{"id":5785,"date":"2021-09-13T15:21:24","date_gmt":"2021-09-13T22:21:24","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=5785"},"modified":"2025-08-12T11:27:10","modified_gmt":"2025-08-12T18:27:10","slug":"call-for-presentations","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/call-for-presentations\/","title":{"rendered":"Call for Presentations"},"content":{"rendered":"<div id=\"cs-content\" class=\"cs-content\"><div class=\"x-section e5785-e1 m4gp-0\"><div class=\"x-row x-container max width e5785-e2 m4gp-1 m4gp-2\"><div class=\"x-row-inner\"><div class=\"x-col e5785-e3 m4gp-3\"><div class=\"x-text x-content e5785-e4 m4gp-4 m4gp-5 m4gp-6\"><h5>Call for Presentations and Posters for<br \/>TestConX 2026<br \/>March 1-4, 2026 - Mesa, Arizona<\/h5><\/div><hr class=\"x-line e5785-e5 m4gp-c m4gp-d\"\/><hr class=\"x-line e5785-e6 m4gp-d m4gp-e\"\/><div class=\"x-text x-content e5785-e7 m4gp-4 m4gp-5 m4gp-7\"><p><span style=\"font-weight: 400;\">Join us for the 27th<\/span><span style=\"font-weight: 400;\"> annual <\/span><a href=\"http:\/\/testconx.org\/\"><span style=\"font-weight: 400;\">TestConX<\/span><\/a><span style=\"font-weight: 400;\"> workshop to be held <strong>in-person<\/strong><\/span><span style=\"font-weight: 400;\"> on March 1-4, 2026. There will be daily technical presentation sessions and a TestConX EXPO where you will find the latest in test products and solutions. <\/span><i><span style=\"font-weight: 400;\">Don\u2019t miss the preeminent event focused on connecting electronic test professionals to solutions.<\/span><\/i><\/p>\n<p><span style=\"font-weight: 400;\">The TestConX Technical Program Committee is seeking presentations that highlight the challenges and solutions for a broad range of test and burn-in topics. <\/span><b>Test applications<\/b><span style=\"font-weight: 400;\"> of highest interest include:<\/span><\/p>\n\n<ul>\n \t<li>AI \/ Machine Learning \/ GenAI everywhere: from specific test challenges to test engineering to the supply chain<\/li>\n \t<li>High performance compute (HPC) and Quantum Compute test challenges<\/li>\n \t<li>Singulated die testing and handling for advanced packaging and chiplet applications<\/li>\n \t<li>Photonics testing - connecting electrical and optical domains<\/li>\n \t<li>Fine pitch socketing - wafer prober precision in socket applications<\/li>\n<\/ul>\n<div>We will also continue our special focused sessions on:<\/div>\n<ul>\n \t<li>Validation and Characterization Testing<\/li>\n \t<li>Printed Circuit Board Design, Fabrication, and Assembly<\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">Each <strong>PRESENTATION<\/strong> at TestConX is provided a thirty-minute presentation slot (approximately 25 minutes for the presentation with 5 minutes for questions and answers). And authors only need to prepare a PowerPoint presentation. (There is no paper to write.)<\/span><\/p>\n<p><span style=\"font-weight: 400;\"><strong>POSTERS<\/strong> provide an opportunity to directly interact with the attendees during the reserved session(s). Each poster is three oversized 24\" W x 36\" H pages that illustrates the technical challenge and solutions.<\/span><\/p><\/div><div class=\"x-text x-content e5785-e8 m4gp-4 m4gp-5 m4gp-8\"><p><b>Please submit a 250-to-500-word abstract for presentations or posters of your original, previously unpublished, technical presentation by October 3, 2025.<\/b><\/p>\n<p><i><\/i><\/p>\n<p><span style=\"font-weight: 400;\">\u00a0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Submit via:<\/span><\/p>\n\n<ul>\n \t<li><span style=\"font-weight: 400;\"> Online form <\/span><a href=\"https:\/\/form.jotform.com\/252226633769161\" target=\"_blank\" rel=\"noopener\"><span style=\"font-weight: 400;\">here<\/span><\/a><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">or\u00a0<\/span><\/p>\n\n<ul>\n \t<li><span style=\"font-weight: 400;\">Email <\/span><a href=\"\\&quot;+d+\\&quot;\\\\\\&quot; target=\\\\\\&quot;_blank\\\\\\&quot;&gt;\\&quot;+d+\\&quot;&lt;\/a&gt;\\&quot;&quot;)\/*]]&gt;*\/&lt;\/script&gt;\"><span style=\"font-weight: 400;\"><span id=\"e714225887\">[javascript protected email address]<\/span><script type=\"text\/javascript\">\/*<![CDATA[*\/eval(\"var a=\\\"1ZpOhrB+NUm9.Tgi08as36cjbYQJ2GqR-d4@eS7tfALoMzwPlyIu_CEWHxXV5DkKFnv\\\";var b=a.split(\\\"\\\").sort().join(\\\"\\\");var c=\\\"ALV5XAo5VrOrUT5zV5oWEFpWXP\\\";var d=\\\"\\\";for(var e=0;e<c.length;e++)d+=b.charAt(a.indexOf(c.charAt(e)));document.getElementById(\\\"e714225887\\\").innerHTML=\\\"<a href=\\\\\\\"mailto:\\\"+d+\\\"\\\\\\\" target=\\\\\\\"_blank\\\\\\\">\\\"+d+\\\"<\/a>\\\"\")\/*]]>*\/<\/script><\/span><\/a><span style=\"font-weight: 400;\"> including title of presentation, complete contact information (name, affiliation\/company name, job title, email address, phone number, and mailing address) for each author, and name of presenter. Please use this <a href=\"https:\/\/www.testconx.org\/premium\/wp-content\/uploads\/2023Korea\/TestConX_Abstract_submission_template.docx\">template<\/a>.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">Abstracts will be reviewed and authors will be notified around October 24, 2025.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Presentation submissions are due December 19, 2025.<\/span><\/p><\/div><div class=\"x-text x-content e5785-e9 m4gp-5 m4gp-7 m4gp-9 m4gp-a\"><p><span style=\"font-weight: 400;\">Topics that address the <\/span><b>challenges of these and other test applications<\/b><span style=\"font-weight: 400;\"> include, but are not limited to:<\/span><\/p>\n<p><b>Electrical, Mechanical, &amp; Thermal Challenges in package testing<\/b><\/p>\n\n<ul>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">High frequency and high data rate techniques and technologies including 5G and mm-wave<\/span><\/li>\n \t<li aria-level=\"1\">Testing next generation of high bandwidth applications: UWB, 6G, and WiFi 8<\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Wafer Level Packages (WLP) and Panel Level Processing (PLP)<\/span><\/li>\n \t<li aria-level=\"1\">Low voltage performance in a world of high power devices<\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">High current, high voltage, high power, high power\/current density, and\/or high temperature device testing<\/span><\/li>\n \t<li aria-level=\"1\">Power efficiency - testing for lowest power consumption<\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Handler &amp; change kit designs and considerations<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Fine Pitch Kelvin Contacting<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Thermal management and modelling<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Contact technology<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Bare Die, system on a chip (SOC), system-in-package (SiP), and 2\/2.5\/3D package testing<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Wafer level chip scale (WLCSP) test for Known Good Die (KGD) or final test<\/span><\/li>\n<\/ul>\n<p><b>Test Process &amp; Operational Challenges\u00a0<\/b><\/p>\n\n<ul>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Growing the number of test professionals and improving engineering efficiency to support every increasing test demand<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Over the Air (OtA) and Antenna in Package (AiP) testing<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">System Level Test (SLT)<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Test &amp; Burn-in floor operations<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Socket repair, cleaning, and re-plating methods<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Massively parallel and non-singulated test (Wafer Level and Panel Level)<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Test strategies for reducing qualification and production time<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Socket &amp; PCB verification, checkout, &amp; qualification<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Strip Testing and Test-in-Tray<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">High reliability testing for mission critical and medical applications<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Microelectromechanical system (MEMS) and non-electrical (optical, fluidic, magnetic, acoustic, etc.) stimuli testing<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Bring-up, characterization, and validation<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Cloud and big-data analytics<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Design for testability including ATE test, SLT, and reliability test<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Failure analysis<\/span><\/li>\n<\/ul>\n<p><b>Module &amp; Product Test Challenges<\/b><\/p>\n\n<ul>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Fixturing and test contact<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Test automation<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Automated material handling<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Wireless testing at scale \/ high volume<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Thermal control<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Battery test and characterization<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Quantum computing<\/span><\/li>\n<\/ul>\n<p><b>Printed Circuit Board (PCB) Design &amp; Manufacturing Challenges\u00a0<\/b><\/p>\n\n<ul>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Advanced via structures (coax, optimized, micro via, etc.)<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">For high temperature Burn-in board applications<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">High data rate test applications<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Space Transformers and Ultra-fine pitch<\/span><\/li>\n \t<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Board to Board Interconnects<\/span><\/li>\n<\/ul><\/div><div class=\"x-text x-content e5785-e10 m4gp-5 m4gp-7 m4gp-a m4gp-b\"><em><\/em>\n<\/div><\/div><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>Call for Presentations and Posters forTestConX 2026March 1-4, 2026 &#8211; Mesa, ArizonaJoin us for the 27th annual TestConX workshop to be held in-person on March 1-4, 2026. There will be daily technical presentation sessions and a TestConX EXPO where you will find the latest in test products and solutions. Don\u2019t miss the preeminent event focused on connecting electronic test professionals &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/call-for-presentations\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-5785","page","type-page","status-publish","hentry","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/5785","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=5785"}],"version-history":[{"count":35,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/5785\/revisions"}],"predecessor-version":[{"id":7843,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/5785\/revisions\/7843"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=5785"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}