{"id":7211,"date":"2024-08-16T12:48:07","date_gmt":"2024-08-16T19:48:07","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=7211"},"modified":"2025-02-10T13:36:08","modified_gmt":"2025-02-10T21:36:08","slug":"testconx-korea-2024","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx-korea-2024\/","title":{"rendered":"TestConX Korea 2024"},"content":{"rendered":"
\"Image\"<\/span>

Suwon, South Korea - October 29, 2024<\/strong><\/h1>\n<\/div><\/div><\/div>

LA VIE D'OR<\/a>
\n

141-39 Botong-ri Jeongnam-myeon Hwaseong-si
\nSuwon-si, Gyeonggi-do, South Korea
\nTEL 031.352.7150<\/p>\n\n

SINTEX Convention Center<\/div>\n
141-36 Botong-ri, Jeongnam-myeon, Hwaseong-si,<\/div>\n
Gyeonggi-do, South Korea<\/div><\/h1>\n<\/div><\/div><\/div><\/div><\/div><\/div><\/div>

TestConX<\/span><\/a>, over the course of its twenty-five-year history, has established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope includes packaged semiconductor \u201cfinal\u201d test, burn-in, system level test, and beyond to encompass all practical aspects of electronics testing such as validation, advanced packaging testing, module test, and finished product test.\u00a0<\/span><\/p>\n

Please join us for our 2nd annual TestConX Korea! Don\u2019t miss this opportunity to be part of TestConX as we connect a larger community of test professionals and to participate in this excellent event!<\/span><\/p>\n

For companies interested in exhibiting or sponsoring please see opportunities below.<\/p><\/div>

EXPO<\/span><\/div><\/div><\/a>
<\/div><\/div><\/div>

Tuesday Program SINTEX Convention Center<\/h1>\n<\/div><\/div><\/div>

8:30<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Tutorial<\/div>
Ballroom<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“Advanced Packaging Semiconductor Trends” \n
“\ucca8\ub2e8 \ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9c0 \uae30\uc220 \ub3d9\ud5a5” \n<\/div>\n
\n
\n
\nMinsuk Suh\n <\/div>\n\t
\nCamtek Korea\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract (English)<\/summary>\n

With the increasing utilization of artificial intelligence such as Chat GPT, the amount of data used in the system is increasing rapidly. Semiconductor technology to respond to this data usage has already reached its limit with the scale-down of the existing method of chip technology, and semiconductor package technology allows the system to meet the necessary requirements of the system, which increases the importance of semiconductor package technology.<\/p>\r\n\r\n

Semiconductor package technology has been developed in consideration of high speed, improved heat dissipation, stacking , high reliability, miniaturization, low cost, and environmental improvement, and advanced semiconductor package technology is a technology that satisfies these technology trends, and wafer-level packages, stack packages, and system-in-packages are referred to as advanced semiconductor package technologies. In this course, I will explain the definition and technology trends of these advanced semiconductor packages. <\/p><\/p><\/details>\n

\n\t\ucd08\ub85d (Korean)<\/summary>\n

\r\n\r\n\r\n \r\n \r\n<\/head>\r\n\r\n

Chat GPT \ub4f1 \uc778\uacf5\uc9c0\ub2a5\uc758 \ud65c\uc6a9\uc774 \ub298\uc5b4\ub098\uba74\uc11c \uc2dc\uc2a4\ud15c\uc5d0\uc11c \uc0ac\uc6a9\ud558\ub294 data\uc758 \uc591\uc740 \uae09\uaca9\ud558\uac8c \uc99d\uac00\ud558\uace0 \uc788\ub2e4. \uc774\ub7ec\ud55c data \uc0ac\uc6a9\ub7c9\uc744 \ub300\uc751\ud558\uae30 \uc704\ud55c \ubc18\ub3c4\uccb4 \uae30\uc220\uc740 \uae30\uc874\uc758 \ubc29\uc2dd\uc778 \uce69 \uae30\uc220\uc758 \uc2a4\ucf00\uc77c \ub2e4\uc6b4\uc73c\ub85c\ub294 \uc774\ubbf8 \ud55c\uacc4\uc5d0 \ub3c4\ub2ec\ud558\uc600\uace0, \ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9c0 \uae30\uc220\uc744 \ud1b5\ud558\uc5ec \uc2dc\uc2a4\ud15c\uc5d0\uc11c \ud544\uc694\ud55c \uc694\uad6c\uc0ac\ud56d\uc744 \ub9cc\uc871\uc2dc\ud0ac \uc218 \uc788\uac8c \ub418\uc5c8\uace0, \uc774 \ub54c\ubb38\uc5d0 \ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9c0 \uae30\uc220\uc758 \uc911\uc694\uc131\uc740 \ucee4\uc9c0\uac8c \ub418\uc5c8\ub2e4.<\/p>\r\n\r\n

\ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9c0 \uae30\uc220\uc740 \uace0\uc18d\ud654, \uc5f4\ubc29\ucd9c \ud5a5\uc0c1, \uc801\uce35, \uace0\uc2e0\ub8b0\uc131, \uc18c\ud615\ud654, \uc800\ube44\uc6a9, \ud658\uacbd \uac1c\uc120 \ub4f1\uc744 \uace0\ub824\ud558\uc5ec \uac1c\ubc1c\ub418\uc5b4 \uc654\uace0, \ucca8\ub2e8 \ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9c0 \uae30\uc220\uc740 \uc774\ub7ec\ud55c \uae30\uc220 \ud2b8\ub80c\ub4dc\ub97c \uc798 \ub9cc\uc871\uc2dc\ud0a4\ub294 \uae30\uc220\ub85c\uc11c \uc6e8\uc774\ud37c \ub808\ubca8 \ud328\ud0a4\uc9c0, \uc801\uce35 \ud328\ud0a4\uc9c0, \uc2dc\uc2a4\ud15c \uc778 \ud328\ud0a4\uc9c0\uac00 \ucca8\ub2e8 \ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9c0 \uae30\uc220\ub85c \uc5b8\uae09\ub418\uace0 \uc788\ub2e4. \ubcf8 \uacfc\uc815\uc5d0\uc11c\ub294 \uc774 \uae30\uc220\ub4e4\uc758 \uc815\uc758\uc640 \uae30\uc220 \ud2b8\ub80c\ub4dc\uc5d0 \ub300\ud574\uc11c \uc124\uba85\ud558\ub824 \ud55c\ub2e4.<\/p>\r\n<\/body>\r\n<\/html>\r\n<\/p><\/details>\n<\/div>\n<\/div>\n\t \n

\"Image\"<\/span><\/div>
\uc11c\ubbfc\uc11d \ubc15\uc0ac\ub294 KAIST\uc5d0\uc11c \uc7ac\ub8cc\uacf5\ud559 \ud559\uc0ac, \uc11d\u00b7\ubc15\uc0ac \ud559\uc704\ub97c \ubc1b\uc558\uc2b5\ub2c8\ub2e4. SK\ud558\uc774\ub2c9\uc2a4\uc5d0\uc11c HBM\uc744 \ud3ec\ud568\ud574 RDL, \ud50c\ub9bd\uce69, WLCSP, TSV \ub4f1\uc758 \uac1c\ubc1c\uacfc \uc591\uc0b0 \uc5c5\ubb34\ub97c 20\ub144 \uc774\uc0c1\u00a0 \ucc38\uc5ec\ud588\uc73c\uba70, \ud604\uc7ac\ub294 \ucea0\ud14d\uc758 \ud55c\uad6d\u00a0 \uc5f0\uad6c\uc18c\uc758 \uc5f0\uad6c \uc18c\uc7a5\uc744 \ub9e1\uace0 \uc788\uc2b5\ub2c8\ub2e4. 2020\ub144\uc5d0\ub294 \ud328\ud0a4\uc9c0 \uc5c5\uacc4\uc5d0\uc11c 20\uc5ec \ub144\uac04 \uc313\uc740 \uacbd\ud5d8\uc744 \ubc14\ud0d5\uc73c\ub85c \ud328\ud0a4\uc9c0 \uc5d4\uc9c0\ub2c8\uc5b4\ub294 \ubb3c\ub860 \uc7a5\ube44, \uc18c\uc7ac, \ud559\uc0dd\ub4e4\uc774 \ud328\ud0a4\uc9c0\ub97c \uacf5\ubd80\ud558\ub294 \ub370 \ud544\uc694\ud55c '\ubc18\ub3c4\uccb4\uc5d0 \uac00\uce58\ub97c \ub354\ud558\ub294 \ud328\ud0a4\uc9c0\uc640 \ud14c\uc2a4\ud2b8'\ub77c\ub294 \ucc45\uc744 \uc37c\uc2b5\ub2c8\ub2e4.<\/span><\/div><\/div><\/div><\/div>

Dr. Minsuk Suh received his bachelor\u2019s, master\u2019s and doctoral degrees of material\nscience and engineering from KAIST. More than 20 years, he involved in the\ndevelopment and mass production of RDL, Flip chip, WLCSP and TSV including HBM\nat SK hynix. At now, he is the leader of R&D center in Camtek Korea. In 2020, based on\nover 20 years of experience in the package industry, he wrote a book, \u2018Package and\nTest that adds value to Semiconductor\u2019, for package engineers as well as engineers at\nequipment, materials, and students studying packages.<\/p><\/div><\/div><\/div><\/div>

10:30<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Welcome<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“Opening Remarks” \n<\/div>\n
\n
\n
\nIra Feldman\n <\/div>\n\t
\nFeldman Engineering\n\t <\/div>\n <\/div>\n<\/div>\n<\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

10:45<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Keynote<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“The Rise of AI-Enhanced Test Engineering: Transforming Challenges into Opportunities” \n
“AI\ub97c \ud65c\uc6a9\ud55c \ud14c\uc2a4\ud2b8 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1\uc758 \ubd80\uc0c1 \u2018\ub3c4\uc804\uacfc\uc81c\ub97c \uae30\ud68c\ub85c \ubc14\uafb8\ub2e4\u2019” \n<\/div>\n
\n
\n
\nKeith Schaub\n <\/div>\n\t
\nAdvantest\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

This keynote presents a pioneering approach in semiconductor testing, where Artificial Intelligence (AI), specifically Large Language Models (LLMs) like GPT-4, is integrated with the expertise of test engineers. This collaboration represents a significant advancement in innovation, efficiency, and problem-solving within the industry, leading to higher quality work product, faster time to market and enhanced productivity for engineers.\r\n\r\n

We illustrate this approach through multiple case studies where the AI assists engineering with: Analyzing semiconductor related data, Developing multi-stack software code for a special engineering project, Analyzing test engineering images, Algorithm development, and a Multi-agent collaboration applied across a multi-discipline engineering team. <\/p>\r\n\r\n

Central to this effort is the use of GPT-4 Turbo and GPT-4o, which aids test engineers in code development, debugging, trouble shooting, and image and data analysis offering expert recommendations to improve quality, efficiency, productivity and project outcomes. This highlights the transformative potential of AI in refining testing methodologies and enhancing the role of test engineers as innovators.<\/p>\r\n\r\n

As semiconductor testing faces increasing complexities, the synergy between AI and human expertise emerges as a vital solution. This keynote aligns with the forward-looking vision of TestConX, urging the semiconductor community to embrace AI-human collaboration as a key driver of the future of test engineering.<\/p><\/p>

Keith Schaub<\/strong> is a seasoned expert in the semiconductor test industry, currently serving as Vice President of Technology and Strategy at Advantest America, Inc. With a career spanning over three decades, Keith has been at the forefront of integrating AI into semiconductor testing, revolutionizing the industry. He holds multiple patents, has founded a startup, and authored key publications on RF and wireless communications. Keith is also the host of the popular Advantest Talks Semi podcast, where he shares insights and explores emerging trends in the semiconductor world. As a respected speaker and author, Keith is known for his strategic insights and innovative solutions in the semiconductor test industry.

<\/p><\/details>\n

\n\t\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n

\uc774 \uae30\uc870\uc5f0\uc124\uc5d0\uc11c\ub294 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8 \ubd84\uc57c\uc5d0\uc11c \uc778\uacf5\uc9c0\ub2a5(AI), \ud2b9\ud788 GPT-4\uc640 \uac19\uc740 \ub300\ud615 \uc5b8\uc5b4 \ubaa8\ub378(LLM)\uc744 \ud65c\uc6a9\ud55c \ud601\uc2e0\uc801\uc778 \uc811\uadfc \ubc29\uc2dd\uc744 \uc18c\uac1c\ud569\ub2c8\ub2e4. \uc774\ub7ec\ud55c AI\uc640 \ud14c\uc2a4\ud2b8 \uc5d4\uc9c0\ub2c8\uc5b4\uc758 \uc804\ubb38\uc131 \uacb0\ud569\uc740 \uc0b0\uc5c5 \ub0b4\uc5d0\uc11c \ud601\uc2e0, \ud6a8\uc728\uc131, \ubb38\uc81c \ud574\uacb0 \ub2a5\ub825\uc744 \ud06c\uac8c \ud5a5\uc0c1\uc2dc\ud0a4\uba70, \uc774\ub97c \ud1b5\ud574 \ub354 \ub192\uc740 \ud488\uc9c8\uc758 \uc81c\ud488\uc744 \ub354 \ube60\ub974\uac8c \uc2dc\uc7a5\uc5d0 \ucd9c\uc2dc\ud558\uace0, \uc5d4\uc9c0\ub2c8\uc5b4\ub4e4\uc758 \uc0dd\uc0b0\uc131\uc744 \ub192\uc77c \uc218 \uc788\uac8c \ub418\uc5c8\uc2b5\ub2c8\ub2e4.<\/p>\r\n \r\n

\uc5ec\ub7ec \uc0ac\ub840 \uc5f0\uad6c\ub97c \ud1b5\ud574 AI\uac00 \ubc18\ub3c4\uccb4 \ub370\uc774\ud130 \ubd84\uc11d, \ud2b9\uc815 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1 \ud504\ub85c\uc81d\ud2b8\ub97c \uc704\ud55c \ub2e4\uc911 \uc2a4\ud0dd \uc18c\ud504\ud2b8\uc6e8\uc5b4 \ucf54\ub4dc \uac1c\ubc1c, \ud14c\uc2a4\ud2b8 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1 \uc774\ubbf8\uc9c0 \ubd84\uc11d, \uc54c\uace0\ub9ac\uc998 \uac1c\ubc1c, \uadf8\ub9ac\uace0 \ub2e4\ud559\uc81c\uc801 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1 \ud300 \ub0b4 \ub2e4\uc911 \uc5d0\uc774\uc804\ud2b8 \ud611\uc5c5\uc5d0\uc11c \uc5b4\ub5bb\uac8c \uc5d4\uc9c0\ub2c8\uc5b4\ub4e4\uc744 \uc9c0\uc6d0\ud558\ub294\uc9c0 \uc124\uba85\ud569\ub2c8\ub2e4. \ud2b9\ud788 GPT-4 Turbo\uc640 GPT-4o \ubaa8\ub378\uc758 \ud65c\uc6a9\uc774 \uc911\uc2ec\uc5d0 \uc788\uc73c\uba70, \uc774 \ubaa8\ub378\ub4e4\uc740 \ud14c\uc2a4\ud2b8 \uc5d4\uc9c0\ub2c8\uc5b4\ub4e4\uc774 \ucf54\ub4dc \uac1c\ubc1c, \ub514\ubc84\uae45, \ubb38\uc81c \ud574\uacb0, \uc774\ubbf8\uc9c0 \ubc0f \ub370\uc774\ud130 \ubd84\uc11d\uc744 \uc218\ud589\ud558\ub294 \ub370 \uc788\uc5b4 \uc804\ubb38\uac00 \uc218\uc900\uc758 \uad8c\uc7a5 \uc0ac\ud56d\uc744 \uc81c\uacf5\ud558\uace0, \ud488\uc9c8\uacfc \ud6a8\uc728\uc131, \uc0dd\uc0b0\uc131, \uadf8\ub9ac\uace0 \ud504\ub85c\uc81d\ud2b8 \uacb0\uacfc\ub97c \uac1c\uc120\ud558\ub294 \ub370 \uae30\uc5ec\ud569\ub2c8\ub2e4. AI\uc758 \ub3c4\uc785\uc740 \ud14c\uc2a4\ud2b8 \ubc29\ubc95\ub860\uc744 \uc815\uad50\ud654\ud558\uace0 \ud14c\uc2a4\ud2b8 \uc5d4\uc9c0\ub2c8\uc5b4\uc758 \uc5ed\ud560\uc744 \uac15\ud654\ud558\ub294 \uc911\uc694\ud55c \uc694\uc18c\ub85c \uc791\uc6a9\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n \r\n

\ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8\uc758 \ubcf5\uc7a1\uc131\uc774 \uc99d\uac00\ud568\uc5d0 \ub530\ub77c, AI\uc640 \uc778\uac04 \uc804\ubb38 \uc9c0\uc2dd \uac04\uc758 \uc2dc\ub108\uc9c0\uac00 \uc911\uc694\ud55c \ud574\uacb0\ucc45\uc73c\ub85c \uc790\ub9ac\uc7a1\uace0 \uc788\uc2b5\ub2c8\ub2e4.\r\n\uc774\ubc88 \uae30\uc870\uc5f0\uc124\uc740 \uc774\ub7ec\ud55c AI-\uc778\uac04 \ud611\uc5c5\uc774 \ud14c\uc2a4\ud2b8 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1\uc758 \ubbf8\ub798\ub97c \uc774\ub044\ub294 \ud575\uc2ec \ub3d9\ub825\uc774 \ub420 \uac83\uc784\uc744 \uac15\uc870\ud569\ub2c8\ub2e4.<\/p><\/p>

Keith Schaub<\/strong>\ub294 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8 \uc0b0\uc5c5\uc5d0\uc11c \uc624\ub79c \uacbd\ud5d8\uc744 \uc313\uc740 \uc804\ubb38\uac00\ub85c, \ud604\uc7ac Advantest America, Inc.\uc5d0\uc11c \uae30\uc220 \ubc0f \uc804\ub7b5 \ubd80\ubb38 \ubd80\uc0ac\uc7a5\uc73c\ub85c \uc7ac\uc9c1 \uc911\uc785\ub2c8\ub2e4. 30\ub144 \uc774\uc0c1\uc758 \uacbd\ub825\uc744 \ud1b5\ud574 Keith\ub294 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8\uc5d0 AI\ub97c \ud1b5\ud569\ud558\uc5ec \uc5c5\uacc4\ub97c \ud601\uc2e0\ud574 \uc654\uc2b5\ub2c8\ub2e4. \uadf8\ub294 \ub2e4\uc218\uc758 \ud2b9\ud5c8\ub97c \ubcf4\uc720\ud558\uace0 \uc788\uc73c\uba70, RF \ubc0f \ubb34\uc120 \ud1b5\uc2e0\uc5d0 \uad00\ud55c \uc8fc\uc694 \ucd9c\ud310\ubb3c\uc744 \uc800\uc220\ud55c \ubc14 \uc788\uc2b5\ub2c8\ub2e4.\r\n\ub610\ud55c, Keith\ub294 \ubc18\ub3c4\uccb4 \uc0b0\uc5c5\uc758 \ucd5c\uc2e0 \ub3d9\ud5a5\uc744 \ud0d0\uad6c\ud558\ub294 \uc778\uae30 \ud31f\uce90\uc2a4\ud2b8\uc778 \"Advantest Talks Semi\"\uc758 \uc9c4\ud589\uc790\ub85c\ub3c4 \uc798 \uc54c\ub824\uc838 \uc788\uc2b5\ub2c8\ub2e4. Keith\ub294 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8 \uc0b0\uc5c5\uc5d0\uc11c \uc804\ub7b5\uc801 \ud1b5\ucc30\ub825\uacfc \ud601\uc2e0\uc801 \uc194\ub8e8\uc158\uc73c\ub85c \ub110\ub9ac \uc778\uc815\ubc1b\ub294 \uc5f0\uc0ac\uc774\uc790 \uc800\uc790\uc785\ub2c8\ub2e4.<\/p>\r\n <\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n
\"Keith\"<\/span><\/div>
Keith Schaub is a seasoned expert in the semiconductor test industry, currently serving as Vice President of Technology and Strategy at Advantest America, Inc. With a career spanning over three decades, Keith has been at the forefront of integrating AI into semiconductor testing, revolutionizing the industry. He holds multiple patents, has founded a startup, and authored key publications on RF and wireless communications. Keith is also the host of the popular Advantest Talks Semi podcast, where he shares insights and explores emerging trends in the semiconductor world. As a respected speaker and author, Keith is known for his strategic insights and innovative solutions in the semiconductor test industry.<\/div><\/div><\/div><\/div><\/div><\/div><\/div>

11:45<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Session 1<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“What next for Asian suppliers of test and burn-in sockets?” \n
“\uc544\uc2dc\uc544 \ud14c\uc2a4\ud2b8 \ubc0f \ubc88\uc778 \uc18c\ucf13 \uacf5\uae09\uc5c5\uccb4\uc758 \ud5a5\ud6c4 \uc804\ub9dd\uc740?” \n<\/div>\n
\n
\n
\nJohn West\n <\/div>\n\t
\nYole Group\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

Asia has long been the leading center for semiconductor testing. In fact, until recently, the region's test houses steadily eroded the relatively small share of tests still being done in Europe, the US, and the rest of the world. Asian socket suppliers have done well in serving their home markets, and together, they now account for over 75% of worldwide socket revenues.\r\n \r\nThis situation is changing as the various chip acts and the re-evaluation of chipmakers' manufacturing strategies impact the test landscape. This presentation explains how semiconductor testing is shifting regionally and within regions and what that means for burn-in and test socket suppliers.<\/p>

John West<\/strong> is a Senior Director of the Semiconductor Subsystems and Test Division at Yole Group. He has over 20 years of industry experience and a successful track record in various strategy and consulting projects. John has a Bachelor's degree in Medical Physics from King's College London and an MBA from Cranfield School of Management.<\/p><\/p><\/details>\n

\n\t\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n

\uc544\uc2dc\uc544\ub294 \uc624\ub7ab\ub3d9\uc548 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8\uc758 \uae00\ub85c\ubc8c \uc911\uc2ec\uc9c0\ub85c \uc790\ub9ac \uc7a1\uc544 \uc654\uc2b5\ub2c8\ub2e4. \ucd5c\uadfc\uae4c\uc9c0\ub3c4 \uc544\uc2dc\uc544\uc758 \ud14c\uc2a4\ud2b8 \uc5c5\uccb4\ub4e4\uc740 \uc720\ub7fd, \ubbf8\uad6d \ubc0f \uae30\ud0c0 \uc9c0\uc5ed\uc5d0\uc11c \uc774\ub8e8\uc5b4\uc9c0\ub358 \ud14c\uc2a4\ud2b8 \uc2dc\uc7a5 \uc810\uc720\uc728\uc744 \uafb8\uc900\ud788 \uc7a0\uc2dd\ud574\uc654\uc73c\uba70, \ud604\uc7ac \uc774\ub4e4\uc740 \uc804 \uc138\uacc4 \uc18c\ucf13 \ub9e4\ucd9c\uc758 75% \uc774\uc0c1\uc744 \ucc28\uc9c0\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n

\ud558\uc9c0\ub9cc, \ubc18\ub3c4\uccb4 \uad00\ub828 \ubc95\uc548\ub4e4\uc758 \uc2dc\ud589\uacfc \ubc18\ub3c4\uccb4 \uc81c\uc870\uc5c5\uccb4\ub4e4\uc758 \uc81c\uc870 \uc804\ub7b5 \uc7ac\ud3c9\uac00\uac00 \uc9c4\ud589\ub428\uc5d0 \ub530\ub77c \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8 \uc2dc\uc7a5\uc774 \ubcc0\ud654\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uc774\ubc88 \uac15\uc5f0\uc5d0\uc11c\ub294 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8\uc758 \uc9c0\uc5ed\uc801 \ubcc0\ud654\uc640 \uadf8\ub85c \uc778\ud574 \ubc88\uc778 \ubc0f \ud14c\uc2a4\ud2b8 \uc18c\ucf13 \uacf5\uae09\uc5c5\uccb4\ub4e4\uc774 \uc9c1\uba74\ud560 \uae30\ud68c\uc640 \ub3c4\uc804\uc5d0 \ub300\ud574 \ub2e4\ub8f0 \uac83\uc785\ub2c8\ub2e4.<\/p><\/p>

JohnWest<\/strong>\ub294 Yole Group\uc758 Semiconductor Subsystems and Test Division\uc758 Senior Director\uc774\ub2e4.\r\n\uadf8\ub294 20\ub144 \uc774\uc0c1\uc758 \uc5c5\uacc4 \uacbd\ud5d8\uacfc \ub2e4\uc591\ud55c \uc804\ub7b5 \ubc0f \ucee8\uc124\ud305 \ud504\ub85c\uc81d\ud2b8\uc5d0\uc11c \uc131\uacf5\uc801\uc778 \uc2e4\uc801\uc744 \ubcf4\uc720\ud558\uace0 \uc788\ub2e4.\r\nJohn\uc740 King's College London\uc5d0\uc11c \uc758\ub8cc \ubb3c\ub9ac\ud559 \ud559\uc0ac \ud559\uc704\ub97c \ucde8\ub4dd\ud588\uc73c\uba70 Cranfield School of Management\uc5d0\uc11c MBA\ub97c \ucde8\ub4dd\ud588\ub2e4.<\/p><\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

12:15<\/h1>\n<\/div><\/div><\/div><\/div>

Lunch and EXPO<\/strong><\/h1>\n

Enjoy the delicious hot buffet lunch and networking time. Then take the time to explore the TestConX EXPO. There will be many great exhibits to connect electronic test professionals to solutions. You will be certain to see something new or meet someone new. As attendees to TestConX know, there is always excellent food, drinks, and time for attendees to network with exhibitors! TestConX EXPO will open at 12:15 and will remain open throughout the afternoon until 18:00
\n<\/span><\/p><\/span><\/div><\/div><\/div>

<\/div><\/div><\/div>

13:30<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Session 2<\/div>
Ballroom<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“Die (HBM) Level Test Handler” \n
“\uc801\uc6a9 \uac00\ub2a5\ud55c DIE Level\uc758 Test Handler \uc18c\uac1c” \n<\/div>\n
\n
\n
\nDu-Chul Kim\n <\/div>\n\t
\nAMT\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

This is equipment that tests the electrical characteristics of the die by dicing the HBM device in a wafer state, loading each die, and then contacting the probe on the probe card.<\/p>\r\n\r\n

Each die is mounted on a hot and cold chuck, and then each die is sequentially aligned using an ultra-precision alignment machine and Vision Align algorithm technology.<\/p>\r\n<\/p>

Du-Chul Kim<\/strong>is an expert with over 30 years of experience in the semiconductor manufacturing equipment industry. He has a proven track record of localizing various equipment, including TR equipment, LSI equipment, and MEMORY TEST equipment. Currently, he is developing HBM TEST equipment, taking on new challenges in emerging markets. As the CEO of AMT Co., Ltd., he leads the company with a focus on innovative technology development and global market expansion. Du-Chul Kim's management philosophy is centered on customer satisfaction, and he is dedicated to enhancing the quality and performance of cutting-edge semiconductor manufacturing equipment.<\/p>\r\n<\/p><\/details>\n

\n\t\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n

\uc774 \uc124\ube44\ub294 Wafer \uc0c1\ud0dc\uc758 HBM \uc81c\ud488\uc744 \ub2e4\uc774(Die)\ub85c \ubd84\ub9ac\ud558\uace0, \uac01\uac01\uc758 \ub2e4\uc774\ub97c \ub85c\ub529\ud558\uc5ec \ud504\ub85c\ube0c\uce74\ub4dc\uc5d0 \uc811\ucd09\uc2dc\ud0a4\ub294 \ubc29\uc2dd\uc73c\ub85c \ub2e4\uc774\uc758 \uc804\uae30\uc801 \ud2b9\uc131\uc744 \ud14c\uc2a4\ud2b8\ud560 \uc218 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n

\ucd08\uc815\ubc00 \uc815\ub82c \uba38\uc2e0\uacfc Vision Align \uc54c\uace0\ub9ac\uc998 \uae30\uc220\uc744 \ud1b5\ud574 \ud56b\/\ucf5c\ub4dc \ucc99\uc5d0 \uc7a5\ucc29\ub41c \uac01\uac01\uc758 \ub2e4\uc774\ub4e4\uc744 \uc21c\ucc28\uc801\uc73c\ub85c \uc815\ub82c\ud569\ub2c8\ub2e4.<\/p><\/p>

\uae40 \ub450\ucca0<\/strong> \ubc18\ub3c4\uccb4 \uc81c\uc870 \uc7a5\ube44 \ubd84\uc57c\uc5d0\uc11c 30\ub144 \uc774\uc0c1\uc758 \uacbd\ub825\uc744 \ubcf4\uc720\ud55c \uc804\ubb38\uac00\uc785\ub2c8\ub2e4. TR \uc7a5\ube44, LSI \uc7a5\ube44, MEMORY TEST \uc7a5\ube44 \ub4f1 \ub2e4\uc218 \uc124\ube44\ub97c \uad6d\uc0b0\ud654\ud55c \uacbd\ub825\uc774 \uc788\uc2b5\ub2c8\ub2e4. \ud604\uc7ac\ub294 HBM TEST \uc7a5\ube44\ub97c \uac1c\ubc1c\ud558\uc5ec \uc0c8\ub85c\uc6b4 \uc2dc\uc7a5\uc5d0 \ub3c4\uc804\uc744 \ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uadf8\ub294 AMT \uc8fc\uc2dd\ud68c\uc0ac\uc758 \ub300\ud45c\uc774\uc0ac\ub85c \uc7ac\uc9c1 \uc911\uc774\uba70, \ud601\uc2e0\uc801\uc778 \uae30\uc220 \uac1c\ubc1c\uacfc \uae00\ub85c\ubc8c \uc2dc\uc7a5 \ud655\uc7a5\uc744 \ud1b5\ud574 \ud68c\uc0ac\ub97c \uc120\ub3c4\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uae40\ub450\ucca0 \ub300\ud45c\uc774\uc0ac\ub294 \uace0\uac1d \uc911\uc2ec\uc758 \uacbd\uc601 \ucca0\ud559\uc744 \ubc14\ud0d5\uc73c\ub85c, \ucd5c\ucca8\ub2e8 \ubc18\ub3c4\uccb4 \uc81c\uc870 \uc7a5\ube44\uc758 \ud488\uc9c8\uacfc \uc131\ub2a5 \ud5a5\uc0c1\uc5d0 \uc8fc\ub825\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n
\n
\n“Space-Efficient Wafer Level Burn-In tool” \n<\/div>\n
\n
\n
\nJeremy \"Jeremy \" Kim\n <\/div>\n\t
\nSEMICS\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

This presentation addresses the importance of reconfiguring the wafer test system layout to enhance density. As semiconductor production continues to grow, ensuring quality reliability is increasingly critical. Given the challenges of expanding physical space, this solution provides a viable approach within the constraints of the current floor area.<\/p>\r\n\r\n<\/p>

Jeremy Kim Biography<\/strong>: 2018: Holding bachelor of mechanical engineering at Hansung University. 2018: Joined Semics as a mechanical engineer. 2018 ~2019: Design prober-tester interface (Semics prober with memory tester) & wafer chuck module(additive function). 2019 ~2024: Developing prior technology, new product concept design & product manager.<\/p>\r\n<\/p><\/details>\n

\n\t\u6458\u8981 (Chinese)<\/summary>\n

\ubcf8 \ubc1c\ud45c\uc5d0\uc11c\ub294 \uc6e8\uc774\ud37c \ud14c\uc2a4\ud2b8 \uc2dc\uc2a4\ud15c\uc758 \ubc00\ub3c4\ub97c \ud5a5\uc0c1\uc2dc\ud0a4\uae30 \uc704\ud574 \uc2dc\uc2a4\ud15c \uad6c\uc131\uc744 \uc7ac\ubc30\uce58\ud558\ub294 \uac83\uc758 \uc911\uc694\uc131\uc744 \ub2e4\ub8f9\ub2c8\ub2e4. \ubc18\ub3c4\uccb4 \uc0dd\uc0b0\uc774 \uc99d\uac00\ud568\uc5d0 \ub530\ub77c \ud488\uc9c8 \uc2e0\ub8b0\uc131\uc744 \ud655\ubcf4\ud558\ub294 \uac83\uc758 \ud544\uc694\uc131 \ub610\ud55c \uc911\uc694\ud574\uc9c0\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uac74\ubb3c \ud655\uc7a5\uc774 \uc5b4\ub824\uc6b4 \uc0c1\ud669\uc5d0\uc11c, \uc774 \uc194\ub8e8\uc158\uc740 \uae30\uc874 \uacf5\uac04 \uc81c\uc57d \ub0b4\uc5d0\uc11c \uc720\uc6a9\ud55c \uc811\uadfc\ubc95\uc744 \uc81c\uc2dc\ud569\ub2c8\ub2e4.<\/p><\/p>

<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n
\n
\n“Automated Test Equipment for Battery Management Systems: Challenges and Solutions” \n
“\ubc30\ud130\ub9ac \uad00\ub9ac \uc2dc\uc2a4\ud15c\uc744 \uc704\ud55c \uc790\ub3d9\ud654 \ud14c\uc2a4\ud2b8 \uc7a5\ube44: \uacfc\uc81c \ubc0f \uc194\ub8e8\uc158” \n<\/div>\n
\n
\n
\nSandeep D'Souza\n <\/div>\n\t
\nElevate Semiconductor\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

This presentation discusses the challenges of automated test equipment (ATE) for testing battery management systems (BMS) in electric vehicles (EV) and introduces novel system-architectural solutions based on highly integrated system-on-a-chip (SOC) parametric measurement units (PMUs).<\/p>\r\n\r\n

BMS measure temperature, voltage, and current in the battery-pack and balance battery cell charge. However, ATE for testing BMS in EVs has several challenges: Since a BMS device-under-test (DUT) may support a battery module with a series-connected stack of 16 or more Lithium-Ion cells, traditional ATE based on discrete devices has low density since it requires a high number of voltage and\/or current source stimuli to emulate individual cell outputs. Second, since the DUT needs to be tested to microVolt (uV) and microAmpere (uA) accuracy, the ATE needs low-noise, precision voltage, and current sources which increase implementation complexity, size, and cost of discrete solutions. Moreover, the test stimuli to the BMS-DUT may require 100\u2019s of Volts common-mode voltage relative to the channel differential voltage. Finally, since discrete-device-based ATE is not readily scalable, testing various BMS and battery-module configurations requires custom designs which take longer to build.<\/p>\r\n\r\n

As a solution to the above challenges, this work first presents a series-connected stack of floating-ground PMUs which connect to the DUT and test if its cell-voltage (CV) and cell-balance (CB) terminal characteristics meet their specifications. The floating-ground-based topology meets both the high common-mode and the uV\/uA precision requirements noted above. Each PMU has an isolated power supply for galvanic isolation from the system input power supply. In this configuration, digital-to-analog converters (DACs) integrated in each PMU drive the DUT CV and CB terminals in force-voltage (FV) or force-current (FI) mode and validate the DUT battery-cell measurement, input-current, and CB switch-transistor on-resistance capabilities from the DUT measure-current (MI) and measure-voltage (MV) responses. Each PMU FV or FI stimulus can be independently programmed by ATE software, thereby enabling test coverage of any battery cell condition. Following the above discussion, a second topology is presented which extends the testable DUT voltage range up to its absolute maximum rating by connecting each PMU in series with a high-voltage common-mode (CM), efficient switching-mode-power-supply (SMPS). The system is reconfigurable between the first high-precision and the second extended-voltage-range topologies using switching matrices. These switching matrices may be discrete to support more flexibility or integrated with the PMU, e.g., as co-packaged Micro-Electromechanical Systems (MEMS) switches. At the circuit level, integrated clamps in the PMU limit the voltage and current across the DUT. Additionally, each PMU has alarm features which detect temperature, voltage, current, and force\/sense Kelvin faults.<\/p>\r\n\r\n

BMS future trends include support for higher-voltage battery-packs, higher precision, various pack topologies as well as several new functions including active management and active cell balance. The presented architecture is scalable and readily addresses these trends because of design choices such as the integrated PMU SOC, series-connected PMUs \/ stacking of PMUs on CM power supply, and reconfigurability between the two topologies via the MEMS switching-matrix.<\/p><\/p>

Sandeep D\u2019Souza<\/strong> is a Principal Engineer with ElevATE Semiconductor working on integrated circuit and system design for Automated Test Equipment (ATE) applications. He has 24 years\u2019 experience in the semiconductor industry on ATE, Semiconductor Device Modeling, Analog, Mixed-Signal and RF IC design, and systems design for Ultrasonic Sensor, Haptics, Audio and Touch-Controller applications. Prior to ElevATE, he was with Qualcomm, Semtech (Jariet), Skyworks and Conexant. He has 8 publications and 40+ issued \/ pending patents. He received his Bachelor, Master and PhD degrees all in Electrical Engineering from IIT Bombay, Purdue University and UCLA respectively.<\/p><\/p><\/details>\n

\n\t\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n

\uc774 \ud504\ub808\uc820\ud14c\uc774\uc158\uc5d0\uc11c\ub294 \uc804\uae30 \uc790\ub3d9\ucc28(EV)\uc758 \ubc30\ud130\ub9ac \uad00\ub9ac \uc2dc\uc2a4\ud15c(BMS)\uc744 \ud14c\uc2a4\ud2b8\ud558\uae30 \uc704\ud55c \uc790\ub3d9 \ud14c\uc2a4\ud2b8 \uc7a5\ube44(ATE)\uc758 \uacfc\uc81c\ub97c \ub17c\uc758\ud558\uace0 \uace0\ub3c4\ub85c \ud1b5\ud569\ub41c \uc2dc\uc2a4\ud15c \uc628 \uce69(SOC) \ud30c\ub77c\uba54\ud2b8\ub9ad \uce21\uc815 \uc720\ub2db(PMU)\uc744 \uae30\ubc18\uc73c\ub85c \ud558\ub294 \uc0c8\ub85c\uc6b4 \uc2dc\uc2a4\ud15c \uc544\ud0a4\ud14d\ucc98 \uc194\ub8e8\uc158\uc744 \uc18c\uac1c\ud569\ub2c8\ub2e4.<\/p>\r\n

BMS\ub294 \ubc30\ud130\ub9ac \ud329\uc758 \uc628\ub3c4, \uc804\uc555 \ubc0f \uc804\ub958\ub97c \uce21\uc815\ud558\uace0 \ubc30\ud130\ub9ac \uc140 \ucda9\uc804\uc758 \uade0\ud615\uc744 \ub9de\ucda5\ub2c8\ub2e4. \uadf8\ub7ec\ub098 \uc804\uae30\ucc28\uc5d0\uc11c BMS\ub97c \ud14c\uc2a4\ud2b8\ud558\uae30 \uc704\ud55c ATE\uc5d0\ub294 \uba87 \uac00\uc9c0 \uacfc\uc81c\uac00 \uc788\uc2b5\ub2c8\ub2e4: \ud14c\uc2a4\ud2b8 \uc911\uc778 BMS \uc7a5\uce58(DUT)\ub294 16\uac1c \uc774\uc0c1\uc758 \ub9ac\ud2ac \uc774\uc628 \uc140\ub85c \uad6c\uc131\ub41c \uc9c1\ub82c \uc5f0\uacb0 \uc2a4\ud0dd\uc73c\ub85c \ubc30\ud130\ub9ac \ubaa8\ub4c8\uc744 \uc9c0\uc6d0\ud560 \uc218 \uc788\uae30 \ub54c\ubb38\uc5d0 \uac1c\ubcc4 \uc140 \ucd9c\ub825\uc744 \uc5d0\ubbac\ub808\uc774\uc158 \ud558\ub294 \ub370 \ub9ce\uc740 \uc218\uc758 \uc804\uc555 \ub610\ub294 \uc804\ub958\uc6d0\uc758 \uc790\uadf9\uc774 \ud544\uc694\ud558\uae30 \ub54c\ubb38\uc5d0 \uac1c\ubcc4 \uc7a5\uce58 \uae30\ubc18\uc758 \uae30\uc874 ATE\ub294 \ubc00\ub3c4\uac00 \ub0ae\uc2b5\ub2c8\ub2e4. \ub458\uc9f8, DUT\ub294 \ub9c8\uc774\ud06c\ub85c \ubcfc\ud2b8(uV) \ubc0f \ub9c8\uc774\ud06c\ub85c \uc554\ud398\uc5b4(uA) \uc815\ud655\ub3c4\uc5d0 \ub9de\uac8c \ud14c\uc2a4\ud2b8\ud574\uc57c \ud558\ubbc0\ub85c ATE\ub294 \uc800 \uc7a1\uc74c, \uc815\ubc00 \uc804\uc555 \ubc0f \uc804\ub958\uc6d0\uc774 \ud544\uc694\ud558\ubbc0\ub85c \uad6c\ud604 \ubcf5\uc7a1\uc131, \ud06c\uae30 \ubc0f \ube44\uc6a9\uc774 \uc99d\uac00\ud569\ub2c8\ub2e4. \ub610\ud55c BMS-DUT\uc5d0 \ub300\ud55c \ud14c\uc2a4\ud2b8 \uc790\uadf9\uc5d0\ub294 \ucc44\ub110 \ucc28\ub3d9 \uc804\uc555\uc5d0 \ube44\ud574 100V\uc758 \ubcfc\ud2b8 \uacf5\ud1b5 \ubaa8\ub4dc \uc804\uc555\uc774 \ud544\uc694\ud560 \uc218 \uc788\uc2b5\ub2c8\ub2e4. \ub9c8\uc9c0\ub9c9\uc73c\ub85c, \uac1c\ubcc4 \uc7a5\uce58 \uae30\ubc18 ATE\ub294 \uc27d\uac8c \ud655\uc7a5\ud560 \uc218 \uc5c6\uae30 \ub54c\ubb38\uc5d0 \ub2e4\uc591\ud55c BMS \ubc0f \ubc30\ud130\ub9ac \ubaa8\ub4c8 \uad6c\uc131\uc744 \ud14c\uc2a4\ud2b8\ud558\ub824\uba74 \uad6c\ucd95\ud558\ub294 \ub370 \ub354 \uc624\ub79c \uc2dc\uac04\uc774 \uac78\ub9ac\ub294 \ub9de\ucda4\ud615 \uc124\uacc4\uac00 \ud544\uc694\ud569\ub2c8\ub2e4.<\/p>\r\n

\uc704\uc758 \uacfc\uc81c\uc5d0 \ub300\ud55c \ud574\uacb0\ucc45\uc73c\ub85c, \uc774 \uc791\uc5c5\uc740 \uba3c\uc800 DUT\uc5d0 \uc5f0\uacb0\ud558\uace0 \uc140 \uc804\uc555(CV) \ubc0f \uc140 \uade0\ud615(CB) \ub2e8\uc790 \ud2b9\uc131\uc774 \uc0ac\uc591\uc744 \ucda9\uc871\ud558\ub294\uc9c0 \ud14c\uc2a4\ud2b8\ud558\ub294 \ud50c\ub85c\ud305 \uadf8\ub77c\uc6b4\ub4dc PMU\uc758 \uc9c1\ub82c \uc5f0\uacb0 \uc2a4\ud0dd\uc744 \uc81c\uc2dc\ud569\ub2c8\ub2e4. \ud50c\ub85c\ud305 \uadf8\ub77c\uc6b4\ub4dc \uae30\ubc18 \ud1a0\ud3f4\ub85c\uc9c0\ub294 \uc704\uc5d0\uc11c \uc5b8\uae09\ud55c \ub192\uc740 \uacf5\ud1b5 \ubaa8\ub4dc \ubc0f uV\/uA \uc815\ubc00\ub3c4 \uc694\uad6c \uc0ac\ud56d\uc744 \ubaa8\ub450 \ucda9\uc871\ud569\ub2c8\ub2e4. \uac01 PMU\uc5d0\ub294 \uc2dc\uc2a4\ud15c \uc785\ub825 \uc804\uc6d0 \uacf5\uae09 \uc7a5\uce58\ub85c\ubd80\ud130 \uac08\ubc14\ub2c9\uc744 \ubd84\ub9ac\ud558\uae30 \uc704\ud55c \uaca9\ub9ac\ub41c \uc804\uc6d0 \uacf5\uae09 \uc7a5\uce58\uac00 \uc788\uc2b5\ub2c8\ub2e4. \uc774 \uad6c\uc131\uc5d0\uc11c \uac01 PMU\uc5d0 \ud1b5\ud569\ub41c \ub514\uc9c0\ud138-\uc544\ub0a0\ub85c\uadf8 \ubcc0\ud658\uae30(DAC)\ub294 \ud798 \uc804\uc555(FV) \ub610\ub294 \ud798 \uc804\ub958(FI) \ubaa8\ub4dc\uc5d0\uc11c DUT CV \ubc0f CB \ub2e8\uc790\ub97c \uad6c\ub3d9\ud558\uace0 DUT \ubc30\ud130\ub9ac-\uc140 \uce21\uc815, \uc785\ub825 \uc804\ub958 \ubc0f CB \uc2a4\uc704\uce58-\ud2b8\ub79c\uc9c0\uc2a4\ud130 \uc628-\uc800\ud56d \uae30\ub2a5\uc744 DUT \uce21\uc815 \uc804\ub958(MI) \ubc0f \uce21\uc815 \uc804\uc555(MV) \uc751\ub2f5\uc5d0\uc11c \uac80\uc99d\ud569\ub2c8\ub2e4. \uac01 PMU FV \ub610\ub294 FI \uc790\uadf9\uc740 ATE \uc18c\ud504\ud2b8\uc6e8\uc5b4\ub85c \ub3c5\ub9bd\uc801\uc73c\ub85c \ud504\ub85c\uadf8\ub798\ubc0d\ud560 \uc218 \uc788\uc73c\ubbc0\ub85c \ubaa8\ub4e0 \ubc30\ud130\ub9ac \uc140 \uc870\uac74\uc5d0 \ub300\ud55c \ud14c\uc2a4\ud2b8 \ucee4\ubc84\ub9ac\uc9c0\ub97c \uac00\ub2a5\ud558\uac8c \ud569\ub2c8\ub2e4. \uc704\uc758 \ub17c\uc758\uc5d0 \uc774\uc5b4, \uac01 PMU\ub97c \uace0\uc804\uc555 \uacf5\ud1b5 \ubaa8\ub4dc(CM), \ud6a8\uc728\uc801\uc778 \uc2a4\uc704\uce6d \ubaa8\ub4dc-\uc804\ub825-\uacf5\uae09\uc7a5\uce58(SMPS)\uc640 \uc9c1\ub82c\ub85c \uc5f0\uacb0\ud558\uc5ec \ud14c\uc2a4\ud2b8 \uac00\ub2a5\ud55c DUT \uc804\uc555 \ubc94\uc704\ub97c \uc808\ub300 \ucd5c\ub300 \ub4f1\uae09\uae4c\uc9c0 \ud655\uc7a5\ud558\ub294 \ub450 \ubc88\uc9f8 \ud1a0\ud3f4\ub85c\uc9c0\uac00 \uc81c\uc2dc\ub429\ub2c8\ub2e4. \uc774 \uc2dc\uc2a4\ud15c\uc740 \uc2a4\uc704\uce6d \ub9e4\ud2b8\ub9ad\uc2a4\ub97c \uc0ac\uc6a9\ud558\uc5ec \uccab \ubc88\uc9f8 \uace0\uc815\ubc00 \ud1a0\ud3f4\ub85c\uc9c0\uc640 \ub450 \ubc88\uc9f8 \ud655\uc7a5 \uc804\uc555 \ubc94\uc704 \ud1a0\ud3f4\ub85c\uc9c0 \uc0ac\uc774\uc5d0\uc11c \uc7ac\uad6c\uc131\ud560 \uc218 \uc788\uc2b5\ub2c8\ub2e4. \uc774\ub7ec\ud55c \uc2a4\uc704\uce6d \ub9e4\ud2b8\ub9ad\uc2a4\ub294 \ub354 \ub9ce\uc740 \uc720\uc5f0\uc131\uc744 \uc9c0\uc6d0\ud558\uae30 \uc704\ud574 \uac1c\ubcc4\uc801\uc774\uac70\ub098 \uacf5\ub3d9 \ud328\ud0a4\uc9d5\ub41c \ub9c8\uc774\ud06c\ub85c-\uc804\uae30\uae30\uacc4 \uc2dc\uc2a4\ud15c(MEMS) \uc2a4\uc704\uce58\uc640 \uac19\uc774 PMU\uc640 \ud1b5\ud569\ub420 \uc218 \uc788\uc2b5\ub2c8\ub2e4. \ud68c\ub85c \uc218\uc900\uc5d0\uc11c PMU\uc758 \ud1b5\ud569 \ud074\ub7a8\ud504\ub294 DUT \uc804\uccb4\uc758 \uc804\uc555\uacfc \uc804\ub958\ub97c \uc81c\ud55c\ud569\ub2c8\ub2e4. \ub610\ud55c \uac01 PMU\uc5d0\ub294 \uc628\ub3c4, \uc804\uc555, \uc804\ub958 \ubc0f \ud798\/\uac10\uc9c0 \ucf08\ube48 \uacb0\ud568\uc744 \uac80\ucd9c\ud558\ub294 \uc54c\ub78c \uae30\ub2a5\uc774 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n

BMS\uc758 \ubbf8\ub798 \ud2b8\ub80c\ub4dc\uc5d0\ub294 \uace0\uc804\uc555 \ubc30\ud130\ub9ac \ud329, \ub354 \ub192\uc740 \uc815\ubc00\ub3c4, \ub2e4\uc591\ud55c \ud329 \ud1a0\ud3f4\ub85c\uc9c0 \uc9c0\uc6d0\ubfd0\ub9cc \uc544\ub2c8\ub77c \ub2a5\ub3d9\ud615 \uad00\ub9ac \ubc0f \ub2a5\ub3d9\ud615 \uc140 \ubc38\ub7f0\uc2a4\ub97c \ud3ec\ud568\ud55c \uba87 \uac00\uc9c0 \uc0c8\ub85c\uc6b4 \uae30\ub2a5\uc774 \ud3ec\ud568\ub429\ub2c8\ub2e4. \uc81c\uc2dc\ub41c \uc544\ud0a4\ud14d\ucc98\ub294 \ud655\uc7a5 \uac00\ub2a5\ud558\uba70 \ud1b5\ud569 PMU SOC, \uc9c1\ub82c \uc5f0\uacb0 PMU \/ CM \uc804\uc6d0 \uacf5\uae09 \uc7a5\uce58\uc758 PMU \uc2a4\ud0dc\ud0b9, MEMS \uc2a4\uc704\uce6d \ub9e4\ud2b8\ub9ad\uc2a4\ub97c \ud1b5\ud55c \ub450 \ud1a0\ud3f4\ub85c\uc9c0 \uac04\uc758 \uc7ac\uad6c\uc131 \uac00\ub2a5\uc131\uacfc \uac19\uc740 \uc124\uacc4 \uc120\ud0dd\uc73c\ub85c \uc778\ud574 \uc774\ub7ec\ud55c \ucd94\uc138\uc5d0 \uc27d\uac8c \ub300\ucc98\ud560 \uc218 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n\r\n<\/p>

Sandeep D'Souza<\/strong> \ub294 ElevATE Semiconductor\uc758 \uc218\uc11d \uc5d4\uc9c0\ub2c8\uc5b4\ub85c, \uc790\ub3d9\ud654 \ud14c\uc2a4\ud2b8 \uc7a5\ube44(ATE) \uc560\ud50c\ub9ac\ucf00\uc774\uc158\uc744 \uc704\ud55c \uc9d1\uc801 \ud68c\ub85c \ubc0f \uc2dc\uc2a4\ud15c \uc124\uacc4\ub97c \ub2f4\ub2f9\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uadf8\ub294 ATE, \ubc18\ub3c4\uccb4 \uc7a5\uce58 \ubaa8\ub378\ub9c1, \uc544\ub0a0\ub85c\uadf8, \ud63c\ud569 \uc2e0\ud638 \ubc0f RF IC \uc124\uacc4, \ucd08\uc74c\ud30c \uc13c\uc11c, \ud585\ud2f1, \uc624\ub514\uc624 \ubc0f \ud130\uce58 \ucee8\ud2b8\ub864\ub7ec \uc560\ud50c\ub9ac\ucf00\uc774\uc158\uc744 \uc704\ud55c \uc2dc\uc2a4\ud15c \uc124\uacc4\uc5d0 \ub300\ud574 \ubc18\ub3c4\uccb4 \uc5c5\uacc4\uc5d0\uc11c 24\ub144\uc758 \uacbd\ud5d8\uc744 \uac00\uc9c0\uace0 \uc788\uc2b5\ub2c8\ub2e4. ElevATE\uc5d0 \uc785\uc0ac\ud558\uae30 \uc804\uc5d0\ub294 Qualcomm, Semtech(Jariet), Skyworks \ubc0f Conexant\uc5d0\uc11c \uadfc\ubb34\ud588\uc2b5\ub2c8\ub2e4. \uadf8\ub294 8 \uac1c\uc758 \ucd9c\ud310\ubb3c\uacfc 40 + \ubc1c\ud589 \/ \ucd9c\uc6d0 \uc911\uc778 \ud2b9\ud5c8\ub97c \ubcf4\uc720\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uadf8\ub294 IIT \ubd04\ubca0\uc774, \ud37c\ub4c0 \ub300\ud559\uad50 \ubc0f UCLA\uc5d0\uc11c \uac01\uac01 \uc804\uae30 \uacf5\ud559 \ud559\uc0ac, \uc11d\uc0ac \ubc0f \ubc15\uc0ac \ud559\uc704\ub97c \ubc1b\uc558\uc2b5\ub2c8\ub2e4.<\/p><\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

13:30<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Tutorial<\/div>
Tutorial Room<\/div><\/div>
<\/div>
<\/div>

<\/p><\/div>

\n
\n“Electromagnetic-Thermal simulation method for the development of high-performance semiconductor test equipment and boards” \n
“\uace0\uc131\ub2a5 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8 \uc7a5\ube44 \ubc0f \ubcf4\ub4dc\uc758 \uac1c\ubc1c\uc744 \uc704\ud55c \uc804\uc790\uae30-\uc5f4 \uc2dc\ubbac\ub808\uc774\uc158 \ubc29\ubc95\r\n” \n<\/div>\n
\n
\n
\nJiwon Kim\n <\/div>\n\t
\nTaesung S&E\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract (English)<\/summary>\n

Recently, semiconductor testing has become increasingly polarized. One field evaluates semiconductors that operate at Low Operating Voltages and High Frequencies, and the other field evaluates High-Power semiconductors. The field of evaluating Low-Voltages and High-Frequency semiconductors has a very big issue regarding SI\/PI and High-Speed Interface for test equipment and boards. And the common issue in both fields is to establish countermeasures for the generated heat. This session introduces the basic understanding and methods of Electromagnetic-Thermal simulation to solve these issues.\r\n<\/p>

<\/p><\/details>\n

\n\t\ucd08\ub85d (Korean)<\/summary>\n

\ucd5c\uadfc \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8\ub294 \uc591\uadf9\ud654\uac00 \ucee4\uc9c0\uace0 \uc788\ub2e4. \ud55c\ubd84\uc57c\ub294 \ub0ae\uc740 \ub3d9\uc791 \uc804\uc555\uacfc \uace0\uc8fc\ud30c\uc218\ub85c \ub3d9\uc791\ud558\ub294 \ubc18\ub3c4\uccb4\ub97c \ud3c9\uac00\ud558\ub294 \uac83\uc774\uace0, \ub2e4\ub978 \ubd84\uc57c\ub294 \ub300\uc804\ub825 \ubc18\ub3c4\uccb4\ub97c \ud3c9\uac00\ud558\ub294 \uac83\uc774\ub2e4. \uc800\uc804\uc555\uacfc \uace0\uc8fc\ud30c\uc218 \ubc18\ub3c4\uccb4\ub97c \ud3c9\uac00\ud558\ub294 \ubd84\uc57c\ub294 \ud14c\uc2a4\ud2b8 \uc7a5\ube44 \uc640 \ubcf4\ub4dc\uc5d0 \ub300\ud55c SI\/PI\uc640 High Speed Interface\uc5d0 \ub300\ud55c \uc774\uc288\uac00 \ub9e4\uc6b0 \ud06c\ub2e4. \uadf8\ub9ac\uace0 \ub450\ubd84\uc57c\uc758 \uacf5\ud1b5\uc801\uc778 \uc774\uc288\ub294 \ubc1c\uc0dd\ub418\ub294 \uc5f4\uc5d0 \ub300\ud55c \ub300\ucc45\uc744 \uc138\uc6b0\ub294 \uac83\uc774\ub2e4. \ubcf8 \uc138\uc158\uc740 \uc774\ub7ec\ud55c \uc774\uc288\ub97c \ud574\uacb0\ud558\uae30 \uc704\ud55c \uc804\uc790\uae30-\uc5f4 \uc2dc\ubbac\ub808\uc774\uc158\uc5d0 \ub300\ud55c \uae30\ubcf8\uc801\uc778 \uc774\ud574\uc640 \ubc29\ubc95\uc744 \uc18c\uac1c\ud558\ub294 \uac83\uc774\ub2e4.\r\n\r\n<\/p>

<\/p><\/details>\n<\/div>\n<\/div>\n\t \n

\"Jiwon_Kim\"<\/span><\/div>
\uae40\uc9c0\uc6d0 Jiwon Kim
<\/br>\n\n\uc22d\uc2e4\ub300\ud559\uad50 \ub300\ud559\uc6d0 \uc804\uc790\uacf5\ud559\ubd80 \uacf5\ud559\ubc15\uc0ac, \ubc18\ub3c4\uccb4 \ubc0f \uc790\uc131\uc18c\uc790 \uc804\uacf5(2006)\n\uc804\uc790\uae30\uc7a5 \ud574\uc11d \uacbd\ub825 : 1994~\ud604\uc7ac\n2015~ : \ud0dc\uc131\uc5d0\uc2a4\uc5d4\uc774 \uae30\uc220\ubcf8\ubd80 \uc804\uae30\uc804\uc790 \ubd84\uc57c \uc120\uc784\ud300\uc7a5\n~2015 : \ucf54\ub9ac\uc544\uc778\uc2a4\ud2b8\ub8e8\uba3c\ud2b8 \uae30\uc220\uc5f0\uad6c\uc18c \ud300\uc7a5\n~2012 : \uc194\ube0c\ub808\uc778\uba64\uc2dc\uc2a4(\uad6c \ud30c\uc774\ucef4) \uae30\uc220\uc5f0\uad6c\uc18c \uc120\ud589\uac1c\ubc1c \ud300\uc7a5\n<\/span><\/div><\/div><\/div><\/div>

Soongsil University Graduate School, Department of Electronic Engineering, Ph.D. in Semiconductor and Magnetic Devices (2006)
\nElectromagnetic Field Analysis Experience: 1994~present
\n2015~: Senior Team Leader, Electrical and Electronic Division, Taesung S&E Technology Headquarters
\n~2015: Team Leader, Korea Instrument Technology Research Institute
\n~2012: Team Leader, Advanced Development Team, Soulbrain Memsys (former Phicom) Technology Research Institute\n<\/p><\/div><\/div><\/div><\/div>

15:00<\/h1>\n<\/div><\/div><\/div><\/div>

Break & Networking<\/strong><\/h1>\nEnjoy time to meet with the presenters and network while refreshments are served.<\/span><\/span><\/div><\/div><\/div>
<\/div><\/div><\/div>

15:30<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Session 3<\/div><\/div>
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<\/div>

<\/p><\/div>

\n
\n“New Pogo Socket with Replaceable Top Plunger” \n
“\r\n” \n
“\uad50\uccb4 \uac00\ub2a5\ud55c Top Plunger\uc758 \uad6c\uc870\ub97c \uac00\uc9c4 \uc0c8\ub85c\uc6b4 Pogo Socket” \n<\/div>\n
\n
\n
\nYee Sun Kang\n <\/div>\n\t
\nTSE\n\t <\/div>\n <\/div>\n
\n
\nBo Hyun \"BH\" Kim\n <\/div>\n\t
\nTSE\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

In the current semiconductor package testing, due to the damage to the tip (Top Plunger) of the pin that contacts the package and the transfer of Sn (tin), the characteristics of the socket deteriorate, leading to the replacement of the entire pin and socket.<\/p>\r\n\r\n

In the case of the Tango socket, it was confirmed that apart from damage to the tip of the pin, other parts of the Pogo pin do not have any issues. Therefore, the socket was designed so that only the pin tip could be replaced, aiming to reduce testing costs and improve the ease of maintenance.<\/p><\/p>

Kang Yeesun<\/strong>\r\nPosition: Deputy Manager \/ Product Engineer \/ Sr. Manager. \r\nDepartment: AP Division, Product Development Team. \r\nSummary of Experience: Over 11 years at TSE, responsible for the development of Pogo socket products and processes. \r\nAreas of Expertise: New product development (Tango socket, Coaxial socket, etc). <\/p>\r\n\r\n

Kang Yeesun has been responsible for the development of Pogo socket products and processes at TSE for over 11 years and has led the development of new products such as Tango socket and Coaxial socket, who aims to share a new approach to the existing Pogo pin through the Tango socket.<\/p>\r\n<\/p><\/details>\n

\n\t\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n

\ud604\uc7ac \ubc18\ub3c4\uccb4 Package\ub97c Test\ud568\uc5d0 \uc788\uc5b4\uc11c \uc0ac\uc6a9\ub418\ub294 Pogo Socket\uc758 \uacbd\uc6b0 Package\uc640 \uc811\ucd09\ub418\ub294 Pin \ub05d\ub2e8 (Top Plunger)\uc758 \uc190\uc0c1\uacfc Sn \uc804\uc774\ub85c \uc778\ud574 Socket \ud2b9\uc131\uc774 \uc545\ud654\ub418\uc5b4 Pin & Socket \uc804\uccb4\ub97c \uad50\uccb4\ud558\uace0 \uc788\ub2e4. <\/p>\r\n\r\n

Tango Socket\uc758 \uacbd\uc6b0 Pin \ub05d\ub2e8\uc758 \uc190\uc0c1 \uc678\uc5d0 Pogo Pin\uc744 \uad6c\uc131\ud558\ub294 \ub2e4\ub978 Part\ub294 \ubb38\uc81c\uc5c6\ub2e4\ub294 \uc810\uc744 \ud655\uc778\ud558\uc5ec Pin \ub05d\ub2e8\ub9cc\uc744 \uad50\uccb4\ud560 \uc218 \uc788\ub3c4\ub85d Socket\uc744 \uad6c\uc131\ud568\uc73c\ub85c Test \ube44\uc6a9 \uc808\uac10\uacfc Maintenance \uc6a9\uc774\uc131\uc744 \uc99d\ub300 \uc2dc\ud0a4\uace0\uc790 \ud558\uc600\ub2e4.<\/p>\r\n<\/p>

\uc774\ub984 : \uac15\uc774\uc120<\/strong>\r\n\r\n\uc9c1\ucc45 : \ucc28\uc7a5 \/ Product Engineer \/ Sr. Manager\r\n\r\n\ubd80\uc11c : AP \uc0ac\uc5c5\ubd80 \uc81c\ud488 \uac1c\ubc1c\ud300\r\n\r\n\uacbd\ub825\uc694\uc57d : TSE\uc5d0\uc11c 11\ub144 \ub118\uac8c Pogo socket \uc81c\ud488 \ubc0f \uacf5\uc815 \uac1c\ubc1c\uc5c5\ubb34\ub97c \ub2f4\ub2f9<\/p>\r\n\r\n

\uc804\ubb38\ubd84\uc57c : Tango socket, Coaxial socket \ub4f1 \uc2e0\uc81c\ud488 \uac1c\ubc1c\u000b\u000b\uac15\uc774\uc120\uc740 TSE \uc5d0\uc11c 11\ub144 \ub118\uac8c Pogo socket \uc81c\ud488 \ubc0f \uacf5\uc815 \uac1c\ubc1c\uc5c5\ubb34\ub97c \ub2f4\ub2f9\ud574 \uc654\uc73c\uba70, Tango socket, Coaxial socket \ub4f1 \uc2e0\uc81c\ud488 \uac1c\ubc1c\uc744 \uc8fc\ub3c4\ud588\uc2b5\ub2c8\ub2e4. \uae30\uc874 Pogo pin\uc5d0 \ub300\ud55c \uc0c8\ub85c\uc6b4 \uc811\uadfc \ubc29\uc2dd\uc778 Tango socket\uc5d0 \ub300\ud574 \uacf5\uc720\ud558\uace0\uc790 \ud569\ub2c8\ub2e4.<\/p>\r\n\r\n<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n
\n
\n“Clean Pad for Test Sockets\/Wafer Probe Cards” \n
“ \ud14c\uc2a4\ud2b8 \uc18c\ucf13 & \uc6e8\uc774\ud37c \ud504\ub85c\ube0c \uce74\ub4dc\uc6a9 \ud074\ub9b0\ud328\ub4dc” \n<\/div>\n
\n
\n
\nHo Boum \"HB\" Rhim\n <\/div>\n\t
\nInspiraz Korea\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract (English)<\/summary>\n

Device testing is a critical process for determining the electrical and functional reliability of chips at the wafer\/device level. The test probe serves as the contact interface between DUT and the tester, making contact with the pads\/bumps of the DUT to form a connection for testing.<\/p>\r\n

During testing, oxides\/debris accumulate on the test probe, affecting electrical conductivity and causing overkill issues. It is important to implement a cleaning procedure during the test process to minimize the accumulation of oxides or contaminants to ensure high reliability.<\/p>\r\n

Clean pad\/clean wafer effectively cleans the probe without deforming the probe tip with its cushion structure and special cleaning resin material.<\/p>\r\n<\/p>

<\/p><\/details>\n

\n\t\ucd08\ub85d (Korean)<\/summary>\n

\ub514\ubc14\uc774\uc2a4 \ud14c\uc2a4\ud2b8\ub294 \uc6e8\uc774\ud37c\/\ub514\ubc14\uc774\uc2a4 \ub808\ubca8\uc5d0\uc11c\uc758 \uce69\uc758 \uc804\uae30\uc801 \ubc0f \uae30\ub2a5\uc801 \uc2e0\ub8b0\uc131\uc744 \uacb0\uc815\ud558\uae30 \uc704\ud55c \uc911\uc694\ud55c \ud504\ub85c\uc138\uc2a4\uc774\uba70 \ud14c\uc2a4\ud2b8 \ud504\ub85c\ube0c\ub294 DUT\uc640 \ud14c\uc2a4\ud130 \uc0ac\uc774\uc758 \uc811\ucd09 \uc778\ud130\ud398\uc774\uc2a4 \uc5ed\ud560\uc744 \ud558\uba70 DUT\uc758 \ud328\ub4dc\/\ubc94\ud504\uc5d0 \uc811\ucd09\ud558\uc5ec \ud14c\uc2a4\ud2b8\ub97c \uc704\ud55c \uc5f0\uacb0\uc744 \ud615\uc131\ud569\ub2c8\ub2e4.<\/p>\r\n\r\n

\ud14c\uc2a4\ud2b8\ub97c \ud558\ub294 \ub3d9\uc548 \ud14c\uc2a4\ud2b8 \ud504\ub85c\ube0c\uc5d0 \uc0b0\ud654\ubb3c\/\ucc0c\uaebc\uae30\uac00 \uc313\uc5ec \uc804\uae30 \uc804\ub3c4\ub3c4\uc5d0 \uc601\ud5a5\uc744 \ubbf8\uce58\uace0 \uacfc\uac80\ubb38\uc81c\uac00 \ubc1c\uc0dd\ud558\uac8c \ub429\ub2c8\ub2e4. \uc0b0\ud654\ubb3c \ub610\ub294 \uc624\uc5fc\ubb3c\uc774 \uc313\uc774\ub294 \uac83\uc744 \ucd5c\uc18c\ud654\ud558\ub3c4\ub85d \ud14c\uc2a4\ud2b8 \ud504\ub85c\uc138\uc2a4 \uc911\uc5d0 \ud074\ub9ac\ub2dd \uc808\ucc28\ub97c \uad6c\ud604\ud558\ub294 \uac83\uc774 \ub192\uc740 \uc2e0\ub8b0\uc131\uc744 \ubcf4\uc7a5\ud558\ub294 \ub370 \uc788\uc5b4\uc11c \uc911\uc694\ud569\ub2c8\ub2e4.<\/p>\r\n\r\n

\ud074\ub9b0 \ud328\ub4dc\/\ud074\ub9b0 \uc6e8\uc774\ud37c\ub294 \ucfe0\uc158 \uad6c\uc870\uc640 \ud2b9\uc218\ud55c \ud074\ub9ac\ub2dd \uc218\uc9c0 \uc18c\uc7ac\ub85c \ud504\ub85c\ube0c \ud301\uc758 \ubcc0\ud615 \uc5c6\uc774 \ud6a8\uacfc\uc801\uc73c\ub85c \ud504\ub85c\ube0c\ub97c \ud074\ub9ac\ub2dd\ud569\ub2c8\ub2e4.<\/p>\r\n<\/p>

<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n
\n
\n“Space Transformer & Ultra fine pitch PCB Solution” \n
“\ud53c\uce58\ubcc0\ud658 \ubc0f \ubbf8\uc138 \ud53c\uce58 PCB \uc194\ub8e8\uc158” \n<\/div>\n
\n
\n
\nInPyo \"Inpyo\" Lee\n <\/div>\n\t
\nTSE\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract - Biography (English)<\/summary>\n

The miniaturization of advanced system semiconductor wafers and packages demands new PCB technologies. Wafer die bumps, which range from thousands to tens of thousands per product, have fine pitches of 40\u03bcm to 150\u03bcm. This presentation covers the design and manufacturing solutions for Space Transformer PCBs that facilitate pitch conversion between the Probe Load Board and probe pins in Vertical Probe Cards for wafer testing. Additionally, it will address high-speed signal transmission testing and Surface Mount Technology (SMT)<\/p>\r\n\r\n <\/p>

In-Pyo Lee<\/strong> has over 20 years of experience in the semiconductor testing field, specializing in the development of Test Interface Boards for both memory and non-memory semiconductors. Currently, he is responsible for the development of Test Interface Board technology at TSE.<\/p>\r\n\r\n

He has developed many test solution interface boards with a focus on high-speed, low-power, high-temperature, and fine-pitch requirements. He aims to share the latest technological trends in PCBs, which are the core materials of Test Interface Boards, under the topic of \"Space Transformer & Fine Pitch Solution<\/strong>.\"<\/p>\r\n<\/p><\/details>\n

\n\t\ucd08\ub85d - \uc804\uae30 (Korean)<\/summary>\n

\uace0\uc131\ub2a5 \uc2dc\uc2a4\ud15c \ubc18\ub3c4\uccb4\uc758 \uc6e8\uc774\ud37c \ubc0f \ud328\ud0a4\uc9c0\uc758 \ubbf8\uc138\ud654\ub294 \uc0c8\ub85c\uc6b4 PCB \uae30\uc220\uc744 \uc694\uad6c\ud569\ub2c8\ub2e4.\r\n\uc6e8\uc774\ud37c \ub2e4\uc774\uc758 \ubc94\ud504\ub294 \uc81c\ud488\uc5d0 \ub530\ub77c \uc218\ucc9c \uac1c\uc5d0\uc11c \uc218\ub9cc \uac1c\uae4c\uc9c0 \uad6c\uc131\ub418\uba70, \ubbf8\uc138 \ud53c\uce58\ub294 40\u03bcm\uc5d0\uc11c 150\u03bcm\uc5d0 \uc774\ub985\ub2c8\ub2e4.\r\n\uc774 \ubc1c\ud45c\uc5d0\uc11c\ub294 \uc6e8\uc774\ud37c \ud14c\uc2a4\ud2b8\uc6a9 Vertical Probe Card\uc5d0\uc11c Probe Load Board\uc640 \ud504\ub85c\ube0c \ud540 \uac04\uc758 \ud53c\uce58 \ubcc0\ud658\uc744 \uac00\ub2a5\ud558\uac8c \ud558\ub294\r\nSpace Transformer PCB\uc758 \uc124\uacc4 \ubc0f \uc81c\uc870 \uc194\ub8e8\uc158\uc744 \uc18c\uac1c\ud569\ub2c8\ub2e4.\r\n\ub610\ud55c \uace0\uc18d \uc2e0\ud638 \uc804\uc1a1 \ud14c\uc2a4\ud2b8 \ubc0f \ud45c\uba74 \uc2e4\uc7a5 \uae30\uc220(SMT)\uc5d0 \ub300\ud574\uc11c\ub3c4 \ub2e4\ub8f9\ub2c8\ub2e4<\/p>\r\n<\/p>

\uc774\uc778\ud45c<\/strong>\ub294 20\uc5ec \ub144\uac04 \ubc18\ub3c4\uccb4 \ud14c\uc2a4\ud2b8 \ubd84\uc57c\uc5d0\uc11c \uacbd\ub825\uc744 \uc313\uc544\uc654\uc73c\uba70, \uba54\ubaa8\ub9ac \ubc0f \ube44\uba54\ubaa8\ub9ac \ubc18\ub3c4\uccb4\uc758 Test Interface Board \uac1c\ubc1c\uc5d0 \uc804\ubb38\uc131\uc744 \uac00\uc9c0\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n\r\n

\ud604\uc7ac TSE\uc5d0\uc11c Test Interface Board \uae30\uc220 \uac1c\ubc1c\uc744 \ub2f4\ub2f9\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\r\n\r\n

\uace0\uc18d, \uc800\uc804\ub825, \uace0\uc628, \ubbf8\uc138 \ud53c\uce58\uc5d0 \uc911\uc810\uc744 \ub454 \ub2e4\uc218\uc758 \ud14c\uc2a4\ud2b8 \uc194\ub8e8\uc158 \uc778\ud130\ud398\uc774\uc2a4 \ubcf4\ub4dc \uac1c\ubc1c \uacbd\ud5d8\uc774 \uc788\uc73c\uba70, \"Space Transformer & Fine Pitch Solution<\/strong>\"\uc5d0 \uad00\ud55c \uc8fc\uc81c\ub85c Test Interface Board\uc758 \ud575\uc2ec \uc790\uc7ac\uc778 PCB\uc5d0 \ub300\ud55c \uae30\uc220 \ud2b8\ub80c\ub4dc\ub97c \uacf5\uc720\ud558\uace0\uc790 \ud569\ub2c8\ub2e4.<\/p>\r\n<\/p><\/details>\n\"\"<\/a>

<\/div>\"PDF-Icon<\/a> Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><\/div>

17:00<\/h1>\n<\/div><\/div><\/div><\/div>

Lucky Draw<\/strong><\/h1>\n

Door prizes for randomly selected attendees<\/span>
\n(Must be present to win \/ void where prohibited)<\/p><\/span><\/div><\/div><\/div><\/div><\/div><\/div>

17:30<\/h1>\n<\/div><\/div><\/div><\/div>

TestConX EXPO Closes \/ Event Adjourns<\/strong><\/h1>\n<\/div><\/div><\/div><\/div><\/div><\/div>
<\/div>
<\/div><\/div><\/div>

For any questions about the event or sponsorship contact us at [javascript protected email address]<\/span>