
{"id":6910,"date":"2023-12-22T19:23:04","date_gmt":"2023-12-23T03:23:04","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=6910"},"modified":"2024-07-13T19:16:34","modified_gmt":"2024-07-14T02:16:34","slug":"testconx2024-monday","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx2024-monday\/","title":{"rendered":"TestConX 2024 &#8211; Monday"},"content":{"rendered":"<div id=\"cs-content\" class=\"cs-content\"><div class=\"x-section e6910-e1 m5by-0 m5by-1 m5by-2\"><div class=\"x-container max width e6910-e2 m5by-6\"><div class=\"x-column x-sm x-1-1 e6910-e3 m5by-8\"><span class=\"x-image e6910-e4 m5by-a m5by-b\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2024\/TestConX2024_band_1500x500.jpg\" width=\"750\" height=\"248\" alt=\"Image\" loading=\"lazy\"><\/span><\/div><\/div><\/div><div class=\"x-section e6910-e5 m5by-0 m5by-1 m5by-2\"><div class=\"x-container max width e6910-e6 m5by-6\"><div class=\"x-column x-sm x-1-1 e6910-e7 m5by-8\"><div class=\"x-content-area e6910-e8 m5by-d\"><h4 class=\"x-hide-sm x-hide-md x-hide-lg x-hide-xl\" style=\"color:red\">Rotate your smartphone to landscape or increase your browser width to see session descriptions.<\/h4><\/div><\/div><\/div><\/div><div class=\"x-section e6910-e9 m5by-0 m5by-2 m5by-3\"><div class=\"x-container max width e6910-e10 m5by-6\"><div class=\"x-column x-sm x-1-1 e6910-e11 m5by-8 m5by-9\"><a class=\"x-anchor x-anchor-button e6910-e12 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Overview<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e6910-e13 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024-sunday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Sunday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e6910-e14 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024-monday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Monday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e6910-e15 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024-tuesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Tuesday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e6910-e16 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024-wednesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Wednesday<\/span><\/div><\/div><\/a><\/div><\/div><div class=\"x-row x-container max width e6910-e17 m5by-f m5by-g m5by-h\"><div class=\"x-row-inner\"><div class=\"x-col e6910-e18 m5by-l m5by-m\"><hr class=\"x-line e6910-e19 m5by-n\"\/><a class=\"x-anchor x-anchor-button e6910-e20 m5by-e\" tabindex=\"0\" href=\"https:\/\/www.testconx.org\/premium\/testconx-expo-2024\/\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">EXPO<\/span><\/div><\/div><\/a><\/div><\/div><\/div><\/div><div class=\"x-section e6910-e21 m5by-0 m5by-4\"><div class=\"x-container max width e6910-e22 m5by-6 m5by-7\"><div class=\"x-column x-sm x-1-1 e6910-e23 m5by-8\"><div class=\"x-text x-text-headline e6910-e24 m5by-o m5by-p m5by-q\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\"><div id=\"monday\">Monday March 4, 2024<\/div><\/h1>\n<\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e6910-e25 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e26 m5by-8\"><div class=\"x-text x-text-headline e6910-e27 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">7:30 am<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e28 m5by-8\"><div class=\"x-text x-text-headline e6910-e29 m5by-o m5by-r m5by-s m5by-t\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">Continental Breakfast<\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e6910-e30 m5by-d\"><p>Start the day right and enjoy the continental breakfast while networking with other attendees.<\/p><\/div><\/div><\/div><div class=\"x-container max width e6910-e31 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e32 m5by-8\"><div class=\"x-text x-text-headline e6910-e33 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">8:30 am<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e34 m5by-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Welcome\">Welcome<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\">Opening Remarks<\/div><div class=\"subtitle\">Welcoming remarks from the General Chair, Ira Feldman<\/div><div class=\"x-hide-xs\"><p><\/p><\/div><\/div>\n\t \n<\/div><\/div><div class=\"x-container max width e6910-e36 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e37 m5by-8\"><div class=\"x-text x-text-headline e6910-e38 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">9:00 am<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e39 m5by-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Keynote\">Keynote<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\">Keynote<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;US Fabs of the Future&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nScott Gatzemeier\n      <\/div>\n\t    <div class=\"authorCompany\">\nMicron\n\t    <\/div>\n   <\/div>\n<\/div>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><\/div>\n<\/div>\n\t \n<div class=\"x-row e6910-e41 m5by-f m5by-g m5by-i\"><div class=\"x-row-inner\"><div class=\"x-col e6910-e42 m5by-l\"><span class=\"x-image e6910-e43 m5by-a m5by-c\"><img decoding=\"async\" src=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2023china\/ScottGatzemeier.png\" width=\"150\" height=\"200\" alt=\"Scott Gatzemeier headshot\" loading=\"lazy\"><\/span><div class=\"x-text x-content e6910-e44 m5by-v m5by-w\">\n<p><strong><em>Scott Gatzemeier<\/em><\/strong><br \/><strong><em>Micron Technology, Inc. <\/em><\/strong><\/p><\/div><\/div><div class=\"x-col e6910-e45 m5by-l\"><div class=\"x-text x-content e6910-e46 m5by-v\"><p>As AI rapidly evolves, it transforms multiple facets of our lives. From natural language processing to computer vision, increasingly sophisticated AI solutions rely not only on innovative algorithms but also on critical hardware components&mdash;specifically, memory and semiconductors. Deep learning networks, in particular, demand substantial memory resources for effective training and inference, with the memory hierarchy (cache, RAM, storage) playing a crucial role in overall AI performance and driving a new wave of memory demand.<\/p><\/div><\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e6910-e47 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e48 m5by-8\">&nbsp;<\/div><div class=\"x-column x-sm x-3-4 e6910-e49 m5by-8\"><div class=\"x-row e6910-e50 m5by-f m5by-g m5by-j\"><div class=\"x-row-inner\"><div class=\"x-col e6910-e51 m5by-l\"><div class=\"x-text x-content e6910-e52 m5by-v\"><p>The CHIPS and FABS Acts play a pivotal role in strengthening semiconductor manufacturing within the United States. By promoting domestic production and reducing dependence on foreign suppliers, these legislative initiatives enhance national security and economic stability. Micron, a leading player in the industry, is actively constructing state-of-the-art manufacturing facilities at its Boise, ID headquarters and a mega-fab in Syracuse, NY. These advanced fabs, focused on producing industry-leading DRAM technology, align with Micron\u2019s commitment to environmental sustainability. Successful collaboration between Micron and key partners will be crucial in realizing the fabs of the future.<u><\/u><u><\/u><\/p>\n<p>Memory-centric AI architectures and legislative initiatives such as CHIPS and FABS play a decisive role in driving the resurgence of domestic semiconductor fabs and shaping the future of the semiconductor industry. By harmonizing innovation with policy support, the United States seeks to regain its leadership position in semiconductor manufacturing and fortify its technological edge.<\/p><\/div><\/div><\/div><\/div><div class=\"x-acc e6910-e53 m5by-x\" id=\"x-acc-e6910-e53\"><div class=\"e6910-e54 x-acc-item\"><button id=\"tab-e6910-e54\" class=\"x-acc-header\" role=\"button\" type=\"button\" aria-expanded=\"false\" aria-controls=\"panel-e6910-e54\" data-x-toggle=\"collapse\" data-x-toggleable=\"e6910-e54\"><span class=\"x-acc-header-content\"><span class=\"x-acc-header-indicator\">&#x25b8;<\/span><span class=\"x-acc-header-text\">Biography<\/span><\/span><\/button><div id=\"panel-e6910-e54\" role=\"tabpanel\" aria-hidden=\"true\" aria-labelledby=\"tab-e6910-e54\" data-x-toggleable=\"e6910-e54\" data-x-toggle-collapse=\"1\" class=\"x-collapsed\"><div class=\"x-acc-content\"><div class=\"x-text x-content e6910-e55 m5by-v\"><p><strong>Scott Gatzemeier<\/strong> is Corporate Vice President of Front End US Expansion at Micron Technology. Scott has more than 25 years of experience across probe, fab engineering, operations, and technology development. Scott has been working on US expansion initiatives for the past year and is responsible for Micron&rsquo;s Boise and New York manufacturing expansion projects.<\/p>\n<p>Scott started his career at Micron in 1997 as an intern of the DRAM Probe Engineering team. After being converted to full time, he held positions of increasing responsibilities in the probe engineering team. In 2006, he joined IM Flash to help with the startup leading several teams over time including Probe Engineering, Product Integration Engineering, Quality Engineering, and eventually becoming the Fab Director. Scott moved back to Micron as Sr. Director, Manufacturing Development Engineering and subsequently became the Vice President of&nbsp; Research &amp; Development Operations where the team delivered strong results and improvement in cycle time, quality, and cost reductions. In his previous role as Vice President of Yield Technology and Data Science, the team developed the data infrastructure and solutions for Technology Development and Front End manufacturing as well as developing and executing the roadmap for defection inspection and yield enhancement.<\/p>\n<p>Scott holds a master&rsquo;s in information and data science from UC Berkeley School of Information and a bachelor of science in electrical engineering from University of North Dakota where he graduated with distinction. A holder of 17 U.S. patents in fields of DRAM and NAND technologies, he also earned an MBA business degree from National Technology University. In his spare time, Scott enjoys spending time with his family and enjoying the outdoors hiking, snowboarding, running, and biking.<\/p><\/div><\/div><\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e6910-e56 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e57 m5by-8\"><div class=\"x-text x-text-headline e6910-e58 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">10:00 am<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e59 m5by-8\"><div class=\"x-text x-text-headline e6910-e60 m5by-o m5by-r m5by-s m5by-t\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">Break & Networking<\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e6910-e61 m5by-d\"><p>Enjoy the break and networking time.<\/p><\/div><\/div><\/div><div class=\"x-container max width e6910-e62 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e63 m5by-8\"><div class=\"x-text x-text-headline e6910-e64 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">10:30 am<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e65 m5by-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Contact technology\">Session 1<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\">Contact Technology<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Understanding Contactor Pin Wearout&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nDale Ohmart\n      <\/div>\n\t    <div class=\"authorCompany\">\nTexas Instruments Inc.\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nRobert Milotta\n      <\/div>\n\t    <div class=\"authorCompany\">\nTexas Instruments Inc.\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>Typical contactor pins for semiconductor final test are specified to have a lifetime of about 200k cycles (might vary over increased temperature and current). Ideally the contactor pin lifetime would be as long as possible to in order to reduce the disruption of replacement. The large number of variables in the chip manufacturing process create challenges measuring pin lifetimes. An experiment was designed to perform a controlled evaluation of the pin lifetime of a commonly utilized spring-loaded contactor pin. This provided a fundamental study of the degradation mechanisms that lead to accelerated wear out, performance degradation prior to failure of the contactor pin.  The experimental design will be described along with surprising information about how pins wear and the effect on contact resistance.<\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s1p1Ohmart_4450.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s1p1Ohmart_4450.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Next Generation Elastomer Socket and Interposer&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nJoshua Kimn\n      <\/div>\n\t    <div class=\"authorCompany\">\nSemiQual\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nGS Kim\n      <\/div>\n\t    <div class=\"authorCompany\">\nSNOW\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>Necessity of new elastomer technology to improve by replacing random particles of conventional elastomer by MEMS particles for lower CRES, longer longevity and more.<\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s1p2Kimn_8682.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s1p2Kimn_8682.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Force-Controlled Device Contacting&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nPeter Liebig\n      <\/div>\n\t    <div class=\"authorCompany\">\nesmo AG\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>Development and implementation of a force-controlled device contacting application for the final test engineering handler \u201ctalos\u201d, which controls the travel of the contacting unit by a predefined contact force.<\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s1p3Liebig_1173.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s1p3Liebig_1173.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Optimal Spring Probe Solutions for Every Application&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nValts Treibergs\n      <\/div>\n\t    <div class=\"authorCompany\">\nJohnstech International\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>Most production test contactor solutions deployed today utilize some sort of spring probe technology that has been derived from some previous implementation in a test cell.  Even though certain spring probe \u2018standards\u2019 have been adopted, they usually result in a degradation of performance in the test cell needed today.  A clear example of this is the \u2018widespread\u2019 adoption of a spring probe of 5mm (or so) compressed test height.  This is a spring probe standard based on a probe design from 20 years ago, originally designed for test handlers that are almost forgotten.\r\nWhat is needed today is a modern standard of spring probes: one family that targets high-speed and high-performance GHz applications, and the other family that is high-performance mechanically, yet very robust for modern digital and RF applications.\r\nThe high-performance GHz family can compete electrically with elastomer-based solutions yet retain mechanical robustness that can endure extreme temperature test environments, as in automotive applications.\r\nThe high-performance mechanical probe family has a very large probe compliance that allows testing of very large modules and strips while maintaining reliable electrical contact and having excellent RF response.\r\nTrue probe families have the added benefit of having flexibility to arrange signal\/ground\/power pins in any configuration to optimize signals while maintaining standard test kit hardware.\r\nCustomer applications will be presented for both high-GHz and high-compliance solutions, and what benefits have been achieved.<\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s1p4Treibergs_8989.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s1p4Treibergs_8989.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><div class=\"x-container max width e6910-e67 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e68 m5by-8\"><div class=\"x-text x-text-headline e6910-e69 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">12:30 pm<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e70 m5by-8\"><div class=\"x-text x-text-headline e6910-e71 m5by-o m5by-r m5by-s m5by-t\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">Lunch<\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e6910-e72 m5by-d\"><p>Lunch is served. Enjoy the break and networking time.<\/p><\/div><\/div><\/div><div class=\"x-container max width e6910-e73 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e74 m5by-8\"><div class=\"x-text x-text-headline e6910-e75 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">1:30 pm<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e76 m5by-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"SI 1\">Session 2<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\">Signal Integrity I<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Differential Probe Design to Support PCB Characterization to 40 GHz for 112G PAM4 Applications&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nDaniel \"Dan\" Bock\n      <\/div>\n\t    <div class=\"authorCompany\">\nPTSL\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nJeffery \"Jeff\" Arasmith\n      <\/div>\n\t    <div class=\"authorCompany\">\nPTSL\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>The expansion of data has lead to dramatic changes in the way data is moved around the world.  From AI processers, the speed at which data is being transferred has grown at a dramatic rate in order to support these chipsets.  Some of the key components in this data transfer include SerDes system for moving data within data centers, which is the backbone for data movement.  In order to support this, PTSL is developing the NuvoRF probe that can be used to characterize high speed data channels in PCBs with pitches nearly 1mm, where other analytic probes are not able to provide high enough bandwidth performance at those bandwidths due to being configured as GS probes where the impedance is not well controlled to the top.  The NuvoRF probe can be used to characterize data channels on PCBs up to speeds of PCIe Gen 7 at 128 Gbps and 224 Gbps PAM4 SerDes signal lines due to the NuvoRF being configurable to a GSSG design with good impedance control to the tip, ensuring that the high speed data channels are operating up to the necessary bandwidth.  PTSL will present data on the NuvoRF probe and illustrate how it can be used to provide high fidelity measurements of in PCB channels, characterizing the PCBs prior to attachment of the ASIC.  Some of the data PTSL will present includes both S-parameters and TDR measurements to representative structures, showing that we can measure these channels with very high BW capabilities, ensuring that the PCB can support these data rates.<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s2p1Arasmith_5132.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s2p1Arasmith_5132.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Effective back-drilling strategies for 200G+ PAM4 Designs&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nQuaid Joher \"Quaid\" Furniturewala\n      <\/div>\n\t    <div class=\"authorCompany\">\nR&D Altanova - Advantest\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nHameem Ur \"Hameem\" Rahman\n      <\/div>\n\t    <div class=\"authorCompany\">\nR&D Altanova - Advantest\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>Effective back-drilling strategies for 200G+ PAM4 Designs\r\n\r\nOver the past few decades, technology has seen tremendous growth on the highspeed networking and RF frequencies. It seems not too distant when the frequencies were in lower MHz and we started to worry about the potential Signal Integrity issues arising due to transmission line losses and reflections. Nowadays as high-speed networking is moving to 200G+ PAM4 designs and even higher Nyquist frequencies, the transmission line losses due to reflections and impedance mismatches are getting more and more critical with a focus to further tune PCB transmission lines with tighter impedances, refined and tuned via\/drill structures, better and improved materials, and specifically back-drill capabilities.\r\nBack-drills have served a critical feature in the past for reducing the losses coming out of the transmission lines due to removal of excessive stubs on the transmission lines. However, as the data rates goes higher and higher, question remain on the effectiveness of back-drills on highspeed networking designs.\r\nThis paper discusses in detail the effects of back-drilling on High-speed transmission lines and the effectiveness for stub-drilling for higher frequencies on 200G+ PAM4 designs.\r\n\r\nAuthors:\r\nHameem Ur Rahman \u2013 R&D Altanova [Advantest]\r\nQuaid Joher Furniturewala \u2013 R&D Altanova [Advantest]<p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s2p2Furniturewala_3852.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s2p2Furniturewala_3852.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Test Hardware Signal Integrity Design for SOC Package with IP Specific Impedance&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nNoel Del Rio\n      <\/div>\n\t    <div class=\"authorCompany\">\nNXP\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>This paper to present test hardware Signal Integrity (SI) design for SOC with complex I\/O transmission line requirements.  NXP products with high speed I\/O's of different format or type.  Different data rate, impedance on a single package.  The concept of one size fits-all I\/O impedance is replaced by IP - specific transmission line parameters.  Signal path design to cater for unique trace impedances for:\r\nEthernet PCIE-85 Ohms Differential Impedance\r\nUSB-90 Ohms Differential Impedance\r\nDDR-80 Ohms Differential Impedance, 40 Ohms Single Ended\r\nOther I\/O 100 Ohms Differential Impedance, 50 Ohms Single Ended\r\nModeling, simulation and validation methods to facilitate optimum performance.  Multi-impedance implementation on test sockets.  Layout and stack-up management on Final Test Loadboard.<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s2p3DelRio_5479.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s2p3DelRio_5479.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Monte Carlo \u201cFEA\u201d - fast solutions for fast interconnects&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nGert Hohenwarter\n      <\/div>\n\t    <div class=\"authorCompany\">\nGateWave Northern, Inc.\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>Summary of Abstract (to be published in TestConX website):\r\nOptimization of high-speed interconnect interfaces into PCBs suffers from difficulties finding optimal performance over wide frequency bands in the presence of many variable PCB layout parameters.  Ideally it would seem desirable to run a large number of simulations with different parameter sets and compare results.  This is in direct conflict with typically long run times and high demand on computational resources when using 3D finite-element-analysis (FEA), thus making it largely impractical to perform many multiple optimizations for comparison purposes.\r\nSimulation platforms such as SPICE circuit modelers allow for very fast computation times in the seconds range and it was shown in last year\u2019s  presentation \"Into the PCB at 90 \u2013 high GHz signal launches\" that under careful examination of the problem it becomes possible to allow use of SPICE engines for interconnect simulations.  Doing so then also enables use of so-called 'Monte Carlo analysis' that relies on repeated random sampling to obtain a large number of numerical results. With it one can define a range of parameters for many individual components in the same design and allow those to vary at will.  Because of the very high computational speed it is then a simple matter to run multiple Monte Carlo analyses in short order and obtain a comprehensive graphical representation and comparison for very large numbers of parameter combinations.  It will therefore be shown here how this approach can be used to identify a \u2018most agreeable solution\u2019 and its associated parameter selection for a particular design.\r\nWhile the process of setting up and running SPICE Monte Carlo simulations is relatively straightforward it must be kept in mind that the real work in using this technique lies in establishing and running 3D FEA \r\nsub-models that allow for 'reverse engineering' the actual 3D interconnect design. This process requires knowledge of which significant parasitic capacitance\/inductance elements must be accounted for and how to extract the SPICE parameters from the 3D FEA simulations. Brief examples of such 3D models will thus be used to illustrate this aspect.  In the same context correlation between SPICE and 3D FEA simulation results will be examined. Finally, pros and cons of the proposed approach will be discussed.<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s2p4Hohenwarter_6104.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s2p4Hohenwarter_6104.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><div class=\"x-container max width e6910-e78 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e79 m5by-8\"><div class=\"x-text x-text-headline e6910-e80 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">3:30 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e81 m5by-8\"><div class=\"x-text x-text-headline e6910-e82 m5by-o m5by-q m5by-s m5by-u\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">Break & Networking<\/h1>\n<\/div><\/div><\/div><div class=\"x-content-area e6910-e83 m5by-d\"><p>Enjoy the break and networking time.<\/p><\/div><\/div><\/div><div class=\"x-container max width e6910-e84 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e85 m5by-8\"><div class=\"x-text x-text-headline e6910-e86 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">4:00 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e87 m5by-8\">\n<div >\n<div class=\"testconx-session-heading \"><div class=\"sessionName\" id=\"Precision Test Equipment\">Session 3<\/div><div class=\"sessionLocation\">Red Mountain Ballroom<\/div><\/div><div class=\"sessionTitle\">Precision Test Equipment<\/div><div class=\"subtitle\"><\/div><div class=\"x-hide-xs\"><p><\/p><\/div><div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Turbo Charging Active Laser Trim for Precision & Throughput Optimization.&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nJoseph Yehle\n      <\/div>\n\t    <div class=\"authorCompany\">\nTexas Instruments\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nYazdi Contractor\n      <\/div>\n\t    <div class=\"authorCompany\">\nTexas Instruments\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>The world needs precision semiconductor parts in a variety of applications.  The need for that precision will only accelerate as semiconductor content is placed in new applications.  Thus, the balance between the benefit of precision trim at test and the cost of executing that trim is a never-ending optimization journey.  Active laser trimmed parts can deliver very high precision, equivalent to 24+ bits when using a more common OTP\/EEPROM based trim, with almost no die cost area and no digital content.  Nothing is free and active laser trimming requires more development time and advanced skillsets to deliver an optimized solution into production.\r\n\r\nThis paper presents a new active laser trim methodology that requires less development time and developer skillset to achieve the same electrical result as the baseline method.  A key challenge with optimizing laser trim solutions is balancing the inverse relationship between the precision of the final result and the speed at achieving it.  A very high precision trim will always be slower than a comparable lower precision trim due to how the active laser trimming process works.  Every method to mitigate that relationship comes at the cost of making the trim optimization process more complicated.  This paper breaks that consequence by adding a new control signal between the control system and the laser trimmer.  A high precision trim can be made much faster without making it more complicated.\r\n\r\nVarious existing active laser trim control methods will be shared to explain the current state of art and its limitations.  That foundation will be used to show how the new methodology is better.  Plots of the electrical results will be shown to highlight where execution time is saved and that the post-trim results are unchanged.  In addition, data from a 10k unit pilot run will be shown to highlight the top-level execution time savings and the same unchanged post-trim results.<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s3p1Yehle_4972.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s3p1Yehle_4972.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Development of an 8-site Change Kit for Parametric OTA Testing&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nRoger Nettles\n      <\/div>\n\t    <div class=\"authorCompany\">\nAdvantest\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nJose Moreira\n      <\/div>\n\t    <div class=\"authorCompany\">\nAdvantest\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nNatsuki Shiota\n      <\/div>\n\t    <div class=\"authorCompany\">\nAdvantest\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nHiromitsu Takasu\n      <\/div>\n\t    <div class=\"authorCompany\">\nAdvantest\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nHiroyuki Mineo\n      <\/div>\n\t    <div class=\"authorCompany\">\nAdvantest\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nSui-Xia Yang\n      <\/div>\n\t    <div class=\"authorCompany\">\nAdvantest\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nFrank Goh\n      <\/div>\n\t    <div class=\"authorCompany\">\nAdvantest\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>Parametric over-the-air (OTA) testing of antenna-in-package (AiP) modules presents several additional challenges to the semiconductor testing community due to the requirement of using a measurement antenna to parametrically test the AiP module. This has several implications starting with the ATE measurement instrumentation, which needs to support frequencies in the mmWave range. The DUT test fixture design also needs to support mmWave frequencies, and the DUT socket now needs to incorporate a measurement antenna, which can add a significant degree of complexity as compared to traditional RF sockets. In the last few years several papers\/presentations have been published on this topic by members of the industry which present different approaches and solutions to these challenges.\r\nIn this presentation we will concentrate on high volume production testing of AiP modules, and the challenge of creating a multi-site (8-sites) OTA change kit that can be readily integrated into a standard commercial handler without any hardware modifications required to the handler itself. This flexibility and ease of integration to existing available hardware is a critical requirement to make parametric OTA production testing lower cost and readily accessible within the OSAT business model.\r\nWe will describe the OTA change kit implementation concept.  We will discuss critical points such as the measurement antenna, pick and place and pusher implementation, and also the blind-mate waveguide interconnect that is required to transmit\/receive the mmWave signal from the measurement antenna to the module under test and ATE measurement instrumentation. We will show the results of testing devices with the OTA change kit. Special emphasis will be on the achievable index time and unit per hour rate.\r\nFor this evaluation we utilized a demonstration AiP module developed by Advantest. which will also be described in the presentation including some parametric OTA measurement results with this demonstration vehicle. Finally, we will discuss the challenges and our experiences of site-to-site isolation on a multi-site OTA change kit and how those challenges can be addressed.\r\nIn this presentation we will concentrate on high volume production testing of AiP modules, and the challenge of creating a multi-site (8-sites) OTA change kit that can be readily integrated into a standard commercial handler without any hardware modifications required to the handler itself. This flexibility and ease of integration to existing available hardware is a critical requirement to make parametric OTA production testing lower cost and readily accessible within the OSAT business model.\r\nWe will describe the OTA change kit implementation concept.  We will discuss critical points such as the measurement antenna, pick and place and pusher implementation, and also the blind-mate waveguide interconnect that is required to transmit\/receive the mmWave signal from the measurement antenna to the module under test and ATE measurement instrumentation. We will show the results of testing devices with the OTA change kit. Special emphasis will be on the achievable index time and unit per hour rate.\r\nFor this evaluation we utilized a demonstration AiP module developed by Advantest. which will also be described in the presentation including some parametric OTA measurement results with this demonstration vehicle. Finally, we will discuss the challenges and our experiences of site-to-site isolation on a multi-site OTA change kit and how those challenges can be addressed.<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s3p2Nettles_3533.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s3p2Nettles_3533.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;Validation Platform to Characterize Standalone Oscillators in Various Package Sizes&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nHarish Ramesh\n      <\/div>\n\t    <div class=\"authorCompany\">\nTexas Instruments India\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nSambit Panda\n      <\/div>\n\t    <div class=\"authorCompany\">\nTexas Instruments India\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nAkhil Singh\n      <\/div>\n\t    <div class=\"authorCompany\">\nTexas Instruments India\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>Every RF, mixed-signal and digital system needs a timing and clock subsystem to synchronize the generation and transportation of data. Standalone oscillators are very basic building blocks in such systems. The industry has a wide range of frequencies starting from a few kHz up to hundreds of MHz range of oscillators and they also come in various package types, package dimensions and pin count. For robust functioning of the system and in order to meet timing requirements, the performance of the Oscillator is very critical. This requires extensive characterization of the part for some of the critical parameters like Jitter, Phase Noise, frequency stability, Power Consumption, Output Clock Characteristics, Aging, Solder Shift and Power-Up Transients. Not all parameters can be tested on the Production due to hardware & test time limitation. Therefore a bench testing is the only way to guarantee these parameters reported in datasheet. It also demands the need for statistical data due to large volume requirement and to ensure quality parts are released with no failures reported in field. To make the testing efficient a Multi Site Bench Test is required. Single Site Bench Test is in-efficient and expensive. Multisite testing improves on the following \r\n\u2022Coverage of devices\r\n\u2022Validation timeline\r\n\u2022Cost and time saving in terms of instrumentation, bench and setup.\r\nIn this paper we present to you a mother board + daughter card solution \/ platform that is used to characterize TIs BAW based Oscillators.<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s3p3Ramesh_7999.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s3p3Ramesh_7999.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<div class=\"presentation\">\n<div class=\"presentationTitle\">\n&ldquo;High Voltage Module Development and Characterization for Automatic Test Equipment&rdquo; \n<\/div>\n<div class=\"authorList\">\n   <div class=\"author\">\n      <div class=\"authorName\">\nZaid Meqbel\n      <\/div>\n\t    <div class=\"authorCompany\">\nThe University of Texas at Arlington\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nAndrew Kozelsky\n      <\/div>\n\t    <div class=\"authorCompany\">\nUniversity of Texas at Arlington\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nMd Safkat Rahman\n      <\/div>\n\t    <div class=\"authorCompany\">\nThe University of Texas at Arlington\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nRicardo Perez\n      <\/div>\n\t    <div class=\"authorCompany\">\nThe University of Texas at Arlington\n\t    <\/div>\n   <\/div>\n   <div class=\"author\">\n      <div class=\"authorName\">\nRaad Abusaad\n      <\/div>\n\t    <div class=\"authorCompany\">\nThe University of Texas at Arlington\n\t    <\/div>\n   <\/div>\n<\/div>\n<details class=\"summaryDetail\">\n\t<summary class=\"summaryLine\">Abstract (English)<\/summary>\n<p>The growth of the semiconductor industry drives a growth in the demanded testing abilities of Automated Test Equipment (ATE). This rising demand for high-voltage testing has prompted the need for innovative ATE solutions. Sponsored by Texas Instruments (TI), our project presents a solution that integrates with the existing system at TI and addresses the high-voltage demand.\r\n\r\nOur objective is to develop a cost-effective high-voltage resource board for ATEs used in semiconductor testing. The prototype is designed to deliver up to 4 kV differential output while maintaining accuracy, efficiency, and exceptional DC power quality. We aim to improve the power quality by using filters to minimize output voltage ripple. This resource board must seamlessly integrate with existing ATE setups while adhering to the limitations imposed by the available signals, power resources, and size constraints.\r\n\r\nAn onboard microcontroller is employed to precisely regulate the voltage and timing required for the Device Under Test (DUT) in accordance with the ATE. The resource board incorporates a DC\/DC converter, filters for enhancing DC power quality, and a control feedback loop, collectively optimizing the accuracy of ATE control. This allows the test engineers to effectively control the high voltage on the resource board by varying the input. Additionally, the onboard control serves to establish a current limit as a safeguard against potential short circuits in the DUT.\r\n\r\nIn this paper, we discuss the process of design and development of our high voltage ATE resource and we discuss the characterization of the prototype and the DC\/DC chosen. The output voltage, output current, output voltage ripple, output voltage accuracy, efficiency, and temperature, are the parameters this project aims to optimize.<\/p><p><\/p><\/details>\n<a href=\"\/premium\/welcome\/\"><img loading=\"lazy\" decoding=\"async\" class=\"alignleft size-full wp-image-129\" title=\"Click here to subscribe to PREMIUM content\" alt=\"\" src=\"\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png\" width=\"480\" height=\"270\" srcset=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber.png 480w, https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/premium-video-non-subscriber-300x168.png 300w\" sizes=\"auto, (max-width: 480px) 100vw, 480px\" \/><\/a><div style=\"clear: both;\"><\/div><a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s3p4Meqbel_7565.pdf\" target=\"_blank\"><img loading=\"lazy\" decoding=\"async\" class=\"size-full wp-image-70\" alt=\"PDF-Icon 150x139\" src=\"\/premium\/wp-content\/uploads\/PDF-Icon-150x139.png\" width=\"75\" height=\"70\" \/><\/a>&nbsp;<a href=\"\/premium\/wp-content\/uploads\/2024\/TestConX2024s3p4Meqbel_7565.pdf\" target=\"_blank\" \/>Presentation Download<\/a><\/div>\n<\/div>\n\t \n<\/div><\/div><div class=\"x-container max width e6910-e89 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e90 m5by-8\"><div class=\"x-text x-text-headline e6910-e91 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\"><div id=\"EXPO\">6:00 p<\/div><\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e92 m5by-8\"><div class=\"x-text x-text-headline e6910-e93 m5by-o m5by-r m5by-s m5by-t\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">TestConX EXPO & Reception<\/h2>\n<\/div><\/div><\/div><div class=\"x-content-area e6910-e94 m5by-d\"><p>The TestConX EXPO is a very popular part of the TestConX program with many great exhibits for <em>connecting electronic test professionals to solutions<\/em>. There is always something new to see or someone new to meet. Not to mention excellent food, drinks, and time for attendees to network with exhibitors!<\/p><\/div><\/div><\/div><div class=\"x-container max width e6910-e95 m5by-6\"><div class=\"x-column x-sm x-1-4 e6910-e96 m5by-8\"><div class=\"x-text x-text-headline e6910-e97 m5by-o m5by-q m5by-r m5by-s\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h1 class=\"x-text-content-text-primary\">9:00 p<\/h1>\n<\/div><\/div><\/div><\/div><div class=\"x-column x-sm x-3-4 e6910-e98 m5by-8\"><div class=\"x-text x-text-headline e6910-e99 m5by-o m5by-r m5by-s m5by-t\"><div class=\"x-text-content\"><div class=\"x-text-content-text\"><h2 class=\"x-text-content-text-primary\">Adjourn<\/h2>\n<\/div><\/div><\/div><\/div><\/div><div class=\"x-container max width e6910-e100 m5by-6\"><div class=\"x-column x-sm x-1-1 e6910-e101 m5by-8\"><div class=\"x-content-area e6910-e102 m5by-d\"><p><em>Program subject to change without notice.<\/em><\/p><\/div><\/div><\/div><\/div><div class=\"x-section e6910-e103 m5by-0 m5by-2 m5by-5\"><div class=\"x-container max width e6910-e104 m5by-6\"><div class=\"x-column x-sm x-1-1 e6910-e105 m5by-8 m5by-9\"><a class=\"x-anchor x-anchor-button e6910-e106 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Overview<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e6910-e107 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024-sunday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Sunday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e6910-e108 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024-monday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Monday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e6910-e109 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024-tuesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Tuesday<\/span><\/div><\/div><\/a><a class=\"x-anchor x-anchor-button e6910-e110 m5by-e\" tabindex=\"0\" href=\"\/premium\/testconx2024-wednesday\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Wednesday<\/span><\/div><\/div><\/a><\/div><\/div><div class=\"x-row x-container max width e6910-e111 m5by-f m5by-g m5by-k\"><div class=\"x-row-inner\"><div class=\"x-col e6910-e112 m5by-l m5by-m\"><hr class=\"x-line e6910-e113 m5by-n\"\/><a class=\"x-anchor x-anchor-button e6910-e114 m5by-e\" tabindex=\"0\" href=\"https:\/\/www.testconx.org\/premium\/testconx-expo-2024\/\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">EXPO<\/span><\/div><\/div><\/a><\/div><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Rotate your smartphone to landscape or increase your browser width to see session descriptions.OverviewSundayMondayTuesdayWednesdayEXPOMonday March 4, 2024 7:30 am Continental Breakfast Start the day right and enjoy the continental breakfast while networking with other attendees.8:30 am WelcomeRed Mountain BallroomOpening RemarksWelcoming remarks from the General Chair, Ira Feldman 9:00 am KeynoteRed Mountain BallroomKeynote &ldquo;US Fabs of the Future&rdquo; Scott Gatzemeier Micron &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/testconx2024-monday\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6910","page","type-page","status-publish","hentry","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/6910","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=6910"}],"version-history":[{"count":25,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/6910\/revisions"}],"predecessor-version":[{"id":7180,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/6910\/revisions\/7180"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=6910"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}