
{"id":7385,"date":"2024-12-04T23:45:20","date_gmt":"2024-12-05T07:45:20","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=7385"},"modified":"2025-05-14T14:18:07","modified_gmt":"2025-05-14T21:18:07","slug":"testconx2025-sunday","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx2025-sunday\/","title":{"rendered":"TestConX 2025 &#8211; Sunday"},"content":{"rendered":"<div id=\"cs-content\" class=\"cs-content\"><div class=\"x-section e7385-e1 m5p5-0 m5p5-1 m5p5-2\"><div class=\"x-container max width e7385-e2 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-1 e7385-e3 m5p5-9\"><span class=\"x-image e7385-e4 m5p5-b m5p5-c\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2023Korea\/TestConX2025_band_1500x500.jpg\" width=\"750\" height=\"250\" alt=\"Image\" loading=\"lazy\"><\/span><\/div><\/div><\/div><div class=\"x-section e7385-e5 m5p5-0 m5p5-2 m5p5-3\"><div class=\"x-container max width e7385-e6 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-1 e7385-e7 m5p5-9 m5p5-a\"><a class=\"x-anchor x-anchor-button e7385-e8 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Overview<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e9 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-sunday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Sunday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e10 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-monday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Monday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e11 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-tuesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Tuesday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e12 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-wednesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Wednesday<\/span><\/div><\/div><\/a><\/div><\/div><div class=\"x-row x-container max width e7385-e13 m5p5-g m5p5-i m5p5-j\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e14 m5p5-u m5p5-v\"><hr class=\"x-line e7385-e15 m5p5-w\"\/><a class=\"x-anchor x-anchor-button e7385-e16 m5p5-e\" tabindex=\"0\" href=\"https:\/\/www.testconx.org\/premium\/testconx-expo-2025\/\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">EXPO<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e17 m5p5-e\" tabindex=\"0\" href=\"https:\/\/form.jotform.com\/243396386676171\" target=\"_blank\" rel=\"noopener noreferrer\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Register<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e18 m5p5-e m5p5-f\" tabindex=\"0\" href=\"https:\/\/form.jotform.com\/250236372630147\" target=\"_blank\" rel=\"noopener noreferrer\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">EXPO Only<\/span><span class=\"x-anchor-text-secondary\">Registration<\/span><\/div><\/div><\/a><\/div><\/div><\/div><\/div><div class=\"x-section e7385-e19 m5p5-0 m5p5-4\"><div class=\"x-container max width e7385-e20 m5p5-6 m5p5-7\"><div class=\"x-column x-sm x-1-1 e7385-e21 m5p5-9\"><div class=\"x-text x-text-headline e7385-e22 m5p5-x m5p5-y m5p5-z\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">Sunday March 2, 2025<\/h1>\n<\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e7385-e23 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-4 e7385-e24 m5p5-9\">&nbsp;<\/div><div class=\"x-column x-sm x-3-4 e7385-e25 m5p5-9\"><div class=\"x-text x-text-headline e7385-e26 m5p5-x m5p5-z m5p5-10 m5p5-11\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\"><p>There will be breaks including \n refreshments to provide networking time for Tutorial attendees.<\/p>\n<p>Please note: attendance at the tutorial will be limited. Please sign-up early to not miss out!<\/p><\/h1>\n<\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e7385-e27 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-4 e7385-e28 m5p5-9\"><div class=\"x-text x-text-headline e7385-e29 m5p5-x m5p5-z m5p5-11 m5p5-12\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">1:00 to&nbsp; 3:00 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7385-e30 m5p5-9\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Tutorial\">Tutorial<\/div><\/div><div class=\"sessionTitle\">Optional Tutorial<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Categorization, Testing, and Selection of Thermal Interface Materials  for Semiconductor Test&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nDave Saums\n      <\/div>\n\t    <div class=\"authorCompany\">\nDS&A LLC\n\t    <\/div>\n   <\/div>\n<\/div>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025Saums_1134.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025Saums_1134.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<div class=\"x-row e7385-e32 m5p5-g m5p5-i m5p5-k\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e33 m5p5-u\"><span class=\"x-image e7385-e34 m5p5-b m5p5-d\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2023Korea\/DaveSaums2.png\" width=\"150\" height=\"200\" alt=\"Image\" loading=\"lazy\"><\/span><div class=\"x-text x-content e7385-e35 m5p5-15\"><p style=\"text-align: center;\"><strong>David L. Saums<\/strong><br \/>DS&amp;A<\/p><\/div><\/div><div class=\"x-col e7385-e36 m5p5-u\"><div class=\"x-text x-content e7385-e37 m5p5-15\"><p>Thermal interface materials are available from hundreds of vendors and in thousands of different part numbers, creating a challenging test, evaluation, and selection procedure. This tutorial is intended to address these facets with an organized approach.<\/p>\n<p>A relatively small number of TIM types are either designed specifically for semiconductor test or are directly applicable. Learning more about TIMs will allow the test engineer to set requirements and select solutions for their specific application.<\/p>\n<\/div><\/div><\/div><\/div><hr class=\"x-line e7385-e38 m5p5-w\"\/><div class=\"x-text x-content e7385-e39 m5p5-15\"><p>This tutorial will include the following topics:<\/p>\n<ul>\n<li>A categorization methodology for thermal interface materials (TIMs) that is standardized for the thermal materials industry, with a number of very recent TIM developments identified by type and category. Understanding how the major categories are identified &ndash; and specific performance characteristics and intended function &ndash; is important to creating a short selection menu for evaluation.&nbsp;<\/li>\n<li>Identification of specific functional areas within the broad TIM range, followed by separating out polymers, graphitic, and metallic materials. Certain categories of TIMs are not appropriate for common application types and for semiconductor test, having been designed to meet specific functional requirements.<\/li>\n<li>Description of very recent developments in graphene-enhanced TIM types, hybrid liquid metal formulations, metallic pastes and gallium-containing materials, and phase-change metal alloys that are either currently in late-stage development or which have been released to production.<\/li>\n<li>Testing methods and specific practices, especially for newly-developed TIM types that have specific constraints on both testing practices and applications, will follow. Gallium-containing TIMs, for example, must be considered for testing and for application requirements with an understanding of this corrosive metal and containment, to prevent damage to joining copper and aluminum surfaces and components.<\/li>\n<li>Testing methodologies including ASTM D 5470-17 for through-plane thermal conductivity and thermal resistance; in-plane lateral testing methods; three-omega liquid, gel, and paste testing equipment and methods; and transient (structure function) methods. The use of standardized testing per ASTM D 5470-17 yields most consistent, accurate, and repeatable measurements.&nbsp; Transient test and thermal test vehicles (TTVs) are designed to produce in-situ test results that are closely matched to a specific package type, surface characteristics, and other non-standard conditions.&nbsp; Understanding the differences and the sequence of testing procedures is therefore important.<\/li>\n<li>Description of the use of thermal test vehicles (TTVs) for in-situ TIM testing for TIM0, TIM1, and TIM2. TTVs are very useful for testing with increased die warpage and non-flat surfaces, which is an increasing challenge for TIMs for bare-die package.<\/li>\n<\/ul>\n<p>&nbsp;<\/p><\/div><div class=\"x-acc e7385-e40 m5p5-17\" id=\"x-acc-e7385-e40\"><div class=\"e7385-e41 x-acc-item\"><button id=\"tab-e7385-e41\" class=\"x-acc-header\" role=\"button\" type=\"button\" aria-expanded=\"false\" aria-controls=\"panel-e7385-e41\" data-x-toggle=\"collapse\" data-x-toggleable=\"e7385-e41\"><span class=\"x-acc-header-content\"><span class=\"x-acc-header-indicator\">&#x25b8;<\/span><span class=\"x-acc-header-text\">Biography<\/span><\/span><\/button><div id=\"panel-e7385-e41\" role=\"tabpanel\" aria-hidden=\"true\" aria-labelledby=\"tab-e7385-e41\" data-x-toggleable=\"e7385-e41\" data-x-toggle-collapse=\"1\" class=\"x-collapsed\"><div class=\"x-acc-content\"><div class=\"x-text x-content e7385-e42 m5p5-15\"><p><strong>Dave L. Saums<\/strong> has forty-five years&rsquo; experience in many aspects of electronics thermal management, for manufacturers and developers of military\/aerospace high-reliability precision fans, high-volume heat sinks and liquid cold plates, advanced thermal interface materials, CTE-matched rigid thermal materials and substrates, and two-phase pumped dielectric liquid cooling systems.&nbsp; Dave operates a full-time consulting business addressing these products and markets, working with vendors, test equipment manufacturers, and system OEMs. &nbsp;These consulting projects have been undertaken for some of the largest materials and computing systems manufacturers and power semiconductor manufacturers.<\/p><\/div><\/div><\/div><\/div><\/div><hr class=\"x-line e7385-e43 m5p5-w\"\/><\/div><\/div><div class=\"x-container max width e7385-e44 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-4 e7385-e45 m5p5-9\"><div class=\"x-text x-text-headline e7385-e46 m5p5-x m5p5-z m5p5-11 m5p5-12\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">3:00 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7385-e47 m5p5-9\"><div class=\"x-text x-text-headline e7385-e48 m5p5-x m5p5-11 m5p5-12 m5p5-13\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\"><div id=\"welcome\">Networking Break<\/div><\/h2>\n<\/div><\/div><\/div><hr class=\"x-line e7385-e49 m5p5-w\"\/><hr class=\"x-line e7385-e50 m5p5-w\"\/><div class=\"x-content-area e7385-e51 m5p5-18\"><\/div><\/div><\/div><div class=\"x-container max width e7385-e52 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-4 e7385-e53 m5p5-9\"><div class=\"x-text x-text-headline e7385-e54 m5p5-x m5p5-z m5p5-11 m5p5-12\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">3:30 to&nbsp; 5:30 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7385-e55 m5p5-9\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Tutorial\">Tutorial<\/div><\/div><div class=\"sessionTitle\">Optional Tutorial<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Connecting Your DUT to Your Tester&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nThomas \"Tom\" Bresnan\n      <\/div>\n\t    <div class=\"authorCompany\">\nR&D Altanova\n\t    <\/div>\n   <\/div>\n<\/div>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025Bresnan_8834.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025Bresnan_8834.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<div class=\"x-row e7385-e57 m5p5-g m5p5-h m5p5-i m5p5-l\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e58 m5p5-u\"><span class=\"x-image e7385-e59 m5p5-b m5p5-d\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/clutter2021\/tombresnanheadshot2019.jpg\" width=\"150\" height=\"201\" alt=\"Image\" loading=\"lazy\"><\/span><div class=\"x-text x-content e7385-e60 m5p5-15 m5p5-16\"><div class=\"authorName\">Thomas \"Tom\" Bresnan<\/div>\n<div class=\"authorCompany\">R&amp;D Altanova<\/div><\/div><\/div><div class=\"x-col e7385-e61 m5p5-u\"><div class=\"x-text x-content e7385-e62 m5p5-15\"><p>This tutorial will be an across-the-board (pun intended) look at those Printed Circuit Boards under your socket. Our focus will be the attributes, materials and processes required to produce those test interface boards we know you&rsquo;ve been dying to learn more about. We&rsquo;ll attempt to bring the board shop to you, giving you a better understanding of what you and your vendors are up against.<\/p><\/div><\/div><\/div><\/div><div class=\"x-row e7385-e63 m5p5-g m5p5-i m5p5-m\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e64 m5p5-u\"><div class=\"x-text x-content e7385-e65 m5p5-15\"><p>We&rsquo;ll explore a brief history of the PCB or PWB (Printed Circuit\/Wiring Board) industry in general and specifically concerning the ATE industry. We&rsquo;ll see how pitch, layer count, overall thickness, and hole diameter, to name but a few of the most critical attributes, will impact the manufacturing (and co$t) of today&rsquo;s test interface boards. We&rsquo;ll examine the many options currently available for materials and how those options may be shrinking, right along with device pitch.<\/p>\n<p>We&rsquo;ll then move on to explain, in detail, the PWB manufacturing process; from raw materials through finished product.&nbsp;<\/p>\n<p>Last but certainly not least, we&rsquo;ll discuss quality and performance characteristics you can demand of your supplier(s). Even with today&rsquo;s boards becoming more crowded (with components) and pitch and pin counts driving attributes ever smaller, there are ways to verify and validate the quality of your interface boards with your suppliers. We&rsquo;ll show you how, with samples of our data gathered over years of process development, characterization and verification.<\/p><\/div><div class=\"x-acc e7385-e66 m5p5-17\" id=\"x-acc-e7385-e66\"><div class=\"e7385-e67 x-acc-item\"><button id=\"tab-e7385-e67\" class=\"x-acc-header\" role=\"button\" type=\"button\" aria-expanded=\"false\" aria-controls=\"panel-e7385-e67\" data-x-toggle=\"collapse\" data-x-toggleable=\"e7385-e67\"><span class=\"x-acc-header-content\"><span class=\"x-acc-header-indicator\">&#x25b8;<\/span><span class=\"x-acc-header-text\">Biography<\/span><\/span><\/button><div id=\"panel-e7385-e67\" role=\"tabpanel\" aria-hidden=\"true\" aria-labelledby=\"tab-e7385-e67\" data-x-toggleable=\"e7385-e67\" data-x-toggle-collapse=\"1\" class=\"x-collapsed\"><div class=\"x-acc-content\"><div class=\"x-text x-content e7385-e68 m5p5-15\"><p><strong>Mr. Tom Bresnan<\/strong>&nbsp;is an Account Manager &amp; Technical Sales Engineer from R&amp;D Altanova of South Plainfield, NJ, joining them in August 2003. His more than 30 years of printed circuit manufacturing experience includes positions in various Engineering, Management and Sales roles for some of the world&rsquo;s largest manufacturers of complex printed circuit boards, including; Hadco, Multek and Sanmina-SCI. He is a distinguished lifetime member of the IPC Technical Activities Executive Committee and has presented and published numerous technical articles for the PWB industry on MCM-L&rsquo;s and advanced plating capabilities. He resides in Fort Myers, FL with his wife Joanne. Mr. Tom Bresnan is an Account Manager &amp; Technical Sales Engineer from R&amp;D Altanova of South Plainfield, NJ, joining them in August 2003. His more than 30 years of printed circuit manufacturing experience includes positions in various Engineering, Management and Sales roles for some of the world&rsquo;s largest manufacturers of complex printed circuit boards, including; Hadco, Multek and Sanmina-SCI. He is a distinguished lifetime member of the IPC Technical Activities Executive Committee and has presented and published numerous technical articles for the PWB industry on MCM-L&rsquo;s and advanced plating capabilities. He resides in Fort Myers, FL with his wife Joanne. Mr. Tom Bresnan is an Account Manager &amp; Technical Sales Engineer from R&amp;D Altanova of South Plainfield, NJ, joining them in August 2003. His more than 30 years of printed circuit manufacturing experience includes positions in various Engineering, Management and Sales roles for some of the world&rsquo;s largest manufacturers of complex printed circuit boards, including; Hadco, Multek and Sanmina-SCI. He is a distinguished lifetime member of the IPC Technical Activities Executive Committee and has presented and published numerous technical articles for the PWB industry on MCM-L&rsquo;s and advanced plating capabilities. He resides in Fort Myers, FL with his wife Joanne<\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><hr class=\"x-line e7385-e69 m5p5-w\"\/><\/div><\/div><div class=\"x-container max width e7385-e70 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-4 e7385-e71 m5p5-9\"><div class=\"x-text x-text-headline e7385-e72 m5p5-x m5p5-z m5p5-11 m5p5-12\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">5:30 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7385-e73 m5p5-9\"><div id=\"welcome\" class=\"x-text x-text-headline e7385-e74 m5p5-x m5p5-11 m5p5-12 m5p5-13\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\"><div id=\"welcome\">Welcome Reception<\/div><\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e7385-e75 m5p5-18\"><div>\n<p>If this is your twenty-forth time attending TestConX, only your first, or somewhere in-between you will feel welcomed at the opening reception by friends old and new.<\/p>\n<\/div><\/div><\/div><\/div><div class=\"x-container max width e7385-e76 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-4 e7385-e77 m5p5-9\"><div class=\"x-text x-text-headline e7385-e78 m5p5-x m5p5-z m5p5-11 m5p5-12\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">6:30 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7385-e79 m5p5-9\"><div class=\"x-text x-text-headline e7385-e80 m5p5-x m5p5-11 m5p5-12 m5p5-13\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">Dinner<\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e7385-e81 m5p5-18\"><p>The first of many excellent meals awaits as you get to network with other industry professionals. This is a great time to catch up with old colleagues or start meeting new friends.<\/p><\/div><\/div><\/div><div class=\"x-container max width e7385-e82 m5p5-5 m5p5-6 m5p5-8\"><div class=\"x-column x-sm x-1-4 e7385-e83 m5p5-9\"><div class=\"x-text x-text-headline e7385-e84 m5p5-x m5p5-z m5p5-11 m5p5-12 m5p5-14\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">7:30 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7385-e85 m5p5-9\"><div class=\"x-row e7385-e86 m5p5-g m5p5-i m5p5-n\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e87 m5p5-u\"><hr class=\"x-line e7385-e88 m5p5-w\"\/><\/div><\/div><\/div>\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Market\">Market Snapshot<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\"><\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Market Snapshot&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nIra Feldman\n      <\/div>\n\t    <div class=\"authorCompany\">\nFeldman Engineering\n\t    <\/div>\n   <\/div>\n<\/div>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025MarketSnapshot_1234.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2025\/TestConX2025MarketSnapshot_1234.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<hr class=\"x-line e7385-e90 m5p5-w\"\/>\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Panel\">Panel<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\"><\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Challenges of hiring and retaining semiconductor test talent&rdquo; \n<\/div>\n<\/div>\n<\/div>\n\t \n<\/div><\/div><div class=\"x-container max width e7385-e92 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-4 e7385-e93 m5p5-9\">&nbsp;<\/div><div class=\"x-column x-sm x-3-4 e7385-e94 m5p5-9\"><div class=\"x-text x-content e7385-e95 m5p5-15\"><p><em><span style=\"font-weight: 400;\">It&rsquo;s not fun to be on a tester all day&hellip;<\/span><\/em><br>\n<em><span style=\"font-weight: 400;\">I can&rsquo;t do it since it&rsquo;s all tribal knowledge (or I didn&rsquo;t learn any of this in college)&hellip;<\/span><\/em><br>\n<em><span style=\"font-weight: 400;\">Too much stress and pressure to catch up all the project delays before it gets to test&hellip;<\/span><\/em><br>\n<em><span style=\"font-weight: 400;\">Not rewarding enough on the technical front...<\/span><\/em><br>\n<em><span style=\"font-weight: 400;\">There is no future in test engineering. AI will do it all soon&hellip;<\/span><\/em><\/p>\n<p><span style=\"font-weight: 400;\">These are some of the many things we have heard over the past twenty years as test engineers in the semiconductor industry. Most companies and experienced managers seem to know this and are working to remedy these concerns. However, there continues to always be a shortage of good test and product engineers and engineering managers. I.e., engineers who are internally motivated and energized to be in test and product engineering seem harder to find with each passing day.&nbsp;<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Why is this the case and what do we as a community need to do different to engage and retain highly motivated and high performing staff in these functions? Or will AI really be the test engineer of the future&hellip; full automation from silicon data to test code to pass fail results?<\/span><\/p>\n<p><span style=\"font-weight: 400;\">We will have an open discussion on this topic to attempt to get a better understanding of the issues.&nbsp;<\/span><\/p><\/div><hr class=\"x-line e7385-e96 m5p5-w\"\/><div class=\"x-row e7385-e97 m5p5-g m5p5-i m5p5-o\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e98 m5p5-u\"><span class=\"x-image e7385-e99 m5p5-b m5p5-d\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2024korea\/Dale_Ohmart_200sq.png\" width=\"200\" height=\"200\" alt=\"Dale Ohmart\" loading=\"lazy\"><\/span><div class=\"x-text x-content e7385-e100 m5p5-15\"><p><strong>Dale Ohmart<\/strong><\/p>\nTest Technology Group<\/div><\/div><div class=\"x-col e7385-e101 m5p5-u\"><div class=\"x-acc e7385-e102 m5p5-17\" id=\"x-acc-e7385-e102\"><div class=\"e7385-e103 x-acc-item\"><button id=\"tab-e7385-e103\" class=\"x-acc-header\" role=\"button\" type=\"button\" aria-expanded=\"false\" aria-controls=\"panel-e7385-e103\" data-x-toggle=\"collapse\" data-x-toggleable=\"e7385-e103\"><span class=\"x-acc-header-content\"><span class=\"x-acc-header-indicator\">&#x25b8;<\/span><span class=\"x-acc-header-text\">Biography<\/span><\/span><\/button><div id=\"panel-e7385-e103\" role=\"tabpanel\" aria-hidden=\"true\" aria-labelledby=\"tab-e7385-e103\" data-x-toggleable=\"e7385-e103\" data-x-toggle-collapse=\"1\" class=\"x-collapsed\"><div class=\"x-acc-content\"><div class=\"x-text x-content e7385-e104 m5p5-15\"><p><span style=\"font-weight: 400;\"><strong>Dale Ohmart<\/strong> is currently a Senior Technologist in the Test Technology Group and Distinguished Member of the Technical Staff, where he is focused on driving excellence in test throughout the company. He holds several patents in test and assembly technology.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">He joined Texas Instruments after graduating from the University of Kansas in 1980 with his Bachelor of Science degree in Engineering Physics.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">His first role was Microprocessor Product Engineer. He was promoted to Test Engineering Manager for the Microprocessors group in 1981 and has been involved in test ever since.&nbsp;<\/span><\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><div class=\"x-row e7385-e105 m5p5-g m5p5-i m5p5-p\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e106 m5p5-u\"><span class=\"x-image e7385-e107 m5p5-b m5p5-d\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2024korea\/Hailin_Wang_200sq.png\" width=\"200\" height=\"200\" alt=\"Image\" loading=\"lazy\"><\/span><div class=\"x-text x-content e7385-e108 m5p5-15\"><p><strong>Hailin Wang<\/strong><\/p>\nElevATE Semiconductor<\/div><\/div><div class=\"x-col e7385-e109 m5p5-u\"><div class=\"x-acc e7385-e110 m5p5-17\" id=\"x-acc-e7385-e110\"><div class=\"e7385-e111 x-acc-item\"><button id=\"tab-e7385-e111\" class=\"x-acc-header\" role=\"button\" type=\"button\" aria-expanded=\"false\" aria-controls=\"panel-e7385-e111\" data-x-toggle=\"collapse\" data-x-toggleable=\"e7385-e111\"><span class=\"x-acc-header-content\"><span class=\"x-acc-header-indicator\">&#x25b8;<\/span><span class=\"x-acc-header-text\">Biography<\/span><\/span><\/button><div id=\"panel-e7385-e111\" role=\"tabpanel\" aria-hidden=\"true\" aria-labelledby=\"tab-e7385-e111\" data-x-toggleable=\"e7385-e111\" data-x-toggle-collapse=\"1\" class=\"x-collapsed\"><div class=\"x-acc-content\"><div class=\"x-text x-content e7385-e112 m5p5-15\"><p><span style=\"font-weight: 400;\"><strong>Hailin<\/strong> is an Applications Engineer at ElevATE Semiconductor with a strong background in engineering and a passion for innovation. A graduate of the University of Toronto Hailin has accumulated diverse experience through COOP and internship roles, including work in software, as a Mixed Signal Engineer, and in academic research collaborations with the University of Toronto and Fidelity Investments. Committed to fostering opportunities for students and tackling complex technical challenges, Hailin is dedicated to advancing the field of engineering while inspiring the next generation of professionals.<\/span><\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><div class=\"x-row e7385-e113 m5p5-g m5p5-i m5p5-q\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e114 m5p5-u\"><span class=\"x-image e7385-e115 m5p5-b m5p5-d\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2024korea\/Ira_Burton_200sq.png\" width=\"200\" height=\"200\" alt=\"Ira Burton\" loading=\"lazy\"><\/span><div class=\"x-text x-content e7385-e116 m5p5-15\"><p><strong>Ira Burton<\/strong><\/p>\nBoise State University<\/div><\/div><div class=\"x-col e7385-e117 m5p5-u\"><div class=\"x-acc e7385-e118 m5p5-17\" id=\"x-acc-e7385-e118\"><div class=\"e7385-e119 x-acc-item\"><button id=\"tab-e7385-e119\" class=\"x-acc-header\" role=\"button\" type=\"button\" aria-expanded=\"false\" aria-controls=\"panel-e7385-e119\" data-x-toggle=\"collapse\" data-x-toggleable=\"e7385-e119\"><span class=\"x-acc-header-content\"><span class=\"x-acc-header-indicator\">&#x25b8;<\/span><span class=\"x-acc-header-text\">Biography<\/span><\/span><\/button><div id=\"panel-e7385-e119\" role=\"tabpanel\" aria-hidden=\"true\" aria-labelledby=\"tab-e7385-e119\" data-x-toggleable=\"e7385-e119\" data-x-toggle-collapse=\"1\" class=\"x-collapsed\"><div class=\"x-acc-content\"><div class=\"x-text x-content e7385-e120 m5p5-15\"><p><span style=\"font-weight: 400;\"><strong>Ira Burton<\/strong> was recently appointed as the Inaugural Director for Boise State University&rsquo;s School of Computing, whose mission is collaborative partnership with industry. Ira is excited to be back at his alma mater (&rsquo;03 MS in Computer Science, &lsquo;99 BS&rsquo;s in Math and Computer Science) to launch this new institution, increasing computing graduates for Idaho, expanding research across academic disciplines, and teaching students of computing&rsquo;s societal impacts. The School&rsquo;s cross-discipline nature provides a home for topics broader than any single department like Cybersecurity, Data Science, and Artificial Intelligence.&nbsp;<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Prior to joining Boise State, Ira held multiple leadership roles in his 28-year career at Micron Technology, all within an internal tester development group. Starting as a software engineering focusing on hardware\/software co-design, he built compilers for custom ASICs and kernel modules for real-time distributed systems. After 10 years, Ira transitioned to leading software development, eventually leading all the tester engineering disciplines. Most recently, as the Director of Strategic Engineering, he gained appreciation for the business and operations side developing testers, overseeing Product Management and Business Process.&nbsp;<\/span><\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><div class=\"x-row e7385-e121 m5p5-g m5p5-i m5p5-r\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e122 m5p5-u\"><span class=\"x-image e7385-e123 m5p5-b m5p5-d\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2024korea\/Ken_Lanier_200sq.png\" width=\"200\" height=\"200\" alt=\"Ken Lanier\" loading=\"lazy\"><\/span><div class=\"x-text x-content e7385-e124 m5p5-15\"><p><strong>Ken Lanier<\/strong><\/p>\nTeradyne<\/div><\/div><div class=\"x-col e7385-e125 m5p5-u\"><div class=\"x-acc e7385-e126 m5p5-17\" id=\"x-acc-e7385-e126\"><div class=\"e7385-e127 x-acc-item\"><button id=\"tab-e7385-e127\" class=\"x-acc-header\" role=\"button\" type=\"button\" aria-expanded=\"false\" aria-controls=\"panel-e7385-e127\" data-x-toggle=\"collapse\" data-x-toggleable=\"e7385-e127\"><span class=\"x-acc-header-content\"><span class=\"x-acc-header-indicator\">&#x25b8;<\/span><span class=\"x-acc-header-text\">Biography<\/span><\/span><\/button><div id=\"panel-e7385-e127\" role=\"tabpanel\" aria-hidden=\"true\" aria-labelledby=\"tab-e7385-e127\" data-x-toggleable=\"e7385-e127\" data-x-toggle-collapse=\"1\" class=\"x-collapsed\"><div class=\"x-acc-content\"><div class=\"x-text x-content e7385-e128 m5p5-15\"><p><span style=\"font-weight: 400;\"><strong>Ken Lanier<\/strong> has been in the ATE industry for over 40 years.&nbsp; He has held positions in applications engineering, system instrument design, as well as engineering and marketing management.&nbsp; He is currently a Director of Business Development and a Principal Technologist in the SOC test division at Teradyne in North Reading, Massachusetts.&nbsp; He was formerly a Director of Marketing at LTX.&nbsp; He received his Bachelor&rsquo;s degree in Electrical Engineering from Worcester Polytechnic Institute.&nbsp;<\/span><\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><div class=\"x-row e7385-e129 m5p5-g m5p5-i m5p5-s\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e130 m5p5-u\"><span class=\"x-image e7385-e131 m5p5-b m5p5-d\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2024korea\/Tyler_Waite_200sq.png\" width=\"200\" height=\"200\" alt=\"Tyler Waite\" loading=\"lazy\"><\/span><div class=\"x-text x-content e7385-e132 m5p5-15\"><p><strong>Tyler Waite<\/strong><\/p>\nMicron<\/div><\/div><div class=\"x-col e7385-e133 m5p5-u\"><div class=\"x-acc e7385-e134 m5p5-17\" id=\"x-acc-e7385-e134\"><div class=\"e7385-e135 x-acc-item\"><button id=\"tab-e7385-e135\" class=\"x-acc-header\" role=\"button\" type=\"button\" aria-expanded=\"false\" aria-controls=\"panel-e7385-e135\" data-x-toggle=\"collapse\" data-x-toggleable=\"e7385-e135\"><span class=\"x-acc-header-content\"><span class=\"x-acc-header-indicator\">&#x25b8;<\/span><span class=\"x-acc-header-text\">Biography<\/span><\/span><\/button><div id=\"panel-e7385-e135\" role=\"tabpanel\" aria-hidden=\"true\" aria-labelledby=\"tab-e7385-e135\" data-x-toggleable=\"e7385-e135\" data-x-toggle-collapse=\"1\" class=\"x-collapsed\"><div class=\"x-acc-content\"><div class=\"x-text x-content e7385-e136 m5p5-15\"><p><span style=\"font-weight: 400;\"><strong>Tyler Waite<\/strong> is the Senior Manager at Micron Technology, overseeing Technology Development in the Wafer Level Test department. With over 20 years of experience in functional test roles, both as an individual contributor and as a leader, Tyler has a deep understanding of the field. He holds a Bachelor's degree in Electrical Engineering from Boise State University. Tyler leads global teams to enhance quality and efficiency in test engineering, with a proven track record of developing and managing teams, innovating testing methodologies, and collaborating with various departments to achieve device functionality and yield. His ability to interact productively with diverse teams, work under pressure, and adapt to change makes him a valuable asset in the field of test engineering.<\/span><\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e7385-e137 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-4 e7385-e138 m5p5-9\"><div class=\"x-text x-text-headline e7385-e139 m5p5-x m5p5-z m5p5-11 m5p5-12\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">9:00 p<\/h2>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e7385-e140 m5p5-9\"><div class=\"x-text x-text-headline e7385-e141 m5p5-x m5p5-11 m5p5-12 m5p5-13\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">Adjourn\n<\/h1>\n<\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e7385-e142 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-1 e7385-e143 m5p5-9\"><div class=\"x-content-area e7385-e144 m5p5-18\"><p><em>Program subject to change without notice.<\/em><\/p><\/div><\/div><\/div><\/div><div class=\"x-section e7385-e145 m5p5-0 m5p5-2 m5p5-3\"><div class=\"x-container max width e7385-e146 m5p5-5 m5p5-6\"><div class=\"x-column x-sm x-1-1 e7385-e147 m5p5-9 m5p5-a\"><a class=\"x-anchor x-anchor-button e7385-e148 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Overview<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e149 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-sunday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Sunday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e150 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-monday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Monday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e151 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-tuesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Tuesday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e7385-e152 m5p5-e\" tabindex=\"0\" href=\"\/premium\/testconx2025-wednesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Wednesday<\/span><\/div><\/div><\/a><\/div><\/div><div class=\"x-row x-container max width e7385-e153 m5p5-g m5p5-i m5p5-t\"><div class=\"x-row-inner\"><div class=\"x-col e7385-e154 m5p5-u m5p5-v\"><hr class=\"x-line e7385-e155 m5p5-w\"\/><a class=\"x-anchor x-anchor-button e7385-e156 m5p5-e\" tabindex=\"0\" href=\"https:\/\/www.testconx.org\/premium\/testconx-expo-2025\/\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">EXPO<\/span><\/div><\/div><\/a><\/div><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>OverviewSundayMondayTuesdayWednesdayEXPORegisterEXPO OnlyRegistrationSunday March 2, 2025 &nbsp;There will be breaks including refreshments to provide networking time for Tutorial attendees. Please note: attendance at the tutorial will be limited. Please sign-up early to not miss out! 1:00 to&nbsp; 3:00 p TutorialOptional Tutorial &ldquo;Categorization, Testing, and Selection of Thermal Interface Materials for Semiconductor Test&rdquo; Dave Saums DS&#038;A LLC &nbsp;Presentation Download David L. SaumsDS&amp;AThermal &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/testconx2025-sunday\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"template-layout-content-sidebar.php","meta":{"footnotes":""},"class_list":["post-7385","page","type-page","status-publish","hentry","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/7385","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=7385"}],"version-history":[{"count":40,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/7385\/revisions"}],"predecessor-version":[{"id":7796,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/7385\/revisions\/7796"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=7385"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}