{"id":7888,"date":"2025-09-01T03:53:38","date_gmt":"2025-09-01T10:53:38","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=7888"},"modified":"2026-01-19T13:35:14","modified_gmt":"2026-01-19T21:35:14","slug":"testconx-korea-2025","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx-korea-2025\/","title":{"rendered":"TestConX Korea 2025"},"content":{"rendered":"
\"Image\"<\/span>

Suwon, South Korea - November 18, 2025<\/strong><\/h1>\n<\/div><\/div><\/div>

SINTEX Convention Center<\/a><\/div>\n
(At LA VIE D'OR Resort)<\/a><\/div>\n
141-36 Botong-ri, Jeongnam-myeon, Hwaseong-si,<\/div>\n
Gyeonggi-do, South Korea<\/div><\/h1>\n<\/div><\/div><\/div><\/div><\/div><\/div><\/div>
EXPO<\/span><\/div><\/div><\/a>

TestConX<\/span><\/a>, over the course of its twenty-six-year history, has established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope includes packaged semiconductor “final” test, burn-in, system level test, and beyond to encompass all practical aspects of electronics testing such as validation, advanced packaging testing, module test, and finished product test. <\/span><\/p>\n

Please join us for our 3rd annual TestConX Korea! Don’t miss this opportunity to be part of TestConX as we connect a larger community of test professionals and to participate in this excellent event!<\/span><\/p>\n

 <\/p><\/div>

<\/div><\/div><\/div>

Tuesday November 18, 2025<\/h1>\n<\/div><\/div><\/div>

9:00<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Welcome<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“Opening Remarks” \n<\/div>\n
\n
\n
\nIra Feldman\n <\/div>\n\t
\nFeldman Engineering\n\t <\/div>\n <\/div>\n<\/div>\n<\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

9:15<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Session 1<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“Integrated Modeling and Experimental Optimization of a Thermal Management System for NkW Heat Dissipation” \n
“\ubaa8\ub378\ub9c1\u2013\uc2e4\ud5d8 \ud1b5\ud569 \uae30\ubc18 NkW\uae09 \uc5f4\uad00\ub9ac \uc2dc\uc2a4\ud15c \ucd5c\uc801\ud654 \uc5f0\uad6c” \n<\/div>\n
\n
\n
\nJoseph Moon\n <\/div>\n\t
\nSemics\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

\r\n The continuous increase in power density and heat generation of advanced semiconductor devices is creating new challenges in wafer-level thermal management.\r\n <\/p>\r\n

\r\n While steady-state analyses have provided effective design baselines, dynamic temperature behavior under transient conditions now demands faster and more responsive thermal control.\r\n <\/p>\r\n

\r\n This work introduces an integrated framework that combines physics-based modeling with experimental validation to accelerate the development of high-capacity thermal management systems.\r\n <\/p>\r\n

\r\n Iterative correlation between simulation and experiment continuously refines both modeling fidelity and experimental accuracy, establishing a reliable foundation for quantitative analysis and optimization.\r\n <\/p>\r\n

\r\n The proposed correlation-driven development approach improves efficiency and predictive confidence, enabling scalable thermal management solutions for next-generation high-power probing environments.\r\n <\/p>\r\n<\/section>\r\n<\/p>

Biography<\/strong><\/p>\r\n

\r\n Joseph Moon is a Senior Engineering Manager at Semics Korea R&D, specializing in advanced thermal management systems for semiconductor test applications.\r\n <\/p>\r\n

\r\n His work focuses on system-level heat dissipation design and model\u2013experiment integration for next-generation high-power probers.\r\n <\/p>\r\n<\/section><\/p><\/details>\n

\n\t\ucd08\ub85d (Korean)<\/summary>\n

\uc694\uc57d<\/strong><\/p>\r\n

\r\n \uc6e8\uc774\ud37c \ub808\ubca8 \ud14c\uc2a4\ud2b8\uc5d0\uc11c \ucd1d \ubc1c\uc5f4\ub7c9\uc774 \uc9c0\uc18d\uc801\uc73c\ub85c \uc99d\uac00\ud568\uc5d0 \ub530\ub77c, \uc5f4 \uad00\ub9ac \ubd84\uc57c\uc5d0\ub294 \uc0c8\ub85c\uc6b4 \uae30\uc220\uc801 \ub3c4\uc804\uc774 \uc694\uad6c\ub418\uace0 \uc788\ub2e4.\r\n <\/p>\r\n

\r\n \uae30\uc874\uc758 \uc815\uc0c1\uc0c1\ud0dc(steady-state) \uc5f4 \ud574\uc11d\uc740 \ud6a8\uacfc\uc801\uc778 \uc124\uacc4 \uae30\uc900\uc73c\ub85c \ud65c\uc6a9\ub418\uc5b4 \uc654\uc73c\ub098, \ub3d9\uc801 \uc628\ub3c4 \uac70\ub3d9\uc774 \uc810\ucc28 \uc911\uc694\ud574\uc9d0\uc5d0 \ub530\ub77c, \uc548\uc815\uc801\uc774\uba74\uc11c\ub3c4 \ube60\ub978 \uc751\ub2f5\uc131\uc744 \ud655\ubcf4\ud560 \uc218 \uc788\ub294 \uc0c8\ub85c\uc6b4 \uc811\uadfc \ubc29\uc2dd\uc774 \ud544\uc694\ud558\ub2e4.\r\n <\/p>\r\n

\r\n \ubcf8 \uc5f0\uad6c\uc5d0\uc11c\ub294 \ubb3c\ub9ac \uae30\ubc18 \ubaa8\ub378\ub9c1\uacfc \uc2e4\ud5d8\uc801 \uac80\uc99d\uc744 \ud1b5\ud569\ud55c \uac1c\ubc1c \ud504\ub808\uc784\uc6cc\ud06c\ub97c \uc81c\uc548\ud55c\ub2e4.\r\n <\/p>\r\n

\r\n \uc2dc\ubbac\ub808\uc774\uc158\uacfc \uc2e4\ud5d8 \uac04\uc758 \ubc18\ubcf5\uc801\uc778 \uc0c1\uad00(Correlation) \uacfc\uc815\uc744 \ud1b5\ud574 \ubaa8\ub378\uc758 \uc815\ubc00\ub3c4\uc640 \uc2e4\ud5d8\uc758 \uc815\ud655\ub3c4\ub97c \uc9c0\uc18d\uc801\uc73c\ub85c \ud5a5\uc0c1\uc2dc\ucf30\uc73c\uba70, \uc774\ub97c \ud1b5\ud574 \uc815\ub7c9\uc801 \ubd84\uc11d \ubc0f \uc2dc\uc2a4\ud15c \ucd5c\uc801\ud654\ub97c \uc704\ud55c \uc2e0\ub8b0\uc131 \ub192\uc740 \uae30\ubc18\uc744 \uad6c\ucd95\ud558\uc600\ub2e4.\r\n <\/p>\r\n

\r\n \ubcf8 Correlation \uae30\ubc18 \uac1c\ubc1c \uc811\uadfc\ubc95\uc740 \uac1c\ubc1c \ud6a8\uc728\uc131\uacfc \uc608\uce21 \uc2e0\ub8b0\ub3c4\ub97c \ub3d9\uc2dc\uc5d0 \uac1c\uc120\ud558\uba70, \ucc28\uc138\ub300 \uace0\ucd9c\ub825 \ud504\ub85c\ube59 \ud658\uacbd\uc5d0 \ub300\uc751 \uac00\ub2a5\ud55c \ud655\uc7a5\ud615 \uc5f4 \uad00\ub9ac \uc194\ub8e8\uc158 \uad6c\ud604\uc758 \uac00\ub2a5\uc131\uc744 \uc81c\uc2dc\ud55c\ub2e4.\r\n <\/p>\r\n<\/section><\/p>

<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n
\n
\n“System Level Test- A need for Chiplet based AI and HPC Devices.” \n
“\uc2dc\uc2a4\ud15c \ub808\ubca8 \ud14c\uc2a4\ud2b8(SLT): \uce69\ub81b \uae30\ubc18 AI\u00b7HPC \ub514\ubc14\uc774\uc2a4\uc5d0\uc11c\uc758 \ud544\uc694\uc131” \n<\/div>\n
\n
\n
\nYogan Senthilkumar\n <\/div>\n\t
\niVP Semiconductor\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

\r\n

\r\n Chiplet-based product development has been around for a few years now, \r\n but it has mostly been achieved using chiplets designed within the same company \r\n (with only HBM stacks sourced externally). As a result, this has largely remained a \r\n homogeneous integration. \r\n <\/p>\r\n\r\n

\r\n The industry is now moving toward true heterogeneous integration, \r\n where different chiplets from multiple vendors are combined along with HBM stacks \r\n from memory vendors. Heterogeneous packaging, combined with chiplet-based architectures, \r\n enables High-Performance Computing (HPC) and AI device development in shorter timelines \r\n while providing flexibility to integrate chiplets from various process nodes. \r\n This creates powerful, scalable, and energy-efficient solutions. \r\n <\/p>\r\n\r\n

\r\n However, these new possibilities bring unprecedented testing challenges \r\n at both the wafer level and package level. Compared to monolithic SoCs, \r\n chiplet-based heterogeneous packaging introduces unique test challenges related to \r\n DFT, D2D interconnect, traceability, and security. \r\n <\/p>\r\n\r\n

\r\n While ATE-based test solutions are well established for creating Known Good Die (KGD) \r\n in monolithic devices (with mature EDA tools supporting fault coverage), \r\n in heterogeneous integration, the functionality of the final packaged device \r\n cannot be defined by the individual KGDs alone. \r\n <\/p>\r\n\r\n

\r\n Technologies such as Through-Silicon Vias (TSVs) enabling 3D ICs, \r\n and interposers\/substrates that interconnect dies, introduce additional \r\n electrical parasitics and IR voltage drop. Device performance is also influenced \r\n by thermal effects from neighboring dies within the same package, \r\n which must be accounted for during testing. \r\n <\/p>\r\n\r\n

\r\n Another growing concern is Silent Data Corruption (SDC)\u2014errors in hardware \r\n that go undetected. These are difficult to diagnose and may be exacerbated \r\n by silicon degradation and hardware aging. \r\n <\/p>\r\n\r\n

\r\n These challenges in testing chiplet-based AI and HPC devices are making \r\n System Level Test (SLT)<\/strong> increasingly necessary in addition \r\n to traditional ATE-based test flows. \r\n <\/p>\r\n\r\n

\r\n This presentation will cover the need for SLT, the associated challenges, \r\n and several SLT case studies.\r\n <\/p>\r\n<\/div>\r\n<\/p>

\r\n

Yogan Senthilkumar<\/strong>
\r\n Chief Technology Officer, iVP Semiconductor<\/p>\r\n\r\n

\r\n Yogan Senthilkumar has over 35 years of experience in the field of Semiconductor Test. \r\n He currently works for iVP Semiconductor as Chief Technology Officer, where he has helped several customers \r\n develop test solutions for Digital, PIMIC, Mixed Signal, and RF Devices, and deploy them to volume production at OSAT.\r\n <\/p>\r\n\r\n

\r\n In his earlier role at Tessolve, he served as Vice President of Engineering, where he was instrumental in implementing \r\n several test process automation initiatives to build robust test programs for Wafer Test and Final Test, \r\n and in applying AI to hardware and test program development.\r\n <\/p>\r\n\r\n

\r\n Earlier in his career, Yogan worked with Teradyne Asia's Test Application Group in Singapore, handling test engineering \r\n projects from Teradyne US and Europe. He has also worked for Salland Engineering, National Semiconductor, and SPEL. \r\n He has presented papers on test techniques at conferences including TUG, Semicon, and OCP, \r\n and has written articles in Test and Measurement World<\/i> and Semiconductor Manufacturing<\/i>.\r\n <\/p>\r\n<\/div>\r\n<\/p><\/details>\n

\n\t\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n

\r\n

\r\n \uce69\ub81b \uae30\ubc18 \uc81c\ud488 \uac1c\ubc1c\uc740 \uc774\ubbf8 \uba87 \ub144 \uc804\ubd80\ud130 \uc2dc\ub3c4\ub418\uc5b4 \uc654\uc2b5\ub2c8\ub2e4. \ud558\uc9c0\ub9cc \uc9c0\uae08\uae4c\uc9c0\ub294 \ub300\ubd80\ubd84 \uc790\uc0ac\uc5d0\uc11c \uc124\uacc4\ud55c \uce69\ub81b\uacfc \uc678\ubd80 \uc5c5\uccb4\uc758 HBM\uc2a4\ud0dd\uc744 \uc870\ud569\ud558\ub294 \uc218\uc900\uc5d0 \uba38\ubb3c\ub7ec, \uc0ac\uc2e4\uc0c1 \ub3d9\uc885\ud1b5\ud569\uc5d0 \uac00\uae4c\uc6e0\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n

\r\n \ucd5c\uadfc\uc5d0\ub294 \uc11c\ub85c \ub2e4\ub978 \ubca4\ub354\uc758 \uce69\ub81b\uacfc \uba54\ubaa8\ub9ac \uc5c5\uccb4\uc758 HBM \uc2a4\ud0dd\uc744 \uacb0\ud569\ud558\ub294 \uc774\uc885\ud1b5\ud569\uc73c\ub85c \uc0b0\uc5c5\uc774 \ube60\ub974\uac8c \uc774\ub3d9\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uce69\ub81b \uc544\ud0a4\ud14d\ucc98\uc640 \uc774\uc885 \ud328\ud0a4\uc9d5\uc740 HPC\uc640 AI \ub514\ubc14\uc774\uc2a4 \uac1c\ubc1c \uc18d\ub3c4\ub97c \ud06c\uac8c \ub2e8\ucd95\uc2dc\ud0a4\uace0, \ub2e4\uc591\ud55c \uacf5\uc815 \ub178\ub4dc\uc758 \uce69\ub81b\uc744 \uc720\uc5f0\ud558\uac8c \ud1b5\ud569\ud560 \uc218 \uc788\ub294 \uc7a5\uc810\uc744 \uc81c\uacf5\ud569\ub2c8\ub2e4. \uc774\ub97c \ud1b5\ud574 \uac15\ub825\ud558\uace0 \ud655\uc7a5 \uac00\ub2a5\ud558\uba70, \uc5d0\ub108\uc9c0 \ud6a8\uc728\uc801\uc778 \uc194\ub8e8\uc158\uc744 \uad6c\ud604\ud560 \uc218 \uc788\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n

\r\n \ud558\uc9c0\ub9cc \uc774\ub7f0 \uac00\ub2a5\uc131\uc740 \ub3d9\uc2dc\uc5d0 \uc6e8\uc774\ud37c \ub808\ubca8\uacfc \ud328\ud0a4\uc9c0 \ub808\ubca8\uc5d0\uc11c \uc0c8\ub85c\uc6b4 \ud14c\uc2a4\ud2b8 \uacfc\uc81c\ub97c \ubd88\ub7ec\uc635\ub2c8\ub2e4. \ubaa8\ub180\ub9ac\uc2dd SoC\uc640 \ub2ec\ub9ac, \uce69\ub81b \uae30\ubc18 \uc774\uc885 \ud328\ud0a4\uc9d5\uc740 DFT, D2D\uc778\ud130\ucee4\ub125\ud2b8, \ucd94\uc801\uc131, \ubcf4\uc548 \ub4f1\uc5d0\uc11c \ub3c5\ud2b9\ud55c \ud14c\uc2a4\ud2b8 \ubb38\uc81c\ub97c \ub3d9\ubc18\ud569\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n

\r\n \uae30\uc874 ATE\uae30\ubc18 \ud14c\uc2a4\ud2b8\uc640 KGD\ud655\ubcf4 \ubc29\ubc95\uc740 \ubaa8\ub180\ub9ac\uc2dd \ud658\uacbd\uc5d0\uc11c\ub294 \ucda9\ubd84\ud788 \uc131\uc219\ud588\uc9c0\ub9cc, \uce69\ub81b \uae30\ubc18 \uc774\uc885 \ud1b5\ud569\uc5d0\uc11c\ub294 \uac1c\ubcc4 KGD\ub9cc\uc73c\ub85c\ub294 \ud328\ud0a4\uc9c0 \uc804\uccb4\uc758 \uae30\ub2a5\uc744 \ubcf4\uc7a5\ud560 \uc218 \uc5c6\uc2b5\ub2c8\ub2e4. \ub610\ud55c TSV\ub97c \ud65c\uc6a9\ud55c 3D IC\uc640 \ub2e4\uc774\ub97c \uc5f0\uacb0\ud558\ub294 \uc778\ud130\ud3ec\uc800\u00b7\uc11c\ube0c\uc2a4\ud2b8\ub808\uc774\ud2b8 \uae30\uc220\uc740 \uc804\uae30\uc801 \uae30\uc0dd\ud6a8\uacfc\uc640 IR\ub4dc\ub86d\uc5d0 \uc9c1\uc811\uc801\uc778 \uc601\ud5a5\uc744 \uc90d\ub2c8\ub2e4. \ud328\ud0a4\uc9c0 \ub0b4\ubd80\uc5d0\uc11c \uc218 \ubc00\ub9ac\ubbf8\ud130 \uac04\uaca9\uc73c\ub85c \ubc30\uce58\ub41c \ub2e4\uc774 \uac04 \uc5f4\uac04\uc12d \uc5ed\uc2dc \uc131\ub2a5 \uc800\ud558 \uc694\uc778\uc774\ubbc0\ub85c \ud14c\uc2a4\ud2b8 \ub2e8\uacc4\uc5d0\uc11c \ubc18\ub4dc\uc2dc \uace0\ub824\ud574\uc57c \ud569\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n

\r\n \ud2b9\ud788, \ud558\ub4dc\uc6e8\uc5b4 \uc624\ub958\uac00 \ud0d0\uc9c0\ub418\uc9c0 \uc54a\uace0 \uc9c0\ub098\uce58\ub294 SDC\ubb38\uc81c\ub294 \uc810\uc810 \ub354 \ud070 \uc6b0\ub824 \uc0ac\ud56d\uc73c\ub85c \ub5a0\uc624\ub974\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uc774\ub294 \uc2e4\ub9ac\ucf58\uacfc \ud558\ub4dc\uc6e8\uc5b4\uc758 \uc5f4\ud654\u00b7\ub178\ud654\uc5d0 \ud06c\uac8c \uc88c\uc6b0\ub418\uba70, \uc6d0\uc778 \uc9c4\ub2e8\uc774 \uc5b4\ub835\ub2e4\ub294 \uc810\uc5d0\uc11c \uc2dc\uc2a4\ud15c \uc2e0\ub8b0\uc131\uc5d0 \uc2ec\uac01\ud55c \ub9ac\uc2a4\ud06c\ub97c \ucd08\ub798\ud560 \uc218 \uc788\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n

\r\n \ub530\ub77c\uc11c \uce69\ub81b \uae30\ubc18 AI\u00b7HPC \ub514\ubc14\uc774\uc2a4\uc5d0\uc11c\ub294 \uae30\uc874 ATE \uae30\ubc18 \ud14c\uc2a4\ud2b8\ub9cc\uc73c\ub85c\ub294 \ud55c\uacc4\uac00 \uc788\uc73c\uba70, \uc2dc\uc2a4\ud15c \ub808\ubca8 \ud14c\uc2a4\ud2b8\uc758 \ub3c4\uc785\uc774 \ud544\uc218\uc801\uc774\ub77c\ub294 \uc810\uc774 \uc810\uc810 \ub354 \ubd84\uba85\ud574\uc9c0\uace0 \uc788\uc2b5\ub2c8\ub2e4. \ubcf8 \ubc1c\ud45c\uc5d0\uc11c\ub294 SLT\uc758 \ud544\uc694\uc131\uacfc \uc8fc\uc694 \uacfc\uc81c, \uadf8\ub9ac\uace0 \uc2e4\uc81c \uc801\uc6a9 \uc0ac\ub840\ub97c \uc18c\uac1c\ud558\uace0\uc790 \ud569\ub2c8\ub2e4.\r\n <\/p>\r\n<\/div>\r\n<\/p>

\r\n

\r\n Yogan Senthilkumar\ub294 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8 \ubd84\uc57c\uc5d0\uc11c 35\ub144 \uc774\uc0c1\uc758 \uacbd\ud5d8\uc744 \ubcf4\uc720\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n

\r\n \ud604\uc7ac iVP Semiconductor\uc5d0\uc11c CTO\ub85c \uc7ac\uc9c1 \uc911\uc774\uba70, \ub514\uc9c0\ud138, PIMIC, Mixed Signal, RF \ub514\ubc14\uc774\uc2a4\uc758 \ud14c\uc2a4\ud2b8 \uc194\ub8e8\uc158 \uac1c\ubc1c\uc744 \uace0\uac1d\ub4e4\uacfc \ud568\uaed8 \ucd94\uc9c4\ud558\uace0, \uc774\ub97c OSAT\uc5d0\uc11c \uc591\uc0b0 \ub2e8\uacc4\uae4c\uc9c0 \uc131\uacf5\uc801\uc73c\ub85c \uc801\uc6a9\ud558\ub294 \ub370 \uae30\uc5ec\ud574 \uc654\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n

\r\n \uc774\uc804\uc5d0\ub294 Tessolve\uc5d0\uc11c Vice President Engineering\uc73c\ub85c \uadfc\ubb34\ud558\uba74\uc11c, \uc6e8\uc774\ud37c \ud14c\uc2a4\ud2b8\uc640 \ucd5c\uc885 \ud14c\uc2a4\ud2b8\ub97c \uc704\ud55c \uc548\uc815\uc801\uc778 \ud14c\uc2a4\ud2b8 \ud504\ub85c\uadf8\ub7a8\uc744 \uad6c\ucd95\ud558\uae30 \uc704\ud574 \ub2e4\uc591\ud55c \ud14c\uc2a4\ud2b8 \ud504\ub85c\uc138\uc2a4 \uc790\ub3d9\ud654\ub97c \uc8fc\ub3c4\ud588\uc2b5\ub2c8\ub2e4. \ub610\ud55c \ud558\ub4dc\uc6e8\uc5b4 \ubc0f \ud14c\uc2a4\ud2b8 \ud504\ub85c\uadf8\ub7a8 \uac1c\ubc1c\uc5d0 AI\ub97c \uc801\uc6a9\ud558\ub294 \ub370 \uc911\uc694\ud55c \uc5ed\ud560\uc744 \ud588\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n

\r\n \uacbd\ub825 \ucd08\uae30\uc5d0\ub294 \uc2f1\uac00\ud3ec\ub974\uc758 Teradyne Asia Test Application Group\uc5d0\uc11c \uadfc\ubb34\ud558\uba70, \ubbf8\uad6d\uacfc \uc720\ub7fd Teradyne \ubcf8\uc0ac\uc758 \ud14c\uc2a4\ud2b8 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1 \ud504\ub85c\uc81d\ud2b8\ub97c \ub2f4\ub2f9\ud588\uc2b5\ub2c8\ub2e4. \uc774\ud6c4 Salland Engineering, National Semiconductor, SPEL\uc5d0\uc11c\ub3c4 \uacbd\ub825\uc744 \uc313\uc558\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n

\r\n \ub610\ud55c TUG, Semicon, OCP \ub4f1 \ub2e4\uc591\ud55c \ucee8\ud37c\ub7f0\uc2a4\uc5d0\uc11c \ud14c\uc2a4\ud2b8 \uae30\ubc95\uacfc \uad00\ub828\ub41c \ub17c\ubb38\uc744 \ubc1c\ud45c\ud588\uc73c\uba70, Test and Measurement World \ubc0f Semicon Manufacturing\uc5d0 \ub2e4\uc218\uc758 \uae30\uc220 \uae30\uace0\ubb38\uc744 \uc791\uc131\ud55c \ubc14 \uc788\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n<\/div>\r\n<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

10:15<\/h1>\n<\/div><\/div><\/div><\/div>

Break & Networking<\/strong><\/h1>\nEnjoy time to meet with the presenters and network while refreshments are served.<\/span><\/span><\/div><\/div><\/div>
<\/div><\/div><\/div>

10:45<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Keynote<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“Shaping the Future of Semiconductors: Trends and Innovations in Advanced Packaging” \n
“\ucca8\ub2e8 \ud328\ud0a4\uc9d5\uc744 \ud1b5\ud55c \ubc18\ub3c4\uccb4 \ubbf8\ub798\uc758 \ubc29\ud5a5\uacfc \ud601\uc2e0” \n<\/div>\n
\n
\n
\n Hak-Sung \"Hak-Sung\" Kim\n <\/div>\n\t
\nHanyang University\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract (English)<\/summary>\n

\r\n

\r\n The semiconductor industry is entering an era where traditional transistor scaling alone can no longer meet the demands for higher performance, lower power consumption, and increased functionality.\r\n <\/p>\r\n

\r\n Advanced packaging technologies are emerging as critical enablers to extend system performance and integration beyond the limits of Moore\u2019s Law.\r\n <\/p>\r\n

\r\n This keynote will provide a comprehensive overview of current and future trends in advanced packaging, highlighting innovations that are reshaping the landscape of high-performance computing, AI accelerators, mobile devices, and heterogeneous integration. Topics will include the evolution of 2.5D\/3D integration, chiplet architectures, and heterogeneous system-in-package solutions; advancements in interposer technologies such as silicon, glass, and organic substrates; fine-pitch interconnect innovations including hybrid bonding and advanced RDL; and emerging thermal management solutions for high-power packages.\r\n <\/p>\r\n

\r\n Attendees will gain insights into the technology roadmap, key research directions, and collaborative opportunities bridging academia and industry to meet the demands of the AI and data-driven era.\r\n <\/p>\r\n<\/div>\r\n<\/p><\/details>\n

\n\t\ucd08\ub85d (Korean)<\/summary>\n

\ubc18\ub3c4\uccb4 \uc0b0\uc5c5\uc740 \ub354 \ub192\uc740 \uc131\ub2a5, \ub0ae\uc740 \uc804\ub825 \uc18c\ube44, \uadf8\ub9ac\uace0 \uae30\ub2a5 \ud655\uc7a5\uc744 \uc694\uad6c\ud558\ub294 \uc2dc\ub300\uc5d0 \uc811\uc5b4\ub4e4\uc5c8\uc9c0\ub9cc, \uc804\ud1b5\uc801\uc778 \ud2b8\ub79c\uc9c0\uc2a4\ud130 \uc2a4\ucf00\uc77c\ub9c1\ub9cc\uc73c\ub85c\ub294 \uc774\ub97c \ucda9\uc871\ud558\uae30 \uc5b4\ub824\uc6b4 \uc0c1\ud669\uc5d0 \uc9c1\uba74\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \r\n\uc774\uc5d0 \ub530\ub77c \ucca8\ub2e8 \ud328\ud0a4\uc9d5 \uae30\uc220\uc740 \ubb34\uc5b4\uc758 \ubc95\uce59 \ud55c\uacc4\ub97c \ub118\uc5b4 \uc2dc\uc2a4\ud15c \uc131\ub2a5\uacfc \uc9d1\uc801\ub3c4\ub97c \ud655\uc7a5\ud560 \uc218 \uc788\ub294 \ud575\uc2ec \ub3d9\ub825\uc73c\ub85c \ubd80\uc0c1\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.\r\n\uc774\ubc88 \uae30\uc870\uac15\uc5f0\uc5d0\uc11c\ub294 \ucca8\ub2e8 \ud328\ud0a4\uc9d5\uc758 \ud604\uc7ac\uc640 \ubbf8\ub798 \ub3d9\ud5a5\uc744 \uc885\ud569\uc801\uc73c\ub85c \ub2e4\ub8e8\uba70, \uace0\uc131\ub2a5 \ucef4\ud4e8\ud305, AI \uac00\uc18d\uae30, \ubaa8\ubc14\uc77c \uae30\uae30, \uc774\uc885 \uc9d1\uc801(heterogeneous integration) \ubd84\uc57c\ub97c \ubcc0\ud654\uc2dc\ud0a4\uace0 \uc788\ub294 \ud601\uc2e0\ub4e4\uc744 \uc870\ub9dd\ud569\ub2c8\ub2e4. \r\n\uc8fc\uc694 \uc8fc\uc81c\ub294 2.5D\/3D \uc9d1\uc801\uacfc \uce69\ub81b \uc544\ud0a4\ud14d\ucc98, \uc774\uc885 \uc2dc\uc2a4\ud15c \uc778 \ud328\ud0a4\uc9c0(System-in-Package) \uc194\ub8e8\uc158\uc758 \ubc1c\uc804, \uc2e4\ub9ac\ucf58\u00b7\uae00\ub77c\uc2a4\u00b7\uc720\uae30 \uae30\ud310 \uae30\ubc18 \uc778\ud130\ud3ec\uc800 \uae30\uc220\uc758 \uc9c4\ud654, \ud558\uc774\ube0c\ub9ac\ub4dc \ubcf8\ub529 \ubc0f \ucca8\ub2e8 RDL\uacfc \uac19\uc740 \ubbf8\uc138 \ud53c\uce58 \uc778\ud130\ucee4\ub125\ud2b8 \ud601\uc2e0, \r\n\uadf8\ub9ac\uace0 \uace0\uc804\ub825 \ud328\ud0a4\uc9c0\ub97c \uc704\ud55c \uc0c8\ub85c\uc6b4 \uc5f4 \uad00\ub9ac \uae30\uc220\uc744 \ud3ec\ud568\ud569\ub2c8\ub2e4.\r\n\ucc38\uc11d\uc790\ub4e4\uc740 \uae30\uc220 \ub85c\ub4dc\ub9f5\uacfc \uc8fc\uc694 \uc5f0\uad6c \ubc29\ud5a5, \uadf8\ub9ac\uace0 \ud559\uacc4\uc640 \uc0b0\uc5c5\uacc4 \uac04 \ud611\ub825 \uae30\ud68c\ub97c \ud1b5\ud574 AI \ubc0f \ub370\uc774\ud130 \uc911\uc2ec \uc2dc\ub300\uc758 \uc694\uad6c\ub97c \ucda9\uc871\ud558\uae30 \uc704\ud55c \uc778\uc0ac\uc774\ud2b8\ub97c \uc5bb\uc744 \uc218 \uc788\uc744 \uac83\uc785\ub2c8\ub2e4.\r\n <\/p><\/details>\n<\/div>\n<\/div>\n\t \n

\"Image\"<\/span><\/div>
\uae40\ud559\uc131 \uad50\uc218\n\ud55c\uc591\ub300\ud559\uad50, \uc11c\uc6b8, \ub300\ud55c\ubbfc\uad6d \n\uae40\ud559\uc131 \uad50\uc218\ub294 \ucca8\ub2e8 \ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9d5 \ubc0f \uc2e0\ub8b0\uc131 \uacf5\ud559 \ubd84\uc57c\uc5d0\uc11c \uad6d\uc81c\uc801\uc73c\ub85c \uc778\uc815\ubc1b\ub294 \uc804\ubb38\uac00\uc785\ub2c8\ub2e4. \n\ud55c\uc591\ub300\ud559\uad50 \uad50\uc218\ub85c\uc11c 200\ud3b8 \uc774\uc0c1\uc758 \uc800\ub110 \ub17c\ubb38\uc744 \ubc1c\ud45c\ud558\uc600\uace0, 227\uac74\uc758 \ud2b9\ud5c8\ub97c \ubcf4\uc720\ud558\uace0 \uc788\uc73c\uba70, \uc0b0\ud559 \ud611\ub825 \uc5f0\uad6c\ub97c \uc8fc\ub3c4\ud558\uc5ec \ub9c9\ub300\ud55c \uc5f0\uad6c\ube44\uc640 \uae30\uc220\uc774\uc804 \uc131\uacfc\ub97c \uc774\ub04c\uc5b4\ub0c8\uc2b5\ub2c8\ub2e4. \n\uadf8\uc758 \uc120\ub3c4\uc801\uc778 \uc5f0\uad6c \uc131\uacfc\uc5d0\ub294 \uce5c\ud658\uacbd \uace0\ubc00\ub3c4 \uc778\ud130\ucee4\ub125\ud2b8 \uae30\uc220, \ud14c\ub77c\ud5e4\ub974\uce20 \uae30\ubc18 \ube44\ud30c\uad34 \uac80\uc0ac, \uadf8\ub9ac\uace0 3D\/\uc774\uc885 \uc9d1\uc801\uc744 \ud5a5\uc0c1\uc2dc\ud0a4\ub294 \ud601\uc2e0 \ud328\ud0a4\uc9d5 \uacf5\uc815\uc774 \ud3ec\ud568\ub429\ub2c8\ub2e4. \n\ud604\uc7ac \ud55c\uc591\ucca8\ub2e8\ubc18\ub3c4\uccb4\ud328\ud0a4\uc9d5\uc13c\ud130 \uc13c\ud130\uc7a5\uc744 \uc5ed\uc784\ud558\uace0\uc788\uc73c\uba70 Microelectronics Reliability \uc800\ub110\uc758 \ubd80\ud3b8\uc9d1\uc778(Associate Editor)\uc73c\ub85c \ud65c\ub3d9\ud558\uba70, \n\ud559\ubb38\uc801 \uc5f0\uad6c\uc640 \uc0b0\uc5c5 \uc751\uc6a9\uc744 \uc5f0\uacb0\ud558\ub294 \uc9c0\uc18d \uac00\ub2a5\ud558\uace0 \uc2e0\ub8b0\uc131 \ub192\uc740 \ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9d5 \uae30\uc220 \ubc1c\uc804\uc744 \uc120\ub3c4\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/div><\/div><\/div><\/div>

Professor Hak-Sung Kim<\/strong> is an internationally recognized expert in advanced semiconductor packaging and reliability engineering. As a professor at Hanyang University, he has published over 200 journal papers, holds 227 patents, and has led major academia–industry collaborations generating significant research funding and technology transfers. His pioneering contributions include eco-friendly high-density interconnects, terahertz-based nondestructive inspection, and innovative packaging processes enhancing 3D\/heterogeneous integration. Currently serving as Associate Editor of Microelectronics Reliability, he continues to drive advances in sustainable and reliable semiconductor packaging technologies bridging academic research with industrial applications.<\/p><\/div><\/div><\/div><\/div>

\n
\n
Market<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“Navigating Market Shifts: The Future of Test and Burn-In Sockets in the AI Era” \n
“\uc2dc\uc7a5\ubcc0\ud654\uc18d\uc5d0\uc11c \uae38\uc744 \ucc3e\ub2e4: AI \uc2dc\ub300, \ubc88\uc778 \ud14c\uc2a4\ud2b8\uc640 \uc18c\ucf13 \uc804\ub9dd” \n<\/div>\n
\n
\n
\nJohn West\n <\/div>\n\t
\nYole Group\n\t <\/div>\n <\/div>\n
\n
\nNur Hilwani \"Nur\" Razi\n <\/div>\n\t
\nYole Group\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

The explosive growth of artificial intelligence is creating new challenges and market imbalances within the semiconductor industry. At the same time, governments are intervening through subsidies, tariffs, and other protectionist policies. The result of these powerful drivers will be a redefinition of global competition across the supply chain.\r\nThis presentation examines how these forces are driving today\u2019s market transformation and their implications for suppliers and buyers of test and burn-in sockets, highlighting both the risks and opportunities that lie ahead.<\/p>

John West<\/strong> is a Senior Director of the Semiconductor Subsystems and Test Division at Yole Group. He has over 20 years of industry experience and a successful track record in various strategy and consulting projects.<\/p>\r\n\r\n

John has a Bachelor's degree in Medical Physics from King's College London and an MBA from Cranfield School of Management.<\/p>\r\n<\/p><\/details>\n

\n\t\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n

AI\uc758 \ub208\ubd80\uc2e0 \uc131\uc7a5\uc740 \ubc18\ub3c4\uccb4 \uc0b0\uc5c5\uc5d0 \uc0c8\ub85c\uc6b4 \uacfc\uc81c\uc640 \uc2dc\uc7a5 \ubd88\uade0\ud615\uc744 \ucd08\ub798\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n\r\n

\ub3d9\uc2dc\uc5d0 \uac01\uad6d \uc815\ubd80\ub294 \ubcf4\uc870\uae08, \uad00\uc138 \ub610\ub294 \uae30\ud0c0 \ubcf4\ud638\ubb34\uc5ed \uc815\ucc45\uc744 \ud1b5\ud574 \uc2dc\uc7a5\uc5d0 \uac1c\uc785\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n\r\n

\uc774\ub7ec\ud55c \uc694\uc778\ub4e4\uc740 \uc804 \uc138\uacc4 \uacf5\uae09\ub9dd \uacbd\uc7c1 \uad6c\ub3c4\ub97c \uadfc\ubcf8\uc801\uc73c\ub85c \uc7ac\uc815\uc758\ud560 \uac83\uc785\ub2c8\ub2e4.<\/p>\r\n\r\n

\uc774\ubc88 \ubc1c\ud45c\uc5d0\uc11c\ub294 \uc774\ub7ec\ud55c \uc694\uc778\ub4e4\uc774 \uc624\ub298\ub0a0 \uc2dc\uc7a5 \ubcc0\ud654\ub97c \uc5b4\ub5bb\uac8c \uc774\ub04c\uace0 \uc788\ub294\uc9c0, \uadf8\ub9ac\uace0 \ud14c\uc2a4\ud2b8 \ubc0f \ubc88\uc778 \uc18c\ucf13 \uacf5\uae09\uc5c5\uccb4\uc640 \uad6c\ub9e4\uc790\ub4e4\uc774 \uc9c1\uba74\ud560 \uc704\ud5d8\uacfc \uae30\ud68c\ub97c \uc870\uba85\ud569\ub2c8\ub2e4.<\/p>\r\n<\/p>

John West<\/strong>\ub294 Yole Group\uc758 Semiconductor Subsystems and Test Division\uc758 Senior Director\uc774\ub2e4. \uadf8\ub294 20\ub144 \uc774\uc0c1\uc758 \uc5c5\uacc4 \uacbd\ud5d8\uacfc \ub2e4\uc591\ud55c \uc804\ub7b5 \ubc0f \ucee8\uc124\ud305 \ud504\ub85c\uc81d\ud2b8\uc5d0\uc11c \uc131\uacf5\uc801\uc778 \uc2e4\uc801\uc744 \ubcf4\uc720\ud558\uace0 \uc788\ub2e4.<\/p>\r\n\r\n

John\uc740 King's College London\uc5d0\uc11c \uc758\ub8cc \ubb3c\ub9ac\ud559 \ud559\uc0ac \ud559\uc704\ub97c \ucde8\ub4dd\ud588\uc73c\uba70 Cranfield School of Management\uc5d0\uc11c MBA\ub97c \ucde8\ub4dd\ud588\ub2e4.<\/p>\r\n<\/p><\/details>\n<\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

12:15<\/h1>\n<\/div><\/div><\/div><\/div>

Lunch & EXPO<\/strong><\/h1>\n

Enjoy the delicious hot buffet lunch and networking time. Then take the time to explore the TestConX EXPO. There will be many great exhibits to connect electronic test professionals to solutions. You will be certain to see something new or meet someone new. As attendees to TestConX know, there is always excellent food, drinks, and time for attendees to network with exhibitors! TestConX EXPO will open at 12:15 and will remain open throughout the afternoon until 18:00
\n<\/span><\/p><\/span><\/div><\/div><\/div>

<\/div><\/div><\/div>

13:30<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Keynote<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“Test Insertions and Test Challenges for AI-HPC in CoWoS and CoPoS Advanced Heterogeneous Integrated Packages” \n
“ CoWoS \ubc0f CoPoS\ub4f1 \uc9c4\ubcf4\ub41c \uc774\uc885\uac04 \ud1b5\ud569 \ud328\ud0a4\uc9c0\uc758 AI-HPC\uc5d0 \ub300\ud55c \ud14c\uc2a4\ud2b8 insertion \ubc0f \ud14c\uc2a4\ud2b8 \uacfc\uc81c.” \n<\/div>\n
\n
\n
\nJeorge Hurtarte\n <\/div>\n\t
\nTeradyne\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract (English)<\/summary>\n

Abstract<\/strong><\/p>\r\n\r\n

As AI-HPC (High Performance Computing) solutions continue to evolve from single compute devices (GPUs or Switches) into advanced heterogeneous integrated packages with multiple chiplets (e.g., HBMs, GPUs and Switches with UCIe interfaces, Silicon Photonics ICs, etc.) in a silicon wafer or panel interposer (aka CoW: chip-on-wafer; CoP: chip-on-panel), and then on to the final package substrate (CoWoS: chip-on-wafer-on-substrate), the test complexity is increasing significantly, as well as the number of possible test insertions.<\/p>\r\n\r\n

This presentation provides an overview of this trend and related new test challenges which also require new test strategies that will guarantee both known-good-die and known-good-CoW to optimize the overall cost of test, while maximizing the final test insertion yield and quality of the finished CoWoS device.<\/p>\r\n<\/p><\/details>\n

\n\t\ucd08\ub85d (Korean)<\/summary>\n

\uc694\uc57d<\/strong><\/p>\r\n\r\n

AI-HPC(\uace0\uc131\ub2a5 \ucef4\ud4e8\ud305) \uc194\ub8e8\uc158\uc774 \ub2e8\uc77c \ucef4\ud4e8\ud305 \uc7a5\uce58(GPU \ub610\ub294 \uc2a4\uc704\uce58)\uc5d0\uc11c \uc2e4\ub9ac\ucf58 \uc6e8\uc774\ud37c \ub610\ub294 panel interposer(\uc77c\uba85 CoW: Chip-on-Wafer; CoP: Chip-on-Panel)\uc5d0 \uc5ec\ub7ec Chiplet(\uc608: UCIe \uc778\ud130\ud398\uc774\uc2a4\uac00 \uc788\ub294 HBM, GPU \ubc0f \uc2a4\uc704\uce58, Silicon Photonics IC \ub4f1)\uc774 \ud3ec\ud568\ub41c \uc9c4\ubcf4\ub41c \uc774\uae30\uc885 \ud1b5\ud569 \ud328\ud0a4\uc9c0\ub85c, \uadf8\ub9ac\uace0 \ucd5c\uc885 \ud328\ud0a4\uc9c0 \uae30\ud310(CoWoS: Chip-on-Wafer-on-Substrate)\uc73c\ub85c \uc9c4\ud654\ud568\uc5d0 \ub530\ub77c \ud14c\uc2a4\ud2b8 \ubcf5\uc7a1\uc131\uc774 \ud06c\uac8c \uc99d\uac00\ud558\uace0 \uc788\uc73c\uba70, \uac00\ub2a5\ud55c \ud14c\uc2a4\ud2b8 insertion \uc218\ub3c4 \uc99d\uac00\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n\r\n

\uc774 \ud504\ub808\uc820\ud14c\uc774\uc158\uc5d0\uc11c\ub294 \uc774\ub7ec\ud55c \ucd94\uc138\uc640 \uad00\ub828\ub41c \uc0c8\ub85c\uc6b4 \ud14c\uc2a4\ud2b8 \uacfc\uc81c\uc5d0 \ub300\ud55c \uac1c\uc694\ub97c \uc81c\uacf5\ud558\uba70, \ub610\ud55c \ud14c\uc2a4\ud2b8\uc758 \uc804\ubc18\uc801\uc778 \ube44\uc6a9\uc744 \ucd5c\uc801\ud654\ud558\uba74\uc11c \ucd5c\uc885 \ud14c\uc2a4\ud2b8 insertion \uc218\uc728\uacfc \uc644\uc131\ub41c CoWoS \uc7a5\uce58\uc758 \ud488\uc9c8\uc744 \uadf9\ub300\ud654\ud558\uae30 \uc704\ud574 \uc54c\ub824\uc9c4 \uc591\ud638\ud55c Die\uc640 \uc54c\ub824\uc9c4 \uc591\ud638\ud55c CoW\ub97c \ubaa8\ub450 \ubcf4\uc7a5\ud558\ub294 \uc0c8\ub85c\uc6b4 \ud14c\uc2a4\ud2b8 \uc804\ub7b5\uc774 \ud544\uc694\ud569\ub2c8\ub2e4.<\/p>\r\n<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n
\"Image\"<\/span><\/div>
Jeorge S. Hurtarte \ubc15\uc0ac\ub294 \ud604\uc7ac Teradyne\uc758 \ubc18\ub3c4\uccb4 \ucef4\ud4e8\ud305 \ud14c\uc2a4\ud2b8 \ubd80\ubb38\uc5d0\uc11c \uc218\uc11d \uc774\uc0ac \uacb8 \uc218\uc11d \ub9c8\ucf00\ud305 \uc804\ub7b5\uac00\ub85c \uc7ac\uc9c1\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uadf8\ub294 Teradyne, Lam Research, LitePoint, TranSwitch, Rockwell Semiconductors\uc5d0\uc11c \ub2e4\uc591\ud55c \uae30\uc220, \uad00\ub9ac \ubc0f \uc784\uc6d0\uc9c1\uc744 \uc5ed\uc784\ud588\uc2b5\ub2c8\ub2e4. \uadf8\ub294 SEMI \ubd81\ubbf8 \uc790\ubb38 \uc704\uc6d0\ud68c \uc704\uc6d0\uc774\uba70, IEEE \uc774\uc885 \uc9d1\uc801 \ub85c\ub4dc\ub9f5(HIR) \ud14c\uc2a4\ud2b8 \uc9c0\ubd80\uc758 \uacf5\ub3d9 \uc758\uc7a5\uc744 \ub9e1\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uadf8\ub294 \uc804\uae30\uacf5\ud559 \ubc15\uc0ac \ud559\uc704\uc640 MBA, \ucef4\ud4e8\ud130 \uacfc\ud559, \ud1b5\uc2e0\ud559 \uc11d\uc0ac \ud559\uc704\ub97c \ucde8\ub4dd\ud588\uc2b5\ub2c8\ub2e4. \ub610\ud55c \uce98\ub9ac\ud3ec\ub2c8\uc544 \ub300\ud559\uad50 \uc0b0\ud0c0\ud06c\ub8e8\uc988 \ucea0\ud37c\uc2a4\uc640 \ud53c\ub2c9\uc2a4 \ub300\ud559\uad50\uc758 \ubc29\ubb38 \uad50\uc218\uc774\uae30\ub3c4 \ud569\ub2c8\ub2e4. \uadf8\ub294 \u300e\ud339\ub9ac\uc2a4 IC \uae30\uc220 \uc774\ud574(Understanding Fabless IC Technology)\u300f\uc758 \uacf5\ub3d9 \uc800\uc790\uc785\ub2c8\ub2e4.<\/div><\/div><\/div><\/div>

Dr. Jeorge S. Hurtarte<\/strong> is currently Senior Director and Principal Marketing Strategist in the Semiconductor Compute Test Division at Teradyne. Jeorge has held various technical, management and executive positions at Teradyne, Lam Research, LitePoint, TranSwitch, and Rockwell Semiconductors. Jeorge is in the Advisory Board of SEMI of North America and serves as co-chair of the IEEE Heterogeneous Integration Roadmap (HIR) Test Chapter. Jeorge holds a PhD in Electrical Engineering, and three master’s degrees (MBA, Computer Science, and Telecommunications). He is also visiting professor at the University of California, Santa Cruz and at the University of Phoenix. He is co-author of the book Understanding Fabless IC Technology.<\/p><\/div><\/div><\/div><\/div>

<\/div><\/div><\/div>
<\/div>
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Distinguished<\/div>
Tutorial Room<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“The Restructuring Semiconductor Landscape: The Rise of the ASIC , the New AI Semiconductor Order, and Opportunities for Back-End Processing” \n
“\uc0c8\ub86d\uac8c \uc7ac\ud3b8\ub418\ub294 \ubc18\ub3c4\uccb4 \uc9c0\ud615. ASIC \uc9c4\uc601\uc758 \ubd80\uc0c1\uacfc '\u65b0 AI \ubc18\ub3c4\uccb4' \uc9c8\uc11c\uc640 \ud6c4\uacf5\uc815\uc758 \uae30\ud68c” \n<\/div>\n
\n
\n
\nJihoon Jang\n <\/div>\n\t
\nGagetseoul Media\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract (English)<\/summary>\n

\r\n\r\n\r\n \r\n AI Semiconductor Market Abstract<\/title>\r\n<\/head>\r\n<body>\r\n <p>\r\n While the AI semiconductor market appears to be dominated by NVIDIA's GPUs, a massive tectonic shift is occurring beneath the surface. As big tech companies like Google (TPU), Amazon (Inferentia), and Meta jump into developing their own AI chips, a transformation of the entire market ecosystem has begun.\r\n <\/p>\r\n\r\n <p>\r\n This session will analyze the fundamental market changes that the rise of the ASIC camp will bring. Furthermore, it will provide an in-depth perspective on the impact these changes will have on the HBM and foundry ecosystems, and the new market opportunities that will open up for OSATs.\r\n <\/p>\r\n<\/body>\r\n<\/html>\r\n<\/p><p><\/p><\/details>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">\ucd08\ub85d (Korean)<\/summary>\n<p><!DOCTYPE html>\r\n<html lang=\"ko\">\r\n<head>\r\n <meta charset=\"UTF-8\">\r\n <title>AI \ubc18\ub3c4\uccb4 \uc2dc\uc7a5 \uc8fc\uc81c \uc124\uba85<\/title>\r\n<\/head>\r\n<body>\r\n <p>\r\n \uc8fc\uc81c \uc124\uba85: AI \ubc18\ub3c4\uccb4 \uc2dc\uc7a5\uc740 \uc5d4\ube44\ub514\uc544\uc758 GPU\uac00 \ud3c9\uc815\ud55c \uac83\ucc98\ub7fc \ubcf4\uc774\uc9c0\ub9cc, \ubb3c\ubc11\uc5d0\uc11c\ub294 \uac70\ub300\ud55c \uc9c0\uac01 \ubcc0\ub3d9\uc774 \uc77c\uc5b4\ub098\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uad6c\uae00(TPU), \uc544\ub9c8\uc874(Inferentia), \uba54\ud0c0 \ub4f1 \ube45\ud14c-\ud06c \uae30\uc5c5\ub4e4\uc774 \uc790\uccb4 AI \uce69 \uac1c\ubc1c\uc5d0 \ub6f0\uc5b4\ub4e4\uba74\uc11c, \uc2dc\uc7a5 \uc0dd\ud0dc\uacc4 \uc804\ubc18\uc5d0 \ub300\ud55c \ubcc0\ud654\uac00 \uc2dc\uc791\ub418\uace0 \uc788\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n\r\n <p>\r\n \uc774 \uc138\uc158\uc5d0\uc11c\ub294 ASIC \uc9c4\uc601\uc758 \ubd80\uc0c1\uc774 \uac00\uc838\uc62c \uc2dc\uc7a5\uc758 \uadfc\ubcf8\uc801\uc778 \ubcc0\ud654\ub97c \ubd84\uc11d\ud569\ub2c8\ub2e4. \ub098\uc544\uac00 \uc774\ub7ec\ud55c \ubcc0\ud654\uac00 HBM(\uace0\ub300\uc5ed\ud3ed \uba54\ubaa8\ub9ac)\uacfc \ud30c\uc6b4\ub4dc\ub9ac \uc0dd\ud0dc\uacc4\uc5d0 \ubbf8\uce60 \uc601\ud5a5, \uadf8\ub9ac\uace0 OSAT(\ud6c4\uacf5\uc815 \uc678\uc8fc\uc5c5\uccb4)\uc5d0\uac8c \uc5f4\ub9b4 \uc0c8\ub85c\uc6b4 \uc2dc\uc7a5 \uae30\ud68c\ub97c \uc2ec\ub3c4 \uc788\uac8c \uc870\ub9dd\ud569\ub2c8\ub2e4.\r\n <\/p>\r\n<\/body>\r\n<\/html>\r\n<\/p><p><\/p><\/details>\n<\/div>\n<\/div>\n\t \n<div class=\"x-row e7888-e72 m634-1 m634-3 m634-6 m634-e m634-m\"><div class=\"x-row-inner\"><div class=\"x-col e7888-e73 m634-u\"><span class=\"x-image e7888-e74 m634-x m634-z\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2024\/JiHoonJang.png\" width=\"150\" height=\"200\" alt=\"Image\" loading=\"lazy\"><\/span><\/div><div class=\"x-col e7888-e75 m634-u\"><div class=\"x-text x-content e7888-e76 m634-1c m634-1e\"><p>\uac00\uc82f\uc11c\uc6b8 \ubbf8\ub514\uc5b4\uc758 \uc7a5\uc9c0\ud6c8 \ub300\ud45c\ub294 \ud55c\uad6d\uc678\uad6d\uc5b4\ub300\ud559\uad50\ub97c \uc878\uc5c5\ud55c \ud6c4 \ud55c\ud654\uadf8\ub8f9 \uacf5\ucc44\ub85c \ucee4\ub9ac\uc5b4\ub97c \uc2dc\uc791\ud588\ub2e4. \uc804\ub7b5\/\uae30\ud68d\ud300\uc5d0\uc11c \uadfc\ubb34\ud558\uba70 IT \ubd84\uc57c\uc758 \uba38\ucc9c\ub2e4\uc774\uc800\ub85c \ube0c\ub79c\ub4dc\uc640 \uc0c1\ud488\uc744 \uc804\uac1c\ud558\uc600\ub2e4. \uc774\ud6c4 \uacbd\uc81c\uc9c0 \uc774\ucf54\ub178\ubbf8 \uc870\uc120\uc758 IT\uc804\ubb38 \uce7c\ub7fc\ub2c8\uc2a4\ud2b8\ub85c \uc5c5\uacc4\uc758 \uc2dc\ud669\uacfc \uc120\ud589\uae30\uc220\ub4e4\uc5d0 \ub300\ud55c \uae4a\uc774 \uc788\ub294 \uc778\uc0ac\uc774\ud2b8\ub97c \uacf5\uc720\ud574\uc654\ub2e4. \ud604\uc7ac\ub294 \uc720\ud29c\ube0c \ucc44\ub110 \uac00\uc82f\uc11c\uc6b8\uc744 \ud1b5\ud574 \uc0c1\ud488\uacfc \ube0c\ub79c\ub4dc, \uae30\uc220\uacfc \uc2dc\ud669\uc744 \uade0\ud615\uac10\uc788\uac8c \uc870\ub9dd\ud558\ub294 \uc601\uc0c1 \uce7c\ub7fc\uc744 \uc81c\uacf5\ud558\uace0 \uc788\ub2e4.<\/p><\/div><\/div><\/div><\/div><div class=\"x-text x-content e7888-e77 m634-1c m634-1e\"><p>Jihoon Jang, the CEO of Gadgetseoul Media, developed and narrates the highly informative and popular <a href=\"https:\/\/www.youtube.com\/gadgetseoul\">Gadgetseoul YouTube channel<\/a> focused on semiconductors and technology. Prior to which he was an Information Technology columnist for <i>Economy<\/i> <i>Chosun<\/i>. He started his career at Hanwha group as an IT\/Tech Merchandiser, managing and promoting many brands and products on the Strategy\/Planning team after completing his studies at Hankuk University of Foreign Studies.<\/p><\/div><hr class=\"x-line e7888-e78 m634-1g m634-1h\"\/><\/div><\/div><\/div><div class=\"x-row x-container max width e7888-e79 m634-1 m634-2 m634-3 m634-4 m634-7 m634-n\"><div class=\"x-row-inner\"><div class=\"x-col e7888-e80 m634-u\"><div class=\"x-text x-text-headline e7888-e81 m634-10 m634-11 m634-15 m634-17\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">15:00<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-col e7888-e82 m634-u\"><div class=\"x-text x-text-headline e7888-e83 m634-10 m634-15 m634-17 m634-18 m634-19\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\"><strong>Posters & EXPO<\/strong><\/h1>\n<span class=\"x-text-content-text-subheadline\"><span style=\"color: #000000;\">Enjoy time to meet with the presenters and network while refreshments are served.<\/span><\/span><\/div><\/div><\/div><hr class=\"x-line e7888-e84 m634-1g m634-1h\"\/>\n<div >\n<div class=\"testconx-session-heading testconx-session-bar-black\"><div class=\"sessionName\" id=\"Poster\">Posters<\/div><\/div><div class=\"sessionTitle\"><\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n“A Vertical Spring Pin Solution for Fine-Pitch (\u2264100\u202f\u03bcm) Die-Level and WLCSP Final Testing” \n<\/div>\n<div class=\"authorList\">\n <div class=\"author\">\n <div class=\"authorName\">\nKeunwoo \"KW\" Song\n <\/div>\n\t <div class=\"authorCompany\">\nTSE\n\t <\/div>\n <\/div>\n <div class=\"author\">\n <div class=\"authorName\">\nGN Gil\n <\/div>\n\t <div class=\"authorCompany\">\nTSE\n\t <\/div>\n <\/div>\n <div class=\"author\">\n <div class=\"authorName\">\nHae Guk \"HG\" Cho\n <\/div>\n\t <div class=\"authorCompany\">\nTSE\n\t <\/div>\n <\/div>\n <div class=\"author\">\n <div class=\"authorName\">\nBo Hyun \"BH\" Kim\n <\/div>\n\t <div class=\"authorCompany\">\nTSE\n\t <\/div>\n <\/div>\n<\/div>\n<\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n“Machine Learning-based Analysis on Rank Margin Test (RMT) Data between CPU and DRAM” \n<br>“CPU\uc640 DRAM\uac04 Rank Margin Tool (RMT) \ub370\uc774\ud130\uc5d0 \ub300\ud55c \uae30\uacc4\ud559\uc2b5 \uae30\ubc18 \ubd84\uc11d” \n<\/div>\n<div class=\"authorList\">\n <div class=\"author\">\n <div class=\"authorName\">\nJunyong Park\n <\/div>\n\t <div class=\"authorCompany\">\nKyung Hee University\n\t <\/div>\n <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract - Biography (English)<\/summary>\n<p><p><strong>Abstract<\/strong><\/p>\r\n\r\n<p>The Rank Margin Test (RMT) has been used to optimize the channels and Rx\/Tx circuits between the Central Processing Unit (CPU) and Dynamic Random-Access Memory (DRAM). The RMT process is an unknown process; machine learning (ML) is applied to analyze the RMT data. Neural networks (NN) and their hyperparameters are optimized in this work to improve trainability.<\/p>\r\n<\/p><p><p><strong>Biography<\/strong><\/p>\r\n\r\n<p>Junyong Park received the B.S. degree from Sungkyunkwan University in 2014, and the Ph.D. degree from the Korea Advanced Institute of Science and Technology (KAIST) in 2019. He was with the DRAM design team at SK Hynix from 2019 to 2023, and joined the Missouri University of Science and Technology from 2023 to 2024. He was with Dankook University by 2025, and he is currently with Kyung Hee University as an assistant professor. His current research interests include statistical signal\/power integrity for high-speed systems, next-generation packaging, and input\/output buffer information specification with an algorithmic modeling interface.<\/p>\r\n<\/p><\/details>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n<p><p><strong>\ucd08\ub85d<\/strong><\/p>\r\n\r\n<p>Rank Margin Tool (RMT)\ub294 \uc911\uc559\ucc98\ub9ac\uc7a5\uce58(CPU)\uc640 DRAM\uac04 \uc1a1\/\uc218\uc2e0 \ud68c\ub85c \ubc0f \uc774\ub4e4\uc744 \uc5f0\uacb0\ud558\ub294 \uace0\uc18d \ucc44\ub110\uc744 \ucd5c\uc801\ud654\ud558\uae30 \uc704\ud574\uc11c \uc0ac\uc6a9\ub418\uace0 \uc788\ub2e4. RMT \ub370\uc774\ud130\ub294 \ubd84\uc11d\uc774 \ud798\ub4e4\uae30 \ub54c\ubb38\uc5d0, \uae30\uacc4 \ud559\uc2b5\uc744 \uc774\uc6a9\ud558\uc5ec RMT \ub370\uc774\ud130\ub97c \ubd84\uc11d\ud55c\ub2e4. \uc5bc\ub9c8\ub098 \ud559\uc2b5\uc774 \uc798 \ub418\ub294\uac00(trainability)\ub97c \ud1b5\ud574 \uc778\uacf5\uc2e0\uacbd\ub9dd\uacfc \uadf8\uc758 \ud558\uc774\ud37c \ud30c\ub77c\ubbf8\ud130\ub4e4\uc774 \ucd5c\uc801\ud654\ub41c\ub2e4.<\/p>\r\n<\/p><p><p><strong>\uc57d\ub825<\/strong><\/p>\r\n\r\n<p>\ubcf8 \uc5f0\uad6c\uc790\ub294 2014\ub144 \uc131\uade0\uad00\ub300\ud559\uad50\uc5d0\uc11c \ud559\uc0ac \ud559\uc704\ub97c, 2019\ub144 \ud55c\uad6d\uacfc\ud559\uae30\uc220\uc6d0(KAIST)\uc5d0\uc11c \ubc15\uc0ac \ud559\uc704\ub97c \ubc1b\uc558\ub2e4. 2019\ub144\ubd80\ud130 2023\ub144\uae4c\uc9c0 SK\ud558\uc774\ub2c9\uc2a4 DRAM \uc124\uacc4\ud300\uc5d0\uc11c \uadfc\ubb34\ud588\uc73c\uba70, 2023\ub144\ubd80\ud130 2024\ub144\uae4c\uc9c0 \ubbf8\uad6d \ubbf8\uc8fc\ub9ac \uacfc\ud559\uae30\uc220\ub300\ud559\uad50(Missouri University of Science and Technology)\uc5d0 \uc7ac\uc9c1\ud588\ub2e4. 2024\ub144\ubd80\ud130 2025\ub144\uae4c\uc9c0 \ub2e8\uad6d\ub300\ud559\uad50\uc5d0\uc11c \uadfc\ubb34\ud588\uc73c\uba70, 2025\ub144 9\uc6d4\ubd80\ub85c \uacbd\ud76c\ub300\ud559\uad50\uc5d0\uc11c \uc870\uad50\uc218\ub85c \uc7ac\uc9c1 \uc911\uc774\ub2e4. \uadf8\uc758 \uc8fc\uc694 \uc5f0\uad6c \ubd84\uc57c\ub294 \uace0\uc18d \uc2dc\uc2a4\ud15c\uc758 \ud1b5\uacc4\uc801 \uc2e0\ud638\u00b7\uc804\ub825 \ubb34\uacb0\uc131, \ucc28\uc138\ub300 \ud328\ud0a4\uc9d5, \uc54c\uace0\ub9ac\uc998 \ubaa8\ub378\ub9c1 \uc778\ud130\ud398\uc774\uc2a4\ub97c \uc774\uc6a9\ud55c \uc785\ucd9c\ub825 \ubc84\ud37c \uc815\ubcf4 \uc0ac\uc591(IBIS) \ub4f1\uc744 \ud3ec\ud568\ud55c\ub2e4.<\/p>\r\n<\/p><\/details>\n<\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n“High Voltage DUT Power Supply IC for Automotive Grade Testing” \n<br>“\uc790\ub3d9\ucc28\uc6a9 \uace0\uc804\uc555 DUT \uc804\uc6d0 \uacf5\uae09 IC testing” \n<\/div>\n<div class=\"authorList\">\n <div class=\"author\">\n <div class=\"authorName\">\nThomas Angelo C. Abiog\n <\/div>\n\t <div class=\"authorCompany\">\nElevATE Semiconductor\n\t <\/div>\n <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p><strong>Abstract<\/strong><\/p>\r\n\r\n<p>The automotive industry's rapid evolution toward electrification and advanced driver assistance systems (ADAS) has dramatically increased demands for semiconductor components capable of withstanding extreme operating conditions while maintaining uncompromising reliability. This poster introduces Whitney, Elevate Semiconductor's innovative two-channel high voltage parametric measurement unit (PMU) System-on-a-Chip, designed specifically to address the rigorous testing requirements of high reliability automotive integrated circuits operating at voltages approaching up to 100V.<\/p>\r\n\r\n<p>Modern electric vehicles incorporate power management systems operating at increasingly higher voltages, with 48V systems becoming standard and full EV powertrains utilizing voltages of 400-800V. This evolution necessitates test equipment capable of characterizing device performance across expanded voltage ranges while maintaining precise measurement accuracy. Whitney delivers this capability through its unique stackable architecture, achieving test voltages suitable for next-generation automotive applications while preserving 0.05% measurement accuracy.<\/p>\r\n\r\n<p>Elevate Semiconductor's solution implements a floating DUT configuration where two Whitney ICs can be stacked, with each channel operating in Master Mode to regulate either positive or negative voltages relative to adjacent channels. This configuration enables comprehensive four-quadrant testing critical for automotive qualification procedures. The comprehensive integration of six 16-bit DACs per channel enables Whitney to simultaneously force voltage on one channel, force current while doing measure voltage or measure current, and perform window compare measurements\u2014all essential functions for characterizing automotive-grade semiconductors. With SPI interface speeds up to 50MHz, the Whitney significantly reduces test time without compromising measurement integrity, addressing a critical challenge in high-volume automotive semiconductor production.<\/p>\r\n\r\n<p>This poster will demonstrate how Elevate Semiconductor's Whitney platform enables automotive IC manufacturers to perform rigorous qualification testing of high voltage components while maintaining the throughput necessary for competitive manufacturing environments. We will present measurement data demonstrating how stacked Whitney configurations maintain measurement fidelity across extended voltage ranges, with particular emphasis for Automotive Semiconductor IC grade testing.<\/p>\r\n\r\n<p>The culmination of these capabilities positions Whitney as an essential tool for qualifying the next generation of high reliability automotive semiconductors, ensuring they meet the exacting standards necessary for safe operation throughout their service lifetime in demanding automotive environments. As vehicle architecture continues evolving toward higher voltage platforms, Elevate Semiconductor's solution provides manufacturers with the testing infrastructure necessary to validate component reliability while accelerating time-to-market for critical automotive systems.<\/p>\r\n<\/p><p><\/p><\/details>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">\ucd08\ub85d (Korean)<\/summary>\n<p><div class=\"abstract\">\r\n <p>\r\n \uc790\ub3d9\ucc28 \uc0b0\uc5c5\uc758 \uc804\uae30\ud654 \ubc0f \ucca8\ub2e8 \uc6b4\uc804\uc790 \ubcf4\uc870 \uc2dc\uc2a4\ud15c(ADAS)\uc73c\ub85c\uc758 \uae09\uc18d\ud55c \uc9c4\ud654\ub294 \uadf9\ud55c\uc758 \uc791\ub3d9 \uc870\uac74\uc744 \uacac\ub514\uba74\uc11c\ub3c4 \ud0c0\ud611 \uc5c6\ub294 \uc2e0\ub8b0\uc131\uc744 \uc720\uc9c0\ud560 \uc218 \uc788\ub294 \ubc18\ub3c4\uccb4 \ubd80\ud488\uc5d0 \ub300\ud55c \uc218\uc694\ub97c \uae09\uaca9\ud788 \uc99d\uac00\uc2dc\ucf30\uc2b5\ub2c8\ub2e4. \uc774 \ud3ec\uc2a4\ud130\ub294 \ucd5c\ub300 100V\uc5d0 \ub2ec\ud558\ub294 \uc804\uc555\uc5d0\uc11c \uc791\ub3d9\ud558\ub294 \uace0\uc2e0\ub8b0\uc131 \uc790\ub3d9\ucc28\uc6a9 \uc9d1\uc801 \ud68c\ub85c\uc758 \uae4c\ub2e4\ub85c\uc6b4 \ud14c\uc2a4\ud2b8 \uc694\uad6c \uc0ac\ud56d\uc744 \ud574\uacb0\ud558\uae30 \uc704\ud574 \ud2b9\ubcc4\ud788 \uc124\uacc4\ub41c, Elevate Semiconductor\uc758 \ud601\uc2e0\uc801\uc778 2\ucc44\ub110 \uace0\uc804\uc555 \ud30c\ub77c\uba54\ud2b8\ub9ad \uce21\uc815 \uc7a5\uce58(PMU) \uc2dc\uc2a4\ud15c \uc628 \uce69\uc778 Whitney\ub97c \uc18c\uac1c\ud569\ub2c8\ub2e4.\r\n <\/p>\r\n <p>\r\n \ud604\ub300 \uc804\uae30\ucc28\ub294 \uc810\uc810 \ub354 \ub192\uc740 \uc804\uc555\uc5d0\uc11c \uc791\ub3d9\ud558\ub294 \uc804\ub825 \uad00\ub9ac \uc2dc\uc2a4\ud15c\uc744 \ud0d1\uc7ac\ud558\uace0 \uc788\uc73c\uba70, 48V \uc2dc\uc2a4\ud15c\uc774 \ud45c\uc900\uc774 \ub418\uace0 \uc644\uc804 \uc804\uae30\ucc28 \ud30c\uc6cc\ud2b8\ub808\uc778\uc740 400~800V\uc758 \uc804\uc555\uc744 \ud65c\uc6a9\ud569\ub2c8\ub2e4. \uc774\ub7ec\ud55c \uc9c4\ud654\ub294 \ud655\uc7a5\ub41c \uc804\uc555 \ubc94\uc704\uc5d0\uc11c \uc7a5\uce58 \uc131\ub2a5\uc744 \ud2b9\uc131\ud654 \ud558\uba74\uc11c\ub3c4 \uc815\ubc00\ud55c \uce21\uc815 \uc815\ud655\ub3c4\ub97c \uc720\uc9c0\ud560 \uc218 \uc788\ub294 \ud14c\uc2a4\ud2b8 \uc7a5\ube44\ub97c \ud544\uc694\ub85c \ud569\ub2c8\ub2e4. \ud718\ud2b8\ub2c8\ub294 \ub3c5\ud2b9\ud55c \uc2a4\ud0dd\ud615 \uc544\ud0a4\ud14d\ucc98\ub97c \ud1b5\ud574 \uc774 \uae30\ub2a5\uc744 \uc81c\uacf5\ud558\uba70, \ucc28\uc138\ub300 \uc790\ub3d9\ucc28 \uc560\ud50c\ub9ac\ucf00\uc774\uc158\uc5d0 \uc801\ud569\ud55c \ud14c\uc2a4\ud2b8 \uc804\uc555\uc744 \ub2ec\uc131\ud558\uba74\uc11c\ub3c4 0.05%\uc758 \uce21\uc815 \uc815\ud655\ub3c4\ub97c \uc720\uc9c0\ud569\ub2c8\ub2e4.\r\n <\/p>\r\n <p>\r\n Elevate Semiconductor\uc758 \uc194\ub8e8\uc158\uc740 \ub450 \uac1c\uc758 Whitney IC\ub97c \uc2a4\ud0dd \ud560 \uc218 \uc788\ub294 \ud50c\ub85c\ud305 DUT \uad6c\uc131\uc744 \uad6c\ud604\ud558\uba70, \uac01 \ucc44\ub110\uc740 \ub9c8\uc2a4\ud130 \ubaa8\ub4dc\uc5d0\uc11c \uc791\ub3d9\ud558\uc5ec \uc778\uc811 \ucc44\ub110\uc5d0 \ub300\ud574 \uc591\uadf9 \ub610\ub294 \uc74c\uadf9 \uc804\uc555\uc744 \uc870\uc808\ud569\ub2c8\ub2e4. \uc774 \uad6c\uc131\uc740 \uc790\ub3d9\ucc28 \uc778\uc99d \uc808\ucc28\uc5d0 \ud544\uc218\uc801\uc778 \ud3ec\uad04\uc801\uc778 4\uc0ac\ubd84\uba74 \ud14c\uc2a4\ud2b8\ub97c \uac00\ub2a5\ud558\uac8c \ud569\ub2c8\ub2e4. \ucc44\ub110\ub2f9 6\uac1c\uc758 16\ube44\ud2b8 DAC\ub97c \ud3ec\uad04\uc801\uc73c\ub85c \ud1b5\ud569\ud568\uc73c\ub85c\uc368 \ud718\ud2b8\ub2c8\ub294 \ud55c \ucc44\ub110\uc5d0 \uc804\uc555\uc744 \uac15\uc81c \uc801\uc6a9\ud558\ub294 \ub3d9\uc2dc\uc5d0 \uc804\ub958\ub97c \uac15\uc81c \uc801\uc6a9\ud558\uba74\uc11c \uc804\uc555\uc744 \uce21\uc815\ud558\uac70\ub098 \uc804\ub958\ub97c \uce21\uc815\ud558\ub294 \uae30\ub2a5, \uadf8\ub9ac\uace0 \uc708\ub3c4\uc6b0 \ube44\uad50 \uce21\uc815\uc744 \uc218\ud589\ud560 \uc218 \uc788\uc2b5\ub2c8\ub2e4. \uc774\ub294 \ubaa8\ub450 \uc790\ub3d9\ucc28 \ub4f1\uae09 \ubc18\ub3c4\uccb4 \ud2b9\uc131 \ubd84\uc11d\uc5d0 \ud544\uc218\uc801\uc778 \uae30\ub2a5\ub4e4\uc785\ub2c8\ub2e4. \ucd5c\ub300 50MHz\uc758 SPI \uc778\ud130\ud398\uc774\uc2a4 \uc18d\ub3c4\ub97c \uc9c0\uc6d0\ud558\ub294 \ud718\ud2b8\ub2c8\ub294 \uce21\uc815 \ubb34\uacb0\uc131\uc744 \uc800\ud574\ud558\uc9c0 \uc54a\uc73c\uba74\uc11c \ud14c\uc2a4\ud2b8 \uc2dc\uac04\uc744 \ud06c\uac8c \ub2e8\ucd95\ud558\uc5ec \ub300\ub7c9 \uc0dd\uc0b0 \ud658\uacbd\uc5d0\uc11c \uc790\ub3d9\ucc28 \ubc18\ub3c4\uccb4 \uc81c\uc870\uc758 \ud575\uc2ec \uacfc\uc81c\ub97c \ud574\uacb0\ud569\ub2c8\ub2e4.\r\n <\/p>\r\n <p>\r\n \ubcf8 \ud3ec\uc2a4\ud130\ub294 \uc5d8\ub9ac\ubca0\uc774\ud2b8 \uc138\ubbf8\ucee8\ub355\ud130\uc758 \ud718\ud2b8\ub2c8 \ud50c\ub7ab\ud3fc\uc774 \uc790\ub3d9\ucc28 IC \uc81c\uc870\uc0ac\uac00 \uacbd\uc7c1\uc801\uc778 \uc81c\uc870 \ud658\uacbd\uc5d0 \ud544\uc694\ud55c \ucc98\ub9ac\ub7c9\uc744 \uc720\uc9c0\ud558\uba74\uc11c \uace0\uc804\uc555 \ubd80\ud488\uc5d0 \ub300\ud55c \uc5c4\uaca9\ud55c \uc778\uc99d \ud14c\uc2a4\ud2b8\ub97c \uc218\ud589\ud560 \uc218 \uc788\ub3c4\ub85d \uc9c0\uc6d0\ud558\ub294 \ubc29\uc2dd\uc744 \ubcf4\uc5ec\uc90d\ub2c8\ub2e4. \ud2b9\ud788 \uc790\ub3d9\ucc28 \ubc18\ub3c4\uccb4 IC \ub4f1\uae09 \ud14c\uc2a4\ud2b8\uc5d0 \uc911\uc810\uc744 \ub450\uace0, \uc2a4\ud0dd\ud615 \ud718\ud2b8\ub2c8 \uad6c\uc131\uc774 \ud655\uc7a5\ub41c \uc804\uc555 \ubc94\uc704 \uc804\ubc18\uc5d0 \uac78\uccd0 \uce21\uc815 \uc815\ud655\ub3c4\ub97c \uc720\uc9c0\ud558\ub294 \ubc29\uc2dd\uc744 \uc785\uc99d\ud558\ub294 \uce21\uc815 \ub370\uc774\ud130\ub97c \uc81c\uc2dc\ud560 \uc608\uc815\uc785\ub2c8\ub2e4.\r\n <\/p>\r\n <p>\r\n \uc774\ub7ec\ud55c \uc5ed\ub7c9\uc758 \uc9d1\uc57d\uccb4\ub85c\uc11c \ud718\ud2b8\ub2c8\ub294 \ucc28\uc138\ub300 \uace0\uc2e0\ub8b0\uc131 \uc790\ub3d9\ucc28 \ubc18\ub3c4\uccb4\uc758 \uc778\uc99d\uc744 \uc704\ud55c \ud544\uc218 \ub3c4\uad6c\ub85c \uc790\ub9ac\ub9e4\uae40\ud558\uba70, \uae4c\ub2e4\ub85c\uc6b4 \uc790\ub3d9\ucc28 \ud658\uacbd\uc5d0\uc11c \uc11c\ube44\uc2a4 \uc218\uba85 \uc804\ubc18\uc5d0 \uac78\uccd0 \uc548\uc804\ud55c \uc791\ub3d9\uc744 \uc704\ud574 \ud544\uc694\ud55c \uc5c4\uaca9\ud55c \uae30\uc900\uc744 \ucda9\uc871\ud558\ub3c4\ub85d \ubcf4\uc7a5\ud569\ub2c8\ub2e4. \ucc28\ub7c9 \uc544\ud0a4\ud14d\ucc98\uac00 \uace0\uc804\uc555 \ud50c\ub7ab\ud3fc\uc73c\ub85c \uacc4\uc18d \uc9c4\ud654\ud568\uc5d0 \ub530\ub77c, \uc5d8\ub9ac\ubca0\uc774\ud2b8 \uc138\ubbf8\ucee8\ub355\ud130\uc758 \uc194\ub8e8\uc158\uc740 \uc81c\uc870\uc5c5\uccb4\uc5d0\uac8c \ubd80\ud488 \uc2e0\ub8b0\uc131\uc744 \uac80\uc99d\ud558\ub294 \ub3d9\uc2dc\uc5d0 \ud575\uc2ec \uc790\ub3d9\ucc28 \uc2dc\uc2a4\ud15c\uc758 \uc2dc\uc7a5 \ucd9c\uc2dc \uae30\uac04\uc744 \ub2e8\ucd95\ud558\ub294 \ub370 \ud544\uc694\ud55c \ud14c\uc2a4\ud2b8 \uc778\ud504\ub77c\ub97c \uc81c\uacf5\ud569\ub2c8\ub2e4.\r\n <\/p>\r\n<\/div>\r\n<\/p><p><\/p><\/details>\n<\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n“A Scalable MEMS Spring Pin Platform for 0.2 mm Pitch and Beyond” \n<br>“0.2 mm \ud53c\uce58 \ubc0f \uadf8 \uc774\uc0c1\uc758 \ud658\uacbd\uc744 \uc704\ud55c \ud655\uc7a5 \uac00\ub2a5\ud55c MEMS \uc2a4\ud504\ub9c1 \ud540 \ud50c\ub7ab\ud3fc” \n<\/div>\n<div class=\"authorList\">\n <div class=\"author\">\n <div class=\"authorName\">\nSungEun \"Rachel\" Ahn\n <\/div>\n\t <div class=\"authorCompany\">\nPoint Engineering\n\t <\/div>\n <\/div>\n <div class=\"author\">\n <div class=\"authorName\">\nChanghee \"CH\" Hong\n <\/div>\n\t <div class=\"authorCompany\">\nPoint Engineering\n\t <\/div>\n <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>With the continued scaling of semiconductor packaging, ensuring reliable electrical contact in fine-pitch test environments has become a critical challenge. Conventional solutions such as pogo pins and wire-based probes reveal fundamental limitations when approaching the 0.2 mm pitch node, including constraints in spring miniaturization, reduced contact stability, and restrictions in manufacturing and assembly processes.\r\nIn this work, we present a novel MEMS-based spring pin technology developed to overcome these barriers for 0.2 pitch package testing. By employing a differentiated high-aspect-ratio MEMS fabrication process, ultra-fine spring structures under 1 mm in length have been realized. The developed pins demonstrate current handling capability above 1 A, stable contact resistance below 0.2 \u03a9, low actuation force, and robust performance suitable for high-frequency and high-reliability evaluations. This poster will introduce the structural features and initial electrical\/mechanical test results, and discuss the potential contributions of this technology to next-generation fine-pitch test applications.<\/p><p><\/p><\/details>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">\ucd08\ub85d (Korean)<\/summary>\n<p>\ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9d5\uc758 \ubbf8\uc138\ud654\uac00 \uc9c0\uc18d\ub428\uc5d0 \ub530\ub77c, \ud30c\uc778 \ud53c\uce58 \ud14c\uc2a4\ud2b8 \ud658\uacbd\uc5d0\uc11c \uc2e0\ub8b0\uc131 \ub192\uc740 \uc804\uae30\uc801 \uc811\uc18d\uc744 \uad6c\ud604\ud558\ub294 \uac83\uc740 \uc911\uc694\ud55c \uacfc\uc81c\ub85c \ubd80\uc0c1\ud558\uace0 \uc788\ub2e4. \uae30\uc874\uc758 \ud3ec\uace0 \ud540(pogo pin) \ubc0f \uc640\uc774\uc5b4 \uae30\ubc18 \ud504\ub85c\ube0c\ub294 0.2 mm \ud53c\uce58 \ub178\ub4dc\uc5d0 \uc811\uadfc\ud560\uc218\ub85d \uc2a4\ud504\ub9c1 \uad6c\uc870\uc758 \ucd5c\uc18c\ud654 \ud55c\uacc4, \uc811\ucd09 \uc548\uc815\uc131 \uc800\ud558, \uc81c\uc870 \ubc0f \uc870\ub9bd \uacf5\uc815\uc0c1\uc758 \uc81c\uc57d \ub4f1 \uadfc\ubcf8\uc801\uc778 \ud55c\uacc4\ub97c \ub4dc\ub7ec\ub0b8\ub2e4.\r\n\ubcf8 \ubc1c\ud45c\uc5d0\uc11c\ub294 \uc774\ub7ec\ud55c \uc7a5\ubcbd\uc744 \uadf9\ubcf5\ud558\uae30 \uc704\ud574 0.2\ud53c\uce58 \ud328\ud0a4\uc9c0 \ud14c\uc2a4\ud2b8\uc6a9\uc73c\ub85c \uac1c\ubc1c\ub41c \uc0c8\ub85c\uc6b4 MEMS \uae30\ubc18 \uc2a4\ud504\ub9c1 \ud540 \uae30\uc220\uc744 \uc81c\uc548\ud55c\ub2e4. \ucc28\ubcc4\ud654\ub41c High aspect ratui MEMS \uacf5\uc815\uc744 \uc801\uc6a9\ud558\uc5ec, \uae38\uc774 1 mm \uc774\ud558\uc758 \ucd08\ubbf8\uc138 \uc2a4\ud504\ub9c1 \uad6c\uc870\ub97c \uad6c\ud604\ud558\uc600\ub2e4. \uac1c\ubc1c\ub41c \ud540\uc740 1 A \uc774\uc0c1\uc758 \uc804\ub958 \uad6c\ub3d9 \ub2a5\ub825, 0.2 \u03a9 \uc774\ud558\uc758 \uc548\uc815\uc801\uc778 \uc811\ucd09 \uc800\ud56d, \ub0ae\uc740 \uc791\ub3d9 \ud558\uc911, \uadf8\ub9ac\uace0 \uace0\uc8fc\ud30c\u00b7\uace0\uc2e0\ub8b0\uc131 \ud3c9\uac00\uc5d0 \uc801\ud569\ud55c \uc6b0\uc218\ud55c \uc131\ub2a5\uc744 \ubcf4\uc5ec\uc8fc\uc5c8\ub2e4. \ubcf8 \ud3ec\uc2a4\ud130\uc5d0\uc11c\ub294 \uad6c\uc870\uc801 \ud2b9\uc9d5\uacfc \ucd08\uae30 \uc804\uae30\u00b7\uae30\uacc4\uc801 \ud3c9\uac00 \uacb0\uacfc\ub97c \uc18c\uac1c\ud558\uace0, \ucc28\uc138\ub300 \ud30c\uc778 \ud53c\uce58 \ud14c\uc2a4\ud2b8 \uc751\uc6a9\uc5d0\uc11c \ubcf8 \uae30\uc220\uc774 \uac00\uc9c8 \uc7a0\uc7ac\uc801 \uae30\uc5ec\ub97c \ub17c\uc758\ud558\uace0\uc790 \ud55c\ub2e4.<\/p><p><\/p><\/details>\n<\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n“Spring Probe Pin for Low Resistance, High Current Carrying and High Voltage” \n<\/div>\n<div class=\"authorList\">\n <div class=\"author\">\n <div class=\"authorName\">\nHyung Jun \"AJ\" Park\n <\/div>\n\t <div class=\"authorCompany\">\nIWIN\n\t <\/div>\n <\/div>\n<\/div>\n<\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n“Burn in Test at Finer Pitch Less than 0.25mm at Lower Cost” \n<\/div>\n<div class=\"authorList\">\n <div class=\"author\">\n <div class=\"authorName\">\nHyung Jun \"AJ\" Park\n <\/div>\n\t <div class=\"authorCompany\">\nIWIN\n\t <\/div>\n <\/div>\n<\/div>\n<\/div>\n<\/div>\n\t \n<hr class=\"x-line e7888-e86 m634-1g m634-1h\"\/><\/div><\/div><\/div><div class=\"x-row x-container max width e7888-e87 m634-1 m634-2 m634-5 m634-7 m634-o\"><div class=\"x-row-inner\"><div class=\"x-col e7888-e88 m634-u\"><div class=\"x-text x-text-headline e7888-e89 m634-10 m634-11 m634-15 m634-17\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">16:00<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-col e7888-e90 m634-u\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"5\">Session 5<\/div><\/div><div class=\"sessionTitle\"><\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n“Coaxial Elastomer Socket for High-bandwidth and High-density Package Test” \n<\/div>\n<div class=\"authorList\">\n <div class=\"author\">\n <div class=\"authorName\">\nJunyong Park\n <\/div>\n\t <div class=\"authorCompany\">\nKyung Hee University\n\t <\/div>\n <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract - Biography (English)<\/summary>\n<p><p><strong>Abstract<\/strong><\/p>\r\n\r\n<p>This presentation introduces a new elastomer socket with ground-signal-ground (GSG) configuration. An elastomer socket consists of metal powders. Hence, the elastomer sockets provide higher bandwidth compared to pogo sockets. The conventional structure in the elastomer socket is a matrix array. In that case, the distance between columns affects the signal quality at the receiver side. Therefore, the above limitations cause a new type of elastomer socket in terms of signal integrity. The GS configuration is limited to provide a wider bandwidth due to the induced electric and magnetic fields. The introduced coaxial elastomer socket has a signal column inside and a ground cylinder outside to establish the coaxial structure. As a verification, the introduced coaxial elastomer socket shows better electrical performance in simulation and measurement.<\/p>\r\n<\/p><p><p><strong>Biography<\/strong><\/p>\r\n\r\n<p><strong>Junyong Park<\/strong><br>\r\nAssistant Professor, Kyung Hee University<\/p>\r\n\r\n<p>Junyong Park received the B.S. degree from Sungkyunkwan University in 2014, and the Ph.D. degree from the Korea Advanced Institute of Science and Technology (KAIST) in 2019. He was with the DRAM design team at SK Hynix from 2019 to 2023, and joined the Missouri University of Science and Technology from 2023 to 2024. He was with Dankook University by 2025, and he is currently with Kyung Hee University as an assistant professor. His current research interests include statistical signal\/power integrity for high-speed systems, next-generation packaging, and input\/output buffer information specification with an algorithmic modeling interface.<\/p>\r\n<\/p><\/details>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n<p><p><strong>\uc694\uc57d<\/strong><\/p>\r\n\r\n<p>\ubcf8 \uc5f0\uad6c\ub294 \uace0\ub300\uc5ed\ud3ed\u00b7\uace0\uc9d1\uc801 \ud328\ud0a4\uc9c0 \ud14c\uc2a4\ud2b8\ub97c \uc704\ud55c \ub3d9\ucd95 \uc5d8\ub77c\uc2a4\ud1a0\uba38 \uc18c\ucf13\uc744 \uc81c\uc548\ud558\ub294 \uc5f0\uad6c\uc785\ub2c8\ub2e4. \ub370\uc774\ud130 \uc804\uc1a1 \uc18d\ub3c4\uac00 \ube68\ub77c\uc9d0\uc5d0 \ub530\ub77c\uc11c \uae30\uc874\uc5d0 \uc0ac\uc6a9\ud558\ub358 \ud3ec\uace0\ud0c0\uc785 \uc18c\ucf13\uc740 \uae30\uc0dd \uc778\ub355\ud134\uc2a4 \uac12\uc774 \ucee4\uc11c \uc2e0\ud638 \uc804\ub2ec\uc5d0 \ud55c\uacc4\ub97c \ubcf4\uc600\uc2b5\ub2c8\ub2e4. \uc774\ub7ec\ud55c \uc2e0\ud638 \uc804\uc1a1 \ud55c\uacc4\ub97c \uadf9\ubcf5\ud558\uace0\uc790 \uae08\uc18d \ud30c\uc6b0\ub354\ub85c \uc774\ub8e8\uc5b4\uc9c4 \uc5d8\ub77c\uc2a4\ud1a0\uba38 \ud0c0\uc785\uc758 \ud328\ud0a4\uc9c0 \uc18c\ucf13\uc774 \uc81c\uc548\ub418\uc5c8\uc2b5\ub2c8\ub2e4. \uc804\uc1a1\uc120 \uc774\ub860\uc5d0 \ub530\ub974\uba74 \ub3d9\ucd95 \uad6c\uc870\ub97c \uc774\uc6a9\ud558\uc5ec \uc2e0\ud638 \uc804\ub2ec \ud2b9\uc131\uc744 \uac1c\uc120\ud560 \uc218 \uc788\ub2e4\ub294 \uac83\uc774 \ub110\ub9ac \uc54c\ub824\uc838 \uc788\uae30 \ub54c\ubb38\uc5d0 \ubcf8 \uc5f0\uad6c\uc5d0\uc11c\ub294 \uc5d8\ub77c\uc2a4\ud1a0\uba38 \ud0c0\uc785 \ud14c\uc2a4\ud2b8 \uc18c\ucf13\uc5d0 \ub3d9\ucd95 \uad6c\uc870\ub97c \uc801\uc6a9\ud558\uc5ec \uae30\uc874 \uc5d8\ub77c\uc2a4\ud1a0\uba38 \uc18c\ucf13\uc758 \uc2e0\ud638 \uc804\ub2ec \ud2b9\uc131\uc744 \uac1c\uc120 \uc2dc\ud0a4\ub294 \uac83\uc744 \uc81c\uc548\ud558\uace0 \uc99d\uba85\ud569\ub2c8\ub2e4.<\/p>\r\n<\/p><p><p><strong>\uac1c\uc778\uc18c\uac1c<\/strong><\/p>\r\n\r\n<p><strong>\ubc15\uc6b4\uc6a9<\/strong><br>\r\n\uc870\uad50\uc218, \uacbd\ud76c\ub300\ud559\uad50<\/p>\r\n\r\n<p>\ubcf8 \uc5f0\uad6c\uc790\ub294 2014\ub144 \uc131\uade0\uad00\ub300\ud559\uad50\uc5d0\uc11c \ud559\uc0ac \ud559\uc704\ub97c, 2019\ub144 \ud55c\uad6d\uacfc\ud559\uae30\uc220\uc6d0(KAIST)\uc5d0\uc11c \ubc15\uc0ac \ud559\uc704\ub97c \ubc1b\uc558\ub2e4. 2019\ub144\ubd80\ud130 2023\ub144\uae4c\uc9c0 SK\ud558\uc774\ub2c9\uc2a4 DRAM \uc124\uacc4\ud300\uc5d0\uc11c \uadfc\ubb34\ud588\uc73c\uba70, 2023\ub144\ubd80\ud130 2024\ub144\uae4c\uc9c0 \ubbf8\uad6d \ubbf8\uc8fc\ub9ac \uacfc\ud559\uae30\uc220\ub300\ud559\uad50(Missouri University of Science and Technology)\uc5d0 \uc7ac\uc9c1\ud588\ub2e4. 2024\ub144\ubd80\ud130 2025\ub144\uae4c\uc9c0 \ub2e8\uad6d\ub300\ud559\uad50\uc5d0\uc11c \uadfc\ubb34\ud588\uc73c\uba70, 2025\ub144 9\uc6d4\ubd80\ub85c \uacbd\ud76c\ub300\ud559\uad50\uc5d0\uc11c \uc870\uad50\uc218\ub85c \uc7ac\uc9c1 \uc911\uc774\ub2e4. \uadf8\uc758 \uc8fc\uc694 \uc5f0\uad6c \ubd84\uc57c\ub294 \uace0\uc18d \uc2dc\uc2a4\ud15c\uc758 \ud1b5\uacc4\uc801 \uc2e0\ud638\u00b7\uc804\ub825 \ubb34\uacb0\uc131, \ucc28\uc138\ub300 \ud328\ud0a4\uc9d5, \uc54c\uace0\ub9ac\uc998 \ubaa8\ub378\ub9c1 \uc778\ud130\ud398\uc774\uc2a4\ub97c \uc774\uc6a9\ud55c \uc785\ucd9c\ub825 \ubc84\ud37c \uc815\ubcf4 \uc0ac\uc591(IBIS) \ub4f1\uc744 \ud3ec\ud568\ud55c\ub2e4.<\/p>\r\n<\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025korea\/TestConXKorea2025s5p1Park_4527.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a> <a href=\"\/premium\/wp-content\/uploads\/2025korea\/TestConXKorea2025s5p1Park_4527.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n“High-Performance Liquid Cooling Solutions (for Next-Generation Semiconductor Test)” \n<br>“\ucc28\uc138\ub300 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8\ub97c \uc704\ud55c \uace0\uc131\ub2a5 \uc561\uccb4 \ub0c9\uac01 \uc194\ub8e8\uc158” \n<\/div>\n<div class=\"authorList\">\n <div class=\"author\">\n <div class=\"authorName\">\nHo Boum \"HB\" Rhim\n <\/div>\n\t <div class=\"authorCompany\">\nInspiraz Technology Pte Ltd\n\t <\/div>\n <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract - Biography (English)<\/summary>\n<p><div class=\"abstract\">\r\n <p>\r\n High performance semiconductors generate significant thermal loads during testing, \r\n making it impossible to maintain proper thermal control with traditional air cooling methods. \r\n <\/p>\r\n \r\n <p>\r\n Furthermore, immersion cooling approaches are impractical for test equipment; \r\n they are difficult to integrate and require complex maintenance, resulting in reduced test efficiency. \r\n <\/p>\r\n \r\n <p>\r\n <strong>VC-COOL<\/strong> addresses these challenges with a hybrid solution that combines \r\n a vapor chamber with an ultra-compact liquid cooling head. \r\n <\/p>\r\n \r\n <p>\r\n This design enables stable and uniform thermal management directly in the test environment, \r\n thereby enhancing both the reliability and efficiency of high-power semiconductor validation.\r\n <\/p>\r\n<\/div>\r\n<\/p><p><div class=\"bio\">\r\n <p><strong>Ho-Boum Rhim<\/strong><br>\r\n General Manager, Inspiraz Korea<\/p>\r\n\r\n <p>\r\n Ho-Boum Rhim is the General Manager of Inspiraz Korea, \r\n specializing in providing Thermal Interface Materials (TIM) \r\n and other advanced thermal management solutions, \r\n as well as semiconductor solutions.\r\n <\/p>\r\n<\/div>\r\n<\/p><\/details>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">\ucd08\ub85d (Korean)<\/summary>\n<p><div class=\"abstract\">\r\n <p>\r\n \uace0\uc131\ub2a5 \ubc18\ub3c4\uccb4\ub294 \ud14c\uc2a4\ud2b8 \uacfc\uc815\uc5d0\uc11c \uae09\uaca9\ud55c \ubc1c\uc5f4\uc744 \uc77c\uc73c\ucf1c \uae30\uc874 \uacf5\ub7ad\uc2dd \ubc29\uc2dd\uc73c\ub85c\ub294 \ud6a8\uacfc\uc801\uc778 \uc81c\uc5b4\uac00 \ubd88\uac00\ub2a5\ud569\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n <p>\r\n \uadf8\ub9ac\uace0, \uc561\uce68\ub0c9\uac01\uacfc \uac19\uc740 \ubc29\ubc95\uc740 \ud14c\uc2a4\ud2b8 \uc7a5\ube44\uc5d0 \uc9c1\uc811 \uc801\uc6a9\ud558\uae30 \uc5b4\ub835\uace0 \uc720\uc9c0\ubcf4\uc218 \ub610\ud55c \ubcf5\uc7a1\ud558\uc5ec \ud14c\uc2a4\ud2b8 \ud6a8\uc728\uc131\uc744 \ud06c\uac8c \uc800\ud558\uc2dc\ud0b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n <p>\r\n <strong>VC-COOL<\/strong>\uc740 \uc774\ub7ec\ud55c \ubb38\uc81c\ub97c \ud574\uacb0\ud558\uae30 \uc704\ud574 \ubca0\uc774\ud37c \ucc54\ubc84\uc640 \ucd08\uc18c\ud615 \uc561\uccb4 \ub0c9\uac01 \ud5e4\ub4dc\ub97c \uacb0\ud569\ud55c \ud558\uc774\ube0c\ub9ac\ub4dc \uc194\ub8e8\uc158\uc73c\ub85c \uac1c\ubc1c\ub418\uc5c8\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n <p>\r\n \uc774\ub97c \ud1b5\ud574 \ud14c\uc2a4\ud2b8 \ud658\uacbd\uc5d0\uc11c\ub3c4 \uc548\uc815\uc801\uc774\uace0 \uade0\uc77c\ud55c \uc5f4 \uc81c\uc5b4\uac00 \uac00\ub2a5\ud574\uc838 \uace0\uc131\ub2a5 \ubc18\ub3c4\uccb4 \uac80\uc99d\uc758 \uc2e0\ub8b0\uc131\uacfc \ud6a8\uc728\uc131\uc744 \ub3d9\uc2dc\uc5d0 \ud655\ubcf4\ud560 \uc218 \uc788\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n<\/div>\r\n<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025korea\/TestConXKorea2025s5p2Rhim_1123.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a> <a href=\"\/premium\/wp-content\/uploads\/2025korea\/TestConXKorea2025s5p2Rhim_1123.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n“Implementing Effective Test Limits for Rapid Root-Cause Analysis in RMA Investigations” \n<br>“RMA \uc870\uc0ac\uc5d0\uc11c \uadfc\ubcf8 \uc6d0\uc778\uc744 \uc2e0\uc18d\ud788 \uaddc\uba85\ud558\uae30 \uc704\ud55c \ud6a8\uacfc\uc801\uc778 \ud14c\uc2a4\ud2b8 \ubc94\uc704 \uc124\uc815” \n<\/div>\n<div class=\"authorList\">\n <div class=\"author\">\n <div class=\"authorName\">\nHailin Wang\n <\/div>\n\t <div class=\"authorCompany\">\nElevATE Semiconductor\n\t <\/div>\n <\/div>\n <div class=\"author\">\n <div class=\"authorName\">\nDavid Chang\n <\/div>\n\t <div class=\"authorCompany\">\nElevATE Semiconductor\n\t <\/div>\n <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract - Biography (English)<\/summary>\n<p><p><strong>Abstract<\/strong><\/p>\r\n\r\n<p>Return Material Authorization (RMA) investigations are essential for semiconductor quality assurance, enabling functional failures to be traced back to their root causes. In this study, we examine an RMA case in which a production device exhibited a complete loss of critical timing measurements after an unspecified period in service. Automated Test Equipment (ATE) and bench tests revealed that one channel failed to meet multiple timing specifications, while the other channel remained within acceptable limits which highlighted a clear functional divergence.<\/p>\r\n\r\n<p>To isolate the anomaly, register-level readback tests were added to the test program. These tests consistently showed deviations in specific comparator configuration registers on the failing channel, confirming a localized functional fault. Guided by these electrical test results, a structured failure analysis protocol was initiated. The device was decapsulated and subjected to high-magnification optical inspection, which identified a process-related defect: metal-to-metal shorting across parallel interconnect lines within the comparator block.<\/p>\r\n\r\n<p>Focused Ion Beam (FIB) cross-sectioning and Scanning Electron Microscopy (SEM) further characterized the defect, revealing a foreign particle lodged beneath the passivation layer at an interconnect level. Energy Dispersive X-ray Spectroscopy (EDS) analysis determined the particle composition to be tungsten, thereby confirming its role in creating an unintended conductive path that led to register read\/write failures.<\/p>\r\n\r\n<p>This case study underscores the importance of defining precise test limits and incorporating comprehensive functional coverage. Tests that span both channel-level performance metrics and register-level checks can help efficiently formulate and validate root-cause hypotheses. By establishing dynamic specification boundaries and augmenting ATE programs with targeted register tests, latent fabrication defects can be detected early, streamlining physical failure analysis (PFA) efforts.<\/p>\r\n\r\n<p>Implementing this integrated approach not only reduces RMA turnaround time and associated costs but also feeds back into production test development, enhancing screening effectiveness to prevent future escapes. We conclude with recommendations for optimizing test programs such as adaptive limit setting, expanded register functional coverage, and closer collaboration between test engineering and failure analysis teams to bolster overall product reliability and accelerate root-cause resolution in high-volume semiconductor manufacturing and production.<\/p>\r\n<\/p><p><div class=\"bio\">\r\n <p>\r\n Hailin is an Applications Engineer at ElevATE Semiconductor with a strong engineering background and a passion for innovation. \r\n He holds a degree from the University of Toronto, where he also engaged in academic research collaborations, and has professional \r\n experience spanning software development and mixed-signal engineering. \r\n <\/p>\r\n\r\n <p>\r\n Dedicated to tackling complex technical challenges and fostering opportunities for students, Hailin is committed to advancing the \r\n field of semiconductor test while inspiring the next generation of professionals. \r\n He is currently pursuing a master\u2019s degree at UC Berkeley, focusing on applying statistical models and data science principles \r\n to enhance test engineering.\r\n <\/p>\r\n<\/div>\r\n<\/p><\/details>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n<p><div class=\"abstract\">\r\n <p>\r\n RMA(Return Material Authorization) \uc870\uc0ac\ub294 \ubc18\ub3c4\uccb4 \ud488\uc9c8 \ubcf4\uc99d\uc5d0 \uc788\uc5b4 \ud575\uc2ec\uc801\uc774\uba70, \uc7a0\uc7ac\uc801\uc778 \uae30\ub2a5\uc801 \ubd88\ub7c9\uc744 \uadfc\ubcf8 \uc6d0\uc778\uae4c\uc9c0 \ucd94\uc801\ud560\uc218 \uc788\ub3c4\ub85d \ud569\ub2c8\ub2e4. \ubcf8 \uc5f0\uad6c\uc5d0\uc11c\ub294 \uc5b4\ub290\uc815\ub3c4 \uc0ac\uc6a9\ub41c \ub514\ubc14\uc774\uc2a4 \ub0b4\uc758 Precision measurement block \uc815\ud655\ub3c4(Accuracy)\uac00 \uc800\ud558\ub418\ub294 \ud604\uc0c1\uc744 \ubcf4\uc778 RMA \uc0ac\ub840\ub97c \uac80\ud1a0\ud558\uc600\uc2b5\ub2c8\ub2e4. \uc790\ub3d9\ud654 \ud14c\uc2a4\ud2b8 \uc7a5\ube44(ATE) \ubc0f \ubca4\uce58 \ud14c\uc2a4\ud2b8 \ubd84\uc11d\uc744 \ud1b5\ud574 \uba85\ud655\ud55c \ucc44\ub110 \ub2e8\uc704 \ud3b8\ucc28\uac00 \uad00\ucc30\ub418\uc5c8\uc73c\uba70, \uc77c\ubd80 \ucc44\ub110\uc740 \uc694\uad6c\ub418\ub294 \uc815\ud655\ub3c4 \uc2a4\ud399\uc744 \uc720\uc9c0\ud558\uc9c0 \ubabb\ud55c \ubc18\uba74 \ub2e4\ub978 \ucc44\ub110\ub4e4\uc740 \uc2a4\ud399\uc744 \ub9cc\uc871\ud558\ub294 \uac83\uc774 \ud655\uc778\ub418\uc5c8\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n <p>\r\n Failure mechanism\uc744 \uaddc\uba85\ud558\uace0 \ud655\uc778\ud558\uae30 \uc704\ud574, Electrical stress \ud14c\uc2a4\ud2b8\uc640 \ucd08\uae30 \uc218\uba85 \ubd88\ub7c9\ub960(Early Life Failure Rate, ELFR) \uc2e4\ud5d8\uc744 \ubcd1\ud589 \uc218\ud589\ud558\uc600\uc2b5\ub2c8\ub2e4. \uc774 \uc2e4\ud5d8\uc740 \uc0c8\ub85c\uc6b4 ATE \uac80\uc0ac \ubc29\ubc95\uc744 \uc785\uc99d\ud588\uc73c\uba70, \uc774\ud6c4\uc758 RMA \uc0ac\ub840\uc5d0\uc11c\ub3c4 \uadf8 \ud6a8\uacfc\uac00 \uac80\uc99d\ub418\uc5b4 \uc7a0\uc7ac\uc801 \ub514\ubc14\uc774\uc2a4 \ucde8\uc57d\uc131\uc744 \uc2dd\ubcc4\ud558\ub294 \ub370 \uc720\uc6a9\ud568\uc774 \ud655\uc778\ub418\uc5c8\uc2b5\ub2c8\ub2e4. \uc774 \ud6c4, \ubd80\ubd84\uc801\uc778 \uc804\uae30\uc801 \ud2b9\uc774\uc0ac\ud56d\uc740 Failure analysis \uc808\ucc28\ub97c \uc774\ub04c\uc5c8\uace0, \ub514\ucea1(decapsulation) \ud6c4 \uace0\ubc30\uc728 \uad11\ud559 \uac80\uc0ac\uc640 \uc8fc\uc0ac \uc804\uc790 \ud604\ubbf8\uacbd(SEM) \ubd84\uc11d\uc744 \ud1b5\ud574 \ud574\ub2f9 \ud68c\ub85c\uc5d0\uc11c \uacf5\uc815 \uad00\ub828 \uacb0\ud568\uc774 \ud655\uc778\ub418\uc5b4 \uad00\ucc30\ub41c \uc804\uae30\uc801 \ubd88\ub7c9\uacfc \ubb3c\ub9ac\uc801 \uc0c1\uad00\uc131\uc774 \uc785\uc99d\ub418\uc5c8\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n <p>\r\n \uc774 \uc0ac\ub840\uc5d0 \ub300\ud55c \uc5f0\uad6c\ub294 \uc7a0\uc7ac\uc801 \uc81c\uc870 \uacb0\ud568\uc744 \ubc1c\uacac\ud558\uae30 \uc704\ud574 \uc815\ubc00\ud55c \uc2dc\ud5d8 \ubc94\uc704 \uc815\uc758\uc640 \uc2a4\ud2b8\ub808\uc2a4 \uae30\ubc18\uc758 \ud14c\uc2a4\ud2b8 \ubc29\ubc95\uc744 \ud1b5\ud55c ATE \ud504\ub85c\uadf8\ub7a8 \ubcf4\uc644\uc758 \uc911\uc694\uc131\uc744 \uac15\uc870\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. Dynamic specification\uc758 \uacbd\uacc4\uc640 ELFR(\ucd08\uae30 \uc218\uba85 \ubd88\ub7c9\ub960)\ub85c \uac80\uc99d\ub41c \uc804\uc6a9 \uc2a4\ud06c\ub9ac\ub2dd\uc744 \uacb0\ud569\ud568\uc73c\ub85c\uc368, \ud14c\uc2a4\ud2b8 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1 \ud300\uc740 Root cause \uaddc\uba85 \uc18d\ub3c4\ub97c \uac1c\uc120\ud558\uace0, RMA \ucc98\ub9ac \uc2dc\uac04\uc744 \ub2e8\ucd95\ud560 \uc218 \uc788\uc2b5\ub2c8\ub2e4. \uc774\ub7ec\ud55c \ud1b5\ud569\ub41c \uc811\uadfc\uc740 \uace0\uac1d\uc774 \ubc1b\uc744 \uc601\ud5a5\uacfc \uad00\ub828\ub41c \ube44\uc6a9\uc744 \ucd5c\uc18c\ud654\ud560 \ubfd0 \uc544\ub2c8\ub77c \uc591\uc0b0 \uc2a4\ud06c\ub9ac\ub2dd\uc758 \ud6a8\uc728\uc744 \ud5a5\uc0c1\uc2dc\ud0b5\ub2c8\ub2e4. \ub9c8\uc9c0\ub9c9\uc73c\ub85c, Test program\uc5d0 \uc801\uc751 \uac00\ub2a5\ud55c \uc124\uc815, \uc2a4\ud2b8\ub808\uc2a4 \uae30\ubc18 \ucee4\ubc84\ub9ac\uc9c0 \ud655\ub300, \uadf8\ub9ac\uace0 \uc81c\ud488 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1\uacfc \uace0\uc7a5 \ubd84\uc11d \ud300 \uac04\uc758 \uae34\ubc00\ud55c \ud611\uc5c5\uc744 \ud1b5\ud574 \ub300\ub7c9 \ubc18\ub3c4\uccb4 \uc81c\uc870\uc5d0\uc11c \uc7a5\uae30\uc801\uc778 \uc2e0\ub8b0\uc131\uc744 \uac15\ud654\ud558\ub294 \ud14c\uc2a4\ud2b8 \ud504\ub85c\uadf8\ub7a8 \ucd5c\uc801\ud654 \ubc29\uc548\uc744 \uc81c\uc548\ud569\ub2c8\ub2e4.\r\n <\/p>\r\n<\/div>\r\n<\/p><p><div class=\"bio\">\r\n <p>\r\n Hailin\uc740 ElevATE Semiconductor\uc758 \uc560\ud50c\ub9ac\ucf00\uc774\uc158 \uc5d4\uc9c0\ub2c8\uc5b4\ub85c, \uc18c\ud504\ud2b8\uc6e8\uc5b4 \uac1c\ubc1c\uacfc \ud63c\ud569 \uc2e0\ud638 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1 \ubd84\uc57c\uc5d0\uc11c \uacbd\ud5d8\uc744 \uc313\uc544\uc654\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n \r\n <p>\r\n \uadf8\ub294 University of Toronto\uc5d0\uc11c \ud559\uc704\ub97c \ucde8\ub4dd\ud588\uc73c\uba70, \ud604\uc7ac UC Berkeley\uc5d0\uc11c \ud1b5\uacc4 \ubaa8\ub378\uacfc \ub370\uc774\ud130 \uacfc\ud559\uc744 \ud65c\uc6a9\ud55c \ud14c\uc2a4\ud2b8 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1 \uc5f0\uad6c\ub85c \uc11d\uc0ac \uacfc\uc815\uc744 \ubc1f\uace0 \uc788\uc2b5\ub2c8\ub2e4.\r\n <\/p>\r\n<\/div>\r\n<\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025korea\/TestConXKorea2025sp3Wang_4623.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a> <a href=\"\/premium\/wp-content\/uploads\/2025korea\/TestConXKorea2025sp3Wang_4623.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><\/div><div class=\"x-row x-container max width e7888-e92 m634-1 m634-2 m634-5 m634-7 m634-p\"><div class=\"x-row-inner\"><div class=\"x-col e7888-e93 m634-u\"><div class=\"x-text x-text-headline e7888-e94 m634-10 m634-11 m634-15 m634-17\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">17:30<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-col e7888-e95 m634-u\"><div class=\"x-text x-text-headline e7888-e96 m634-10 m634-11 m634-15 m634-17 m634-19 m634-1a\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\"><strong>Lucky Draw<\/strong><\/h1>\n<span class=\"x-text-content-text-subheadline\"><p><span style=\"color: #000000;\" data-sheets-value=\"{"1":2,"2":"Door prizes for randomly selected attendees (Must be present to win \/ void where prohibited)"}\" data-sheets-userformat=\"{"2":897,"3":{"1":0},"10":0,"11":4,"12":0}\">Door prizes for randomly selected attendees<\/span><br \/>\n(Must be present to win \/ void where prohibited)<\/p><\/span><\/div><\/div><\/div><\/div><\/div><\/div><div class=\"x-row x-container max width e7888-e97 m634-1 m634-2 m634-5 m634-7 m634-q\"><div class=\"x-row-inner\"><div class=\"x-col e7888-e98 m634-u\"><div class=\"x-text x-text-headline e7888-e99 m634-10 m634-11 m634-15 m634-17\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">18:00<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-col e7888-e100 m634-u\"><div class=\"x-text x-text-headline e7888-e101 m634-10 m634-11 m634-15 m634-17\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\"><strong>TestConX EXPO Closes \/ Event Adjourns<\/strong><\/h1>\n<\/div><\/div><\/div><\/div><\/div><\/div><div class=\"x-row x-container max width e7888-e102 m634-1 m634-2 m634-3 m634-4 m634-7 m634-r\"><div class=\"x-row-inner\"><div class=\"x-col e7888-e103 m634-u\"><\/div><div class=\"x-col e7888-e104 m634-u\"><\/div><\/div><\/div><div class=\"x-row x-container max width e7888-e105 m634-1 m634-2 m634-3 m634-4 m634-7 m634-s\"><div class=\"x-row-inner\"><div class=\"x-col e7888-e106 m634-u m634-w\"><hr class=\"x-line e7888-e107 m634-1f m634-1g\"\/><hr class=\"x-line e7888-e108 m634-1f m634-1g\"\/><hr class=\"x-line e7888-e109 m634-1g m634-1i\"\/><div class=\"x-text x-text-headline e7888-e110 m634-10 m634-11 m634-14 m634-15\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">For any questions about the event or sponsorship contact us at <span id=\"e244106250\">[javascript protected email address]<\/span><script type=\"text\/javascript\">\/*<![CDATA[*\/eval(\"var a=\\\"j@uxG2QHbgFSWKUmoqZ8_4nyR6pOze9Bvc0rdYJCl5s+-V.IfkLETPAMDhtX7ai1wN3\\\";var b=a.split(\\\"\\\").sort().join(\\\"\\\");var c=\\\"M..k+VK7VX7+MAwuMtI\\\";var d=\\\"\\\";for(var e=0;e<c.length;e++)d+=b.charAt(a.indexOf(c.charAt(e)));document.getElementById(\\\"e244106250\\\").innerHTML=\\\"<a href=\\\\\\\"mailto:\\\"+d+\\\"\\\\\\\" target=\\\\\\\"_blank\\\\\\\">\\\"+d+\\\"<\/a>\\\"\")\/*]]>*\/<\/script>.<\/h1>\n<\/div><\/div><\/div><hr class=\"x-line e7888-e111 m634-1f m634-1g\"\/><div class=\"x-text x-text-headline e7888-e112 m634-10 m634-11 m634-13 m634-14 m634-15\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">Program subject to change without notice<\/h1>\n<\/div><\/div><\/div><hr class=\"x-line e7888-e113 m634-1f m634-1g\"\/><\/div><\/div><\/div><div class=\"x-row x-container max width e7888-e114 m634-1 m634-2 m634-3 m634-4 m634-7 m634-t\"><div class=\"x-row-inner\"><div class=\"x-col e7888-e115 m634-u m634-v\"><\/div><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Suwon, South Korea – November 18, 2025 SINTEX Convention Center (At LA VIE D’OR Resort) 141-36 Botong-ri, Jeongnam-myeon, Hwaseong-si, Gyeonggi-do, South Korea EXPOTestConX, over the course of its twenty-six-year history, has established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope includes packaged semiconductor “final” test, burn-in, system level test, and beyond … <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/testconx-korea-2025\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-7888","page","type-page","status-publish","hentry","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/7888","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=7888"}],"version-history":[{"count":39,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/7888\/revisions"}],"predecessor-version":[{"id":8710,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/7888\/revisions\/8710"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=7888"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}