{"id":7386,"date":"2024-12-04T23:45:29","date_gmt":"2024-12-05T07:45:29","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=7386"},"modified":"2025-05-14T14:35:38","modified_gmt":"2025-05-14T21:35:38","slug":"testconx2025-monday","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx2025-monday\/","title":{"rendered":"TestConX 2025 – Monday"},"content":{"rendered":"
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Rotate your smartphone to landscape or increase your browser width to see session descriptions.<\/h4><\/div><\/div><\/div><\/div>
Overview<\/span><\/div><\/div><\/a>
Sunday<\/span><\/div><\/div><\/a>
Monday<\/span><\/div><\/div><\/a>
Tuesday<\/span><\/div><\/div><\/a>
Wednesday<\/span><\/div><\/div><\/a><\/div><\/div>
EXPO<\/span><\/div><\/div><\/a><\/div><\/div><\/div><\/div>

Monday March 3, 2025<\/div><\/h1>\n<\/div><\/div><\/div><\/div><\/div>

7:30 a<\/h1>\n<\/div><\/div><\/div><\/div>

Continental Breakfast<\/h2>\n<\/div><\/div><\/div>

Start the day right and enjoy the continental breakfast while networking with other attendees.<\/p><\/div><\/div><\/div>

8:30 a<\/h1>\n<\/div><\/div><\/div><\/div>
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Welcome<\/div>
Red Mountain Ballroom<\/div><\/div>
Opening Remarks<\/div>
Welcoming remarks from the General Chair, Ira Feldman<\/div>

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9:00 a<\/h1>\n<\/div><\/div><\/div><\/div>
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Keynote<\/div>
Red Mountain Ballroom<\/div><\/div>
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<\/p><\/div>

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\n“AI for Test” \n<\/div>\n\"\"<\/a>
<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n
\"Ming<\/span>
Ming Zhang
\n PDF Solutions<\/b><\/div><\/div>
The semiconductor industry stands at a pivotal moment, driven by the transformative forces of artificial intelligence (AI) and chiplet technology. AI applications demand the seamless heterogenous integration of diverse chiplets: compute, memory, communication, and sensing. At the same time, the exponential growth in systemic complexity of chiplet-based designs generates an unprecedented volume of data across the design, manufacturing, and deployment phases of semiconductor products. This convergence presents a unique and vast opportunity to harness the power of data, through AI in semiconductor testing while posing significant challenges due to the distinct nature of semiconductor data.<\/div><\/div><\/div><\/div>
\nThis presentation explores the evolving industry landscape, outlines our vision for leveraging AI in the testing of chiplets and systems, and addresses the critical challenges that remain in this exciting frontier.<\/div>