening due to its time-dependent nature.\n<\/p>\n\n

                          \nFailure analysis techniques such as Focused Ion Beam (FIB)<\/strong> produced misleading initial results. Severing a capacitor and diode in the comparator path arrested the drift, which initially appeared to identify the offending components. A subsequent control FIB cutting non-functional metal also halted the drift, demonstrating that the FIB process itself was perturbing the measurement rather than the targeted devices. This sensitivity to invasive characterization is a notable hazard for this defect class and constrains the design of subsequent debug experiments.\n<\/p>\n\n

                          \nRoot cause was traced to Safe Operating Area (SOA)<\/strong> violations within the analog comparator. Floating-node conditions in one register state and an over-stressed gain-stage VGS<\/sub><\/strong> in another subjected gate oxides to chronic overstress, accelerating Hot Carrier Injection (HCI)<\/strong> and Bias Temperature Instability (BTI)<\/strong>. Pre-silicon simulation did not flag the floating-node case due to the initial conditions the simulator applies, preventing the very condition responsible. Final test could not screen for the effect because the resulting offset is sub-microvolt at t = 0<\/strong> and accumulates only after days of biased operation.\n<\/p>\n\n

                          \nThis case study underscores the importance of integrating aging-aware design verification with adaptive test strategies for analog devices intended for long-deployment applications. The presentation walks through the diagnostic flow, the validated workaround shipped to the customer during silicon respin development, and the design corrections incorporated in successor revisions. We conclude with recommendations for screening long-latency, bias-dependent drift in the analog devices on which AI and HPC test programs increasingly depend, including SOA analysis<\/strong> during pre-silicon verification, extended-stress characterization protocols<\/strong>, and closer coordination between design verification and production test engineering teams.\n<\/p><\/p>

                          Hailin is an Applications Engineer at ElevATE Semiconductor with a strong engineering background and a passion for innovation. He holds a degree from the University of Toronto, where he also engaged in academic research collaborations, and has professional experience spanning software development and mixed-signal engineering.<\/p>\n\n

                          Dedicated to tackling complex technical challenges and fostering opportunities for students, Hailin is committed to advancing the field of semiconductor test while inspiring the next generation of professionals. He is currently pursuing a master\u2019s degree at UC Berkeley, focusing on applying statistical models and data science principles to enhance test engineering.<\/p><\/p><\/details>\n

                          \n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

                          \u9759\u9ed8\u6570\u636e\u635f\u574f\uff08SDC\uff09\u4e0e\u90e8\u7f72\u540e\u786c\u4ef6\u6545\u969c\u5df2\u6210\u4e3a\u8d85\u5927\u89c4\u6a21AI\u4e0eHPC\u57fa\u7840\u8bbe\u65bd\u53ef\u9760\u6027\u7684\u91cd\u8981\u8bae\u9898\uff0cGoogle\u3001Meta\u53ca\u5f00\u653e\u8ba1\u7b97\u9879\u76ee\uff08OCP\uff09\u8fd1\u671f\u62a5\u544a\u5747\u6307\u51fa\uff0c\u90e8\u5206\u7f3a\u9677\u5668\u4ef6\u53ef\u901a\u8fc7\u51fa\u5382\u6d4b\u8bd5\uff0c\u5374\u4ec5\u5728\u7279\u5b9a\u504f\u7f6e\u6761\u4ef6\u6216\u957f\u671f\u8fd0\u884c\u540e\u624d\u4f1a\u663e\u73b0\u3002\u5df2\u53d1\u8868\u6848\u4f8b\u4ee5\u6570\u5b57\u5668\u4ef6\u4e3a\u4e3b\uff0c\u672c\u7814\u7a76\u5219\u9488\u5bf9\u540c\u7c7b\u6545\u969c\u673a\u5236\u5728\u6a21\u62df\u81ea\u52a8\u6d4b\u8bd5\u8bbe\u5907\uff08ATE\uff09\u5f15\u811a\u7535\u5b50\u4e13\u7528\u96c6\u6210\u7535\u8def\uff08ASIC\uff09\u4e2d\u7684\u8868\u73b0\u8fdb\u884c\u5206\u6790\u3002<\/p>\n\n

                          \u67d0\u5ba2\u6237\u62a5\u544a\u5728\u4e00\u6b3e256\u901a\u9053\u5e94\u7528\u4e2d\u51fa\u73b0\u6e10\u8fdb\u6027VCOM\u9608\u503c\u6f02\u79fb\uff0c\u7ea650%\u901a\u9053\u53d7\u5f71\u54cd\uff0c\u4e14\u65e0\u6536\u655b\u8ff9\u8c61\uff0c\u6240\u6709\u5668\u4ef6\u5747\u5df2\u901a\u8fc7\u51fa\u5382\u6d4b\u8bd5\u3002\u521d\u6b65\u76ee\u89c6\u68c0\u67e5\u3001ATE\u590d\u6d4b\u53ca\u53d1\u5c04\u663e\u5fae\u955c\u68c0\u6d4b\u5747\u65e0\u6cd5\u5b9a\u4f4d\u95ee\u9898\u3002\u8de8\u6279\u6b21\u53f0\u67b6\u8868\u5f81\u8bc1\u5b9e\u8be5\u6f02\u79fb\u53ef\u91cd\u590d\uff0c\u4e14\u4e0e\u5bc4\u5b58\u5668\u914d\u7f6e\u53ca\u5de5\u4f5c\u6e29\u5ea6\u5bc6\u5207\u76f8\u5173\uff0c\u56e0\u5176\u65f6\u95f4\u4f9d\u8d56\u7279\u6027\u800c\u672a\u88ab\u6807\u51c6\u91cf\u4ea7\u7b5b\u9009\u6355\u83b7\u3002<\/p>\n\n

                          \u805a\u7126\u79bb\u5b50\u675f\uff08FIB\uff09\u5206\u6790\u521d\u671f\u7ed9\u51fa\u8bef\u5bfc\u6027\u7ed3\u679c\uff1a\u5207\u65ad\u6bd4\u8f83\u5668\u8def\u5f84\u4e2d\u7684\u7279\u5b9a\u5143\u4ef6\u540e\u6f02\u79fb\u5373\u505c\u6b62\uff0c\u4f46\u540e\u7eed\u5bf9\u7167\u5b9e\u9a8c\u663e\u793a\uff0c\u5207\u5272\u65e0\u529f\u80fd\u91d1\u5c5e\u8d70\u7ebf\u540c\u6837\u80fd\u4e2d\u6b62\u6f02\u79fb\uff0c\u8bc1\u660e\u662fFIB\u52a0\u5de5\u8fc7\u7a0b\u672c\u8eab\u5e72\u6270\u4e86\u6d4b\u91cf\u3002\u8fd9\u4e00\u73b0\u8c61\u63ed\u793a\u4e86\u8be5\u7c7b\u7f3a\u9677\u5bf9\u4fb5\u5165\u5f0f\u8868\u5f81\u624b\u6bb5\u7684\u654f\u611f\u6027\uff0c\u4e5f\u9650\u5236\u4e86\u540e\u7eed\u8c03\u8bd5\u5b9e\u9a8c\u7684\u8bbe\u8ba1\u3002<\/p>\n\n

                          \u6839\u672c\u539f\u56e0\u88ab\u8ffd\u6eaf\u81f3\u6a21\u62df\u6bd4\u8f83\u5668\u5185\u90e8\u7684\u5b89\u5168\u5de5\u4f5c\u533a\uff08SOA\uff09\u8fdd\u89c4\uff1a\u7279\u5b9a\u5bc4\u5b58\u5668\u72b6\u6001\u4e0b\u7684\u60ac\u7a7a\u8282\u70b9\u53ca\u589e\u76ca\u7ea7\u8fc7\u5e94\u529b\uff0c\u4f7f\u6805\u6c27\u5316\u5c42\u957f\u671f\u627f\u53d7\u8fc7\u5e94\u529b\uff0c\u52a0\u901f\u4e86\u70ed\u8f7d\u6d41\u5b50\u6ce8\u5165\uff08HCI\uff09\u4e0e\u504f\u7f6e\u6e29\u5ea6\u4e0d\u7a33\u5b9a\u6027\uff08BTI\uff09\u6548\u5e94\u3002\u7531\u4e8e\u4eff\u771f\u521d\u59cb\u6761\u4ef6\u89c4\u907f\u4e86\u60ac\u7a7a\u8282\u70b9\u72b6\u6001\uff0c\u524d\u7845\u4eff\u771f\u672a\u80fd\u6355\u6349\u8be5\u95ee\u9898\uff1b\u800c\u7531\u6b64\u4ea7\u751f\u7684\u504f\u79fb\u5728t=0\u65f6\u4ec5\u4e3a\u4e9a\u5fae\u4f0f\u7ea7\uff0c\u987b\u7ecf\u6570\u65e5\u504f\u7f6e\u8fd0\u884c\u65b9\u9010\u6e10\u663e\u73b0\uff0c\u56e0\u800c\u4e5f\u65e0\u6cd5\u88ab\u6700\u7ec8\u6d4b\u8bd5\u7b5b\u51fa\u3002<\/p>\n\n

                          \u672c\u6848\u4f8b\u7814\u7a76\u8868\u660e\uff0c\u9488\u5bf9\u957f\u671f\u90e8\u7f72\u5e94\u7528\u7684\u6a21\u62df\u5668\u4ef6\uff0c\u9700\u5c06\u8001\u5316\u611f\u77e5\u8bbe\u8ba1\u9a8c\u8bc1\u4e0e\u81ea\u9002\u5e94\u6d4b\u8bd5\u7b56\u7565\u76f8\u7ed3\u5408\u3002\u62a5\u544a\u5c06\u4ecb\u7ecd\u8bca\u65ad\u6d41\u7a0b\u3001\u63d0\u4f9b\u7ed9\u5ba2\u6237\u7684\u9a8c\u8bc1\u6027\u4e34\u65f6\u65b9\u6848\uff0c\u4ee5\u53ca\u540e\u7eed\u7248\u672c\u4e2d\u7684\u8bbe\u8ba1\u6539\u8fdb\uff0c\u5e76\u5c31\u524d\u7845SOA\u5206\u6790\u3001\u6269\u5c55\u5e94\u529b\u8868\u5f81\u53ca\u8bbe\u8ba1\u9a8c\u8bc1\u4e0e\u91cf\u4ea7\u6d4b\u8bd5\u56e2\u961f\u534f\u4f5c\u63d0\u51fa\u5efa\u8bae\uff0c\u4ee5\u7b5b\u67e5AI\u4e0eHPC\u6d4b\u8bd5\u6240\u4f9d\u8d56\u7684\u6a21\u62df\u5668\u4ef6\u4e2d\u957f\u6f5c\u4f0f\u671f\u3001\u504f\u7f6e\u4f9d\u8d56\u6027\u6f02\u79fb\u95ee\u9898\u3002<\/p><\/p>

                          Hailin \u662f ElevATE Semiconductor \u7684\u5e94\u7528\u5de5\u7a0b\u5e08\uff0c\u5177\u5907\u624e\u5b9e\u7684\u5de5\u7a0b\u80cc\u666f\u5e76\u5bf9\u521b\u65b0\u5145\u6ee1\u70ed\u60c5\u3002\u4ed6\u6bd5\u4e1a\u4e8e\u591a\u4f26\u591a\u5927\u5b66\uff0c\u5e76\u53c2\u4e0e\u4e86\u591a\u9879\u5b66\u672f\u7814\u7a76\u5408\u4f5c\uff0c\u804c\u4e1a\u7ecf\u5386\u6db5\u76d6\u8f6f\u4ef6\u5f00\u53d1\u4e0e\u6df7\u5408\u4fe1\u53f7\u5de5\u7a0b\u3002<\/p>\n\n

                          Hailin \u81f4\u529b\u4e8e\u89e3\u51b3\u590d\u6742\u7684\u6280\u672f\u6311\u6218\u5e76\u4e3a\u5b66\u751f\u521b\u9020\u673a\u4f1a\uff0c\u4e13\u6ce8\u4e8e\u63a8\u52a8\u534a\u5bfc\u4f53\u6d4b\u8bd5\u9886\u57df\u7684\u53d1\u5c55\uff0c\u540c\u65f6\u6fc0\u52b1\u4e0b\u4e00\u4ee3\u5de5\u7a0b\u4e13\u4e1a\u4eba\u624d\u3002\u4ed6\u76ee\u524d\u6b63\u5728\u52a0\u5dde\u5927\u5b66\u4f2f\u514b\u5229\u5206\u6821\u653b\u8bfb\u7855\u58eb\u5b66\u4f4d\uff0c\u7814\u7a76\u91cd\u70b9\u662f\u8fd0\u7528\u7edf\u8ba1\u6a21\u578b\u548c\u6570\u636e\u79d1\u5b66\u539f\u7406\u63d0\u5347\u6d4b\u8bd5\u5de5\u7a0b\u6c34\u5e73\u3002<\/p><\/p><\/details>\n<\/div>\n<\/div>\n\t \n

                          <\/div><\/div><\/div>

                          17:45<\/h1>\n<\/div><\/div><\/div><\/div>

                          Lucky Draw<\/strong><\/h1>\n

                          Door prizes for randomly selected attendees<\/span>
                          \n(Must be present to win \/ void where prohibited)<\/p><\/span><\/div><\/div><\/div>

                          <\/div><\/div><\/div>

                          18:00<\/h1>\n<\/div><\/div><\/div><\/div>

                          TestConX EXPO Closes \/ Event Adjourns<\/strong><\/h1>\n<\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>
                          <\/div><\/div><\/div>

                          For any questions about the event or sponsorship contact us at [javascript protected email address]<\/span>