{"id":7221,"date":"2024-08-16T13:38:53","date_gmt":"2024-08-16T20:38:53","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=7221"},"modified":"2025-03-02T12:25:03","modified_gmt":"2025-03-02T20:25:03","slug":"testconx-china-2024","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx-china-2024\/","title":{"rendered":"TestConX China 2024"},"content":{"rendered":"
\"Image\"<\/span>

Pudong, Shanghai\u00a0October\u00a031, 2024<\/span><\/strong><\/h1>\n<\/div><\/div><\/div>

InterContinental Shanghai Pudong Hotel<\/a>
\nNo. 777 Zhangyang Road,
\nPudong New Area Shanghai, SH, 200120,
\nPeople's Republic of China
\n+86-21-58356666<\/p>\n

\u00a0Workshop registration includes all technical sessions, the TestConX EXPO, buffet lunch, morning & afternoon tea breaks,\u00a0<\/span><\/span>and download of the Proceedings.<\/span><\/span><\/p><\/div><\/div><\/div><\/div><\/div>

TestConX<\/span><\/a>, over the course of its twenty-five-year history, has established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope includes packaged semiconductor \u201cfinal\u201d test, burn-in, system level test, and beyond to encompass all practical aspects of electronics testing such as validation, advanced packaging testing, module test, and finished product test.<\/span><\/p>\n

Join us in-person for the 10th annual TextConX China<\/strong>! You will not want to\u00a0<\/span>miss this opportunity to be part of TestConX as we connect a larger community of test professionals and to participate in this excellent event!<\/span><\/p>\n

For companies interested in exhibiting or sponsoring please see opportunities below.<\/p><\/div>

EXPO<\/span><\/div><\/div><\/a><\/div><\/div><\/div>

Thursday October 31, 2024<\/span><\/strong><\/h1>\n<\/div><\/div><\/div>
<\/div><\/div><\/div>

9:00<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Welcome<\/div><\/div>
Welcome<\/div>
<\/div>

<\/p><\/div><\/div>\n\t \n<\/div><\/div><\/div>

<\/div>
\n
\n
Keynote<\/div><\/div>
Keynote<\/div>
<\/div>

<\/p><\/div>

\n
\n“Testing and Built-In Fault-Tolerance Against Silent Data Corruptions on Computing Chips” \n
“\u9762\u5411\u591a\u6838\u7b97\u529b\u82af\u7247\u9759\u9ed8\u6570\u636e\u635f\u574f\u7684\u6d4b\u8bd5\u548c\u7247\u4e0a\u5bb9\u9519\u8ba1\u7b97\u6280\u672f” \n<\/div>\n
\n
\n
\nHuawei Li\n <\/div>\n\t
\nChinese Academy Of Sciences\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract (English)<\/summary>\n

Chip multiprocessors or deep learning processors, provide arrays of processing engines to meet the increasing computing power requirements of various applications. However, silent data corruptions (SDCs) induced by unreliable integrated circuits, impacting the computational integrity of processing engines, have raised increasing attention in industry. For instance, in data centers, the propagation of SDCs can cause data loss and may need months of debugging. This talk will expose the origins of SDCs and emphasize the challenges of sufficient testing of nanotechnology integrated circuits along with opportunities to improve testing. Built-in fault-tolerant computing techniques against SDCs will then be discussed across circuit level, architecture level, and algorithm level, to detect and\/or correct the SDCs with low latencies.\r\n<\/p><\/details>\n

\n\t\u6458\u8981 (Chinese)<\/summary>\n

\u6f14\u8bb2\u6458\u8981\uff1a\r\n\u591a\u5904\u7406\u5668\u82af\u7247\u548c\u6df1\u5ea6\u5b66\u4e60\u5904\u7406\u82af\u7247\u901a\u8fc7\u63d0\u4f9b\u5927\u91cf\u5904\u7406\u5f15\u64ce\u6765\u6ee1\u8db3\u5404\u7c7b\u5e94\u7528\u65e5\u76ca\u589e\u957f\u7684\u7b97\u529b\u9700\u6c42\uff0c\u7136\u800c\uff0c\u7531\u4e0d\u53ef\u9760\u7684\u96c6\u6210\u7535\u8def\u5f15\u53d1\u7684\u9759\u9ed8\u6570\u636e\u635f\u574f\uff08SDC\uff09\uff0c\u5bf9\u8ba1\u7b97\u5b8c\u6574\u6027\u7684\u5f71\u54cd\u5df2\u7ecf\u5f15\u8d77\u5de5\u4e1a\u754c\u7684\u65e5\u76ca\u91cd\u89c6\u3002\u4f8b\u5982\u5728\u6570\u636e\u4e2d\u5fc3\uff0cSDC\u4f20\u64ad\u5bfc\u81f4\u7684\u6570\u636e\u4e22\u5931\u53ef\u80fd\u9700\u8981\u51e0\u4e2a\u6708\u65f6\u95f4\u53bb\u67e5\u627e\u95ee\u9898\u3002\u8bb2\u8005\u5c06\u9996\u5148\u63a2\u8ba8SDC\u4ea7\u751f\u7684\u539f\u56e0\uff0c\u9610\u8ff0\u5bf9\u7eb3\u7c73\u7ea7\u96c6\u6210\u7535\u8def\u6d4b\u8bd5\u8fdb\u884c\u5145\u5206\u6d4b\u8bd5\u9762\u4e34\u7684\u6311\u6218\u548c\u63d0\u5347\u6d4b\u8bd5\u8d28\u91cf\u7684\u89e3\u51b3\u65b9\u6848\uff1b\u7136\u540e\u5c06\u4ecb\u7ecd\u5e94\u5bf9SDC\u7684\u7247\u4e0a\u5bb9\u9519\u8ba1\u7b97\u6280\u672f\uff0c\u6d89\u53ca\u5728\u7535\u8def\u7ea7\u3001\u67b6\u6784\u7ea7\u3001\u7b97\u6cd5\u7ea7\u7b49\u5c42\u6b21\u5982\u4f55\u5b9e\u73b0\u4f4e\u5ef6\u65f6\u7684\u5dee\u9519\u68c0\u6d4b\u548c\u6062\u590d\u3002\r\n<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n
\"HuaweiLi\"<\/span><\/div>
\u6f14\u8bb2\u4eba\u7b80\u4ecb\uff1a<\/span>\u674e\u534e\u4f1f\uff0c\u4e2d\u56fd\u79d1\u5b66\u9662\u8ba1\u7b97\u6280\u672f\u7814\u7a76\u6240\u7814\u7a76\u5458\uff0c\u5904\u7406\u5668\u82af\u7247\u5168\u56fd\u91cd\u70b9\u5b9e\u9a8c\u5ba4\u526f\u4e3b\u4efb\uff0c\u4e2d\u79d1\u9274\u82af\uff08\u5317\u4eac\uff09\u79d1\u6280\u6709\u9650\u8d23\u4efb\u516c\u53f8\u8463\u4e8b\u957f\uff0c\u5165\u9009\u56fd\u5bb6\u9ad8\u5c42\u6b21\u4eba\u624d\u8ba1\u5212\u79d1\u6280\u521b\u65b0\u9886\u519b\u4eba\u624d\u3002\u4e3b\u8981\u4ece\u4e8b\u6570\u5b57\u7535\u8def\u6d4b\u8bd5\u4e0e\u5bb9\u9519\u3001\u4e13\u7528\u5904\u7406\u5668\u81ea\u52a8\u8bbe\u8ba1\u7b49\u65b9\u5411\u7814\u7a76\uff0c\u53d1\u8868\u8bba\u6587300\u4f59\u7bc7\uff0c\u66fe\u83b72012\u5e74\u56fd\u5bb6\u6280\u672f\u53d1\u660e\u4e8c\u7b49\u5956\u30012021\u5e74IEEE TC\u671f\u520a\u5e74\u5ea6\u6700\u4f73\u8bba\u6587\u5956\u30012019\u5e74ICCD\u56fd\u9645\u4f1a\u8bae\u6700\u4f73\u8bba\u6587\u5956\u30012018\u5e74ITC-Asia\u56fd\u9645\u4f1a\u8bae\u6700\u4f73\u8bba\u6587\u5956\u7b49\u591a\u4e2a\u5956\u9879\u3002\u674e\u6559\u6388\u62c5\u4efbIEEE Design & Test\u3001IEEE TVLSI\u3001JCST\u7b49\u671f\u520a\u7f16\u59d4\uff0cCCF\u96c6\u6210\u7535\u8def\u8bbe\u8ba1\u4e13\u59d4\u4e3b\u4efb\uff0c\u66fe\u4efbCCF\u5bb9\u9519\u8ba1\u7b97\u4e13\u59d4\u4e3b\u4efb\uff082016-2019\uff09\uff0cIEEE\u4e9a\u6d32\u6d4b\u8bd5\u5b66\u672f\u4f1a\u8bae\uff08ATS\uff09\u6307\u5bfc\u59d4\u5458\u4f1a\u4e3b\u5e2d\uff082020-2022\uff09\u3002<\/b><\/div><\/div><\/div><\/div><\/div><\/div><\/div>
<\/div>

Huawei Li<\/b> is a Professor in the Institute of Computing Technology, Chinese Academy of Sciences, and the President and Co-founder of CASTEST Inc. She received her Ph.D. in Computer Science from Chinese Academy of Sciences in 2001. Her current research interests include testing and fault tolerance of VLSI\/SOC circuits, and automatic design of deep learning processors. <\/span>She has published over 300 technical papers in these areas. <\/span>She was a recipient of the 2012 National Technology Invention Award of China, a recipient of the Best Paper Awards of 2021 IEEE Transactions on Computers (TC), 2019 IEEE International Conference on Computer Design (ICCD), and 2018 IEEE International Test Conference in Asia (ITC-Asia).\u00a0<\/span><\/p>\n

<\/p>\n

Prof. Li serves as an Associate Editor for IEEE Design & Test, IEEE Transactions on Very Large Scale Integration (TVLSI), and Journal of Computer Science & Technology (JCST). She is currently the Chair of the China Computer Federation (CCF) Technical Committee on Integrated Circuit Design. She served as the Chair of the CCF Technical Committee on Fault Tolerant Computing (2016\u20132019), and the Steering Committee Chair for IEEE Asian Test Symposium (2020-2022). <\/span><\/p><\/div><\/div><\/div><\/div>\n

\n
Market<\/div><\/div>
Market<\/div>
<\/div>

<\/p><\/div>

\n
\n“What next for Asian suppliers of test and burn-in sockets?” \n
“\u4e9a\u6d32\u6d4b\u8bd5\u53ca\u8001\u5316\u63d2\u5ea7\u4f9b\u5e94\u5546\u7684\u4e0b\u4e00\u6b65\u53d1\u5c55\u662f\u4ec0\u4e48\uff1f” \n<\/div>\n
\n
\n
\nJohn West\n <\/div>\n\t
\nYole Group\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

Asia has long been the leading center for semiconductor testing. In fact, until recently, the region's test houses steadily eroded the relatively small share of tests still being done in Europe, the US, and the rest of the world. Asian socket suppliers have done well in serving their home markets, and together, they now account for over 75% of worldwide socket revenues.<\/p>\r\n \r\n

This situation is changing as the various chip acts and the re-evaluation of chipmakers' manufacturing strategies impact the test landscape. This presentation explains how semiconductor testing is shifting regionally and within regions and what that means for burn-in and test socket suppliers.<\/p><\/p>

John West<\/strong> is a Senior Director of the Semiconductor Subsystems and Test Division at Yole Group. He has over 20 years of industry experience and a successful track record in various strategy and consulting projects. John has a Bachelor's degree in Medical Physics from King's College London and an MBA from Cranfield School of Management.<\/p><\/p><\/details>\n

\n\t\u6458\u8981 (Chinese)<\/summary>\n

\u4e9a\u6d32\u957f\u671f\u4ee5\u6765\u4e00\u76f4\u662f\u534a\u5bfc\u4f53\u6d4b\u8bd5\u7684\u9886\u5148\u4e2d\u5fc3\u3002\u5b9e\u9645\u4e0a\uff0c\u76f4\u5230\u6700\u8fd1\uff0c\u8be5\u5730\u533a\u7684\u6d4b\u8bd5\u673a\u6784\u4e00\u76f4\u5728\u7a33\u6b65\u4fb5\u8680\u5728\u6b27\u6d32\u3001\u7f8e\u56fd\u548c\u4e16\u754c\u5176\u4ed6\u5730\u533a\u4ecd\u5728\u8fdb\u884c\u7684\u76f8\u5bf9\u8f83\u5c0f\u7684\u6d4b\u8bd5\u4efd\u989d\u3002\u4e9a\u6d32\u63d2\u5ea7\u4f9b\u5e94\u5546\u5728\u670d\u52a1\u672c\u56fd\u5e02\u573a\u65b9\u9762\u505a\u5f97\u5f88\u597d\uff0c\u4ed6\u4eec\u73b0\u5728\u5171\u540c\u5360\u636e\u4e86\u5168\u7403\u63d2\u5ea7\u6536\u5165\u768475%\u4ee5\u4e0a\u3002<\/p>\r\n

\u8fd9\u79cd\u60c5\u51b5\u6b63\u5728\u968f\u7740\u5404\u79cd\u82af\u7247\u6cd5\u6848\u4ee5\u53ca\u5bf9\u82af\u7247\u5236\u9020\u5546\u5236\u9020\u7b56\u7565\u7684\u91cd\u65b0\u8bc4\u4f30\u5f71\u54cd\u6d4b\u8bd5\u683c\u5c40\u800c\u53d1\u751f\u53d8\u5316\u3002\u672c\u6b21\u6f14\u8bb2\u5c06\u89e3\u91ca\u534a\u5bfc\u4f53\u6d4b\u8bd5\u5982\u4f55\u5728\u533a\u57df\u5185\u90e8\u548c\u533a\u57df\u4e4b\u95f4\u8f6c\u79fb\uff0c\u4ee5\u53ca\u8fd9\u5bf9\u8001\u5316\u6d4b\u8bd5\u548c\u63d2\u5ea7\u4f9b\u5e94\u5546\u610f\u5473\u7740\u4ec0\u4e48\u3002<\/p>\r\n<\/p>

<\/p><\/details>\n

\n\t\uc804\uae30 (Korean)<\/summary>\n

<\/p>

John West<\/strong>\u662fYole Group\u534a\u5bfc\u4f53\u5b50\u7cfb\u7edf\u53ca\u6d4b\u8bd5\u90e8\u95e8\u7684\u9ad8\u7ea7\u603b\u76d1\u3002\r\n\u4ed6\u6709\u7740\u957f\u8fbe20\u591a\u5e74\u7684\u884c\u4e1a\u7ecf\u9a8c\uff0c\u5e76\u5728\u591a\u79cd\u6218\u7565\u548c\u54a8\u8be2\u9879\u76ee\u4e2d\u53d6\u5f97\u4e86\u6210\u529f\u3002John\u62e5\u6709\u4f26\u6566\u56fd\u738b\u5b66\u9662\u533b\u5b66\u7269\u7406\u5b66\u5b66\u58eb\u5b66\u4f4d\u548c\u514b\u5170\u83f2\u5c14\u5fb7\u5927\u5b66\u7ba1\u7406\u5b66\u9662\u5de5\u5546\u7ba1\u7406\u7855\u58eb\u5b66\u4f4d\u3002<\/p><\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

10:45<\/h1>\n<\/div><\/div><\/div><\/div>

Break & Networking<\/strong><\/h1>\nEnjoy time to meet with the presenters and network while refreshments are served.<\/span><\/span><\/div><\/div><\/div><\/div><\/div><\/div>

11:15<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Session 1<\/div><\/div>
Session 1<\/div>
<\/div>

<\/p><\/div>

\n
\n“Optimizing testing costs using AI technology in big data systems” \n
“\u5229\u7528\u5927\u6570\u636e\u7cfb\u7edf\u7684AI\u6280\u672f\u4f18\u5316\u6d4b\u8bd5\u6210\u672c” \n<\/div>\n
\n
\n
\nLisi \"Ma\" Ma\n <\/div>\n\t
\nShanghai Gubo Technology Co., Ltd.\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

With the rapid development of the semiconductor industry, the volume of data generated during the mass production process has increased dramatically, providing a rich source of information for semiconductor testing. This paper proposes an analytical method based on Gubo OneData big data system to mine and analyze the vast amount of semiconductor testing data to discover potential correlations between different testing phases. By constructing advanced data mining algorithms, this study is able to identify key test items affecting the performance of semiconductor products and further evaluate the interrelationships among these test items. The results show that by optimizing the testing process and eliminating redundant or inefficient test items, production costs can be significantly reduced while ensuring product quality. This paper details the entire process of data collection, preprocessing, feature selection, model construction, and validation, and presents practical application cases, proving the effectiveness and feasibility of the method in actual production environments. Ultimately, this study provides a new cost optimization strategy for the semiconductor industry, which helps to promote technological progress and economic benefits in the industry.<\/p>\r\n\r\n

Keywords: Semiconductor Testing; Big Data Analysis; Data Mining; Cost Optimization; Correlation Analysis<\/p>\r\n<\/p>

Lisi Ma<\/strong> as one of the core team members of Gubo Technologies, Lisi Ma is currently in charge of the Product Management and Design Team. His expertise and domain of responsibilities extend to areas including testing and automation, data analysis, and the product definition of enterprise-level R&D product management platforms. He leads the team in conducting multiple in-depth collaborations with top-tier design companies in China.<\/p><\/p><\/details>\n

\n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

\u968f\u7740\u534a\u5bfc\u4f53\u884c\u4e1a\u7684\u5feb\u901f\u53d1\u5c55\uff0c\u5927\u89c4\u6a21\u751f\u4ea7\u8fc7\u7a0b\u4e2d\u4ea7\u751f\u7684\u6570\u636e\u91cf\u6025\u5267\u589e\u52a0\uff0c\u4e3a\u534a\u5bfc\u4f53\u6d4b\u8bd5\u63d0\u4f9b\u4e86\u4e30\u5bcc\u7684\u4fe1\u606f\u8d44\u6e90\u3002\u672c\u6587\u63d0\u51fa\u4e86\u4e00\u79cd\u57fa\u4e8e\u5b64\u6ce2OneData\u5927\u6570\u636e\u7cfb\u7edf\u7684\u5206\u6790\u65b9\u6cd5\uff0c\u65e8\u5728\u901a\u8fc7\u6316\u6398\u548c\u5206\u6790\u6d77\u91cf\u534a\u5bfc\u4f53\u6d4b\u8bd5\u6570\u636e\uff0c\u53d1\u73b0\u4e0d\u540c\u6d4b\u8bd5\u9636\u6bb5\u4e4b\u95f4\u7684\u6f5c\u5728\u76f8\u5173\u6027\u3002\u901a\u8fc7\u6784\u5efa\u5148\u8fdb\u7684\u6570\u636e\u6316\u6398\u7b97\u6cd5\uff0c\u672c\u7814\u7a76\u80fd\u591f\u8bc6\u522b\u51fa\u5f71\u54cd\u534a\u5bfc\u4f53\u4ea7\u54c1\u6027\u80fd\u7684\u5173\u952e\u6d4b\u8bd5\u9879\u76ee\uff0c\u5e76\u8fdb\u4e00\u6b65\u8bc4\u4f30\u8fd9\u4e9b\u6d4b\u8bd5\u9879\u76ee\u4e4b\u95f4\u7684\u76f8\u4e92\u5173\u7cfb\u3002\u7814\u7a76\u7ed3\u679c\u8868\u660e\uff0c\u901a\u8fc7\u4f18\u5316\u6d4b\u8bd5\u6d41\u7a0b\uff0c\u5254\u9664\u5197\u4f59\u6216\u4f4e\u6548\u7684\u6d4b\u8bd5\u9879\u76ee\uff0c\u53ef\u4ee5\u663e\u8457\u964d\u4f4e\u751f\u4ea7\u6210\u672c\uff0c\u540c\u65f6\u4fdd\u8bc1\u4ea7\u54c1\u8d28\u91cf\u3002\u672c\u8bba\u6587\u8be6\u7ec6\u4ecb\u7ecd\u4e86\u6570\u636e\u6536\u96c6\u3001\u9884\u5904\u7406\u3001\u7279\u5f81\u9009\u62e9\u3001\u6a21\u578b\u6784\u5efa\u548c\u9a8c\u8bc1\u7684\u5168\u8fc7\u7a0b\uff0c\u5e76\u5c55\u793a\u4e86\u5b9e\u9645\u5e94\u7528\u6848\u4f8b\uff0c\u8bc1\u660e\u4e86\u8be5\u65b9\u6cd5\u5728\u5b9e\u9645\u751f\u4ea7\u73af\u5883\u4e2d\u7684\u6709\u6548\u6027\u548c\u53ef\u884c\u6027\u3002\u6700\u7ec8\uff0c\u672c\u7814\u7a76\u4e3a\u534a\u5bfc\u4f53\u884c\u4e1a\u63d0\u4f9b\u4e86\u4e00\u79cd\u65b0\u7684\u6210\u672c\u4f18\u5316\u7b56\u7565\uff0c\u6709\u52a9\u4e8e\u63a8\u52a8\u884c\u4e1a\u7684\u6280\u672f\u8fdb\u6b65\u548c\u7ecf\u6d4e\u6548\u76ca\u7684\u63d0\u5347\u3002<\/p>\r\n\r\n

\u5173\u952e\u8bcd\uff1a\u534a\u5bfc\u4f53\u6d4b\u8bd5\uff1b\u5927\u6570\u636e\u5206\u6790\uff1b\u6570\u636e\u6316\u6398\uff1b\u6210\u672c\u4f18\u5316\uff1b\u76f8\u5173\u6027\u5206\u6790<\/p>\r\n<\/p>

\u9a6c\u529b\u65af<\/strong>\u4f5c\u4e3a\u4e0a\u6d77\u5b64\u6ce2\u79d1\u6280\u6709\u9650\u516c\u53f8\u7684\u6838\u5fc3\u56e2\u961f\u6210\u5458\u4e4b\u4e00\uff0c\u76ee\u524d\u8d1f\u8d23\u4ea7\u54c1\u7ba1\u7406\u4e0e\u8bbe\u8ba1\u56e2\u961f\u3002\u4ed6\u7684\u4e13\u4e1a\u9886\u57df\u5305\u62ec\u6d4b\u8bd5\u4e0e\u81ea\u52a8\u5316\u3001\u6570\u636e\u5206\u6790\u4ee5\u53ca\u4f01\u4e1a\u7ea7\u7814\u53d1\u4ea7\u54c1\u7ba1\u7406\u5e73\u53f0\u7684\u4ea7\u54c1\u5b9a\u4e49\u3002\u4ed6\u5e26\u9886\u56e2\u961f\u4e0e\u56fd\u5185\u4e00\u7ebf\u8bbe\u8ba1\u516c\u53f8\u8fdb\u884c\u591a\u4e2a\u6df1\u5ea6\u5408\u4f5c\u3002<\/p>\r\n<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n
\n
\n“Development and Verification of Wet Testing Platform for BioMEMS Chips” \n
“\u751f\u7269\u5fae\u673a\u7535\u82af\u7247\u6e7f\u6d4b\u8bd5\u5e73\u53f0\u7684\u5f00\u53d1\u4e0e\u9a8c\u8bc1” \n<\/div>\n
\n
\n
\nPo Ting Lai\n <\/div>\n\t
\nKYEC\n\t <\/div>\n <\/div>\n
\n
\nYu-Hao Ciou\n <\/div>\n\t
\nKYEC\n\t <\/div>\n <\/div>\n
\n
\nChieh-Wen Lu\n <\/div>\n\t
\nKYEC\n\t <\/div>\n <\/div>\n
\n
\nWendy Chen\n <\/div>\n\t
\nKYEC\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

According to the Yole 2023 report, the production value of silicon-based biomedical chips is expected to reach US$900 million by 2027. After the outbreak of COVID-19, many medical institutions found that traditional PCR testing was too slow. The need for fast detection led many companies to invest in the development of new types of BioMEMS. MEMS technology can reduce the size of BioMEMS chips and integrate microfluidic systems. The microstructure on BioMEMS can effectively reduce the usage of reagents. The testing requires only a small amount of sample, reagent, and testing time to obtain results. On the other hand, even with the strong performance of BioMEMS, due to the lack of mature mass production testing technologies, the low coverage rate of mass production testing causes the BioMEMS production capacity to be unable to increase.<\/p>\r\n\r\n

This study developed a wet testing platform for BioMEMS chips and achieved stable and highly reproducible measurement results. BioMEMS chips require additional wet testing to verify product yield. In the wet testing process, the test solution is dispensed onto the sensing area of the chip test key, the Kelvin pin makes contact with the pad, and then electrical testing can commence. In addition, due to the restriction of the structure and size of the BioMEMS chip, the volume of the solution to be tested must be controlled within a micro volume of 1 \u03bcl. Based on the above situations, this study developed the wet testing platform according to the droplet testing method used in the past. The wet testing platform integrates and optimizes the probe station, semiconductor analyzer, and microfluidic control system. The testing method also verified the influencing factors such as solution concentration, different solutions, cleaning methods, testing time, and needle force, and used the experimental results to improve the testing process. Additionally, this study developed a water-retaining shield method for long-term testing. The shield prevents test sample evaporation and environmental effects. In long-term testing, the shield prolonged the testing time and stabilized the measurement data. This testing platform and process were also verified with the BioMEMS chips, and the measurement data of electrical properties not only showed accuracy but also reproducibility. In summary, the developed wet testing platform can provide reliable electrical measurement capability and has the potential to be developed into a semi-automatic and fully automatic testing platform. The technology is expected to be applied in the field of contract manufacturing testing in the future.<\/p>\r\n<\/p>

Po-Ting Lai<\/strong> joined King Yuan Electronics in 2018 and is currently a staff engineer in the Advanced Test Development & Application division.<\/p>\r\n

Over the past seven years, his work specifically focusing on developing mass production testing technologies for bioMEMS and microfluidic chips.<\/p>\r\n

In recent years, his team has presented their research findings at the 2020 ITC-Asia, 2023 ITC-Asia, and 2024 ICSS conferences, and has been awarded several invention patents.<\/p><\/p><\/details>\n

\n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

\u751f\u7269\u5fae\u673a\u7535(BioMEMS)\u5728\u751f\u533b\u82af\u7247\u4e2d\u662f\u4e2a\u53d1\u5c55\u8fc5\u901f\u7684\u9886\u57df\uff0c\u6839\u636e2023\u7684\u4ea7\u4e1a\u62a5\u544a\uff0c\u751f\u533b\u82af\u7247\u7684\u4ea7\u503c\u57282027\u9884\u8ba1\u5c06\u8fbe\u52309\u4ebf\u7f8e\u5143\u3002\u6b64\u5916\u5728\u65b0\u51a0\u75ab\u60c5\u7206\u53d1\u540e\uff0c\u8ba9\u533b\u5b66\u5355\u4f4d\u53d1\u73b0\u4f20\u7edfPCR\u7684\u901f\u5ea6\u592a\u6162\uff0c\u6545\u8bb8\u591a\u4f01\u4e1a\u4e0e\u5b9e\u9a8c\u5ba4\u7686\u6295\u5165\u65b0\u578b\u751f\u7269\u5fae\u673a\u7535\u7684\u5f00\u53d1\u3002\u5fae\u673a\u7535\u6280\u672f\u53ef\u4ee5\u51cf\u5c0f\u82af\u7247\u7684\u5c3a\u5bf8\uff0c\u5e76\u96c6\u6210\u5fae\u6d41\u63a7\u6280\u672f\u3002\u82af\u7247\u4e0a\u7684\u5fae\u7ed3\u6784\u53ef\u4ee5\u6709\u6548\u51cf\u5c11\u8bd5\u5242\u7684\u7528\u91cf\uff0c\u68c0\u6d4b\u53ea\u9700\u8981\u5c11\u91cf\u7684\u6837\u54c1\u3001\u8bd5\u5242\u53ca\u6d4b\u8bd5\u65f6\u95f4\u4fbf\u80fd\u591f\u5f97\u5230\u7ed3\u679c\u3002\u53e6\u4e00\u65b9\u9762\u5c3d\u7ba1\u751f\u7269\u5fae\u673a\u7535\u82af\u7247\u5177\u6709\u51fa\u8272\u7684\u6027\u80fd\uff0c\u4f46\u7531\u4e8e\u7f3a\u4e4f\u6210\u719f\u7684\u5927\u89c4\u6a21\u91cf\u4ea7\u6d4b\u8bd5\u6280\u672f\uff0c\u5bfc\u81f4\u91cf\u4ea7\u6d4b\u8bd5\u8986\u76d6\u7387\u4f4e\u8ff7\uff0c\u4f7f\u5f97\u7ec8\u7aef\u4ea7\u80fd\u65e0\u6cd5\u63d0\u5347\u3002<\/p>\r\n\r\n

\u6b64\u6b21\u7684\u7814\u7a76\uff0c\u6211\u4eec\u6839\u636e\u5ba2\u6237\u7684\u751f\u7269\u5fae\u673a\u7535\u82af\u7247\u5f00\u53d1\u4e86\u4e00\u4e2a\u624b\u52a8\u6d4b\u8bd5\u5e73\u53f0\uff0c\u5e76\u5b9e\u73b0\u4e86\u7a33\u5b9a\u4e14\u9ad8\u5ea6\u53ef\u91cd\u590d\u7684\u91cf\u6d4b\u7ed3\u679c\u3002\u8bb8\u591a\u751f\u7269\u5fae\u673a\u7535\u82af\u7247\u9700\u8981\u989d\u5916\u7684\u6e7f\u6d4b\u8bd5(wet testing)\u6765\u9a8c\u8bc1\u4ea7\u54c1\u7684\u826f\u7387\u3002\u5728\u6e7f\u6d4b\u8bd5\u8fc7\u7a0b\u4e2d\uff0c\u6d4b\u8bd5\u6eb6\u6db2\u4f1a\u6ef4\u5230\u82af\u7247\u6d4b\u8bd5\u952e(chip test key)\u7684\u611f\u6d4b\u533a\u57df\uff0c\u5e76\u5728\u6d4b\u8bd5\u952e\u4e0a\u7684\u82af\u7247\u5ea7(chip pad)\u624e\u9488(probing)\u540e\u624d\u80fd\u8fdb\u884c\u7535\u6027\u6d4b\u8bd5\u3002\u7531\u4e8e\u6b64\u82af\u7247\u7684\u7ed3\u6784\u5c3a\u5bf8\u53cd\u5e94\u533a\u57df\u4e0e\u82af\u7247\u5ea7\u8ddd\u79bb\u592a\u77ed\uff0c\u4f7f\u5f85\u6d4b\u6db2\u7684\u4f53\u79ef\u53d7\u9650\uff0c\u5fc5\u987b\u63a7\u5236\u57281\u5fae\u5347\u4ee5\u5185\u7684\u5fae\u4f53\u79ef\u3002\u57fa\u4e8e\u4e0a\u8ff0\u72b6\u51b5\uff0c\u6b64\u7814\u7a76\u6839\u636e\u8fc7\u53bb\u7684\u6ef4\u73e0\u6d4b\u8bd5\u65b9\u6cd5\u5f00\u53d1\u4e86\u5177\u81ea\u52a8\u5316\u6f5c\u529b\u7684\u6e7f\u6d4b\u8bd5\u5e73\u53f0\u3002\u6b64\u6e7f\u6d4b\u8bd5\u5e73\u53f0\u6574\u5408\u4e0e\u4f18\u5316\u4e86\u63a2\u9488\u53f0\u3001\u534a\u5bfc\u4f53\u5206\u6790\u4eea\u3001\u5fae\u6d41\u4f53\u63a7\u5236\u7cfb\u7edf\u3002\u6d4b\u8bd5\u65b9\u6cd5\u540c\u65f6\u5bf9\u5404\u5f85\u6d4b\u6db2\u6d53\u5ea6\u3001\u79cd\u7c7b\u3001\u5f85\u6d4b\u6db2\u6e05\u6d01\u65b9\u6cd5\u3001\u6d4b\u8bd5\u65f6\u95f4\u3001\u4e0b\u9488\u529b\u9053\u7b49\u5f71\u54cd\u56e0\u5b50\u8fdb\u884c\u9a8c\u8bc1\uff0c\u5e76\u5229\u7528\u5b9e\u9a8c\u7ed3\u679c\u5b8c\u6210\u6d4b\u8bd5\u6d41\u7a0b\u7684\u6539\u5584\u3002\u6b64\u5916\u7528\u4e8e\u957f\u671f\u91cf\u6d4b\uff0c\u672c\u7814\u7a76\u5f00\u53d1\u4e86\u4e00\u79cd\u6321\u6c34\u5899\u5c4f\u853d\u65b9\u6cd5\u3002\u8fd9\u79cd\u5c4f\u853d\u80fd\u9632\u6b62\u6d4b\u8bd5\u6837\u54c1\u53d7\u5230\u73af\u5883\u5f71\u54cd\u800c\u84b8\u53d1\u3002\u5728\u957f\u671f\u6d4b\u8bd5\u4e2d\uff0c\u5c4f\u853d\u80fd\u5ef6\u957f\u6d4b\u8bd5\u65f6\u95f4\u5e76\u4f7f\u6d4b\u91cf\u6570\u636e\u66f4\u52a0\u7a33\u5b9a\u3002\u8be5\u6d4b\u8bd5\u5e73\u53f0\u548c\u6d41\u7a0b\u4e5f\u5728\u5ba2\u6237\u7684\u751f\u7269\u5fae\u673a\u7535\u82af\u7247\u4e0a\u8fdb\u884c\u4e86\u9a8c\u8bc1\uff0c\u7535\u6027\u6d4b\u91cf\u6570\u636e\u4e0d\u4ec5\u663e\u793a\u4e86\u5176\u51c6\u786e\u6027\uff0c\u8fd8\u5c55\u793a\u4e86\u5176\u53ef\u91cd\u590d\u6027\uff0c\u5176\u6210\u679c\u4e5f\u53d7\u5230\u5ba2\u6237\u7684\u80af\u5b9a\u3002\u603b\u800c\u8a00\u4e4b\uff0c\u5f00\u53d1\u7684\u6e7f\u6d4b\u8bd5\u5e73\u53f0\u5177\u5907\u53ef\u9760\u7684\u7535\u6027\u6d4b\u91cf\u80fd\u529b\uff0c\u5e76\u6709\u6f5c\u529b\u53d1\u5c55\u6210\u4e3a\u534a\u81ea\u52a8\u548c\u5168\u81ea\u52a8\u6d4b\u8bd5\u5e73\u53f0\u3002\u9884\u8ba1\u8be5\u6280\u672f\u672a\u6765\u53ef\u5e94\u7528\u4e8e\u4ee3\u5de5\u91cf\u4ea7\u6d4b\u8bd5\u9886\u57df\u3002<\/p>\r\n<\/p>

\u8cf4\u67cf\u5ef7<\/strong>\u4e8e2018\u52a0\u5165\u4eac\u5143\u7535\u5b50\uff0c\u73b0\u5728\u4e8e\u5c16\u7aef\u6d4b\u8bd5\u6280\u672f\u5f00\u53d1\u5904\u62c5\u4efb\u8d44\u6df1\u5de5\u7a0b\u5e08\uff0c<\/p>\r\n

\u8fd9\u4e03\u5e74\u4e3b\u8981\u4e13\u6ce8\u4e8e\u751f\u7269\u5fae\u6a5f\u96fb\u4e0e\u5fae\u6d41\u9053\u82af\u7247\uff0c\u76ee\u6807\u662f\u5f00\u53d1\u76f8\u5173\u4ea7\u54c1\u7684\u91cf\u4ea7\u6d4b\u8bd5\u6280\u672f\uff0c<\/p>\r\n

\u5176\u56e2\u961f\u8fd1\u5e74\u7684\u7814\u7a76\u6210\u679c\u5df2\u6210\u529f\u4e8e2020 ITC-Asia\u30012023 ITC-Asia\u30012024 ICSS\u8fdb\u884c\u53d1\u8868\uff0c\u5e76\u83b7\u5f97\u6570\u4e2a\u4e13\u5229<\/p>\r\n<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

12:15<\/h1>\n<\/div><\/div><\/div><\/div>

Lunch and EXPO<\/h1>\nEnjoy the delicious hot buffet lunch and networking time. Then take the time to explore the TestConX EXPO. There will be many great exhibits to connect electronic test professionals to solutions. You will be certain to see something new or meet someone new. As attendees to TestConX know, there is always excellent food, drinks, and time for attendees to network with exhibitors! TestConX EXPO will open at 12:15 and will remain open throughout the afternoon until 18:00<\/span><\/span><\/div><\/div><\/div><\/div><\/div><\/div>

13:30<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Session 2<\/div><\/div>
Session 2<\/div>
<\/div>

<\/p><\/div>

\n
\n“Parametric Studies on Miniaturization of Immersion Cooling Technology for Desktop PC and Edge Devices” \n
“\u53f0\u5f0f\u7535\u8111\u548c\u8fb9\u7f18\u8bbe\u5907\u6d78\u6ca1\u5f0f\u51b7\u5374\u6280\u672f\u5c0f\u578b\u5316\u7684\u53c2\u6570\u7814\u7a76\r\n” \n<\/div>\n
\n
\n
\nJiancheng \"Johnson\" Tao\n <\/div>\n\t
\nIntel\n\t <\/div>\n <\/div>\n
\n
\nKhai Ern See\n <\/div>\n\t
\nIntel\n\t <\/div>\n <\/div>\n
\n
\nBaomin Liu\n <\/div>\n\t
\nIntel\n\t <\/div>\n <\/div>\n
\n
\nChin Kung Goh\n <\/div>\n\t
\nIntel\n\t <\/div>\n <\/div>\n
\n
\nCora Nien\n <\/div>\n\t
\nIntel\n\t <\/div>\n <\/div>\n
\n
\nChun Keang Ooi\n <\/div>\n\t
\nIntel\n\t <\/div>\n <\/div>\n
\n
\nJia Yan Go\n <\/div>\n\t
\nIntel\n\t <\/div>\n <\/div>\n
\n
\nEng Kwong Lee\n <\/div>\n\t
\nIntel\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

The compute power of stationary Small Form Factor (SFF) systems, such as desktops or Internet-of-Things (IOT) edge devices, are often thermally limited by the constrained space which makes it a challenge to support the Processor Base Power (also known as Thermal Design Power, i.e. TDP). While customers want to take full advantage of Intel processors with turbo performance, it is even more incredibly challenging to meet the additional thermal requirements by using traditional air-cooling technology in SFF systems. What adds to the pain point is that the system often operates in high operating ambient temperature (in the range of 50-60\u00b0C) for IOT applications.<\/p>\r\n\r\n

Liquid immersion cooling is one of the most recent innovative technologies in which electronic systems are submerged in a non-conductive liquid bath to allow much more effective cooling. While it is commonly deployed for heat-intensive large-scale servers, we are taking proactive measures to perform sensitivity study to miniaturize immersion cooling to a desktop-tower-size system. The goal of this study is to achieve the smallest possible tower size with the targeted power dissipation. We will demonstrate the proof-of-concept (POC) system equipped with single phase liquid immersion cooling and measure the temperature on the dummy heater units, which mimic an Intel processor and a discrete graphic component. A series of parametric studies were performed to optimize the system in order to achieve the targeted power dissipation.<\/p>\r\n\r\n

This paper presents the optimization approach and the components that were changed to arrive at the final POC. The POC that we present in this study measures 160mm (W) x 405mm (H) x 300mm (L) with volumetric size approximately 19.4L. The combined total power dissipation from the heaters is 650W. This POC is the smallest form factor that we can achieve based on the design requirements we have set forth. We believe this concept study with immersion liquid cooling can be scaled to Intel high performance processors with a discrete graphics card which brings the next level of user experience in the desktop, IOT, and workstation user space.<\/p>\r\n<\/p>

Khai Ern<\/strong> is currently the Platform Architect in the CCG-Malaysia Client Customer Engineering team at Intel. His experience spans multiple computing segments, from tablets and laptops to desktop PCs. He was part of the pioneering team that created the Intel Compute Stick and the first Intel Dual Screen Device Proof-of-Concept prototype, which eventually became successful customer products. His current focus is on defining the system architecture for the next generation of laptop systems, where he collaborates with PC industry players to advance the compute user experience. He is an active technical paper writer with over 30 publications and presentations at technical conferences, where he has received multiple best paper awards.<\/p>\r\n \r\n

Johnson Tao<\/strong> is a senior system architect engineer from Client Computing Group(CCG) based in Shanghai PRC.<\/p> \r\n

He is responsible for the intel platform customer enabling and innovation for customer feature landing. Johnson joined Intel in 2011. He received his EE bachelor degree from Nanjing university China, master Degree of EEE from Nanyang technological university Singapore<\/p><\/p><\/details>\n

\n\t\u6458\u8981 - \u7b80\u4ecb (Chinese)<\/summary>\n

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\u672c\u6587\u4ecb\u7ecd\u4e86\u4f18\u5316\u65b9\u6cd5\u548c\u4e3a\u8fbe\u5230\u6700\u7ec8POC\u800c\u66f4\u6539\u7684\u7ec4\u4ef6\u3002\u6211\u4eec\u5728\u8fd9\u9879\u7814\u7a76\u4e2d\u5c55\u793a\u7684POC\u5c3a\u5bf8\u4e3a160mm\uff08\u5bbd\uff09x 405mm\uff08\u9ad8\uff09x 300mm\uff08\u957f\uff09\uff0c\u4f53\u79ef\u5927\u7ea6\u4e3a19.4L\u3002\u6765\u81ea\u52a0\u70ed\u5668\u7684\u603b\u529f\u7387\u8017\u6563\u4e3a650W\u3002\u8fd9\u4e2aPOC\u662f\u6211\u4eec\u57fa\u4e8e\u6211\u4eec\u8bbe\u5b9a\u7684\u8bbe\u8ba1\u8981\u6c42\u6240\u80fd\u5b9e\u73b0\u7684\u6700\u5c0f\u5f62\u5f0f\u673a\u7bb1\u3002\u6211\u4eec\u76f8\u4fe1\uff0c\u8fd9\u9879\u5e26\u6709\u6d78\u6ca1\u6db2\u4f53\u51b7\u5374\u7684\u6982\u5ff5\u7814\u7a76\u53ef\u4ee5\u6269\u5c55\u5230\u82f1\u7279\u5c14\u9ad8\u6027\u80fd\u5904\u7406\u5668\u548c\u72ec\u7acb\u663e\u5361\uff0c\u4e3a\u53f0\u5f0f\u673a\u3001IOT\u548c\u5de5\u4f5c\u7ad9\u7528\u6237\u5e26\u6765\u4e0b\u4e00\u7ea7\u522b\u7684\u7528\u6237\u4f53\u9a8c\u3002<\/p>\r\n<\/p>

\u9676\u5251\u8bda<\/strong>\uff0c\u82f1\u7279\u5c14\u4e9a\u592a\u7814\u53d1\u6709\u9650\u516c\u53f8\uff08\u4e0a\u6d77\uff09\u7cfb\u7edf\u8bbe\u8ba1\u67b6\u6784\u5e08\u30022011\u5e74\u52a0\u5165\u82f1\u7279\u5c14\u8ba1\u7b97\u4e0e\u5ba2\u6237\u96c6\u56e2\uff0c\u4e3b\u8981\u8d1f\u8d23\u5927\u4e2d\u56fd\u533a\u8ba1\u7b97\u673a\u5ba2\u6237\u652f\u6301\uff0c\u7814\u53d1\u4e0e\u521b\u65b0\u529f\u80fd\u843d\u5730\u3002\u9676\u5251\u8bda\u672c\u79d1\u6bd5\u4e1a\u4e8e\u5357\u4eac\u5927\u5b66\uff0c\u7814\u7a76\u751f\u6bd5\u4e1a\u4e8e\u65b0\u52a0\u5761\u5357\u6d0b\u7406\u5de5\u5927\u5b66\u3002<\/p>\r\n<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n
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\n“Optimizing Semiconductor Testing Through Advanced Simulation in Automation and Thermal Management” \n
“\u901a\u8fc7\u81ea\u52a8\u5316\u548c\u70ed\u7ba1\u7406\u4e2d\u7684\u9ad8\u7ea7\u4eff\u771f\u4f18\u5316\u534a\u5bfc\u4f53\u6d4b\u8bd5” \n<\/div>\n
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\nSee Jean \"Sid\" Chan\n <\/div>\n\t
\nAEM Holdings\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

In the dynamic and competitive semiconductor industry, optimizing test equipment throughput and managing thermal performance are essential for efficiency and productivity. However, predicting automation throughput and thermal behavior remains a complex task. This presentation explores how simulation can transform the prediction of both automation throughput and thermal performance for semiconductor test equipment.<\/p>\r\n\r\n

By using simulation, we can create virtual models that replicate real-world semiconductor testing conditions. This discussion will cover how simulation allows us to model the intricate interactions between equipment modules, processes, resources, and thermal dynamics, enabling accurate forecasts of both performance and thermal characteristics. We will also delve into the benefits of using simulation, such as optimizing equipment utilization and power loads. By modeling the automation process flow, potential bottlenecks and inefficiencies can be identified, allowing for proactive adjustments and continuous improvement.<\/p>\r\n\r\n

This presentation will provide detailed examples of how thermal simulation can be leveraged to enhance the design of thermal solutions, effectively addressing challenging thermal issues in semiconductor testing. We will explore specific cases where thermal simulation has been used to identify and mitigate thermal challenges during testing, such as thermal hotspots and thermal gradients.<\/p>\r\n\r\n

Key Takeaways:<\/strong><\/p>\r\n