{"id":2403,"date":"2017-11-01T20:08:09","date_gmt":"2017-11-02T03:08:09","guid":{"rendered":"https:\/\/www.testconx.org\/premium\/?page_id=2403"},"modified":"2023-05-15T10:00:27","modified_gmt":"2023-05-15T17:00:27","slug":"bits-china-2017","status":"publish","type":"page","link":"https:\/\/www.testconx.org\/premium\/bits-china-2017\/","title":{"rendered":"BiTS China 2017"},"content":{"rendered":"<h4>Tutorial - September 6, 2017<\/h4>\n<ul>\n<li><a title=\"Tutorial \u2013 Interconnect Sockets and Applications\" href=\"\/premium\/2017\/bits-china-2017-tutorial\/\">Tutorial \u2013 Interconnect Sockets and Applications<\/a>\n<\/ul>\n<h4>Session 1 - September 7, 2017<\/h4>\n<ul>\n<li><a title=\"Opening Remarks\" href=\"\/premium\/2017\/bits-china-2017-opening-keynote-market-report\/#s0p1\">Opening Remarks<\/a><\/li>\n<li><a title=\"Keynote - Fan Out Technology Overview\" href=\"\/premium\/2017\/bits-china-2017-opening-keynote-market-report\/#s0p2\">Keynote - Fan Out Technology Overview<\/a><\/li>\n<li><a title=\"Market Place Report - Opportunities and Challenges of the Chinese Test and Burn-in Sockets Market\" href=\"\/premium\/2017\/bits-china-2017-opening-keynote-market-report\/#s0p3\">Market Place Report - Opportunities and Challenges of the Chinese Test and Burn-in Sockets Market<\/a><\/li>\n<li><a title=\"High Speed Testing\" href=\"\/premium\/2017\/bits-china-2017-session-1\/#s1p1\">High Speed Testing<\/a><\/li>\n<li><a title=\"Flat Probe Technology for RF Test\" href=\"\/premium\/2017\/bits-china-2017-session-1\/#s1p2\">Flat Probe Technology for RF Test<\/a><\/li>\n<li><a title=\"Coplanar Waveguide On Wafer Calibration Technology for Enabling High Volume Microwave On-Wafer Test\" href=\"\/premium\/2017\/bits-china-2017-session-1\/#s1p3\">Coplanar Waveguide On Wafer Calibration Technology for Enabling High Volume Microwave On-Wafer Test<\/a><\/li>\n<li><a title=\"DUT ATE Test Fixture S-Parameters Estimation using 1x-Reflect Methodology\" href=\"\/premium\/2017\/bits-china-2017-session-1\/#s1p4\">DUT ATE Test Fixture S-Parameters Estimation using 1x-Reflect Methodology<\/a><\/li>\n<li><a title=\"Contactor Arcing Fundamentals\" href=\"\/premium\/2017\/bits-china-2017-session-1\/#s1p4\">Contactor Arcing Fundamentals<\/a><\/li>\n<\/ul>\n<h4>Session 2<\/h4>\n<ul>\n<li><a title=\"The challenge of testing and burn-in for System in Package\" href=\"\/premium\/2017\/bits-china-2017-session-2\/#s2p1 \">The challenge of testing and burn-in for System in Package<\/a><\/li>\n<li><a title=\"Socket Material Characterization & Selection\" href=\"\/premium\/2017\/bits-china-2017-session-2\/#s2p2 \">Socket Material Characterization & Selection<\/a><\/li>\n<li><a title=\"Deterministic contact resistance of BGA contact pins\" href=\"\/premium\/2017\/bits-china-2017-session-2\/#s2p3\">Deterministic contact resistance of BGA contact pins<\/a><\/li>\n<li><a title=\"New universal multi-beam Kelvin contactor concept for turret applications\" href=\"\/premium\/2017\/bits-china-2017-session-2\/#s2p4\">New universal multi-beam Kelvin contactor concept for turret applications<\/a><\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Tutorial &#8211; September 6, 2017 Tutorial \u2013 Interconnect Sockets and Applications Session 1 &#8211; September 7, 2017 Opening Remarks Keynote &#8211; Fan Out Technology Overview Market Place Report &#8211; Opportunities and Challenges of the Chinese Test and Burn-in Sockets Market High Speed Testing Flat Probe Technology for RF Test Coplanar Waveguide On Wafer Calibration Technology for Enabling High Volume Microwave &#8230; <\/p>\n<div><a href=\"https:\/\/www.testconx.org\/premium\/bits-china-2017\/\" class=\"more-link\">Read More<\/a><\/div>\n","protected":false},"author":548,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-2403","page","type-page","status-publish","hentry","no-post-thumbnail"],"_links":{"self":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/2403","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/users\/548"}],"replies":[{"embeddable":true,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/comments?post=2403"}],"version-history":[{"count":13,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/2403\/revisions"}],"predecessor-version":[{"id":2797,"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/pages\/2403\/revisions\/2797"}],"wp:attachment":[{"href":"https:\/\/www.testconx.org\/premium\/wp-json\/wp\/v2\/media?parent=2403"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}