{"id":5706,"date":"2021-08-13T15:41:07","date_gmt":"2021-08-13T22:41:07","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=5706"},"modified":"2026-05-19T15:30:53","modified_gmt":"2026-05-19T22:30:53","slug":"testconx-china-2021","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx-china-2021\/","title":{"rendered":"TestConX China 2021"},"content":{"rendered":"
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Virtual Event - October 26-29, 2021<\/h1>\n<\/div><\/div><\/div><\/div><\/div><\/div>
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Tuesday<\/th>\n October 26, 2021 - 0900 to 1130 Shanghai\/CST<\/a><\/td>\n \n <\/tr>\n
Wednesday<\/td>\n October 27, 2021 - 0900 to 1130 Shanghai\/CST<\/a><\/td>\n \n <\/tr>\n
Thursday<\/th>\n October 28, 2020 - 1500 to 1700 Shanghai\/CST<\/a><\/td>\n \n <\/tr>\n
Friday<\/th>\n October 29, 2021 - 0900 to 1130 Shanghai\/CST<\/a><\/td>\n \n <\/tr>\n<\/table><\/div>

Event registration is free courtesy of our sponsors<\/h1>\n<\/div><\/div><\/div>
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TestConX<\/span><\/a> has, over the course of its twenty two-year history, established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope has expanded over these years from packaged semiconductor “final” test and burn-in to encompass all practical aspects of electronics testing including validation, advanced packaging testing, system level test, module test, and beyond to finished product test. <\/span><\/p>\n

Last year, the 6th<\/sup> annual TestConX China 2020<\/a> was held as a virtual live on-line event with excellent <\/span>average daily attendance of over 800 and peaked with 1188 viewers online at once.<\/b> (Please see the Post-Event Report for additional details.) We will once again hold TestConX China 2021 as a virtual event using the same online platform. This will provide global attendees with the opportunity to see new locally created and developed content in addition to the best from international presenters. <\/span><\/p>\n

Don’t miss this opportunity to be part of TestConX as we connect a larger community of test professionals and to participate in this excellent event!<\/span><\/p><\/div>

Tuesday<\/h1>\nOctober 26, 2021 - 0900 to 1130 Shanghai\/CST<\/a><\/span><\/div><\/div><\/div><\/div><\/div><\/div>
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Opening Remarks<\/div><\/div>
Opening Remarks<\/div>
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Keynote<\/div><\/div>
Keynote<\/div>
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\n“Tectonic Shift to System-Oriented Test - Be Ready or Be Left Behind” \n
“\u5411\u4ee5\u7cfb\u7edf\u4e3a\u5bfc\u5411\u8fdb\u884c\u6d4b\u8bd5\u7684\u6784\u9020\u8f6c\u53d8--\u4e0d\u8fdb\u5219\u9000” \n<\/div>\n
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\nHarry Chen\n <\/div>\n\t
\nMediaTek Inc.\n\t <\/div>\n <\/div>\n<\/div>\n
\n\tAbstract (English)<\/summary>\n

With the slowing of Moore's Law, advances in packaging and chiplet technology have stepped in to continue the drive towards ever higher levels of integration. What continues unabated is the increasing complexity of realized end products and systems. Electronics is becoming pervasive in and around all aspects of our lives. As a result, beyond quality, assurances of reliability, safety, and security are drawing attention in many new application domains from electric cars to smart factories. In light of these trends, current testing methodologies and practices face daunting challenges. Thorough testing of individual components and their structural interconnects can no longer guarantee the required levels of quality and reliability of the integrated system. In this talk, I will delve into aspects of the challenges now arising, discuss how testing has to shift to a system-oriented perspective, describe what that means in terms of specific enabling capabilities, and highlight recent developments in support of this paradigm shift.<\/p><\/p><\/details>\n

\n\t\u6458\u8981 (Chinese)<\/summary>\n

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