{"id":6909,"date":"2023-12-22T19:22:25","date_gmt":"2023-12-23T03:22:25","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=6909"},"modified":"2024-07-12T16:15:03","modified_gmt":"2024-07-12T23:15:03","slug":"testconx2024-wednesday","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx2024-wednesday\/","title":{"rendered":"TestConX 2024 – Wednesday"},"content":{"rendered":"
\"Image\"<\/span><\/div><\/div><\/div>

Rotate your smartphone to landscape or increase your browser width to see session descriptions.<\/h4><\/div><\/div><\/div><\/div>
Overview<\/span><\/div><\/div><\/a>
Sunday<\/span><\/div><\/div><\/a>
Monday<\/span><\/div><\/div><\/a>
Tuesday<\/span><\/div><\/div><\/a>
Wednesday<\/span><\/div><\/div><\/a>
EXPO<\/span><\/div><\/div><\/a><\/div><\/div>
<\/div><\/div><\/div>

Wednesday March 6, 2024<\/div><\/h1>\n<\/div><\/div><\/div><\/div><\/div>

7:00 a<\/h1>\n<\/div><\/div><\/div><\/div>

Continental Breakfast<\/h2>\n<\/div><\/div><\/div>

Start the day right and enjoy the continental breakfast while networking with other attendees.<\/p><\/div><\/div><\/div>

8:00 a<\/h1>\n<\/div><\/div><\/div><\/div>
\n
\n
Session 7<\/div>
Red Mountain Ballroom<\/div><\/div>
Chiplets & mmWave<\/div>
<\/div>

<\/p><\/div>

\n
\n“Addressing Test Challenges with Solid Contact Technology” \n<\/div>\n
\n
\n
\nBrian Sheposh\n <\/div>\n\t
\nJohnstech International\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract (English)<\/summary>\n

The repeatability and accuracy of test plays a critical role of ensuring optimal test throughput.\u202f The demand for semiconductor test reliability increases with the requirements for device performance. <\/p>\r\n

Testing high performance devices comes with many test challenges: