{"id":6666,"date":"2023-07-19T16:16:24","date_gmt":"2023-07-19T23:16:24","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=6666"},"modified":"2025-04-30T19:57:40","modified_gmt":"2025-05-01T02:57:40","slug":"call-for-presentations-korea","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/call-for-presentations-korea\/","title":{"rendered":"TestConX Korea Call for Presentations"},"content":{"rendered":"<div id=\"cs-content\" class=\"cs-content\"><div class=\"x-section e6666-e1 m556-0\"><div class=\"x-row x-container max width e6666-e2 m556-1 m556-2\"><div class=\"x-row-inner\"><div class=\"x-col e6666-e3 m556-3\"><a class=\"x-anchor x-anchor-button e6666-e4 m556-4\" tabindex=\"0\" href=\"#english\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">English<\/span><\/div><\/div><\/a><div class=\"x-text x-content e6666-e5 m556-5 m556-6 m556-7\"><p><i><span style=\"font-weight: 400;\">English version follows<\/span><\/i><\/p>\n<p><span style=\"font-weight: 400;\">2024\ub144 10\uc6d4 28~29\uc77c\uc5d0 \uac1c\ucd5c\ub418\ub294 \uccab\ubc88\uc9f8 <\/span><a href=\"https:\/\/www.testconx.org\/premium\/\"><span style=\"font-weight: 400;\">TestConX<\/span><span style=\"font-weight: 400;\">&reg;<\/span><span style=\"font-weight: 400;\"> Korea<\/span><\/a><span style=\"font-weight: 400;\"> \ud589\uc0ac\uc5d0 \uc5ec\ub7ec\ubd84\uc744 \ucd08\ub300\ud569\ub2c8\ub2e4.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\uc774\ud2c0\uc77c\uc815\uc73c\ub85c \uc9c4\ud589\ub418\ub294 TestConX Korea\ub294 \ucd5c\uc2e0\uae30\uc220 \ubc0f \uc5c5\uacc4\ub3d9\ud5a5\uc5d0 \ub300\ud55c \uc778\uc0ac\uc774\ud2b8\ub97c \uc81c\uacf5\ud558\ub294 \uc138\uc158\ud30c\ud2b8\uc640 \uad6d\ub0b4 \uc678 \uc720\ub825 \ud14c\uc2a4\ud2b8 \uc5c5\uccb4\ub4e4\uc758 \uc194\ub8e8\uc158\uc744 \uc9c1\uc811 \ud655\uc778\ud560 \uc218 \uc788\ub294 TestConX EXPO\ud589\uc0ac\ub85c \uad6c\uc131\ub418\uc5b4 \uc788\uc2b5\ub2c8\ub2e4.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\ud14c\uc2a4\ud2b8 \uacf5\uc815 \uc804\ubb38\uac00\ub4e4\uacfc \ud074\ub77c\uc774\uc5b8\ud2b8\uac00 \ud55c \uc790\ub9ac\uc5d0 \ub9cc\ub098\ub294TestConX Korea\ub294<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\uc11c\ub85c\uc758 \uc778\uc0ac\uc774\ud2b8\ub97c \uacf5\uc720\ud558\uace0 \ube44\uc988\ub2c8\uc2a4 \uae30\ud68c\ub97c \ubaa8\uc0c9\ud560 \uc218 \uc788\ub294 \ucd5c\uc801\uc758 \uc7a5\uc18c\ub85c&nbsp;<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\ucc38\uc11d\ud558\ub294 \ubd84\ub4e4 \ubaa8\ub450\uc5d0\uac8c \uc88b\uc740 \uae30\ud68c\uac00 \ub420 \uac83\uc785\ub2c8\ub2e4.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\uc544\uc6b8\ub7ec TestConX Korea\uc5d0\uc11c\ub294&nbsp;<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Ultra-high volume operation \ubc0f Millimeter-wave \uae30\uc220\uc744 \ud3ec\ud568\ud55c&nbsp;<\/span><\/p>\n<p><span style=\"font-weight: 400;\">5G Testing\uacfc \uad00\ub828\ud574 \uc778\uc0ac\uc774\ud2b8\ub97c \ub098\ub220 \uc8fc\uc2e4 \uc5f0\uc0ac\ub97c \ucc3e\uace0 \uc788\uc2b5\ub2c8\ub2e4.&nbsp;<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\ucd94\uac00\uc801\uc73c\ub85c \ud14c\uc2a4\ud2b8\uc640 Burn-in\uc5d0 \ub300\ud55c \ubc1c\ud45c \uc81c\uc548\ub3c4 \ud070 \uc758\ubbf8\uac00 \uc788\uc744 \uac83 \uac19\uc2b5\ub2c8\ub2e4.&nbsp;<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Presentation\uc2dc\uac04\uc740 30\ubd84\uc73c\ub85c (\ubc1c\ud45c25\ubd84, Q&amp;A 5\ubd84)<\/span><\/p>\n<p><span style=\"font-weight: 400;\">TestConX\uc5d0\uc11c \uc81c\uacf5\ud558\ub294 PPT\uc591\uc2dd\uc744 \uc0ac\uc6a9\ud558\uc5ec \uc601\uc5b4 \ub610\ub294 \ud55c\uad6d\uc5b4\ub85c \ubc1c\ud45c\ud560 \uc218 \uc788\uace0,<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\ubc1c\ud45c\ub97c \uc704\ud55c \uc81c\uc548\uc11c\ub294 250~300\ub2e8\uc5b4\ub85c \uc791\uc131\ud574 \ud558\ub2e8 \uc8fc\uc18c\ub85c \ubcf4\ub0b4\uc8fc\uc2dc\uba74 \ub429\ub2c8\ub2e4.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\u2610 \uc138\ubd80 <\/span><span style=\"font-weight: 400;\">\uc77c\uc815<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\uc81c\uc548\uc11c \uc81c\ucd9c : 7\uc6d4 12\uc77c (\uae08)<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\uacb0\uacfc \ud1b5\ubcf4 : 8\uc6d4 2\uc77c (\uae08)<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\uc790\ub8cc \uc81c\ucd9c : 9\uc6d4 30\uc77c (\uae08)<\/span><\/p>\n<p><span style=\"font-weight: 400;\">\u2610 <\/span><span style=\"font-weight: 400;\">\uc591\uc2dd \/ \uc81c\ucd9c\ucc98<\/span><\/p>\n\n<\/div><a class=\"x-anchor x-anchor-button e6666-e6 m556-4\" tabindex=\"0\" href=\"\/premium\/abstracts-korea-2025\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Submit Abstracts<\/span><\/div><\/div><\/a><hr class=\"x-line e6666-e7 m556-a m556-b\"\/><div class=\"x-text x-content e6666-e8 m556-5 m556-6 m556-7\"><p><a href=\"\\&quot;+d+\\&quot;\\\\\\&quot; target=\\\\\\&quot;_blank\\\\\\&quot;&gt;\\&quot;+d+\\&quot;&lt;\/a&gt;\\&quot;&quot;)\/*]]&gt;*\/&lt;\/script&gt;\"><span style=\"font-weight: 400;\"><span id=\"e804357273\">[javascript protected email address]<\/span><script type=\"text\/javascript\">\/*<![CDATA[*\/eval(\"var a=\\\"tdExPTDlBq_oI2h0grUiL6Ve4RZcjsHAYX.M-73O+kWwFz8vba1pGK@nSfy9umCQNJ5\\\";var b=a.split(\\\"\\\").sort().join(\\\"\\\");var c=\\\"pnyzkdkW9uykwu92uz9uwn@NEnyv\\\";var d=\\\"\\\";for(var e=0;e<c.length;e++)d+=b.charAt(a.indexOf(c.charAt(e)));document.getElementById(\\\"e804357273\\\").innerHTML=\\\"<a href=\\\\\\\"mailto:\\\"+d+\\\"\\\\\\\" target=\\\\\\\"_blank\\\\\\\">\\\"+d+\\\"<\/a>\\\"\")\/*]]>*\/<\/script> <\/span><\/a><\/p>\n<p><span style=\"font-weight: 400;\">\ub2e4\uc74c \uc8fc\uc81c \ubaa9\ub85d\uc744 \ucc38\uc870\ud574 \uc8fc\uc138\uc694<\/span><\/p><\/div><div class=\"x-text x-content e6666-e9 m556-5 m556-8 m556-9\"><h5 id=\"english\">Call for Presentations and Posters for<br \/>TestConX Korea 2025<\/h5><\/div><div class=\"x-text x-content e6666-e10 m556-5 m556-6 m556-9\"><p>Suwon, South Korea &ndash; November 18, 2025<\/p>\n<p>&nbsp;<\/p>\n<p>Join us for the 3<sup>rd<\/sup> annual <a href=\"https:\/\/www.testconx.org\/premium\/\">TestConX&reg; Korea<\/a> workshop to be held as a <strong>live in-person event<\/strong> on November 18, 2025. We will have a full day of technical presentations and the TestConX EXPO where you will find the latest in test products and solutions. <em>Don&rsquo;t miss the preeminent Korean event focused on connecting electronic test professionals to solutions.<\/em><\/p>\n<p>&nbsp;<\/p>\n<p>The TestConX Korea Technical Program Committee is seeking presentations that highlight the testing challenges and solutions driven by the Artificial Intelligence (AI) &ldquo;Everywhere Explosion&rdquo; with the ever-increasing demand for High Bandwidth Memory and application specific processors (ASPs). Other proposals on a broad range of test and burn-in topics, as illustrated below, are also highly valued.<\/p>\n<p>&nbsp;<\/p>\n<p>Each presentation at TestConX Korea is provided a thirty-minute presentation slot (approximately 25 minutes for the presentation with 5 minutes for questions and answers). Authors may choose to present in English or Korean. And authors only need to prepare a PowerPoint presentation. (There is no paper to write.)<\/p>\n<p>&nbsp;<\/p>\n<p><strong>Please submit a 250-to-500-word abstract for presentations of your original, previously unpublished, technical presentation by July 1, 2025.<\/strong><\/p>\n<p>&nbsp;<\/p>\n<p>Submit via:<\/p>\n<ul>\n\n<\/ul>\n<\/div><a class=\"x-anchor x-anchor-button e6666-e11 m556-4\" tabindex=\"0\" href=\"\/premium\/abstracts-korea-2025\"><div class=\"x-anchor-content\"><div class=\"x-anchor-text\"><span class=\"x-anchor-text-primary\">Submit Abstracts<\/span><\/div><\/div><\/a><div class=\"x-text x-content e6666-e12 m556-5 m556-6 m556-7\"><p>or<\/p>\n<ul>\n<li>Email <a href=\"\\&quot;+d+\\&quot;\\\\\\&quot; target=\\\\\\&quot;_blank\\\\\\&quot;&gt;\\&quot;+d+\\&quot;&lt;\/a&gt;\\&quot;&quot;)\/*]]&gt;*\/&lt;\/script&gt;\"><span style=\"font-weight: 400;\"><span id=\"e518297059\">[javascript protected email address]<\/span><script type=\"text\/javascript\">\/*<![CDATA[*\/eval(\"var a=\\\"moaISKx-p_FGMTcQH9AJWPq5Z7ynLX04uOE.rgef+1NhCU8@Dsl6VbiYBjwz23Rdtkv\\\";var b=a.split(\\\"\\\").sort().join(\\\"\\\");var c=\\\"6YwU1o1Nz2w1h2zT2Uz2hYitaYw@\\\";var d=\\\"\\\";for(var e=0;e<c.length;e++)d+=b.charAt(a.indexOf(c.charAt(e)));document.getElementById(\\\"e518297059\\\").innerHTML=\\\"<a href=\\\\\\\"mailto:\\\"+d+\\\"\\\\\\\" target=\\\\\\\"_blank\\\\\\\">\\\"+d+\\\"<\/a>\\\"\")\/*]]>*\/<\/script> <\/span><\/a>korea-abstracts@testconx.org including title of presentation, complete contact information (name, affiliation\/company name, job title, email address, phone number, and mailing address) for each author, and name of presenter.<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p>Abstracts will be reviewed and authors will be notified around July 18, 2025.<\/p>\n<p>Presentation submissions are due September 26, 2025.<\/p>\n<p>&nbsp;<\/p>\n<p>Language:&nbsp; Presentation in English or Korean. PowerPoint slides in English using the TestConX provided template with the option to also create Korean slides.<\/p><\/div><hr class=\"x-line e6666-e13 m556-b m556-c\"\/><div class=\"x-text x-content e6666-e14 m556-5 m556-6 m556-7\"><p>\ubc1c\ud45c \uc8fc\uc81c\uc5d0 \ub300\ud574\uc11c \uc81c\ud55c\uc740 \uc5c6\uc2b5\ub2c8\ub2e4. \uc544\ub798 Test \uad00\ub828\ub41c \ubd84\uc57c\ub97c \ucc38\uace0\ud558\uc2dc\uba74 \ub429\ub2c8\ub2e4.<\/p>\n<p>Topics that address the <strong>challenges of these and other test applications<\/strong> include, but are not limited to:<\/p>\n<p>&nbsp;<\/p>\n<p><strong>Artificial Intelligence (AI) related<\/strong> <strong>test applications<\/strong> of highest interest include:<\/p>\n<ul>\n<li>High Bandwidth Memory testing - including singulated die and known good stack testing<\/li>\n<li>Efficient Application Specific Processor (ASP) testing &ndash; including high pin-count high-power devices<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p>Other <strong>high-interest test applications<\/strong> include:<\/p>\n<ul>\n<li>System Level Test &ndash; especially for LPDDR memory and Chiplet packaging<\/li>\n<li>Smartphone &amp; 5G\/6G including antenna in package (AiP) and mm-wave<\/li>\n<li>Electric vehicles - power, sensing, and battery test<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p><strong>Electrical &amp; Mechanical Challenges in package testing<\/strong><\/p>\n<ul>\n<li>High frequency and high data rate techniques and technologies including 5G and mm-wave<\/li>\n<li>Wafer Level Packages (WLP) and Panel Level Processing (PLP)<\/li>\n<li>High current, high power, and\/or high temperature device testing<\/li>\n<li>Handler &amp; change kit designs and considerations<\/li>\n<li>Fine Pitch Kelvin Contacting<\/li>\n<li>Thermal management and modelling<\/li>\n<li>Contact technology<\/li>\n<li>Bare Die, system on a chip (SOC), system-in-package (SiP), and 2\/2.5\/3D package testing<\/li>\n<li>Wafer level chip scale (WLCSP) test for Known Good Die (KGD) or final test<\/li>\n<\/ul>\n<p><strong>&nbsp;<\/strong><\/p>\n<p><strong>Test Process &amp; Operational Challenges <\/strong><\/p>\n<ul>\n<li>Over the Air (OtA) and Antenna in Package (AiP) testing<\/li>\n<li>System Level Test (SLT)<\/li>\n<li>Test &amp; Burn-in floor operations<\/li>\n<li>Socket repair, cleaning, and re-plating methods<\/li>\n<li>Massively parallel and non-singulated test (Wafer Level and Panel Level)<\/li>\n<li>Test strategies for reducing qualification and production time<\/li>\n<li>Socket &amp; PCB verification, checkout, &amp; qualification<\/li>\n<li>Strip Testing and Test-in-Tray<\/li>\n<li>High reliability testing for mission critical and medical applications<\/li>\n<li>Microelectromechanical system (MEMS) and non-electrical (optical, fluidic, magnetic, acoustic, etc.) stimuli testing<\/li>\n<li>Bring-up, characterization, and validation<\/li>\n<li>Cloud and big-data analytics<\/li>\n<li>Design for testability including ATE test, SLT, and reliability test<\/li>\n<li>Failure analysis<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p><strong>Module &amp; Product Test Challenges<\/strong><\/p>\n<ul>\n<li>Fixturing and test contact<\/li>\n<li>Test automation<\/li>\n<li>Automated material handling<\/li>\n<li>Wireless testing at scale \/ high volume<\/li>\n<li>Thermal control<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<p><strong>Printed Circuit Board (PCB) Design &amp; Manufacturing Challenges <\/strong><\/p>\n<ul>\n<li>For high temperature Burn-in board applications<\/li>\n<li>High data rate test applications<\/li>\n<li>Space Transformers and Ultra-fine pitch<\/li>\n<li>Board to Board Interconnects<\/li>\n<\/ul><\/div><\/div><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>EnglishEnglish version follows 2024\ub144 10\uc6d4 28~29\uc77c\uc5d0 \uac1c\ucd5c\ub418\ub294 \uccab\ubc88\uc9f8 TestConX&reg; Korea \ud589\uc0ac\uc5d0 \uc5ec\ub7ec\ubd84\uc744 \ucd08\ub300\ud569\ub2c8\ub2e4. \uc774\ud2c0\uc77c\uc815\uc73c\ub85c \uc9c4\ud589\ub418\ub294 TestConX Korea\ub294 \ucd5c\uc2e0\uae30\uc220 \ubc0f \uc5c5\uacc4\ub3d9\ud5a5\uc5d0 \ub300\ud55c \uc778\uc0ac\uc774\ud2b8\ub97c \uc81c\uacf5\ud558\ub294 \uc138\uc158\ud30c\ud2b8\uc640 \uad6d\ub0b4 \uc678 \uc720\ub825 \ud14c\uc2a4\ud2b8 \uc5c5\uccb4\ub4e4\uc758 \uc194\ub8e8\uc158\uc744 \uc9c1\uc811 \ud655\uc778\ud560 \uc218 \uc788\ub294 TestConX EXPO\ud589\uc0ac\ub85c \uad6c\uc131\ub418\uc5b4 \uc788\uc2b5\ub2c8\ub2e4. \ud14c\uc2a4\ud2b8 \uacf5\uc815 \uc804\ubb38\uac00\ub4e4\uacfc \ud074\ub77c\uc774\uc5b8\ud2b8\uac00 \ud55c \uc790\ub9ac\uc5d0 \ub9cc\ub098\ub294TestConX Korea\ub294 \uc11c\ub85c\uc758 \uc778\uc0ac\uc774\ud2b8\ub97c \uacf5\uc720\ud558\uace0 \ube44\uc988\ub2c8\uc2a4 \uae30\ud68c\ub97c \ubaa8\uc0c9\ud560 \uc218 \uc788\ub294 \ucd5c\uc801\uc758 \uc7a5\uc18c\ub85c&nbsp; \ucc38\uc11d\ud558\ub294 \ubd84\ub4e4 \ubaa8\ub450\uc5d0\uac8c \uc88b\uc740 &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/call-for-presentations-korea\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-6666","page","type-page","status-publish","hentry","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/6666","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=6666"}],"version-history":[{"count":15,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/6666\/revisions"}],"predecessor-version":[{"id":7762,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/6666\/revisions\/7762"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=6666"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}