{"id":3168,"date":"2018-11-19T14:20:42","date_gmt":"2018-11-19T22:20:42","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=3168"},"modified":"2023-05-15T10:01:20","modified_gmt":"2023-05-15T17:01:20","slug":"testconx-china-2018","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/testconx-china-2018\/","title":{"rendered":"TestConX China 2018"},"content":{"rendered":"<h4>Session 1 - Market Report<\/h4>\n<ul>\n<li><a title=\"Keynote - Advanced Packaging Innovation Challenges - Super-thin Optical SiP & CIS\" href=\"\/premium\/2018\/keynote\/#s0p1\">Keynote - Advanced Packaging Innovation Challenges - Super-thin Optical SiP & CIS<\/a><\/li>\n<li><a title=\"Keynote - Large Panel Fan-Out (LPFO) Technology Overview and Development\" href=\"\/premium\/2018\/keynote\/#s0p2\">Keynote - Large Panel Fan-Out (LPFO) Technology Overview and Development<\/a><\/li>\n<li><a title=\"Market Place Report - Strong Global Demand for Semiconductors Brings Unlimited Opportunities in China\" href=\"\/premium\/2018\/testconx-china-2018-market-place\/#s0p3\">Market Place Report - Strong Global Demand for Semiconductors Brings Unlimited Opportunities in China<\/a><\/li>\n<\/ul>\n<h4>Session 2 - 5G and mm-wave Test Challenges <\/h4>\n<ul>\n<li><a title=\"RF Module Test Challenges\" href=\"\/premium\/2018\/testconx-china-2018-session-2\/#s2p1\">RF Module Test Challenges<\/a><\/li>\n<li><a title=\"Over the Air Test for Antenna in Package IC\" href=\"\/premium\/2018\/testconx-china-2018-session-2\/#s2p2\">Over the Air Test for Antenna in Package IC<\/a><\/li>\n<li><a title=\"Feasibility Evaluation of a Spring Pin Wafer Probing Approach for a 5G WLCSP Application\" href=\"\/premium\/2018\/testconx-china-2018-session-2\/#s2p3\">Feasibility Evaluation of a Spring Pin Wafer Probing Approach for a 5G WLCSP Application<\/a><\/li>\n<\/ul>\n<h4>Session 3 - High Frequency and High Current<\/h4>\n<ul>\n<li><a title=\"Interpretation and Application of Test Contactor Specification\" href=\"\/premium\/2018\/testconx-china-2018-session-3\/#s3p1\">Interpretation and Application of Test Contactor Specification<\/a><\/li>\n<li><a title=\"One Type Wiping Contact Introduction\" href=\"\/premium\/2018\/testconx-china-2018-session-3\/#s3p2\">One Type Wiping Contact Introduction<\/a><\/li>\n<li><a title=\"Contact Probe CCC Study and Application\" href=\"\/premium\/2018\/testconx-china-2018-session-3\/#s3p3\">Contact Probe CCC Study and Application<\/a><\/li>\n<\/ul>\n<h4>Session 4 - Advanced Contact & Socket Technology<\/h4>\n<ul>\n<li><a title=\"The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side\" href=\"\/premium\/2018\/testconx-china-2018-session-4\/#s4p1\">The Impact on Probe Pin Performance of Different Plunger Cutting Methods at Device Side<\/a><\/li>\n<li><a title=\"Test yield control by on-line laser cleaning\" href=\"\/premium\/2018\/testconx-china-2018-session-4\/#s4p2\">Test yield control by on-line laser cleaning<\/a><\/li>\n<li><a title=\"Additive Manufacturing Capability Study for Semiconductor Test Components\" href=\"\/premium\/2018\/testconx-china-2018-session-4\/#s4p3\">Additive Manufacturing Capability Study for Semiconductor Test Components<\/a><\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Session 1 &#8211; Market Report Keynote &#8211; Advanced Packaging Innovation Challenges &#8211; Super-thin Optical SiP &#038; CIS Keynote &#8211; Large Panel Fan-Out (LPFO) Technology Overview and Development Market Place Report &#8211; Strong Global Demand for Semiconductors Brings Unlimited Opportunities in China Session 2 &#8211; 5G and mm-wave Test Challenges RF Module Test Challenges Over the Air Test for Antenna in &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/testconx-china-2018\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-3168","page","type-page","status-publish","hentry","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/3168","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=3168"}],"version-history":[{"count":5,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/3168\/revisions"}],"predecessor-version":[{"id":3268,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/3168\/revisions\/3268"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=3168"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}