TestConX 2020


TestConX has been postponed to May 10-13 due to Coronavirus

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Wednesday May 13, 2020

7:00 a

Continental Breakfast

Start the day right and enjoy the continental breakfast while networking with other attendees.

8:00 a

Session 7
Red Mountain Ballroom
Heating Up

There are thermal test challenges at both wafer-level and system-level. Wafer-level High-Temperature-Operating-Life-Test (HTOL) case studies and solutions will be shown as the fastest way to identify early reliability failure mechanisms. Next, the key challenges and a solution for the biased-life stress testing of high-power IC products will be offered. As integrated circuit (IC) power densities increase, traditional cooling approaches using heatsinks are reaching their limits. The advantages and disadvantages of other available cooling solutions including heat-pipes, cold plate with chiller, thermoelectric cooling, and thermal bath will be discussed for different power requirements. In the final presentation, the thermal challenges of automotive device reliability testing and time-to-market is covered. A system level test (SLT) solution with individual active thermal control (ATC) for reliability testing at extreme temperatures across 480 sites will be discussed.

“Implementation of Wafer Level HTOL for Early Reliability Assessments”
Krishna Mohan Chavali
Global Foundries
“Bias-Stress Testing of Ultra High-Power Integrated Circuits: HTOL and ORM”
David Leary
Incal Technology
“IC Test Thermal Management”
Quynh Nguyen
Smiths Interconnect
“System Level Test for Automotive Devices - A Thermal Perspective”
See Jean "Sid" Chan
AEM Holdings
Wee Tick Lo
AEM Holdings

10:00 a

Break & Networking

Enjoy the break and networking time.

10:30 a

Session 8
Red Mountain Ballroom
The Right Connection
Contact Technology

With data rates continuing to climb and package pitch continuing to scale down, it is increasingly difficult to provide cost-effective package test interconnect solutions that meets stringent mechanical and electrical requirements. First a high-speed contact design to support high data rates is shown to meet cycle life, force-resistance, and signal integrity (SI) requirements. Then an advanced hybrid coaxial high-performance socket fabricated by 3D micro-electro-mechanical system (MEMS) process is described. The presentation will show electrical characterizations using both 3D-electromagnetic simulation and evaluation results. Lastly, the issues of cleaning the pads of the printed circuit board (PCB) and device when using traditional spring-pins is discussed. A test socket using MEMS particles on rubber will be shown to have less tin migration resulting in lower damage to the PCB and device pads.

“Bridging the Gap”
Dong Weon "Dan" Hwang
HiCon Co., Ltd
Noel Del Rio
NXP Semiconductors
Paul Schubring
HighRel, Inc.
“Design and Analysis of Advanced Hybrid Coaxial Socket for High Bandwidth Package Test”
Taekyun "Steve" Kim
Mircofriend Inc
Yongho Cho
Mircofriend Inc
Jongwan Yook
Yonsei University
“Using Energy Dispersive X-Ray Spectrometry to Analyze & Compare Contamination and Transference on Final Test Sockets”
BoHyun "BH" Kim
Sol Lee
JongMok "JM" Lee


Red Mountain Ballroom
Awards & Closing Remarks

It's been three and a half days packed with learning, exploring, and sharing. Before we pack our bags and take what we've learned back to our jobs, there are a few closing remarks. We will take a moment to reflect and recognize the people, presentations, and posters that have distinguished themselves at TestConX 2020.

12:30 p

Workshop Adjourns

Program subject to change without notice.