
{"id":7387,"date":"2024-12-04T23:45:32","date_gmt":"2024-12-05T07:45:32","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=7387"},"modified":"2025-05-14T14:36:43","modified_gmt":"2025-05-14T21:36:43","slug":"testconx2025-tuesday","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx2025-tuesday\/","title":{"rendered":"TestConX 2025 &#8211; Tuesday"},"content":{"rendered":"<div id=\"cs-content\" class=\"cs-content\"><div class=\"x-section e7387-e1 m5p7-0 m5p7-1 m5p7-2\"><div class=\"x-container max width e7387-e2 m5p7-5\"><div class=\"x-column x-sm x-1-1 e7387-e3 m5p7-8\"><span class=\"x-image e7387-e4 m5p7-a m5p7-b\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2023Korea\/TestConX2025_band_1500x500.jpg\" width=\"750\" height=\"250\" alt=\"Image\" loading=\"lazy\"><\/span><\/div><\/div><\/div><div class=\"x-section e7387-e5 m5p7-0 m5p7-1 m5p7-2\"><div class=\"x-container max width e7387-e6 m5p7-5\"><div class=\"x-column x-sm x-1-1 e7387-e7 m5p7-8\"><div class=\"x-content-area e7387-e8 m5p7-d\"><h4 class=\"x-hide-sm x-hide-md x-hide-lg x-hide-xl\" style=\"color:red\">Rotate your smartphone to landscape or increase your browser width to see session descriptions.<\/h4><\/div><\/div><\/div><\/div><div class=\"x-section e7387-e9 m5p7-0 m5p7-2 m5p7-3\"><div class=\"x-container max width e7387-e10 m5p7-5\"><div class=\"x-column x-sm x-1-1 e7387-e11 m5p7-8 m5p7-9\"><a class=\"x-anchor x-anchor-button e7387-e12 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Overview<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7387-e13 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-sunday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Sunday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7387-e14 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-monday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Monday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7387-e15 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-tuesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Tuesday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7387-e16 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-wednesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Wednesday<\/span><\/div><\/div><\/a><\/div><\/div><div class=\"x-row x-container max width e7387-e17 m5p7-f m5p7-g m5p7-h\"><div class=\"x-row-inner\"><div class=\"x-col e7387-e18 m5p7-l m5p7-m\"><hr class=\"x-line e7387-e19 m5p7-n\"\/><a class=\"x-anchor x-anchor-button e7387-e20 m5p7-e\" tabindex=\"0\" href=\"https:\/\/www.testconx.org\/premium\/testconx-expo-2025\/\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">EXPO<\/span><\/div><\/div><\/a><\/div><\/div><\/div><\/div><div class=\"x-section e7387-e21 m5p7-0 m5p7-4\"><div class=\"x-container max width e7387-e22 m5p7-5 m5p7-6\"><div class=\"x-column x-sm x-1-1 e7387-e23 m5p7-8\"><div class=\"x-text x-text-headline e7387-e24 m5p7-o m5p7-p m5p7-q\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">Tuesday March 4, 2025<\/h1>\n<\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e7387-e25 m5p7-5\"><div class=\"x-column x-sm x-1-4 e7387-e26 m5p7-8\"><div class=\"x-text x-text-headline e7387-e27 m5p7-o m5p7-q m5p7-r\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">7:00 a<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e28 m5p7-8\"><div class=\"x-text x-text-headline e7387-e29 m5p7-o m5p7-r m5p7-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">Continental Breakfast<\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e7387-e30 m5p7-d\"><p>Start the day right and enjoy the continental breakfast while networking with other attendees.<\/p><\/div><\/div><\/div><div class=\"x-container max width e7387-e31 m5p7-5 m5p7-7\"><div class=\"x-column x-sm x-1-4 e7387-e32 m5p7-8\"><div class=\"x-text x-text-headline e7387-e33 m5p7-o m5p7-q m5p7-r m5p7-t\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">8:00 a<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e34 m5p7-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Distinguished\">Distinguished Speaker<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\"><\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Towards An Equitable AI Cloud: Leveraging Agility and Innovation&rdquo; \n<\/div>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025Distinguished_3294.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025Distinguished_3294.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<div class=\"x-row e7387-e36 m5p7-f m5p7-g m5p7-i\"><div class=\"x-row-inner\"><div class=\"x-col e7387-e37 m5p7-l\"><span class=\"x-image e7387-e38 m5p7-a m5p7-c\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2023Korea\/RohitVidwans150.png\" width=\"150\" height=\"200\" alt=\"Rohit Vidwans\" loading=\"lazy\"><\/span><div class=\"x-text x-content e7387-e39 m5p7-u\"><div class=\"authorName\">Rohit Vidwans<\/div>\n<div class=\"authorCompany\">Ampere Computing<\/div><\/div><\/div><div class=\"x-col e7387-e40 m5p7-l\"><div class=\"x-text x-content e7387-e41 m5p7-u m5p7-v\"><p><span style=\"font-weight: 400;\">The semiconductor industry is witnessing a very historic and aggressive pace of development never seen before. Developments in CPU, GPU and xPU for example have leapfrogged AI applications, taken level-5 autonomous driving to a deployment phase, enabled new drug discoveries with accelerated genomics and molecular docking, vastly improved weather forecasts, etc. The forgoing are some of the exemplary use cases each of that spawn many more variants which grow their own product ecosystem. However, the developments of the processor variants which enable them and the access to their cloud-based services comes at enormous costs for new entrants as well as established enterprises. This not only stifles innovation but also denies opportunities to start ups and small to medium enterprises.<\/span><\/p><\/div><\/div><\/div><\/div><div class=\"x-row e7387-e42 m5p7-f m5p7-g m5p7-j\"><div class=\"x-row-inner\"><div class=\"x-col e7387-e43 m5p7-l\"><div class=\"x-text x-content e7387-e44 m5p7-u m5p7-v\"><p><span style=\"font-weight: 400;\">Ampere Computing has embarked on a different approach to address this shortfall by offering sustainable and energy-efficient cloud at the core. It is offering its state-of-the-art cloud native processors and augmenting them with AI compute-capable accelerators that enable the entire spectrum of application development in a modern day AI cloud. The key features of Ampere&rsquo;s approach are agility and innovation in every phase of its product development -from concept, architecture, silicon design, test, platform development to deployment in the cloud. Lower cost, better performance and higher efficiency remain as the core values in Ampere&rsquo;s portfolio.<br>\nRohit Vidwans will discuss what innovations are needed at the various stages of platform\/CPU development, test ecosystem and deployment. He will discuss some examples covering these areas. In closing, he will have a call to action for sustained innovations in the primary areas of CPU development and test through industry partnership and collaboration.<\/span><\/p><\/div><div class=\"x-acc e7387-e45 m5p7-w\" id=\"x-acc-e7387-e45\"><div class=\"e7387-e46 x-acc-item\"><button id=\"tab-e7387-e46\" class=\"x-acc-header\" role=\"button\" type=\"button\" aria-expanded=\"false\" aria-controls=\"panel-e7387-e46\" data-x-toggle=\"collapse\" data-x-toggleable=\"e7387-e46\"><span class=\"x-acc-header-content\"><span class=\"x-acc-header-indicator\">&#x25b8;<\/span><span class=\"x-acc-header-text\">Biography<\/span><\/span><\/button><div id=\"panel-e7387-e46\" role=\"tabpanel\" aria-hidden=\"true\" aria-labelledby=\"tab-e7387-e46\" data-x-toggleable=\"e7387-e46\" data-x-toggle-collapse=\"1\" class=\"x-collapsed\"><div class=\"x-acc-content\"><div class=\"x-text x-content e7387-e47 m5p7-u\"><p style=\"text-align: left;\"><span style=\"font-weight: 400;\"><strong>Rohit Vidwans<\/strong> is the Chief Engineering &amp; Manufacturing Officer for Ampere Computing, a modern semiconductor company. Rohit and his experienced technical team are inventing the future in cloud-based processor technology. Developing the first Cloud Native processors, Ampere is providing a new level of performance and efficiency for large demand requirements of today&rsquo;s hyperscale cloud and edge computing workloads and applications. Ampere Computing has launched 4 generations of high core count high performance Cloud Native processors since it was formed. &nbsp;&nbsp;<\/span><\/p>\n<p style=\"text-align: left;\"><span style=\"font-weight: 400;\">Prior to Ampere, Rohit was an Engineering executive at Intel with a career that spans 20+ years and accomplishments in the design and delivery of multiple generations of Intel&reg; Xeon&reg;, Intel&reg; Atom&trade;, Intel&reg; Core&trade;, Pentium&trade; and Celeron&trade; family of processors and client chipsets.<\/span><\/p>\n<p style=\"text-align: left;\"><span style=\"font-weight: 400;\">Rohit received his Bachelors and Master&rsquo;s degrees in Computer Engineering from the University of Michigan at Ann Arbor and the University of Texas at Austin respectively. He holds 11 patents in computer architecture and design.&nbsp;<\/span><span style=\"font-weight: 400;\"><br \/><\/span><\/p><\/div><\/div><\/div><\/div><\/div><hr class=\"x-line e7387-e48 m5p7-n\"\/><\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e7387-e49 m5p7-5\"><div class=\"x-column x-sm x-1-4 e7387-e50 m5p7-8\"><div class=\"x-text x-text-headline e7387-e51 m5p7-o m5p7-q m5p7-r\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">9:00 a<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e52 m5p7-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"4\">Session 4<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\">Market<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Semiconductor Market Insights and Advanced Packaging trends&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nPanchami Phadke\n      <\/div>\n\t    <div class=\"authorCompany\">\nTechInsights\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>The global semiconductor market has witnessed extraordinary growth, because of the demand for different sectors such as automotive, AI, consumer electronics, and telecommunications. This presentation will provide a comprehensive overview of the current semiconductor landscape, highlighting key market data and trends of the industry. While focusing on the socket market, we will explore the market revenue by technology, type and application, trends and forecasts and look into dynamics of demand and supply within Test and Burn-in sockets. We will also talk about advanced packaging technologies, which address performance, power, and integration challenges through innovations like 3D stacking and Chiplet architectures. This presentation aims to offer a holistic view of the semiconductor industry, particularly as it responds to rising technological demands and moves toward next-generation device manufacturing.<\/p>\r\n<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s4p1Phadke_6912.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s4p1Phadke_6912.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;How Evolution of Advanced Packaging Drives Innovations in Test&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nJohn West\n      <\/div>\n\t    <div class=\"authorCompany\">\nYole Group\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nNur Hilwani \"Nur\" Razi\n      <\/div>\n\t    <div class=\"authorCompany\">\nYole Group\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>The rapid adoption of the latest packaging technologies, particularly for high-end applications, is outpacing the industry\u2019s ability to develop cost-effective test solutions. Choosing the optimal test flow is becoming more complex, especially when testing of singulated die or partially assembled packages is required. In many instances, the supply chain doesn\u2019t have the equipment and consumables solutions the industry needs or will need in the future. This presentation provides an overview of the high-end advanced packaging technologies from a test and cost of test perspective. It also explores the opportunities for suppliers of test and burn-in sockets.<\/p><\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s4p2West_3361.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s4p2West_3361.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><div class=\"x-container max width e7387-e54 m5p7-5\"><div class=\"x-column x-sm x-1-4 e7387-e55 m5p7-8\"><div class=\"x-text x-text-headline e7387-e56 m5p7-o m5p7-q m5p7-r\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">10:00 a<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e57 m5p7-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Poster\">Poster<\/div><div class=\"sessionLocation\">Red Mountain Foyer<\/div><\/div><div class=\"sessionTitle\">Poster<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;AuCNT Plated Contact Probes&rdquo; \n<\/div>\n<div class=\"presentationAward\">\n\t\t<div class=\"presentationAwardRibbon\">\n\t\t\t<img decoding=\"async\" src=\"\/images\/award_ribbon50x75.png\"><\/a>\n\t\t<\/div>\n\t\t<div class=\"presentationAwardTitle\">\nBest Poster\t\t<\/div>\n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nKazuaki Mita\n      <\/div>\n\t    <div class=\"authorCompany\">\nSeiken Co., Ltd.\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nMorinobu Nakamura\n      <\/div>\n\t    <div class=\"authorCompany\">\nSeiken Co., Ltd.\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nSusumu Arai\n      <\/div>\n\t    <div class=\"authorCompany\">\nShinshu University\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nHitoshi Kimura\n      <\/div>\n\t    <div class=\"authorCompany\">\nSeiken Co., Ltd.\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nJose Antonio Fermin  \"Antonio\" Jimenez\n      <\/div>\n\t    <div class=\"authorCompany\">\nSeiken Co., Ltd.\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>Contact probes are critical for the electrical testing of semiconductors and electronic components, ensuring reliable performance. Our research introduces AuCNT plated contact probes, designed to meet the increasing demand for high-current testing applications.<\/p>\r\n<p>The AuCNT plating technology combines the conductive benefits of gold plating with carbon nanotubes. This approach enhances probe durability and performance.<\/p>\r\n<p>Key Features:Durability and Strength, Heat Resistance, High Current Capacity.<\/p>\r\n<\/p><p><\/p><\/details>\n<div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025Fermin_8934.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025Fermin_8934.pdf\" target=\"_blank\" \/>Poster Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Bridging the Engineering Talent Gap&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nHailin Wang\n      <\/div>\n\t    <div class=\"authorCompany\">\nElevATE Semiconductor\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>The increasing demand for consumer electronics, IoT devices, and automotive systems have heightened the need for test professionals. According to the SIA (Semiconductor Industry Association), the industry faces a declining workforce, with test engineering perceived as more complex and less attractive than other careers even within the STEM space. This paper addresses these challenges by proposing strategies to attract, retain, and develop talent while enhancing engineering efficiency to meet growing test demands. Drawing from research, industry data, expert interviews, as well as personal experience, the study highlights the impact of talent shortages and what can be done to help curb those perceptions. Insights from the semiconductor industry reveal that 67,000 technical roles, including engineers and computer scientists, are projected to go unfilled by 2030. This reflects a broader challenge, with over 1.4 million technical jobs at risk across the U.S. economy. Strategies discussed include mentoring programs, interdisciplinary training, and career development pathways to engage new talent, along with process optimizations and automation to improve engineering productivity. This paper will be providing actionable insights for managers, educators, and engineers to address these workforce gaps by discussing what has been impactful in multiple professional\u2019s (both academic as well as engineers) careers and how mentorship can be improved. This work aims to inspire new frameworks to attract the next generation of test engineers while boosting operational efficiency in response to escalating testing demands. As a new professional in this exciting industry, I want to highlight the experiences and insights that have motivated me to remain engaged, and I hope to inspire other young professionals to see the incredible potential, innovation, and impact they can have by choosing a career in testing and engineering.<\/p>\r\n<\/p><p><\/p><\/details>\n<div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterHWang_9287.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterHWang_9287.pdf\" target=\"_blank\" \/>Poster Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Burn In test at finer pitch less than 0.25 mm at lower cost&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nSang Yang \"Samuel\" Pak\n      <\/div>\n\t    <div class=\"authorCompany\">\nIWIN Co\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>The Technology originally targeted for the finer pitch of 0.25 mm or below for Burn-In test, but also demonstrated excellent performance at High Frequency Test and solving most of the issues due to traditional longer burn-in pins. <\/p>\r\n<p>Traditional burn in test socket are experiencing ball damages, or open failures due to dimensional tolerance of BGA balls and high testing temperature, the poster will address the problems and the solutions.<\/p>\r\n<\/p><p><\/p><\/details>\n<div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterPak_1734.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterPak_1734.pdf\" target=\"_blank\" \/>Poster Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Spring probe pin for Low resistance, High current carrying and High voltage&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nHyung Jun \"AJ\" Park\n      <\/div>\n\t    <div class=\"authorCompany\">\nIWIN Co\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>For AI connector and test socket, and high heat generating system, outstanding technology for test\/connector spring probe pins enabling low resistance, high current carrying and high voltage.  \r\nThe pin should be demonstrating performance at the small pitch and space to increase the density, height of board and decrease the size the equipment <\/p>\r\n    <p>In addition to the high performances, irregular high temperatures, vibrating condition and humidity, and harsh operating condition, a specially designed spring probe pin is desperately needed in various industrial areas.<\/p>\r\n<\/p><p><\/p><\/details>\n<div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterPark_9002.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterPark_9002.pdf\" target=\"_blank\" \/>Poster Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Mechanical cycling of extremely soft graphene-enhanced thermal interface materials for HPC and AI cooling applications&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nYuanyuan \"Melissa\" Wang\n      <\/div>\n\t    <div class=\"authorCompany\">\nSmart High Tech AB\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nJefferson Lee\n      <\/div>\n\t    <div class=\"authorCompany\">\nAMD\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nKristoffer Harr\n      <\/div>\n\t    <div class=\"authorCompany\">\nSmart High Tech AB\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nJin Chen\n      <\/div>\n\t    <div class=\"authorCompany\">\nShanghai Ruixi New Materials High Tech Co. Ltd\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nLijie He\n      <\/div>\n\t    <div class=\"authorCompany\">\nSmart High Tech AB\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nAmos Nkansah\n      <\/div>\n\t    <div class=\"authorCompany\">\nSmart High Tech AB\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nJohan Liu\n      <\/div>\n\t    <div class=\"authorCompany\">\nChalmers University of Technology\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>With the huge need for efficient heat dissipation in High-Performance Computing (HPC) and Artificial\r\nIntelligence (AI) applications, the conventional thermal interface materials, for example, thermal grease,\r\nmetal foil, and phase change materials all face serious challenges to be used due to their drying and\r\npumping out problems. Recently developed Graphene- enhanced thermal interface materials (G-TIMs)\r\nwith extremely high thermal conductivity (between 70 to 200W\/Km in the vertical direction) and great\r\nthermal stability are clearly a potential alternative for it. The flexibility of physical properties with different\r\nsoftness of this class of material make it possible work in different applications. In this work, a series of\r\ngraphene-enhanced TIMs with a hardness ranging between 20 and 80 (Shore A) were prepared. A\r\nmechanical cycling tool was developed, and mechanical cycling tests with up to 5000 insertion cycles\r\nwere carried out to evaluate the effect of softness on the thermal and mechanical performance for\r\ndifferent potential HPC and AI cooling applications. To mimic the power mechanical cycling, the testing\r\nchamber temperature varied between room temperature and up to 90 \u00b0C.<\/p>\r\n<\/p><p><\/p><\/details>\n<div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterWangYY_1323.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterWangYY_1323.pdf\" target=\"_blank\" \/>Poster Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Remote Power Telemetry with Intel Power Consumption Measurement (iPCM)&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nYean Shim Tan\n      <\/div>\n\t    <div class=\"authorCompany\">\nIntel\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nAmyrul Azuan Mohd Bahar\n      <\/div>\n\t    <div class=\"authorCompany\">\nIntel\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nChin Seng Soon\n      <\/div>\n\t    <div class=\"authorCompany\">\nIntel\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nTroy Willes\n      <\/div>\n\t    <div class=\"authorCompany\">\nIntel\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>iPCM Cloud-Controlled Tool for A Compact Solution on Power Telemetry \r\n\r\nAbstract: \r\n\r\n<p>This presentation introduces the iPCM (Intel Power Consumption Measurement), a compact tool designed for power measurement. The iPCM tool utilizes a cloud-based infrastructure for control and offers the capability to deploy on various customer platforms, enabling remote measurement of desired power rails through the cloud service. Compared to the existing market tool used for platform power consumption validation, the iPCM tool has demonstrated exceptional accuracy with a delta of less than 3%. This solution brings numerous benefits, including reduced debug and validation engineering hours, accelerated product time to market, enhanced accessibility to limited boards, and improved customer self-sufficiency. Currently, there is no other released solution that combines the iPCM's accuracy, price point, and ease of use with remote cloud-based debugging capabilities. The proposed solution focuses on the validation and debug of platform power consumption, specifically highlighting the advantages of utilizing the iPCM tool and its cloud-based capabilities.<\/p><\/p><p><\/p><\/details>\n<div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterWilles_4523.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterWilles_4523.pdf\" target=\"_blank\" \/>Poster Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Reliable Fine Pitch Contacting of Rigid PCBAs and Flex Circuits&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nAdrian Bangarter\n      <\/div>\n\t    <div class=\"authorCompany\">\nMicrocontact\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nBrian Crisp\n      <\/div>\n\t    <div class=\"authorCompany\">\nArrowhead Technical Sales\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>The problem of a lack of space for test points on contemporary product designs is more relevant than ever. The aim of the designer is to gain test access by placing as many test points as possible for maximum test coverage on a minimum substrate size. This often conflicts with existing test fixture hardware solutions, which do not allow this due to the size of the spring contact probes that are used.<\/p>\r\n\r\n<p>A solution to this challenge is an advanced rigid needle adapter. This high-precision adapter technology enables in-circuit test, functional test and program flashing of test points as small as \u00f8100\u00b5m with a test point spacing of 250\u00b5m or 400\u00b5m. The advantage of this test solutions for designers, for example, is that the test point spacing is reduced from 2mm to 400\u00b5m, and 25X more test points can be placed on the same substrate area.<\/p>\r\n\r\n<p>For contacting larger single UUTs, and panels, rigid needle adapters can be easily scaled and adjusted in size. This allows production to correlate the adapter size to the corresponding production batch within minutes. In this way, qualitative contacting on 0.3 mm test points can be ensured even on 400 mm panels with accommodations for coplanarity issues.<\/p>\r\n\r\n<p>Coupling this adapter technology, with  fixtures and testers which incorporate a unique contacting method that is divided into a feed stroke and a contacting stroke.  With this approach, there is the advantage for double-sided contacting of the substrate which is first well supported from both sides before the contacting force is applied. As a result, the load caused by the actuation of the test interface can be reduced to a minimum.<\/p><\/p><p><\/p><\/details>\n<div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterBangerter_7823.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025posterBangerter_7823.pdf\" target=\"_blank\" \/>Poster Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><div class=\"x-container max width e7387-e59 m5p7-5\"><div class=\"x-column x-sm x-1-4 e7387-e60 m5p7-8\"><div class=\"x-text x-text-headline e7387-e61 m5p7-o m5p7-q m5p7-r\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">11:00 a<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e62 m5p7-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"5\">Session 5<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\">Socket Technology<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Column Replaceable Elastomer Socket&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nJosh Choi\n      <\/div>\n\t    <div class=\"authorCompany\">\nTSE\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nBo Hyun \"BH\" Kim\n      <\/div>\n\t    <div class=\"authorCompany\">\nTSE\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nYunchan \"YC\" Nam\n      <\/div>\n\t    <div class=\"authorCompany\">\nTSE\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nDaeHyun \"DH\" Ro\n      <\/div>\n\t    <div class=\"authorCompany\">\nTSE\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>Existing elastomer contains conductive paths within the silicone mold, which causes structural interference between the conductive paths. This interference leads to limitations when testing large-sized packages with warpage. To overcome these limitations, introduce ELTUNE-Air, which has independent conductive paths.<\/p>\r\n<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s5p1Choi_9982.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s5p1Choi_9982.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Unified Socket Interconnect in the Test Ecosystem of High Pin Count and Large Body Size Packages&rdquo; \n<\/div>\n<div class=\"presentationAward\">\n\t\t<div class=\"presentationAwardRibbon\">\n\t\t\t<img decoding=\"async\" src=\"\/images\/award_ribbon50x75.png\"><\/a>\n\t\t<\/div>\n\t\t<div class=\"presentationAwardTitle\">\nBest Presentation\t\t<\/div>\n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nMysore \"MP\" Divakar\n      <\/div>\n\t    <div class=\"authorCompany\">\nAmpere Computing\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nAshok Kabadi\n      <\/div>\n\t    <div class=\"authorCompany\">\nAmpere Computing\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nPrathiksha Dhanpal\n      <\/div>\n\t    <div class=\"authorCompany\">\nAmpere Computing\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>The test ecosystem for the processor chips typically includes bring up (validation), automated test engineering (ATE), final test (FT), system level test (SLT) and high temperature operating life (HTOL) tests, typically performed in the same sequence. Historically the foregoing test functions have remained fragmented with respect to the type of socket interconnection. On one end, legacy and familiarity with a given type of socket interconnect factors into decision making, and on the other, it appears that the test industry is risk averse to innovate to a common standard for socket interconnects. Complexity in designing to large package dimensions, accommodating a large number of package pins and their pitch, additional complexities in loading mechanisms to manage many 100\u2019s of kilograms of force on the package, maintaining the integrity of Silicon in exposed die or lidless packages, addressing package warpage, etc., all feed into a design funnel to meet the ultimate goal which is standardizing a common interconnect end-to-end in the semiconductor test ecosystem. While this may seem as an unrealistic goal, recent advances in socket interconnects have shown a path to feasibility and realizing it.<\/p>\r\n\r\n<p>We present an approach to designing a common socket interconnect for all of the aforementioned test functions by using elastomeric sockets. This approach addresses the interconnect strategy for the entire semiconductor test ecosystem irrespective of the package type, i.e., ball grid arrays (BGA) or the land grid arrays (LGA) which are the predominant types of packages in the processor chips category. The elastomer socket interconnect is closely coupled with the type of loading mechanism which can be different in validation, ATE, FT, SLT and HTOL test areas. Therefore the socket interconnect is required to operate seamlessly and reliably across all of the foregoing test types and or loading mechanisms. To accomplish this, we focused on multiple design areas which are, addressing alignment of the socket to the package, a self-levelling loading mechanism, a profiled socket interconnect to deal with package warpage, a partitioned loading approach to deal with exposed die packages, a socket nest design which houses the elastomer socket and provides interfaces to loading mechanism and thermal regulation systems, managing deflections in the circuit board under 100\u2019s of kilograms of forces and maintenance such as cleaning manually or in-line for the automated test environment. Each contact in the elastomer was designed to meet current handling as well as signal integrity requirements for PCIe5 and DDR5.<\/p>\r\n<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s5p2Divakar_1832.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s5p2Divakar_1832.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Enabling Near-DUT Voltage Sense and Control&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nJames Hastings\n      <\/div>\n\t    <div class=\"authorCompany\">\nAdvantest\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>Enabling Near-DUT Voltage Sense and Control<\/p>\r\n<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s5p3Hastings_5423.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s5p3Hastings_5423.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><div class=\"x-container max width e7387-e64 m5p7-5\"><div class=\"x-column x-sm x-1-4 e7387-e65 m5p7-8\"><div class=\"x-text x-text-headline e7387-e66 m5p7-o m5p7-q m5p7-r\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">12:30 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e67 m5p7-8\"><div class=\"x-text x-text-headline e7387-e68 m5p7-o m5p7-r m5p7-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">Lunch<\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e7387-e69 m5p7-d\"><p>Lunch is served. Enjoy the break and networking time.<\/p><\/div><\/div><\/div><div class=\"x-container max width e7387-e70 m5p7-5\"><div class=\"x-column x-sm x-1-4 e7387-e71 m5p7-8\"><div class=\"x-text x-text-headline e7387-e72 m5p7-o m5p7-q m5p7-r\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">1:30 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e73 m5p7-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"6\">Session 6<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\">Thermal<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Extreme Temperature Automotive Testing&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nThomas Pham\n      <\/div>\n\t    <div class=\"authorCompany\">\nTeradyne\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nNicholas Madrid\n      <\/div>\n\t    <div class=\"authorCompany\">\nTeradyne\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nAndrew \"Andy\" Westall\n      <\/div>\n\t    <div class=\"authorCompany\">\nTeradyne\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nMatthew Roberts\n      <\/div>\n\t    <div class=\"authorCompany\">\nTexas Instruments\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>How to guarantee Hot and Cold junction temperatures during production testing of Integrated Circuits is a challenging problem.  This paper analyzes findings for improved IC junction temperature regulation during test for AEC-Q100 grade 0 devices by using passive and active thermal regulation, specialized software techniques to guarantee quality, appropriate materials and components, and thermal zoning.<\/p>\r\n<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s6p1Westall_5542.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s6p1Westall_5542.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Enhancing AI and High-Speed Computing Tests with High-Performance TIMs&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nIvan Tan\n      <\/div>\n\t    <div class=\"authorCompany\">\nInspiraz Technology Pte Ltd\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>As faster speeds and higher performance become standard expectations for AI, CPUs, and high-speed computing IC devices, packaging technology is also becoming more complex, with larger multi-chip designs. This introduces challenges such as package warpage, uneven chip heights, and increased heat generation due to higher processing speeds. Testing requirements for IC devices have become more stringent, including the evaluation of test programs, parameters, temperatures, and durations. Common testing methods include final test, system-level, and burn-in etc.<\/p>\r\n\r\n<p>Although TIM is just a small component in the overall testing or package assembly, it plays a crucial role in ensuring rapid heat transfer between the IC device and the thermal head during testing. Ensuring minimal temperature variance between the pedestal and die is essential for accurate and efficient testing.<\/p>\r\n\r\n<p>This paper explores various TIM materials available in the market that are designed to address the demands of high-power, high-speed IC device testing, and analyses the pros and cons of each material.<\/p>\r\n<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s6p2Tan_4283.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s6p2Tan_4283.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Advanced Thermal Management: Enhancing Heat Sink Performance for Hand Socket Lids with Generative Design and Additive Manufacturing&rdquo; \n<\/div>\n<div class=\"presentationAward\">\n\t\t<div class=\"presentationAwardRibbon\">\n\t\t\t<img decoding=\"async\" src=\"\/images\/award_ribbon50x75.png\"><\/a>\n\t\t<\/div>\n\t\t<div class=\"presentationAwardTitle\">\nMost Inspirational\t\t<\/div>\n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nMark Selvan\n      <\/div>\n\t    <div class=\"authorCompany\">\nTest Tooling Solutions Group\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nJeevinthiran Karunagaran\n      <\/div>\n\t    <div class=\"authorCompany\">\nTest Tooling Solutions Group\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nCheng Hsin \"Kenny\" Lee\n      <\/div>\n\t    <div class=\"authorCompany\">\nTest Tooling Solutions Group\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nPhaik Yean \"PY\" Goay\n      <\/div>\n\t    <div class=\"authorCompany\">\nTest Tooling Solutions Group\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>This presentation explores the thermal optimization of 3D-printable heat sinks designed for hand socket lids, focusing on the use of generative AI and parametric study methodologies in ColdStream, a generative design software for thermal management. As electronic devices shrink and power densities increase, effective thermal management becomes increasingly critical. To address this challenge, we employ optimization tools and additive manufacturing methods to enhance the heat dissipation efficiency of the heat sink.<\/p>\r\n<p>The first phase utilizes a thermal resistance network-based optimization, designed to efficiently estimate correlations using minimal computational resources. This approach searches the design space for the highest-performing design configuration and manufacturing method. <\/p>\r\n<p>Once the software has identified the optimal shape and manufacturing method, a detailed CFD (Computational Fluid Dynamics) analysis is applied to further refine and improve the design using generative AI. This step incorporates advanced airflow modeling, temperature distribution, and heat transfer analysis to optimize the TPMS structures used for the heat sinks.<\/p>\r\n<p>The resulting optimized heat sink achieved a reduction in thermal resistance compared to a traditional pin heat sink. This case study demonstrates the potential of combining generative design and additive manufacturing to enhance thermal performance, especially for low-volume production devices such as custom hand socket lids.<\/p>\r\n<p>Through this presentation, we will outline the steps taken, the improvements made, and the challenges encountered during the use of ColdStream for heat sink optimization in a hand socket lid. Attendees will gain insights into how the integration of optimization tools and additive manufacturing can lead to significant improvements in heat sink performance, supported by real-world examples of the process and results.<\/p>\r\n<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s6p3Selvan_9009.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s6p3Selvan_9009.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Solving warping issues with novel metal compressible TIM&rdquo; \n<\/div>\n<div class=\"presentationAward\">\n\t\t<div class=\"presentationAwardRibbon\">\n\t\t\t<img decoding=\"async\" src=\"\/images\/award_ribbon50x75.png\"><\/a>\n\t\t<\/div>\n\t\t<div class=\"presentationAwardTitle\">\nBest Data Presented\t\t<\/div>\n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nMilo\u0161 \"Milos\" Lazi\u0107\n      <\/div>\n\t    <div class=\"authorCompany\">\nIndium Corporation\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nBob Jarrett\n      <\/div>\n\t    <div class=\"authorCompany\">\nIndium Corporation\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nRicky McDonough\n      <\/div>\n\t    <div class=\"authorCompany\">\nIndium Corporation\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nCarson Burt\n      <\/div>\n\t    <div class=\"authorCompany\">\nIndium Corporation\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p><p>Metals have been used as thermal interface materials (TIMs) for many years. Even though they have a higher thermal conductivity than thermal pastes or polymeric phase change materials (PCMs), there is a need for novel metal TIMs with better thermal performance that can be used in high-power applications. In this work, we will present new types of compressible metal TIMs. Compressible TIMs have a special pattern to address any warping, non-planarities between surfaces that are connecting, as well as CTE mismatch when the material is used as a TIM1 or TIM0 (TIM1.5)..The novel type of the compressible TIM has a specially designed one side pattern that makes this TIM more compressible than any other compressible TIM. It is recommended for more wrapped, irregular or curved surfaces.<\/p>\r\n<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s6p4Burt_2347.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025s6p4Burt_2347.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><div class=\"x-container max width e7387-e75 m5p7-5\"><div class=\"x-column x-sm x-1-4 e7387-e76 m5p7-8\"><div class=\"x-text x-text-headline e7387-e77 m5p7-o m5p7-q m5p7-r\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">3:30 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e78 m5p7-8\"><div class=\"x-text x-text-headline e7387-e79 m5p7-o m5p7-r m5p7-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">TestConX EXPO<\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e7387-e80 m5p7-d\"><p>Continue to explore the great exhibits at the TestConX EXPO. There is always something new to see or someone new to meet.  Refreshments and drinks are served but don't spoil your appetite before the TestConX Social...<\/p><\/div><\/div><\/div><div class=\"x-container max width e7387-e81 m5p7-5\"><div class=\"x-column x-sm x-1-4 e7387-e82 m5p7-8\"><div class=\"x-text x-text-headline e7387-e83 m5p7-o m5p7-q m5p7-r\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">6:30 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e84 m5p7-8\"><div class=\"x-text x-text-headline e7387-e85 m5p7-o m5p7-r m5p7-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">TestConX Social Event<\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e7387-e86 m5p7-d\"><p>Continue the networking with your colleagues and industry friends at the TestConX Social Event.<\/p>\n<p>There will be lots of fun and great food in store!<\/p><\/div><\/div><\/div><div class=\"x-container max width e7387-e87 m5p7-5\"><div class=\"x-column x-sm x-1-4 e7387-e88 m5p7-8\"><div class=\"x-text x-text-headline e7387-e89 m5p7-o m5p7-q m5p7-r\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">9:00 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7387-e90 m5p7-8\"><div class=\"x-text x-text-headline e7387-e91 m5p7-o m5p7-r m5p7-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">Adjourn<\/h2>\n<\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e7387-e92 m5p7-5\"><div class=\"x-column x-sm x-1-1 e7387-e93 m5p7-8\"><div class=\"x-content-area e7387-e94 m5p7-d\"><p><em>Program subject to change without notice.<\/em><\/p><\/div><\/div><\/div><\/div><div class=\"x-section e7387-e95 m5p7-0 m5p7-2 m5p7-3\"><div class=\"x-container max width e7387-e96 m5p7-5\"><div class=\"x-column x-sm x-1-1 e7387-e97 m5p7-8 m5p7-9\"><a class=\"x-anchor x-anchor-button e7387-e98 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Overview<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7387-e99 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-sunday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Sunday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7387-e100 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-monday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Monday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7387-e101 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-tuesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Tuesday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7387-e102 m5p7-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-wednesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Wednesday<\/span><\/div><\/div><\/a><\/div><\/div><div class=\"x-row x-container max width e7387-e103 m5p7-f m5p7-g m5p7-k\"><div class=\"x-row-inner\"><div class=\"x-col e7387-e104 m5p7-l m5p7-m\"><hr class=\"x-line e7387-e105 m5p7-n\"\/><a class=\"x-anchor x-anchor-button e7387-e106 m5p7-e\" tabindex=\"0\" href=\"https:\/\/www.testconx.org\/premium\/testconx-expo-2025\/\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">EXPO<\/span><\/div><\/div><\/a><\/div><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Rotate your smartphone to landscape or increase your browser width to see session descriptions.OverviewSundayMondayTuesdayWednesdayEXPOTuesday March 4, 2025 7:00 a Continental Breakfast Start the day right and enjoy the continental breakfast while networking with other attendees.8:00 a Distinguished SpeakerRed Mountain Ballroom &ldquo;Towards An Equitable AI Cloud: Leveraging Agility and Innovation&rdquo; &nbsp;Presentation Download Rohit Vidwans Ampere ComputingThe semiconductor industry is witnessing a &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/testconx2025-tuesday\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-7387","page","type-page","status-publish","hentry","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/7387","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=7387"}],"version-history":[{"count":27,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/7387\/revisions"}],"predecessor-version":[{"id":7800,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/7387\/revisions\/7800"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=7387"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}